Chip turnover device

Abstract

The utility model relates to a chip turnover device. The chip turnover device comprises a first driving mechanism, a second driving mechanism and a turnover swing arm, the second driving mechanism is connected with the output end of the first driving mechanism, and the first driving mechanism is used for driving the second driving mechanism to ascend and descend in the first direction. The overturning swing arm is connected with the output end of the second driving mechanism, and the second driving mechanism is used for driving the overturning swing arm to rotate around the axis parallel to the second direction. Wherein the overturning swing arm comprises a swing arm seat, a first elastic piece and a suction nozzle used for adsorbing or releasing a chip, the swing arm seat is connected with the output end of the second driving mechanism, and the suction nozzle is connected with the first elastic piece and the swing arm seat. The first direction and the second direction intersect each other. The probability of chip cracking can be reduced, and the yield during chip overturning operation can be improved.

Description

Technical Field

[0001] This application relates to the field of chip technology, and in particular to a chip flipping device. Background Technology

[0002] In related technologies, mechanical grippers are typically used to flip the chip; however, this can cause the chip's edges to crack. Utility Model Content

[0003] Therefore, it is necessary to provide a chip flipping device that can reduce the probability of chip breakage and improve the yield during chip flipping operations, in order to address the above technical problems.

[0004] This application provides a chip flipping device, comprising:

[0005] First drive mechanism;

[0006] A second drive mechanism is connected to the output end of the first drive mechanism, and the first drive mechanism is used to drive the second drive mechanism to move up and down along a first direction; and

[0007] A flipping swing arm is connected to the output end of the second drive mechanism, which is used to drive the flipping swing arm to rotate about an axis parallel to the second direction.

[0008] The flipping arm includes a swing arm base, a first elastic element, and a suction nozzle for adsorbing or releasing the chip.

[0009] The swing arm seat is connected to the output end of the second drive mechanism, and the suction nozzle is connected to the first elastic element and the swing arm seat respectively.

[0010] The first direction and the second direction intersect each other.

[0011] In one embodiment, the first elastic member extends along the first direction.

[0012] In one embodiment, the tilting arm further includes:

[0013] A nozzle holder, wherein the nozzle is disposed on the nozzle holder; and

[0014] The first guide rail, which extends in the first direction, is connected to the swing arm seat;

[0015] The first elastic element is connected to the nozzle seat and the first guide rail respectively;

[0016] The nozzle seat is slidably connected to the first guide rail along the first direction.

[0017] In one embodiment, the tilting arm further includes a counterweight disposed on the arm seat;

[0018] A plane passing through the central axis of the output end of the second drive mechanism is defined as a reference plane, which is parallel to the first direction and the second direction;

[0019] The counterweight and the suction nozzle are located on opposite sides of the reference plane.

[0020] In one embodiment, the counterweight is used to make the center of gravity of the tilting arm coincide with the central axis of the output end of the second drive mechanism.

[0021] In one embodiment, the swing arm seat is provided with a first mounting hole;

[0022] The output end of the second drive mechanism is adapted to snap into the first mounting hole.

[0023] In one embodiment, the swing arm seat has a first end and a second end disposed opposite to each other along a third direction;

[0024] Along a third direction, the suction nozzle is closer to the second end than to the first end;

[0025] Along a third direction, the output end of the second drive mechanism is closer to the first end than the second end;

[0026] The first direction, the second direction, and the third direction intersect each other.

[0027] In one embodiment, the chip flipping device further includes:

[0028] A bracket is connected to the output end of the first drive mechanism; the second drive mechanism is mounted on the bracket; and

[0029] The second elastic element is connected to both the first drive mechanism and the bracket.

[0030] In one embodiment, the second elastic element is provided with at least two; and / or

[0031] The second elastic element extends along the first direction.

[0032] In one embodiment, the first drive mechanism includes a voice coil motor or a cylinder.

[0033] In the technical solution of this application, during the process of the suction nozzle adsorbing the chip downward along the first direction, since the suction nozzle is connected to the first elastic element and the swing arm seat respectively, the first elastic element can be used to form a buffer to reduce the impact force of the suction nozzle on the chip, avoid forming a rigid impact on the chip, thereby reducing the probability of chip breakage and improving the yield during chip flipping operation. Attached Figure Description

[0034] Figure 1 A schematic diagram of the chip flipping device according to an embodiment of this application is shown.

[0035] Figure 2 A schematic diagram of the structure of the flipping swing arm in one embodiment of this application is shown from a first-view perspective.

[0036] Figure 3 A schematic diagram of the chip and substrate in one embodiment of this application is shown.

[0037] Figure 4 A schematic diagram of the structure of the flipping swing arm in one embodiment of this application is shown from a second perspective.

[0038] Reference numerals: 10, chip flipping device; 100, first driving mechanism; 200, second driving mechanism; 300, flipping swing arm; 310, first elastic element; 320, suction nozzle; 330, swing arm seat; 331, first mounting hole; 332, first end; 333, second end; 340, first guide rail; 341, guide part; 350, suction nozzle seat; 351, suction nozzle seat body; 352, slider; 353, first bolt; 3521, first guide slope; 3411, second guide slope; 360, counterweight; 371, guide rail seat; 372, second bolt; 381, positive electrode; 382, ​​negative electrode; 400, bracket; 410, first frame; 420, second frame; 500, second elastic element; 600, base; 700, second guide rail; 20, chip; 30, substrate. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0045] Figure 1 A schematic diagram of the chip flipping device 10 in one embodiment of this application is shown. Figure 2 A schematic diagram of the structure of the flip arm 300 in one embodiment of this application is shown.

[0046] Please refer to the following: Figure 1 and Figure 2 One embodiment of this application provides a chip flipping device 10, including a first driving mechanism 100, a second driving mechanism 200, and a flipping swing arm 300.

[0047] The second drive mechanism 200 is connected to the output end of the first drive mechanism 100, and the first drive mechanism 100 drives the second drive mechanism 200 to move up and down along the first direction F1. The tilting arm 300 is connected to the output end of the second drive mechanism 200, and the second drive mechanism 200 drives the tilting arm 300 to rotate around an axis parallel to the second direction F2. The first direction F1 and the second direction F2 intersect each other.

[0048] The first drive mechanism 100 can be a motor, cylinder or other mechanism, as long as it can drive the second drive mechanism 200 to move up and down in the first direction F1.

[0049] The second drive mechanism 200 can be a motor, a rotary cylinder, or other mechanism, as long as it can drive the tilting arm 300 to rotate around an axis parallel to the second direction F2.

[0050] Optionally, the first direction F1 and the second direction F2 are perpendicular to each other. For example, the first direction F1 is parallel to the direction of gravity of the chip flipping device 10, and the second direction F2 is parallel to the horizontal direction.

[0051] The flip arm 300 includes a swing arm base 330, a first elastic element 310, and a suction nozzle 320 for adsorbing or releasing the chip 20. The swing arm base 330 is connected to the output end of the second drive mechanism 200, and the suction nozzle 320 is connected to the first elastic element 310 and the swing arm base 330 respectively.

[0052] The suction nozzle 320 refers to the component on the flip arm 300 used to adsorb or release the chip 20. It can be connected to a vacuum negative pressure device to form a negative pressure in the suction nozzle 320, so that the chip 20 can be adsorbed by the suction nozzle 320, or the vacuum in the suction nozzle 320 can be broken, so that the chip 20 can be released at the corresponding position.

[0053] The first elastic element 310 may be a spring or other elastic component.

[0054] The suction nozzle 320 has a waiting position and a flipping position spaced apart along a first direction F1. The first driving mechanism 100 can drive the second driving mechanism 200 and the flipping arm 300 to move downward along the first direction F1, thereby moving the suction nozzle 320 downward along the first direction F1 to the waiting position. The suction nozzle 320 can then pick up the chip 20 at the waiting position. Then, the first driving mechanism 100 drives the second driving mechanism 200 and the flipping arm 300 to move upward along the first direction F1, thereby moving the suction nozzle 320 from the waiting position to the flipping position. Then, the second driving mechanism 200 drives the flipping arm 300 to rotate 180 degrees around an axis parallel to the second direction F2, thereby flipping the chip 20 upward so that other mechanisms can pick up the chip 20 on the suction nozzle 320, thus facilitating the subsequent die bonding operation between the flipped chip 20 and the substrate 30. Figure 3 A schematic diagram of the structure of the chip 20 after being flipped upwards and then bonded to the substrate 30 is shown. After other mechanisms pick up the chip 20 from the nozzle 320, the second drive mechanism 200 drives the flipping arm 300 to rotate 180 degrees again around an axis parallel to the second direction F2. The first drive mechanism 100 then drives the second drive mechanism 200 and the flipping arm 300 to move along the first direction F1, so that the nozzle 320 is displaced downwards from the flipped position to the waiting position. In this way, the chip flipping device 10 can be used to perform the flipping operation of the next chip 20.

[0055] During the process of the suction nozzle 320 adsorbing the chip 20 at the waiting position downward along the first direction F1, since the suction nozzle 320 is connected to the first elastic element 310 and the swing arm seat 330 respectively, the first elastic element 310 can be used to form a buffer to reduce the impact force of the suction nozzle 320 on the chip 20, avoid rigid impact on the chip 20, thereby reducing the probability of chip 20 breaking and improving the yield of chip 20 during flipping operation.

[0056] In some embodiments, the first elastic member 310 extends along a first direction F1.

[0057] It is possible that the first elastic element 310 is arranged to bend and extend in a spiral shape around an axis parallel to the first direction F1.

[0058] Since the first elastic element 310 extends along the first direction F1, the first elastic element 310 can better form a buffer force along the first direction F1, which can better avoid rigid impact on the chip 20, thereby better reducing the probability of chip 20 breaking, and also better improving the yield of chip 20 during flipping operation.

[0059] In some embodiments, please refer to Figure 2 and Figure 4 The flip arm 300 also includes a nozzle seat 350 and a first guide rail 340 extending in the first direction F1. The nozzle 320 is disposed on the nozzle seat 350. The first guide rail 340 is connected to the arm seat 330. The first elastic element 310 is connected to the nozzle seat 350 and the first guide rail 340 respectively. The nozzle seat 350 is slidably connected to the first guide rail 340 along the first direction F1.

[0060] The nozzle holder 350 and the first guide rail 340 can be used to make the nozzle 320 have good straightness in the linear movement along the first direction F1, which makes it easier for the nozzle 320 to form a flexible suction chip 20.

[0061] In some embodiments, the nozzle holder 350 includes a nozzle holder body 351 and a slider 352. The nozzle 320 is mounted on the nozzle holder body 351, the slider 352 is connected to the nozzle holder body 351, and the slider 352 is slidably connected to the first guide rail 340 along the first direction F1.

[0062] Optionally, the slider 352 is detachably connected to the nozzle holder body 351. Specifically, the slider 352 can be connected to the nozzle holder body 351 via a first bolt 353.

[0063] In some embodiments, the flip arm 300 further includes a guide rail seat 371 connected to the arm seat 330, a first guide rail 340 connected to the guide rail seat 371, and a first elastic member 310 connected to the nozzle seat body 351 and the guide rail seat 371 of the nozzle seat 350 respectively.

[0064] Optionally, the first guide rail 340 is detachably connected to the guide rail base 371. Specifically, the first guide rail 340 can be connected to the guide rail base 371 by a second bolt 372.

[0065] Optionally, the guide rail seat 371 and the swing arm seat 330 are detachably connected. Specifically, the guide rail seat 371 is connected to the swing arm seat 330 by a third bolt.

[0066] In some embodiments, the first guide rail 340 has two guide portions 341 spaced apart along a third direction F3. Along the third direction F3, a slider 352 is disposed between the two guide portions 341, and the slider 352 is slidably connected to the two guide portions 341 respectively.

[0067] Optionally, the slider 352 is provided with a first guide slope 3521 on each of the opposite sides along the third direction F3, and a second guide slope 3411 is provided on each guide part 341. The first guide slope 3521 and the second guide slope 3411 correspond one-to-one, and the first guide slope 3521 and the second guide slope 3411 are parallel to the first direction F1, and are set at an angle to the second direction F2 and the third direction F3, respectively.

[0068] Thus, the movement of the slider 352 along the second direction F2 and the third direction F3 can be restricted by the first guide ramp 3521 and the corresponding second guide ramp 3411, thereby allowing the slider 352 to be more reliably slidably connected to the first guide rail 340. In some embodiments, the flipping swing arm 300 further includes a counterweight 360 disposed on the swing arm seat 330. A plane passing through the central axis of the output end of the second drive mechanism 200 is defined as a reference plane, which is parallel to the first direction F1 and the second direction F2. The counterweight 360 and the suction nozzle 320 are located on opposite sides of the reference plane. Specifically, the reference plane is perpendicular to the third direction F3, the first direction F1 and the second direction F2 intersect each other and are both perpendicular to the third direction F3. Optionally, the first direction F1 and the second direction F2 and the third direction F3 are mutually perpendicular.

[0069] The counterweight 360 has a second mounting hole, and the swing arm seat 330 has a third mounting hole corresponding to the second mounting hole. The counterweight 360 and the swing arm seat 330 can be connected by means of the second mounting hole and the third mounting hole. For example, both the second mounting hole and the third mounting hole are threaded holes, and the counterweight 360 and the swing arm seat 330 can be connected by bolts adapted to the threaded holes.

[0070] The counterweight 360 partially surrounds the swing arm seat 330. A part of the counterweight 360 is connected to one side of the swing arm seat 330 along the first direction F1, and another part of the counterweight 360 is connected to one side of the swing arm seat 330 along the third direction F3. Yet another part of the counterweight 360 is curved in an arc shape and is connected between one part and the other part of the counterweight 360.

[0071] Since the counterweight 360 and the suction nozzle 320 are located on opposite sides of the reference plane, along the third direction F3, the counterweight 360 and the suction nozzle 320 are situated on opposite sides of the central axis of the output end of the second drive mechanism 200. Thus, the counterweight 360 can be used to change the center of gravity of the flip arm 300, so that the center of gravity of the flip arm 300 can approximately coincide with the central axis of the output end of the second drive mechanism 200, achieving flipping stability during the high-speed flipping and picking up of the chip 20. In some embodiments, the counterweight 360 is used to make the center of gravity of the flip arm 300 coincide with the central axis of the output end of the second drive mechanism 200, thereby achieving flipping stability during the high-speed flipping and picking up of the chip 20.

[0072] In some embodiments, the swing arm seat 330 is provided with a first mounting hole 331, and the output end of the second drive mechanism 200 is adapted to be engaged with the first mounting hole 331.

[0073] This facilitates the assembly or disassembly of the output end of the second drive mechanism 200 to the swing arm seat 330, improving the ease of installation and disassembly of the tilting swing arm 300.

[0074] In some embodiments, the swing arm seat 330 has a first end 332 and a second end 333 disposed opposite each other along a third direction F3. Along the third direction F3, the suction nozzle 320 is closer to the second end 333 than the first end 332. Along the third direction F3, the output end of the second drive mechanism 200 is closer to the first end 332 than the second end 333. The first direction F1, the second direction F2, and the third direction F3 intersect each other.

[0075] The suction nozzle 320, which is closer to the second end 333, is farther from the first end 332 and the output end of the second drive mechanism 200. This allows the flipping arm 300 to operate in torque mode during the flipping of the chip 20 (the suction nozzle 320 has a long lever arm). This makes it easier to further control the force with which the flipping arm 300 picks up the chip 20, which can better reduce damage to the chip and thus improve the yield during chip flipping operations.

[0076] In some embodiments, the swing arm seat 330 is provided with one of the positive electrode 381 and the negative electrode 382, ​​and the nozzle seat 350 is provided with the other of the positive electrode 381 and the negative electrode 382.

[0077] Under normal conditions, the positive electrode 381 and the negative electrode 382 are in contact with each other. When the first elastic element 310 is in a contracted state, the positive electrode 381 and the negative electrode 382 are separated from each other.

[0078] Positive electrode 381 and negative electrode 382 are used for height measurement operations under normal conditions.

[0079] In some embodiments, the chip flipping device 10 further includes a bracket 400 and a second elastic member 500. The bracket 400 is connected to the output end of the first driving mechanism 100, the second driving mechanism 200 is disposed on the bracket 400, and the second elastic member 500 is connected to the first driving mechanism 100 and the bracket 400 respectively.

[0080] Optionally, the bracket 400 includes a first frame 410 and a second frame 420 connected together, the output end of the first drive mechanism 100 is connected to the first frame 410, and the second drive mechanism 200 is mounted on the second frame 420.

[0081] Thus, during the process of the first drive mechanism 100 driving the second drive mechanism 200 to move along the first direction F1, if the first drive mechanism 100 suddenly loses power or suddenly stops operating, the bracket 400 and the flipping arm 300 will easily slide downward under the action of gravity. During this process, the second elastic element 500 can play a buffering and supporting role for the bracket 400 and the flipping arm 300, thereby improving the safety and stability of the chip flipping device 10.

[0082] In some embodiments, the second elastic element 500 is provided with at least two.

[0083] Thus, during the process of sudden power failure or sudden stop of operation of the first drive mechanism 100, at least two second elastic elements 500 can better provide buffer support for the bracket 400 and the flipping swing arm 300, thereby improving the safety and stability of the chip flipping device 10.

[0084] All second elastic elements 500 are provided on the base 600 described below.

[0085] In some embodiments, the second elastic member 500 extends along the first direction F1.

[0086] Thus, during the process of the first drive mechanism 100 suddenly losing power or suddenly stopping, the second elastic element 500 can better support the bracket 400 and the flipping arm 300 along the first direction F1, thereby improving the safety and stability of the chip flipping device 10.

[0087] In some embodiments, the first drive mechanism 100 includes a voice coil motor.

[0088] This allows for a shorter up-and-down picking time for the flip arm 300.

[0089] Of course, this application is not limited to this. For chips 20 with strong bearing capacity, the first drive mechanism 100 may also include a cylinder.

[0090] In some embodiments, the chip flipping device 10 further includes a base 600 and a second guide rail 700, with the first drive mechanism 100 and the second guide rail 700 respectively mounted on the base 600, and the bracket 400 slidably connected to the second guide rail 700 along the first direction F1.

[0091] Optionally, two second guide rails 700 are provided.

[0092] In this way, the first drive mechanism 100 can drive the second drive mechanism 200 and the flipping arm 300 to move directionally along the first direction F1, so that the second drive mechanism 200 and the flipping arm 300 have good straightness in the linear movement along the first direction F1. The chip flipping device 10 of this application solves the problem of chip 20 flipping in the flip chip bonding process. Moreover, the chip flipping device 10 of this application, through the setting of the first elastic element 310, provides a buffer for the nozzle 320 when picking up the chip 20, which increases the force control of the chip 20. In addition, the flipping arm 300 operates in torque mode during the picking process, which can further control the force of picking up the chip 20, and can better improve the defects such as chip edge breakage.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip flipping device, characterized in that, include: First drive mechanism; The second drive mechanism is connected to the output end of the first drive mechanism, and the first drive mechanism is used to drive the second drive mechanism to move up and down along the first direction. and A flipping swing arm is connected to the output end of the second drive mechanism, which is used to drive the flipping swing arm to rotate about an axis parallel to the second direction. The flipping arm includes a swing arm base, a first elastic element, and a suction nozzle for adsorbing or releasing the chip. The swing arm seat is connected to the output end of the second drive mechanism, and the suction nozzle is connected to the first elastic element and the swing arm seat respectively. The first direction and the second direction intersect each other.

2. The chip flipping device according to claim 1, characterized in that, The first elastic element extends along the first direction.

3. The chip flipping device according to claim 1, characterized in that, The tilting arm also includes: A nozzle holder, wherein the nozzle is disposed on the nozzle holder; and The first guide rail, which extends in the first direction, is connected to the swing arm seat; The first elastic element is connected to the nozzle seat and the first guide rail respectively; The nozzle seat is slidably connected to the first guide rail along the first direction.

4. The chip flipping device according to any one of claims 1-3, characterized in that, The tilting swing arm also includes a counterweight disposed on the swing arm seat; A plane passing through the central axis of the output end of the second drive mechanism is defined as a reference plane, which is parallel to the first direction and the second direction; The counterweight and the suction nozzle are located on opposite sides of the reference plane.

5. The chip flipping device according to claim 4, characterized in that, The counterweight is used to make the center of gravity of the tilting arm coincide with the central axis of the output end of the second drive mechanism.

6. The chip flipping device according to any one of claims 1-3, characterized in that, The swing arm seat is provided with a first mounting hole; The output end of the second drive mechanism is adapted to snap into the first mounting hole.

7. The chip flipping device according to any one of claims 1-3, characterized in that, The swing arm seat has a first end and a second end disposed opposite to each other along a third direction; Along a third direction, the suction nozzle is closer to the second end than to the first end; Along a third direction, the output end of the second drive mechanism is closer to the first end than the second end; The first direction, the second direction, and the third direction intersect each other.

8. The chip flipping device according to any one of claims 1-3, characterized in that, The chip flipping device further includes: A bracket is connected to the output end of the first drive mechanism; the second drive mechanism is mounted on the bracket; and The second elastic element is connected to both the first driving mechanism and the bracket.

9. The chip flipping device according to claim 8, characterized in that, The second elastic element is provided with at least two; and / or The second elastic element extends along the first direction.

10. The chip flipping device according to any one of claims 1-3, characterized in that, The first drive mechanism includes a voice coil motor or a cylinder.

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