Crystal stabbing device and die bonding system

Abstract

The utility model relates to a chip puncturing device and a chip fixing system, the chip puncturing device comprises a base, an ejector pin cap and an ejector pin, the ejector pin cap is arranged on the base, the ejector pin cap is arranged to be capable of moving relative to the base along a first direction, the ejector pin cap is provided with an adsorption part deviating from one side of the base, and the adsorption part is arranged to be capable of adsorbing a chip. The ejector pin is arranged on the side, facing the ejector pin cap, of the base, a via hole extending in the first direction is formed in the adsorption part in a penetrating mode, and the ejector pin is arranged to move relative to the base in the first direction and stretch out of the ejector pin cap through the via hole. The crystal stabbing device is beneficial to improving the stability and success rate of crystal stabbing operation.

Description

Technical Field

[0001] This application relates to the field of chip transfer equipment technology, and in particular to a crystal bonding device and a crystal bonding system. Background Technology

[0002] In the chip-to-flexible bonding process, or die bonding process, the chip and the blue film are connected by conductive adhesive particles. Although the connection strength is relatively low, the chip is still prone to skew during the separation process from the blue film. After separating the chip from the blue film, it needs to be attached to the corresponding substrate. This process requires ensuring that the chip detaches smoothly from the blue film and remains horizontal to meet the precision requirements of die bonding.

[0003] However, the crystal-piercing devices in related technologies often struggle to solve the problem of chip misalignment when separating from the blue film. Utility Model Content

[0004] Based on this, a chip-splitting device and a die-bonding system are provided. When the chip is separated from the blue film using the chip-splitting device of this application, the chip can have better stability and is less likely to be damaged, thereby improving the die-bonding quality of the die-bonding system.

[0005] According to one aspect of this application, a crystal-piercing device is provided, the crystal-piercing device comprising:

[0006] Base;

[0007] A pin cap, disposed on the base, is configured to move relative to the base along a first direction. The pin cap has an adsorption portion on a side opposite to the base, the adsorption portion being configured to adsorb a chip.

[0008] A ejector pin is disposed on the side of the base facing the ejector pin cap; the suction part is provided with a through hole extending along the first direction, and the ejector pin is configured to be able to move relative to the base along the first direction and extend out of the ejector pin cap through the through hole.

[0009] In one embodiment, the crystal-piercing device further includes a sleeve assembly extending along the first direction between the base and the ejector cap, the sleeve assembly being movable relative to the base along the first direction, the sleeve assembly and the ejector cap defining a receiving space in which the ejector pin is disposed; the ejector cap being detachably connected to the sleeve.

[0010] In one embodiment, the crystal-piercing device further includes a crystal-piercing rod extending along the first direction between the base and the ejector pin, and configured to be movable relative to the base and the sleeve assembly along the first direction, the crystal-piercing rod being located within the sleeve assembly.

[0011] In one embodiment, the sleeve assembly includes an outer cylinder and a guide inner cylinder, both of which extend along the first direction. The guide inner cylinder is disposed inside the outer cylinder and sleeved around the crystal-piercing rod to guide the crystal-piercing rod.

[0012] In one embodiment, the sleeve assembly further includes an inner guide and an outer guide. The inner guide is disposed on the outer wall of the crystal-piercing rod, and the outer guide is disposed on the inner wall of the inner guide cylinder. The outer guide is sleeved outside the inner guide and is capable of sliding relative to the inner guide along the first direction.

[0013] In one embodiment, the crystal-piercing device further includes a driving member disposed on the base, the driving member including a first output terminal and a second output terminal;

[0014] The crystal-piercing device further includes a first sliding assembly, which comprises a first guide and a first sliding member. The first sliding member is slidably connected to the first guide, which is disposed on the base. The first sliding member is connected to the sleeve assembly and to the first output end. Under the drive of the first output end, the first sliding member slides relative to the first guide relative to the first guide in the first direction; and / or

[0015] The crystal-piercing device further includes a second sliding assembly, which includes a second guide and a second sliding member. The second sliding member is slidably connected to the second guide, which is disposed on the base. The second sliding member is connected to the crystal-piercing rod and to the second output end. The second sliding member slides relative to the second guide in the first direction under the drive of the second output end.

[0016] In one embodiment, a vacuum channel is defined within the crystal-piercing rod. The end of the crystal-piercing rod near the ejector cap along the first direction has a vacuum hole, which connects the vacuum channel and the receiving space. The end of the vacuum channel away from the ejector cap along the first direction connects to a vacuum device. The adsorption part is also provided with a vacuum hole extending along the first direction. The vacuum hole and the through hole are spaced apart from each other. The vacuum hole connects to the receiving space and the external environment.

[0017] In one embodiment, the crystal-piercing device further includes a venting component, which defines a gas guiding space that extends along a second direction. The venting component is provided with a first gas port and a second gas port that are respectively connected to the two ends of the gas guiding space along the second direction. The first gas port is connected to a vacuum device, and the second gas port is connected to the vacuum channel.

[0018] The first direction and the second direction intersect each other.

[0019] In one embodiment, the crystal-piercing device further includes a locking ring, the locking ring having a first stepped portion and a second stepped portion provided on the outer side wall of the ejector cap, the locking ring being sleeved on the ejector cap and limited to the second stepped portion of the ejector cap by the first stepped portion;

[0020] The locking ring further includes an inner recess on one side of the first step portion along the first direction, and the sleeve assembly has an outer protrusion adapted to the inner recess. The locking ring is sleeved on the outside of the sleeve assembly, and the outer protrusion is engaged with the inner recess.

[0021] According to another aspect of this application, a die bonding system is provided, including the die-bonding device described in any of the above embodiments.

[0022] The aforementioned crystal-piercing device first moves the ejector cap relative to the base along a first direction, bringing the adsorption part of the ejector cap close to the chip with the blue film attached. The adsorption part is located on the side of the blue film facing away from the chip, and then the adsorption part adsorbs the blue film and the chip. Next, the ejector pin moves away from the base along the first direction and extends the ejector cap, piercing the blue film. As the ejector pin continues to move, it pushes out and pushes the chip, separating the chip and the blue film from each other. The crystal-piercing device of this application utilizes the adsorption part of the ejector cap to improve the stability of the chip during crystal piercing, especially before the ejector pin is pushed out, keeping the chip stable and reducing the risk of crystal piercing failure due to chip instability. Therefore, the crystal-piercing device of this application helps to improve the stability and success rate of the crystal piercing operation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the crystal-piercing device in one embodiment of this application.

[0024] Figure 2 This is a schematic diagram of the structure of the adsorption part of the pin cap adsorbing the blue film and the chip in one embodiment of this application.

[0025] Figure 3 This is a schematic diagram of the structure in one embodiment of the present application, in which a pin pierces the blue film and pushes out the chip.

[0026] Figure 4This is a cross-sectional view showing the corresponding guide and slider of the crystal-piercing device in one embodiment of this application.

[0027] Figure 5 This is a cross-sectional view showing the crystal-piercing rod of a crystal-piercing device in one embodiment of this application.

[0028] Figure 6 This is a cross-sectional view showing the ventilation element of the crystal-piercing device in one embodiment of this application.

[0029] Explanation of icon numbers:

[0030] 10. Crystal-piercing device;

[0031] 1. Base;

[0032] 2. Pin cap; 21. Adsorption part; 22. Second step part;

[0033] 3. Ejector pin; 4. Crystal spike; 41. Vacuum channel; 42. Vacuum hole; 43. Chuck;

[0034] 51. Outer cylinder; 52. Guide inner cylinder; 53. Accommodation space; 54. Inner guide component; 55. Outer guide component; 56. Outer protrusion;

[0035] 6. Driving component; 61. First output terminal; 62. Second output terminal; 63. First guide component; 64. First sliding component; 65. Second guide component; 66. Second sliding component; 67. First connecting component; 68. Second connecting component;

[0036] 7. Ventilation component; 71. Air guide space; 72. First air inlet; 73. Second air inlet;

[0037] 8. Locking ring; 81. First step portion; 82. Recessed portion;

[0038] 91. Blue film; 92. Chip;

[0039] F1, First Direction. Detailed Implementation

[0040] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0041] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0044] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0046] The primary purpose of chip piercing is to use pins to pierce and transfer chips from carriers such as blue films onto the target substrate, achieving precise chip transfer and fixation. However, in actual operation, the high-frequency movement of the motion platform and the piercing head can easily cause nonlinear vibrations, limiting the yield of chip transfer.

[0047] In other words, during the chip-bonding operation, it is usually necessary to keep the chip smoothly detached from the blue film to meet the precision requirements of chip transfer and bonding, so that the chip can be successfully transferred to the target substrate. However, due to the high-frequency movement of the chip-bonding device itself, it is difficult to keep the chip from tilting. Chip tilting will lead to a decrease in the yield of the finished product transferred to the substrate.

[0048] Based on this, this application provides a die-bonding device and a die-attachment system, which enable the chip to have better stability during the transfer process and are less likely to cause chip damage, thereby improving the die-attachment quality of the die-attachment system. Furthermore, the die-bonding device and die-attachment system of this application also have the advantage of being applicable to the transfer of chips of different sizes.

[0049] The crystal-piercing device 10 provided in this application includes a base 1, a pin cap 2, and a pin 3. The pin cap 2 is disposed on the base 1 and is configured to move relative to the base 1 along a first direction F1. The pin cap 2 has an adsorption part 21 on the side opposite to the base 1, which is configured to adsorb the chip 92. Before piercing the blue film 91 with the pin, the pin cap 2 moves relative to the base 1 along the first direction F1, so that the adsorption part 21 of the pin cap 2 approaches the chip 92 to which the blue film 91 is attached. The adsorption part 21 is located on the side of the blue film 91 opposite to the chip 92, and then the adsorption part 21 adsorbs the blue film 91 and the chip 92. This improves the stability of chip 92 transfer, effectively prevents chip 92 from tilting and shaking in the initial stage of crystal piercing, lays a good foundation for the subsequent accurate pushing and transfer of chip 92, thereby effectively improving the yield of the entire crystal piercing process, reducing the scrap rate caused by the initial instability of chip 92, and improving the working quality and reliability of the crystal-piercing device 10.

[0050] The ejector pin 3 is located on the side of the base 1 facing the ejector pin cap 2. The adsorption part 21 has a through hole extending along the first direction F1. The ejector pin 3 is configured to move relative to the base 1 along the first direction F1 and extend out of the ejector pin cap 2 through the through hole. After the adsorption part 21 adsorbs and stabilizes the blue film 91 and the chip 92, the ejector pin 3 moves away from the base 1 along the first direction F1 and extends out of the ejector pin cap 2. As the ejector pin 3 continues to move, it pierces the blue film 91 and pushes the chip 92, separating the chip 92 from the blue film 91. This staged operation method, first using the ejector pin cap 2 for adsorption and fixation, and then using the ejector pin 3 for precise piercing and pushing, greatly reduces the impact force and irregular force on the chip 92 at the moment of detachment from the blue film 91. This effectively avoids damage or displacement of the chip 92, further improving the success rate and quality of chip 92 transfer, ensuring that the chip 92 can be completely and accurately separated from the blue film 91 and transferred to the target location.

[0051] The die bonding device 10 of this application utilizes the adsorption part 21 of the ejector cap 2 to improve the stability of the die bonding process of the chip 92, especially before the ejector pin 3 is ejected, keeping the chip 92 stable and achieving smooth detachment and horizontal pushing of the chip 92. This reduces the risk of die bonding failure due to chip instability and helps improve the stability and success rate of the die bonding operation. In other words, the die bonding device 10 can provide reliable support and guidance in the critical stage of chip 92 transfer, effectively solving the problems of chip 92 being prone to skewness and detachment in the prior art, providing a strong guarantee for high-precision chip 92 transfer, especially suitable for the transfer operation of micro chips 92 with high precision requirements, and significantly improving the performance and efficiency of the entire die bonding system.

[0052] In some embodiments, the crystal-piercing device 10 further includes a sleeve assembly extending along a first direction F1 between the base 1 and the ejector cap 2. The sleeve assembly is configured to move relative to the base 1 along the first direction F1. The sleeve assembly and the ejector cap 2 define a receiving space 53, within which the ejector pin 3 is disposed. This facilitates the protection and limiting of the ejector pin 3, ensuring its stability and accuracy during movement. The receiving space 53 provides a relatively enclosed and stable operating environment for the ejector pin 3, preventing it from being disturbed or deviating during high-speed movement. This ensures that the ejector pin 3 can move accurately along a predetermined trajectory, precisely piercing the blue film 91 and pushing the chip 92.

[0053] In this embodiment, the ejector cap 2 is detachably connected to the sleeve. This facilitates the replacement of different ejector caps 2, thereby adapting to the crystal-piercing operation of chips 92 of different sizes. This greatly improves the versatility and flexibility of the crystal-piercing device 10, enabling the same equipment to quickly adapt to the production needs of various specifications of chips 92.

[0054] In actual production, when it is necessary to perform crystal-piercing operation on chips 92 of different sizes, the operator only needs to simply replace the corresponding ejector cap 2, without having to make complex adjustments or replacements to the entire device, which greatly shortens the line changeover time and improves production efficiency.

[0055] In some embodiments, the crystal-piercing device 10 further includes a crystal-piercing rod 4, which extends along a first direction F1 and is connected between the base 1 and the ejector pin 3. The crystal-piercing rod 4 is configured to move relative to the base 1 and the sleeve assembly along the first direction F1, and is located within the sleeve assembly. Thus, the crystal-piercing rod 4 can move relative to the sleeve assembly, enabling the ejector pin 3 to move along the first direction F1 relative to the sleeve assembly and extend the ejector pin cap 2 after the adsorption part 21 has stabilized adsorbing the blue film 91 and the chip 92, thereby piercing the blue film 91. Through the cooperative structure of the crystal-piercing rod 4, the sleeve assembly, and the ejector pin 3, the motion control precision of the piercing needle is further optimized, allowing the movement of the ejector pin 3 to be more stable and accurate. With the precise drive of the crystal-piercing rod 4, the ejector pin 3 can pierce the blue film 91 with appropriate force and speed after the chip 92 is fixed in the adsorption part 21, ensuring that the chip 92 is subjected to uniform force and that the process of detaching from the blue film 91 is smooth and without impact.

[0056] In some embodiments, the sleeve assembly includes an outer cylinder 51 and a guide inner cylinder 52, both extending along a first direction F1. The guide inner cylinder 52 is disposed inside the outer cylinder 51 and sleeved around the crystal-piercing rod 4 to guide the crystal-piercing rod 4. The guiding function of the guide inner cylinder 52 helps improve the stability of the crystal-piercing rod 4 driving the needle to move along the first direction F1, as well as the accuracy of the alignment between the ejector pin 3 and the via, thereby improving the stability of the chip 92 transfer.

[0057] In some embodiments, the sleeve assembly further includes an inner guide 54 and an outer guide 55. The inner guide 54 is disposed on the outer wall of the crystal-piercing rod 4, and the outer guide 55 is disposed on the inner wall of the guide inner cylinder 52. The outer guide 55 is sleeved outside the inner guide 54 and can slide relative to the inner guide 54 in the first direction F1. The cooperation of the inner and outer guides helps to reduce the friction of the crystal-piercing rod 4 sliding relative to the sleeve assembly, thereby helping to control the accuracy of the moving distance of the crystal-piercing rod 4 during the movement, and further improving the crystal-piercing accuracy.

[0058] In some embodiments, the crystal-piercing device 10 further includes a driving member 6 disposed on the base 1, the driving member 6 including a first output terminal 61 and a second output terminal 62. The crystal-piercing device 10 also includes a first sliding assembly, the first sliding assembly including a first guide member 63 and a first sliding member 64, the first sliding member 64 being slidably connected to the first guide member 63, the first guide member 63 being disposed on the base 1, the first sliding member 64 being connected to the sleeve assembly and connected to the first output terminal 61, the first sliding member 64 sliding relative to the first guide member 63 along a first direction F1 under the drive of the first output terminal 61. This facilitates precise and efficient driving and control of the sleeve assembly, ensuring that the sleeve assembly can move along the first direction F1 according to a predetermined motion law and speed, thereby ensuring that the adsorption part 21 of the pin cap 2 can accurately approach, adsorb, and stabilize the chip 92.

[0059] It should be noted that the first guide member 63 and the first slider 64 can adopt a structure of guide rail and slider cooperation, wherein the first guide member 63 can be a slider and the first slider 64 can be a guide rail. In this way, the slider is fixedly installed on the base 1, the guide rail is fixedly installed on the sleeve assembly, and the first output end 61 of the drive member 6 is connected to the guide rail. The drive member 6 drives the guide rail to move relative to the slider, thereby moving the guide rail relative to the slider, realizing the sliding of the sleeve assembly relative to the base 1 along the first direction F1. In this embodiment, the first guide member 63 can also be set as a guide rail and the first slider 64 as a slider, with the first output end 61 connected to the slider, so as to realize the sliding of the sleeve assembly relative to the base 1. No further restrictions are imposed here.

[0060] In some embodiments, the crystal-piercing device 10 further includes a second sliding assembly, which includes a second guide 65 and a second sliding member 66. The second sliding member 66 is slidably connected to the second guide 65, which is disposed on the base 1. The second sliding member 66 is connected to the crystal-piercing rod 4 and to the second output terminal 62. Driven by the second output terminal 62, the second sliding member 66 slides relative to the second guide 65 along the first direction F1. By setting the second sliding assembly, the crystal-piercing rod 4 can be precisely and stably driven and guided, ensuring that the crystal-piercing rod 4 can move accurately and smoothly along the first direction F1 during movement, thereby achieving precise piercing of the blue film 91 by the ejector pin 3 and smooth pushing of the chip 92.

[0061] It should be noted that the second guide member 65 and the second slider 66 can also adopt a structure of guide rail and slider cooperation. In this case, the second guide member 65 can be set as a slider and the second slider 66 as a guide rail. Alternatively, the second guide member 65 can be set as a guide rail and the second slider 66 as a slider. No further restrictions are imposed here.

[0062] In some embodiments, the driving element 6 may be a dual-actuator linear motor, thereby driving the first sliding component and the second sliding component respectively. Alternatively, two driving structures may be used to drive the first sliding component and the second sliding component respectively, without further restrictions.

[0063] In some embodiments, the crystal-piercing device 10 further includes a first fixing seat and a second fixing seat (not shown in the figure). The first fixing seat is connected between the first guide member 63 and the base 1, and the second fixing seat is connected between the second guide member 65 and the base 1. The corresponding fixing seats achieve a fixed connection between the corresponding guide member and the base 1.

[0064] The crystal-piercing device 10 also includes a first connector 67 and a second connector 68. The first connector 67 is connected to the first sliding member 64 and the sleeve assembly, realizing the connection between the first sliding member 64 and the sleeve assembly. The second connector 68 is connected between the second sliding member 66 and the crystal-piercing rod 4, realizing the connection between the second sliding member 66 and the crystal-piercing rod 4.

[0065] The chip-attaching device 10 also includes a monitoring component, which includes a first grating and a first reading head. The first grating is disposed on the first connector 67, and the first reading head is disposed on the first fixed base. It can be understood that the chip 92 has a short attachment distance, so the stroke control of the sleeve assembly can be achieved using a grating reading head structure. As the driving member 6 drives the first sliding member 64 and the first connector 67 to move along the first direction F1, the first reading head on the first fixed base and the first grating on the first connector 67 form a relative displacement, acquiring their displacement information, thereby enabling precise displacement control of the sleeve assembly.

[0066] The monitoring component also includes a second grating and a second reading head. The second grating is mounted on the second connector 68, and the second reading head is mounted on the second fixed base. As the driving component 6 drives the second sliding component 66 and the second connector 68 to move along the first direction F1, the second reading head on the second fixed base and the second grating on the second connector 68 form a relative displacement, thereby acquiring their displacement information and enabling precise displacement control of the crystal-piercing rod 4.

[0067] In some embodiments, a vacuum channel 41 is defined within the crystal-piercing rod 4. A vacuum hole 42 is provided at the end of the crystal-piercing rod 4 near the ejector cap 2 along the first direction F1. The vacuum hole 42 connects the vacuum channel 41 and the receiving space 53. The end of the vacuum channel 41 away from the ejector cap 2 along the first direction F1 connects to a vacuum device. The adsorption part 21 is also provided with a vacuum hole 42 extending along the first direction F1. The vacuum hole 42 and the through hole are spaced apart from each other. The vacuum hole 42 connects the receiving space 53 and the external environment. This enables the adsorption part 21 to achieve vacuum adsorption of the blue film 91 and the chip 92, which is beneficial for the stable transfer of the chip 92.

[0068] In some embodiments, the sleeve assembly adopts a double-layer sealing structure, which helps to improve the sealing performance of the accommodating space 53 and improve the adsorption stability of the adsorption part 21 on the chip 92.

[0069] In some embodiments, the crystal-piercing device 10 further includes a venting member 7, which defines a gas-guiding space 71 extending along a second direction. The venting member 7 is provided with a first gas port 72 and a second gas port 73 respectively connected to the two ends of the gas-guiding space 71 along the second direction. The first gas port 72 is connected to a vacuum device, and the second gas port 73 is connected to a vacuum channel 41. The first direction F1 and the second direction intersect each other. Thus, the venting member 7 facilitates communication between the working end of the vacuum device and the vacuum channel 41, and the gas-guiding space 71 extending along the second direction prevents the crystal-piercing device 10 from extending continuously along the first direction F1, which would result in an excessively large size in the first direction F1, thereby helping to reduce the size of the crystal-piercing device 10.

[0070] In this embodiment, a sealing structure is provided at the connection between the second air port 73 and the vacuum channel 41 to improve the sealing performance of the connection between the two. By enhancing the sealing performance, it is possible to effectively prevent air leakage during the adsorption of the chip 92, and ensure that the adsorption force of the adsorption part 21 on the chip 92 is uniform and stable, thereby avoiding the chip 92 from shifting or falling off before crystal piercing due to insufficient or unstable adsorption force.

[0071] In some embodiments, the crystal-piercing device 10 further includes a chuck 43, which is disposed on the side of the crystal-piercing rod 4 facing the ejector cap 2. The chuck 43 is configured to hold multiple ejector pins 3. This facilitates the advancement of the chip 92 using multiple ejector pins 3 and improves the stability of pushing the chip 92.

[0072] In some embodiments, the crystal-piercing device 10 further includes a locking ring 8, which includes a first stepped portion 81 and a second stepped portion 22 on the outer side wall of the ejector cap 2. The locking ring 8 is sleeved on the ejector cap 2 and is limited by the first stepped portion 81 to the second stepped portion 22 of the ejector cap 2. It is understood that the ejector cap 2 can pass through the locking ring 8, the locking ring 8 can be sleeved on the ejector cap 2, and the second stepped portion 22 of the ejector cap 2 and the first stepped portion 81 of the locking ring 8 are mutually limited, so that the ejector cap 2 and the locking ring 8 can be detachably connected.

[0073] In this embodiment, the locking ring 8 further includes a recessed portion 82 located on one side of the first step portion 81 along the first direction F1. The sleeve assembly has an externally protruding portion 56 adapted to the recessed portion 82. The locking ring 8 is sleeved on the sleeve assembly, and the externally protruding portion 56 is engaged with the recessed portion 82. It can be understood that when the sleeve assembly is inserted into the locking ring 8, the externally protruding portion 56 of the sleeve assembly and the recessed portion 82 of the locking ring 8 engage with each other, thus realizing the insertion and engagement between the locking ring 8 and the sleeve assembly, making the sleeve assembly and the locking ring 8 detachably connected to each other.

[0074] In this way, the locking ring 8 is detachably connected to the sleeve assembly and the ejector cap 2 respectively, so that different ejector caps 2 can be used to accommodate the transfer of chips 92 of different sizes.

[0075] This application also provides a die bonding system, including the die-bonding device 10 in any of the above embodiments. The die bonding system using the die-bonding device 10 of this application can stably transfer chips 92 of different sizes, reduce damage, and thus improve the yield of the die bonding system.

[0076] The crystal-piercing device 10 and crystal-bonding system of this application have an adsorption part 21 of the ejector cap 2 that can adsorb the blue film 91 and the chip 92 before the ejector 3 pierces the blue film 91, keeping the chip 92 stable before the ejector 3 is ejected, preventing the chip 92 from tilting, achieving smooth detachment and horizontal pushing, reducing the risk of crystal-piercing failure, and improving the stability and success rate of crystal-piercing operation. The use of a sleeve assembly reduces assembly difficulty through the limiting effect of the sleeve assembly, eliminating the need for other complex structures and reducing costs. Furthermore, the cooperation of the inner guide 54 and outer guide 55 in the sleeve assembly ensures that the crystal-piercing rod 4 moves accurately and smoothly along the first direction F1, further improving the accuracy and reliability of the ejector 3 crystal-piercing operation and reducing vibration and deviation during the crystal-piercing process. The ejector cap 2 is detachably connected to the sleeve, facilitating the replacement of ejector caps 2 of different sizes to adapt to the crystal-piercing operation of chips 92 of different sizes, improving the versatility and flexibility of the crystal-piercing device 10, and meeting diverse production needs. After the chip 92 is stabilized in the adsorption section 21, the ejector pin 3 moves along the first direction F1, extending the ejector pin cap 2 to precisely pierce the blue film 91 and push the chip 92, allowing the chip 92 to separate smoothly from the blue film 91. This reduces the impact and irregular force during the separation process, effectively preventing chip 92 from being damaged or shifted, ensuring that the chip 92 is transferred completely and accurately to the target substrate, and improving the success rate and quality of chip 92 transfer. It is also equipped with first and second sliding components and a driving component 6 to automate the operation of the crystal-piercing device 10. The driving component 6 drives the sleeve assembly and the crystal-piercing rod 4 to slide along the first direction F1 through the first and second output ends, respectively, precisely controlling the movement of the ejector pin cap 2 and the ejector pin 3, reducing manual intervention, and improving production efficiency and product quality.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A crystal-piercing device, characterized in that, The crystal-piercing device includes: Base; A pin cap, disposed on the base, is configured to move relative to the base along a first direction. The pin cap has an adsorption portion on a side opposite to the base, the adsorption portion being configured to adsorb a chip. A ejector pin is disposed on the side of the base facing the ejector pin cap; the suction part is provided with a through hole extending along the first direction, and the ejector pin is configured to be able to move relative to the base along the first direction and extend out of the ejector pin cap through the through hole.

2. The crystal-piercing device according to claim 1, characterized in that, The crystal-piercing device further includes a sleeve assembly that extends along the first direction and is connected between the base and the ejector cap. The sleeve assembly is configured to be movable relative to the base along the first direction. The sleeve assembly and the ejector cap define a receiving space, in which the ejector pin is disposed. The ejector cap is detachably connected to the sleeve.

3. The crystal-piercing device according to claim 2, characterized in that, The crystal-piercing device further includes a crystal-piercing rod that extends along the first direction and is connected between the base and the ejector pin, and is configured to move relative to the base and the sleeve assembly along the first direction, the crystal-piercing rod being located within the sleeve assembly.

4. The crystal-piercing device according to claim 3, characterized in that, The sleeve assembly includes an outer cylinder and a guide inner cylinder, both of which extend along the first direction. The guide inner cylinder is disposed inside the outer cylinder and sleeved around the crystal-piercing rod to guide the crystal-piercing rod.

5. The crystal-piercing device according to claim 4, characterized in that, The sleeve assembly further includes an inner guide and an outer guide. The inner guide is disposed on the outer wall of the crystal-piercing rod, and the outer guide is disposed on the inner wall of the inner guide cylinder. The outer guide is sleeved on the outer side of the inner guide and can slide relative to the inner guide in the first direction.

6. The crystal-piercing device according to claim 3, characterized in that, The crystal-piercing device also includes a driving component disposed on the base, the driving component including a first output terminal and a second output terminal; The crystal-piercing device further includes a first sliding assembly, which includes a first guide and a first sliding member. The first sliding member is slidably connected to the first guide. The first guide is disposed on the base. The first sliding member is connected to the sleeve assembly and to the first output end. The first sliding member slides relative to the first guide in the first direction under the drive of the first output end. and / or The crystal-piercing device further includes a second sliding assembly, which includes a second guide and a second sliding member. The second sliding member is slidably connected to the second guide, which is disposed on the base. The second sliding member is connected to the crystal-piercing rod and to the second output end. The second sliding member slides relative to the second guide in the first direction under the drive of the second output end.

7. The crystal-piercing device according to claim 3, characterized in that, A vacuum channel is defined within the crystal-piercing rod. A vacuum hole is provided at one end of the crystal-piercing rod near the pin cap along the first direction. The vacuum hole connects the vacuum channel and the receiving space. The end of the vacuum channel away from the pin cap along the first direction connects to a vacuum device. A vacuum hole extending along the first direction is also provided on the adsorption part. The vacuum hole and the through hole are spaced apart from each other. The vacuum hole connects the receiving space and the external environment.

8. The crystal-piercing device according to claim 7, characterized in that, The crystal-piercing device further includes a venting component, which defines a gas guiding space that extends along a second direction. The venting component is provided with a first gas port and a second gas port that are respectively connected to the two ends of the gas guiding space along the second direction. The first gas port is connected to a vacuum device, and the second gas port is connected to the vacuum channel. The first direction and the second direction intersect each other.

9. The crystal-piercing device according to claim 2, characterized in that, The crystal-piercing device further includes a locking ring, which includes a first stepped portion and a second stepped portion on the outer side wall of the ejector cap. The locking ring is sleeved on the outside of the ejector cap and is limited to the second stepped portion of the ejector cap by the first stepped portion. The locking ring further includes an inner recess on one side of the first step portion along the first direction, and the sleeve assembly has an outer protrusion adapted to the inner recess. The locking ring is sleeved on the outside of the sleeve assembly, and the outer protrusion is engaged with the inner recess.

10. A die bonding system, characterized in that, Includes the crystal-piercing device as described in any one of claims 1 to 9.

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