Wafer clamping device capable of reducing abrasion
By incorporating buffers and limiting rods in the wafer clamping device, the wear problem between the wafer and the clamping device is solved, improving the processing effect and the durability of the device, and reducing the risk of contamination.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO BESLAN SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-05
AI Technical Summary
The rigid contact between the wafer clamping device and the wafer causes wear, affecting the processing effect and the durability of the clamping device. Existing monitoring and adjustment structures are complex and pose a risk of contamination.
Design a wafer clamping device that reduces wear caused by hard contact by setting a buffer between the base and end of the clamping member, using an elastic material such as a spring or elastic pad, and setting a limiting rod inside the spring, combined with the snap-fit structure of the columnar protrusion and the chuck pin.
It effectively reduces wafer wear, improves clamping stability, avoids loosening caused by non-uniform compression, facilitates chuck pin replacement, and reduces the risk of contamination.
Smart Images
Figure CN224205627U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a wafer clamping device that reduces wear, belonging to the field of semiconductor processing technology. Background Technology
[0002] In integrated circuit manufacturing, multiple wet processing steps are involved. Wet processing utilizes liquid chemicals such as acids, alkalis, and organic compounds to rinse the wafer, achieving purposes such as cleaning surface particles, removing reactive polymers, and etching surface films. As the requirements for process efficiency have increased, the type of wet processing equipment has gradually shifted from early batch wafer processing to single-wafer processing.
[0003] When a wafer clamping device comes into contact with a wafer, the rigid contact causes wear on both, which is detrimental to the wafer processing effect and the durability of the clamping device. Existing technologies use detection devices to monitor the clamping condition and adjust the clamping device accordingly, but these methods are complex, have a degree of reactive control, and pose a risk of introducing contaminants. Therefore, it is crucial to address the contact and wear issues between the clamping device and the wafer using hardware design. Utility Model Content
[0004] To address the aforementioned issues, this application proposes a wafer clamping device that reduces wear, creating a buffer between the wafer clamping device and the wafer to minimize wear.
[0005] According to one aspect of this application, a wafer clamping device for reducing wear is provided, comprising: a wafer rotary disk, a plurality of chuck pins and a drive mechanism;
[0006] The chuck pin is movably disposed on the upper surface of the wafer swivel disk. The chuck pin includes a chuck holder and a clamping member. The chuck holder and the clamping member are rotatable about the axis of the chuck holder.
[0007] The clamping member includes a base and an end, which are connected by a buffer.
[0008] Specifically, the wafer rotating disk includes an upper layer, a metal middle layer, and a lower layer. The upper layer is an isolation layer made of corrosion-resistant material to prevent the acids, alkalis, and organic solvents used in wafer cleaning and etching processes from corroding or dissolving the middle and lower layers. The metal middle layer is equipped with a transmission mechanism that can be electrically connected to a drive mechanism to rotate the chuck pins. The lower layer is equipped with mounting holes for connecting to the drive mechanism to control the motion of the wafer rotating disk. The lower layer is made of a polymer material with a certain degree of elasticity, which acts as an isolation and buffer between the middle layer and the drive mechanism.
[0009] Optionally, the buffer element is one of a spring or an elastic pad.
[0010] Specifically, the spring is made of one of the following materials: PEEK, PEI, PSU, PC, POM, and nickel-based alloys; the elastic washer is made of one of the following materials: FKM, FFKM, and HNBR.
[0011] Optionally, the spring is provided with a limiting rod inside, and the two ends of the limiting rod are respectively fixed to the end and the base of the clamping member.
[0012] Specifically, the limiting rod is a sleeve rod with a smooth surface, and the radius of the limiting rod gradually decreases from the connection end with the base to the connection end. The outer periphery of the connection position between the base and the limiting rod is provided with a groove that mates with the outer periphery of the spring, providing placement space when the spring and the limiting rod retract.
[0013] Optionally, the spring constant is 0.05 to 0.45 N / mm, and the free length is 3 to 5 mm.
[0014] Optionally, the wafer slewing disk has columnar protrusions, and the lower end of the chuck pin has a groove that mates with the columnar protrusions on the wafer slewing disk, so that the chuck pin engages with the wafer slewing disk.
[0015] Optionally, the height of the columnar protrusion is 0.3 to 0.5 times the height of the chuck pin.
[0016] Optionally, the outer surface of the columnar protrusion is provided with friction strips.
[0017] Optionally, the friction stripe is a horizontal stripe or a spiral stripe.
[0018] Optionally, the chuck holder is provided with a number of smooth anti-slip points.
[0019] Optionally, the number of chuck pins is at least four.
[0020] The beneficial effects that this application may produce include, but are not limited to:
[0021] 1. The wafer clamping device for reducing wear provided in this application, by providing a base and an end and a buffer between them, can provide a certain buffer for the clamping device when it contacts the wafer, reduce the stress generated during contact, and reduce the wear of the wafer caused by stress.
[0022] 2. The wafer clamping device for reducing wear provided in this application limits the compression direction of the spring by setting a limiting rod inside the spring, thereby avoiding loosening of the wafer clamping caused by uneven compression of the spring.
[0023] 3. The wafer clamping device for reducing wear provided in this application, by setting columnar protrusions on the wafer swivel disk and being able to engage with the chuck pins, facilitates the replacement of chuck pins that have been worn to a certain extent, and the structural design ensures the stability of the chuck pins. Attached Figure Description
[0024] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0025] Figure 1 This is a front view schematic diagram of a wafer clamping device for reducing wear according to an embodiment of this application;
[0026] Figure 2 This is a top view of the chuck pin involved in an embodiment of this application;
[0027] Figure 3 This is a top view of the columnar protrusion involved in the embodiments of this application;
[0028] Figure 4 This is a front view of the columnar protrusions and the wafer rotating disk involved in the embodiments of this application;
[0029] Figure 5 This is a top view schematic diagram of a wafer clamping device for reducing wear according to an embodiment of this application;
[0030] List of components and reference numerals:
[0031] 1. Wafer clamping device; 2. Wafer rotating disk; 3. Chuck pin; 4. Chuck holder; 5. Clamping component; 6. Base; 7. End; 8. Buffer component; 9. Spring; 10. Limiting rod; 11. Columnar protrusion; 12. Friction strip; 13. Anti-slip point. Detailed Implementation
[0032] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.
[0033] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0034] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.
[0035] Furthermore, it should be understood in the description of this application that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0038] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.
[0039] The wafer clamping device in this application is only used to clamp the wafer during wafer cleaning, etching and other processes. Since the wafer needs to be rotated during the above-mentioned cleaning, etching and other processes, the wafer clamping device in this application can be connected to an additional drive mechanism. The drive mechanism drives the device to rotate so as to realize the processing of the wafer.
[0040] refer to Figure 1-5 The embodiments of this application disclose a wafer clamping device 1 for reducing wear, including: a wafer rotary disk 2, a plurality of chuck pins 3 and a drive mechanism;
[0041] The chuck pin 3 is movably disposed on the upper surface of the wafer rotary disk 2. The chuck pin 3 includes a chuck holder 4 and a clamping member 5. The chuck holder 4 and the clamping member 5 are rotatable around the axis of the chuck holder 4.
[0042] The clamping member 5 includes a base 6 and an end 7, which are connected by a buffer member 8.
[0043] Specifically, the wafer rotating disk 2 includes an upper layer, a middle metal layer, and a lower layer; the upper layer is an isolation layer made of corrosion-resistant material, the middle metal layer is equipped with a transmission mechanism, and the lower layer is connected to the drive mechanism to realize motion control of the wafer rotating disk 2.
[0044] By providing a buffer 8 between the base 6 and the end 7, the clamping member 5 can be provided with a certain buffer when it contacts the wafer, thereby reducing the stress generated during contact and reducing the wear on the wafer.
[0045] In one implementation, the buffer 8 is one of the spring 9 and the elastic pad, preferably the spring 9.
[0046] In one specific implementation, the spring 9 is made of one of the following materials: PEEK, PEI, PSU, PC, POM, or nickel-based alloy; the elastic washer is made of one of the following materials: FKM, FFKM, or HNBR.
[0047] In one embodiment, the spring 9 is provided with a limiting rod 10 inside, and the two ends of the limiting rod 10 are fixed to the end 7 and the base 6 of the clamping member 5, respectively.
[0048] The limiting rod 10 is located inside the spring 9 and can limit and guide the spring 9, so that the spring 9 can only be compressed or stretched in the direction of the extension of the limiting rod 10, thus avoiding uneven excessive deformation of the spring 9 when the radial force is uneven, which would cause the wafer clamping to loosen.
[0049] In one embodiment, the spring constant of spring 9 is 0.05 to 0.45 N / mm, and the free length is 3 to 5 mm.
[0050] The smaller spring constant provides higher sensitivity when the chuck pin 3 contacts the wafer, eliminating the impact force from hard contact and reducing wafer wear. At the same time, the smaller free length not only ensures the uniformity of the deformation of the spring 9, but also requires only a small force to achieve full compression of the spring 9 without generating excessive reaction force on the base 6 and the wafer, thus preventing clamping instability.
[0051] In one embodiment, the wafer rotating disk 2 is provided with columnar protrusions 11, and the lower end of the chuck pin 3 is provided with a groove that mates with the columnar protrusions 11 on the wafer rotating disk 2, so that the chuck pin 3 is engaged with the wafer rotating disk 2.
[0052] In one specific implementation, the columnar protrusion 11 is connected to the wafer rotating disk 2 by bolts.
[0053] The chuck pin 3 engages with the columnar protrusion 11 to facilitate the replacement of the chuck pin 3 when it is worn to a certain extent.
[0054] In one implementation, the height of the columnar protrusion 11 is 0.3 to 0.5 times the height of the chuck pin 3. This ensures connection stability while preventing the chuck pin 3 from having insufficient outer wall support and strength due to excessive groove depth, thus preventing the chuck pin 3 from cracking during the high-speed rotation of the wafer.
[0055] As one implementation, the outer surface of the columnar protrusion 11 is provided with a friction strip 12 to enhance the mechanical locking effect.
[0056] In one embodiment, the friction strip 12 is a horizontal stripe or a spiral stripe. The horizontal or spiral stripe can enhance the locking effect between the two parts in the vertical direction and improve the stability of wafer clamping.
[0057] As one implementation method, the chuck tray 4 is provided with several smooth anti-slip points 13, which can form frictional contact with the wafer surface during clamping to prevent the wafer from shifting when rotating at high speed; at the same time, the design of the anti-slip points 13 can effectively disperse pressure, reduce damage to the wafer surface, and provide better clamping stability.
[0058] In one implementation, the number of chuck pins 3 is at least four, and the chuck pins 3 are evenly or symmetrically distributed along the circumference of the wafer rotating disk 2.
[0059] The wafer clamping device 1 works as follows: the wafer is placed on the chuck tray 4 on the chuck pin 3, the drive mechanism drives the chuck pin 3 to rotate around the axis of the chuck tray 4 so that the clamping member 5 clamps the wafer, and the drive mechanism drives the wafer rotating disk 2 to rotate around its axis, thereby rotating the wafer to perform soaking or rinsing.
[0060] During this process, a buffer 8 is provided between the base 6 and the end 7 of the clamping member 5. When the clamping member 5 contacts the wafer, the buffer 8 is compressed, forming a buffer between the clamping member 5 and the wafer, thus preventing the clamping member 5 from making hard contact with the wafer and causing wear.
[0061] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.
[0062] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.
Claims
1. A wafer clamping device for reducing wear, characterized in that, include: Wafer rotating disk, several chuck pins, and drive mechanism; The chuck pin is movably disposed on the upper surface of the wafer swivel disk. The chuck pin includes a chuck holder and a clamping member. The chuck holder and the clamping member are rotatable about the axis of the chuck holder. The clamping member includes a base and an end, which are connected by a buffer.
2. The wafer clamping device for reducing wear according to claim 1, characterized in that, The buffer component is either a spring or an elastic washer.
3. The wafer clamping device for reducing wear according to claim 2, characterized in that, The spring has a limiting rod inside, and the two ends of the limiting rod are fixed to the end and the base of the clamping member, respectively.
4. The wafer clamping device for reducing wear according to claim 3, characterized in that, The spring constant is 0.05 to 0.45 N / mm, and the free length is 3 to 5 mm.
5. The wafer clamping device for reducing wear according to any one of claims 1 to 4, characterized in that, The wafer rotating disk has columnar protrusions, and the lower end of the chuck pin has a groove that mates with the columnar protrusions on the wafer rotating disk. The chuck pin engages with the wafer rotating disk.
6. The wafer clamping device for reducing wear according to claim 5, characterized in that, The height of the columnar protrusion is 0.3 to 0.5 times the height of the chuck pin.
7. The wafer clamping device for reducing wear according to claim 5, characterized in that, The outer surface of the columnar protrusion is provided with friction strips.
8. The wafer clamping device for reducing wear according to claim 7, characterized in that, The friction stripes are horizontal stripes or spiral stripes.
9. The wafer clamping device for reducing wear according to claim 8, characterized in that, The chuck holder is provided with several smooth anti-slip points.
10. The wafer clamping device for reducing wear according to claim 1, characterized in that, The number of chuck pins is at least four.