Clamping jaw mounting disc for clamping wafer

By setting a slider and a synchronous motion transmission device on the chuck, the problem of lack of auxiliary components on the fixture is solved, and stable coaxial clamping and position adjustment of the wafer are achieved, thus improving processing efficiency.

CN224205620UActive Publication Date: 2026-05-05盖泽精密科技(苏州)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
盖泽精密科技(苏州)有限公司
Filing Date
2025-03-31
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

The existing fixtures do not have reserved positions for installing auxiliary components, which means that the identifier cannot recognize the wafer notch when it is blocked by the clamping hand. Workers need to manually adjust the wafer position, which affects processing efficiency.

Method used

Sliders are evenly arranged around the circumference of the through hole on the chuck. The synchronous movement of the slides is achieved by a synchronous motion transmitter and drive device. Through holes are reserved for installing auxiliary components. The wafer is stably clamped and its position is adjusted in conjunction with the lifting shaft and grippers.

Benefits of technology

This achieves stable coaxial clamping and position adjustment of the wafer, avoids the identifier being blocked, and improves processing efficiency and ease of operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of semiconductors, and particularly relates to a clamping jaw mounting disc for clamping wafers, which comprises a disc body, a through hole is formed in the center of the disc body, at least two sliding blocks are uniformly arranged on the periphery of the through hole on the disc body, and a synchronous movement driver which does not shield the through hole is arranged on the disc body. The input end of the synchronous movement driver is in transmission connection with one sliding block, the output end of the synchronous movement driver is in transmission connection with the remaining sliding blocks, and the extension line of each sliding block in the sliding direction on the disc body passes through the circle center of the through hole; the sliding blocks in transmission connection with the input end of the synchronous movement driver are in transmission connection with the output end of the driving device, each sliding block is provided with one clamping jaw installer, and all the sliding blocks can be synchronously far away from the center of the disc body or synchronously close to the center of the disc body through the synchronous movement driver. The problem that a position for installing an auxiliary component is not reserved on an existing clamp used for clamping a wafer is solved.
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Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically a clamping mounting disk for holding wafers. Background Technology

[0002] Wafers are used to manufacture semiconductors. During wafer fabrication, many of the wafer's top surfaces cannot be touched. Therefore, during clamping, only the circumferential surface of the wafer can be clamped. A positioning element, typically a notch, is provided on the wafer. A reader identifies this notch to ensure the wafer is correctly positioned. Therefore, after the wafer is clamped, the clamp needs to be rotated, causing the wafer to rotate around its center to align the notch with the preset position. If the notch on the wafer is blocked by the clamping hand, the reader will not be able to recognize the notch because it is obstructed. Therefore, if the notch on the wafer is blocked by the clamping hand, an auxiliary component is needed to rotate the wafer to adjust its clamping position so that the notch is not blocked by the clamping hand. Currently, the fixtures used to hold wafers can only be equipped with grippers and do not have space reserved for installing auxiliary components. Therefore, when workers place the wafers on the grippers, they need to pay special attention to ensure that the notch on the wafer is not the part of the wafer that will be held. Utility Model Content

[0003] The purpose of this application is to address the shortcomings of existing technologies by designing a clamping mounting plate for holding wafers by uniformly arranging sliders around a through hole on the clamping plate. The clamping base has a through hole reserved for mounting auxiliary components, which solves the problem that current wafer clamping fixtures do not have reserved positions for mounting auxiliary components.

[0004] To achieve the above objectives, the technical solution adopted in this application is:

[0005] A clamping mounting pad for holding wafers includes a pad body with a through hole at its center. At least two sliders are evenly arranged around the through hole on the pad body. A synchronous motion actuator, which does not obstruct the through hole, is provided on the pad body. The input end of the synchronous motion actuator is connected to one of the sliders, and the output end of the synchronous motion actuator is connected to the remaining sliders. The extension line of the sliding direction of each slider on the pad body passes through the center of the through hole. A driving device is provided on the pad body, and the sliders connected to the input end of the synchronous motion actuator are connected to the output end of the driving device. Each slider is equipped with a clamping mount. Through the synchronous motion actuator, all sliders can be simultaneously moved away from or simultaneously moved closer to the center of the pad body.

[0006] Preferably, the synchronous motion transmission device includes an annular component and several connecting rods. The annular component is rotatably mounted on the disk body and is concentric with the through hole. One end of each connecting rod is rotatably connected to the upper end face of the annular component. The connection points of the connecting rods and the annular component are evenly distributed around the center of the annular component. A predetermined distance is maintained between the connection points of the connecting rods and the annular component and the straight line in which the slider moves on the disk body. The number of connecting rods is equal to the number of sliders. The end of each connecting rod away from the annular component is rotatably connected to one side of a slider. All connecting rods are of equal length, and a slider is located at the angle formed between any two adjacent connecting rods.

[0007] Preferably, the disk body is provided with three sliders.

[0008] Preferably, the disk body has three slide rails equidistantly arranged around the circumference of the through hole, the central axis of each slide rail passes through the center of the through hole, and each slider is slidably disposed between the two ends of one of the slide rails.

[0009] Preferably, the gripper installer includes a mounting rod, one mounting rod is fixedly mounted on a slider, and each mounting rod is provided with a mounting hole.

[0010] Preferably, the driving device includes a linear motor and a connecting plate. The linear motor is fixedly mounted on the disk body, and the output shaft of the linear motor is parallel to the sliding direction of one of the sliders. One end of the connecting plate is fixedly connected to the output shaft of the linear motor, and the other end of the connecting plate is fixedly connected to the slider.

[0011] Preferably, the device further includes a U-shaped component and a spring. The projection of the U-shaped component onto the surface of the disk body where the slider is mounted is U-shaped. The closed end of the U-shaped component is fixedly connected to the slider or the connecting plate. The open end of the U-shaped component faces the output shaft of the linear motor. A pin is provided on the U-shaped component. The two ends of the pin are respectively fixedly connected to the two U-shaped sidewalls of the U-shaped component. A slot is provided on the end of the connecting plate facing away from the linear motor. The slot passes through the two ends of the pin. The spring is sleeved on the pin between the side of the connecting plate facing the synchronous motion transmitter and the U-shaped sidewall of the U-shaped component.

[0012] Compared with the prior art, this application has the following beneficial effects:

[0013] This application designs a clamping mounting plate for holding wafers by uniformly arranging sliders around a through hole on the clamping plate. The clamping base has a through hole that is the same as the mounting auxiliary component, which solves the problem that the current clamps for holding wafers do not have a reserved position for mounting auxiliary components. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this application;

[0015] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0016] Figure 3 This is an exploded view of this application;

[0017] Figure 4 This is a schematic diagram of the application in use (only the key components are shown in the schematic diagram).

[0018] The components are as follows: 1. Disc body; 2. Through hole; 3. Slider; 4. Ring part; 5. Connecting rod; 6. Slide rail; 7. Mounting rod; 8. Mounting hole; 9. Linear motor; 10. Connecting plate; 11. U-shaped part; 12. Spring; 13. Pin; 14. Groove. Detailed Implementation

[0019] like Figure 1-4 As shown, a clamping mounting disk for holding wafers includes a disk body 1. A through-hole 2 is provided in the center of the disk body 1. At least two sliders 3 are evenly arranged around the through-hole 2 on the disk body 1. A synchronous motion actuator, which does not obstruct the through-hole 2, is provided on the disk body 1. The input end of the synchronous motion actuator is connected to one of the sliders 3, and the output end of the synchronous motion actuator is connected to the remaining sliders 3. The extension line of the sliding direction of each slider 3 on the disk body 1 passes through the center of the through-hole 2. A driving device is provided on the disk body 1, and the sliders 3 connected to the input end of the synchronous motion actuator are connected to the output end of the driving device. Each slider 3 is equipped with a clamping mount. Through the synchronous motion actuator, all sliders 3 can be synchronously moved away from or synchronously moved closer to the center of the disk body 1.

[0020] In this embodiment, when used, such as Figure 4As shown, the mounting disk is mounted on the bracket 15, and the gripper 18 is mounted by the gripper mounter. The slider 3 drives the gripper 18 to move towards the through hole 2 to clamp the wafer. When the slider 3 drives the gripper to move away from the through hole 2, the wafer clamping is released. The synchronous motion transmission makes the movement speed of each slider 3 towards the through hole 2 equal, so that when the gripper 18 clamps the wafer, the wafer and the through hole 2 are coaxial. The through hole 2 is designed to facilitate the coaxial installation of auxiliary components, such as the lifting shaft (cylinder 17) coaxial with the through hole 2. At the same time, after the lifting shaft is installed, the lifting shaft can also be rotated (the method can be very simple, that is, a cylinder 17 is coaxially mounted on the output shaft of the rotating motor 16, so that the cylinder 17 lifts and the rotating motor 16 rotates). After the lifting shaft is installed, as long as the circumferential surface of the lifting shaft does not contact the inner circumferential surface of the through hole 2, the lifting shaft will not affect the disk body 1. When it is necessary to change the position where the jaws hold the wafer, simply raise the lifting shaft to support the wafer, then drive one slider 3 to move away from the through hole 2 via the drive device. All other sliders 3 will move away from the through hole 2 simultaneously, thus releasing the wafer from the grip. At this point, the wafer is held in place by the lifting shaft and will not fall (in practical applications, a suction cup 19 can be installed at the top of the lifting shaft to hold the wafer and prevent it from falling). The lifting shaft then slowly rotates until the notch on the wafer is misaligned with the jaw 18. The lifting shaft then slowly descends to a position where the jaws can hold the wafer. Then, drive one slider 3 to move towards the through hole 2 via the drive device. All other sliders 3 will move towards the through hole 2 simultaneously, thus achieving the gripping of the wafer. By setting through hole 2, the position of the auxiliary component is reserved. Since through hole 2 penetrates through the disk body 1, the lifting shaft can be completely lowered below the disk body 1 when the lifting shaft is not needed. It does not occupy the space above the surface of the disk body 1 where the clamps and slider 3 are installed, and thus will not affect the clamps 18 clamping the wafer.

[0021] In a preferred embodiment, the synchronous motion transmitter includes an annular component 4 and several connecting rods 5. The annular component 4 is rotatably mounted on the disk body 1 and is concentric with the through hole 2. One end of each connecting rod 5 is rotatably connected to the upper end face of the annular component 4. The connection points of the connecting rods 5 and the annular component 4 are evenly distributed around the center of the annular component 4. A predetermined distance is maintained between the connection points of the connecting rods 5 and the annular component 4 and the straight line in which the slider 3 moves on the disk body 1. The number of connecting rods 5 is equal to the number of sliders 3. The end of each connecting rod 5 away from the annular component 4 is rotatably connected to one side of a slider 3. All connecting rods 5 are of equal length, and a slider 3 is located at the angle formed between any two adjacent connecting rods 5. With this configuration, when the slider 3 connected to the drive device moves, it will drive the connecting rod 5 connected to it to move. The movement of the connecting rod 5 will pull the annular component 4 to rotate. The rotation of the annular component 4 will then pull other sliders 3 (slider 3s not connected to the drive device) to move, thereby enabling each slider 3 to move synchronously away from or synchronously move closer to the center of the disk body 1. The annular component 4 is designed so that all sliders 3 can move synchronously away from or synchronously move closer to the center of the disk body 1 without obstructing the through hole 2.

[0022] As a preferred embodiment, the disk body 1 is provided with three sliders 3. By providing three sliders 3, three grippers can be installed, thereby making the wafer clamping more stable.

[0023] As a preferred embodiment, the disk body 1 has three slide rails 6 equidistantly arranged around the circumference of the through hole 2. The central axis of each slide rail 6 passes through the center of the through hole 2, and each slider 3 is slidably disposed between the two ends of one of the slide rails 6. The slide rails 6 restrict the movement of the slider 3 in a linear direction.

[0024] As a preferred embodiment, the gripper installer includes a mounting rod 7, with one mounting rod 7 fixedly mounted on each slider 3. Each mounting rod 7 has a mounting hole 8. By providing the mounting rod 7 and the mounting hole 8, grippers can be installed through the mounting hole 8. This allows for the replacement of different grippers according to different requirements during use. When installing the gripper, the gripper 18 is locked onto the mounting rod 7 by bolts passing through the mounting hole 8.

[0025] In a preferred embodiment, the driving device includes a linear motor 9 and a connecting plate 10. The linear motor 9 is fixedly mounted on the disk body 1, and its output shaft is parallel to the sliding direction of one of the sliders 3. One end of the connecting plate 10 is fixedly connected to the output shaft of the linear motor 9, and the other end is fixedly connected to the slider 3. With this configuration, movement of the output shaft of the linear motor 9 will cause the connecting plate 10 to move, which in turn will cause the slider 3 to move.

[0026] As a preferred embodiment, the device also includes a U-shaped component 11 and a spring 12. The projection of the U-shaped component 11 onto the surface of the disk body 1 where the slider 3 is mounted is U-shaped. The closed end of the U-shaped component 11 is fixedly connected to the slider 3 or the connecting plate 10. The open end of the U-shaped component 11 faces the output shaft of the linear motor 9. A pin 13 is provided on the U-shaped component 11. The two ends of the pin 13 are respectively fixedly connected to the two U-shaped sidewalls of the U-shaped component 11. A slot 14 is provided on the end of the connecting plate 10 facing away from the linear motor 9. The slot 14 passes through the two ends of the pin 13. The spring 12 is sleeved on the pin 13 between the side of the connecting plate 10 facing the synchronous motion transmitter and the U-shaped sidewall of the U-shaped component 11. With this setup, when the output shaft of the linear motor 9 retracts, it drives the slider 3 to move towards the through hole 2, which is to clamp the wafer. However, with the spring 12 installed, when the output shaft of the linear motor 9 continues to retract after clamping the wafer, the spring 12 acts as a buffer to prevent excessive force from damaging the wafer.

Claims

1. A clamping mounting pad for holding wafers, characterized in that, The device includes a disk body (1), a through hole (2) in the center of the disk body (1), at least two sliders (3) are evenly arranged around the through hole (2) on the disk body (1), a synchronous motion actuator is provided on the disk body (1) without blocking the through hole (2), the input end of the synchronous motion actuator is connected to one of the sliders (3), and the output end of the synchronous motion actuator is connected to the remaining sliders (3). The extension line of the sliding direction of each slider (3) on the disk body (1) passes through the center of the through hole (2). The disk body (1) is provided with a driving device, and the sliders (3) connected to the input end of the synchronous motion actuator are connected to the output end of the driving device. Each slider (3) is provided with a gripper mount. Through the synchronous motion actuator, all the sliders (3) can be moved away from the center of the disk body (1) or moved closer to the center of the disk body (1) synchronously.

2. A clamping mounting pad for holding wafers according to claim 1, characterized in that, The synchronous motion transmission device includes an annular component (4) and several connecting rods (5). The annular component (4) is rotatably mounted on the disk body (1). The annular component (4) is concentric with the through hole (2). One end of each connecting rod (5) is rotatably connected to the upper end face of the annular component (4). The connection points of the connecting rods (5) and the annular component (4) are evenly arranged around the center of the annular component (4). There is a preset distance between the connection points of the connecting rods (5) and the annular component (4) and the straight line in which the slider (3) moves on the disk body (1). The number of connecting rods (5) is equal to the number of sliders (3). The end of each connecting rod (5) away from the annular component (4) is rotatably connected to one side of a slider (3). All connecting rods (5) are of equal length. There is a slider (3) at the angle formed between any two adjacent connecting rods (5).

3. A clamping mounting pad for holding wafers according to claim 1, characterized in that, The disk body (1) is provided with three sliders (3).

4. A clamping pad for holding a wafer according to claim 3, characterized in that, The disk body (1) has three slide rails (6) arranged equidistantly around the through hole (2). The central axis of each slide rail (6) passes through the center of the through hole (2), and each slider (3) is slidably disposed between the two ends of one of the slide rails (6).

5. A clamping mounting pad for holding wafers according to claim 1, characterized in that, The gripper installer includes a mounting rod (7), and a mounting rod (7) is fixedly mounted on a slider (3). Each mounting rod (7) is provided with a mounting hole (8).

6. A clamping mounting pad for holding wafers according to claim 1, characterized in that, The driving device includes a linear motor (9) and a connecting plate (10). The linear motor (9) is fixedly mounted on the disk body (1). The output shaft of the linear motor (9) is parallel to the sliding direction of one of the sliders (3). One end of the connecting plate (10) is fixedly connected to the output shaft of the linear motor (9), and the other end of the connecting plate (10) is fixedly connected to the slider (3).

7. A clamping pad for holding a wafer according to claim 6, characterized in that, It also includes a U-shaped component (11) and a spring (12). The projection of the U-shaped component (11) onto the surface of the disk body (1) where the slider (3) is mounted is U-shaped. The closed end of the U-shaped component (11) is fixedly connected to the slider (3) or the connecting plate (10). The open end of the U-shaped component (11) faces the output shaft of the linear motor (9). The U-shaped component (11) is provided with a pin (13). The two ends of the pin (13) are respectively fixedly connected to the two U-shaped sidewalls of the U-shaped component (11). The connecting plate (10) has a slot (14) at one end facing away from the linear motor (9). The slot (14) passes through the two ends of the pin (13). The spring (12) is sleeved on the pin (13) between the side of the connecting plate (10) facing the synchronous motion transmitter and the U-shaped sidewall of the U-shaped component (11).