Semiconductor wafer pre-bonding jig

Abstract

The utility model relates to a pre-bonding jig for a semiconductor wafer. The pressure applying mechanism adopts gravity as a power source and applies pressure to wafers in the pre-bonding process through a connected pressing plate, and the wafer bearing units are arranged on the bearing substrate and used for bearing the wafers to be bonded; the wafer positioning mechanism comprises positioning bearings and sliding block guide rail mechanisms, the positioning bearing mechanisms are arranged on the two sides of each wafer bearing unit respectively, the positioning bearing mechanisms are driven to move through movement of the guide rail sliding block mechanisms, and alignment and positioning of wafers are achieved; and when the guide rail slide block mechanism is manually pushed to move, the spring mechanism enables the wafer positioning mechanism to automatically return to the original position. According to the utility model, high-precision and stable bonding between a thinned wafer, especially a wafer with a large warpage, and the bearing substrate is realized, and the bonding quality and the production efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser technology, and in particular to a semiconductor wafer pre-bonding fixture. Background Technology

[0002] Temporary bonding technology plays a crucial role in semiconductor device manufacturing, especially in the processing of special semiconductor devices such as thin wafers and flexible chips. For example, in advanced 3D integrated circuit manufacturing, wafer-level packaging, and processes requiring back-side processing (such as wafer thinning and back-side metallization), it is necessary to temporarily bond the wafer to a carrier substrate. Existing temporary bonding processes have several problems. First, during bonding, the alignment accuracy between the thinned wafer, especially one with significant warpage, and the carrier substrate is difficult to guarantee, often resulting in large relative positional deviations after bonding, affecting the accuracy of subsequent processes and device performance. Second, traditional bonding methods lack effective pre-bonding techniques; direct high-temperature, high-pressure bonding can easily lead to problems such as bubbles and stress concentration between the wafer and the carrier substrate, reducing bonding quality and device reliability. Furthermore, some existing bonding equipment is complex in structure and expensive, hindering large-scale production applications. Utility Model Content

[0003] Based on the technical problems existing in the background technology, this utility model proposes a semiconductor wafer pre-bonding fixture to achieve high-precision and stable bonding of thinned wafers, especially wafers with large warpage, to the carrier substrate, thereby improving bonding quality and production efficiency.

[0004] This utility model proposes a semiconductor wafer pre-bonding fixture, comprising:

[0005] The pressure application mechanism uses gravity as a power source and applies pressure to the wafer during the pre-bonding process via connected pressure plates.

[0006] Several wafer carrier units are disposed on a carrier substrate and are used to carry wafers to be bonded;

[0007] The wafer positioning mechanism includes positioning bearings and slider guide rail mechanisms. Each wafer carrier unit is equipped with a positioning bearing mechanism on both sides. The positioning bearing mechanism is moved by the slider guide rail mechanism to achieve the alignment and positioning of the wafer.

[0008] The spring mechanism causes the wafer positioning mechanism to automatically return to its original position after the guide rail slider mechanism is manually pushed to move.

[0009] The buffer mechanism, used in conjunction with the spring mechanism, serves a buffering function.

[0010] The heating mechanism is used to heat the carrier substrate and the wafer carrier unit and maintain a constant temperature. During the pre-bonding process, it softens the bonding adhesive on the surface of the carrier substrate, thereby allowing the wafer to adhere to the carrier substrate.

[0011] Preferably, the wafer carrier unit includes a wafer positioning groove, a wafer picking station, and two positioning bearing grooves, wherein the positioning bearing grooves are adapted to the positioning bearing mechanism.

[0012] Preferably, the pressure application mechanism is provided with a wafer clamping sheet adapted to the wafer positioning groove.

[0013] Preferably, the heating mechanism heats and maintains the wafer carrier unit at 100°C-200°C.

[0014] Preferably, the buffer mechanism is mounted on the spring mechanism and used in conjunction with the spring mechanism to provide a buffering effect.

[0015] Preferably, the spring mechanism is located on the support substrate.

[0016] The beneficial effects of this invention are as follows: the pre-bonding fixture can effectively and accurately position the thinned wafer, especially the wafer with large warpage, and the carrier substrate, reducing bonding offset; the use of the pre-bonding fixture in conjunction with the heating unit and pressure mechanism can form a pre-bonded structure between the semiconductor wafer and the carrier substrate, reducing the generation of defects such as bubbles, and providing a good foundation for formal bonding. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor wafer pre-bonding fixture proposed in this utility model.

[0018] Figure 2 This is a schematic diagram of the structure of the wafer carrier unit of this utility model.

[0019] In the diagram: 1. Pressure application mechanism, 2. Wafer carrier unit, 3. Wafer positioning mechanism, 4. Spring mechanism, 5. Buffer mechanism, 6. Heating mechanism, 7. Wafer positioning groove, 8. Wafer picking station, 9. Positioning bearing groove. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figure 1-2 A semiconductor wafer pre-bonding fixture, comprising:

[0022] Pressure application mechanism 1: Gravity is used as the power source. Pressure is applied to the wafer during the pre-bonding process through the connected pressure plate. The pressure plate has good flatness, and the holding time can ensure the bonding effect of the wafer during the pre-bonding process.

[0023] The wafer carrier unit 2 consists of several units disposed on the carrier substrate for carrying wafers to be bonded. The wafer carrier unit 2 includes a wafer positioning groove 7, a wafer picking station 8, and two positioning bearing grooves 9, which are adapted to the positioning bearing mechanism. The pressure application mechanism 1 is provided with a wafer pressing sheet adapted to the wafer positioning groove 7. The surface of the carrier substrate is flat to ensure the flatness of the carrier wafer placement.

[0024] The wafer positioning mechanism 3 includes a positioning bearing and a slider guide rail mechanism. Each wafer carrier unit is equipped with a positioning bearing mechanism on both sides. The positioning bearing mechanism is moved by the slider guide rail mechanism to achieve the alignment and positioning of the wafer.

[0025] Spring mechanism 4: When the guide rail slider mechanism is manually pushed to move, the spring mechanism 4 causes the wafer positioning mechanism 3 to automatically return to the original position.

[0026] The buffer mechanism 5 works in conjunction with the spring mechanism 4 to provide a buffering effect; specifically, the buffer mechanism 5 is mounted on the spring mechanism 4 and works in conjunction with the spring mechanism 4 to provide a buffering effect.

[0027] Heating mechanism 6 is used to heat the carrier substrate and the wafer carrier unit 2 and maintain a constant temperature of 100℃-200℃. During the pre-bonding process, it softens the bonding adhesive on the surface of the carrier substrate, thereby allowing the wafer to adhere to the carrier substrate.

[0028] A method of using a semiconductor wafer pre-bonding fixture, characterized by comprising the following steps:

[0029] S1. Bonding adhesive: First, apply temporary bonding adhesive to the substrate, place it in heating mechanism 6 for heating and curing, heating temperature 150-200℃, heating time 10-20 minutes, and then cool for later use.

[0030] S2. Placement and positioning of the carrier substrate and wafer: The wafer carrier unit 2 is placed into the wafer carrier unit positioning groove of the carrier substrate coated with temporary bonding adhesive. Then, the semiconductor wafer is placed on the carrier substrate. Since the wafer to be bonded has a large warp, the pressure application mechanism 1 needs to be placed on the wafer carrier unit 2 to apply pressure to the semiconductor wafer and the carrier substrate to make them initially bonded. Then, the wafer positioning mechanism 3 is used to perform secondary positioning of the carrier substrate and the semiconductor wafer to make the semiconductor wafer and the carrier substrate accurately aligned.

[0031] S3, Pre-bonding: The heating mechanism 6 is set to a temperature of 100-120℃ to heat the wafer, causing the temporary bonding adhesive to soften at this temperature. At the same time, under the action of the pressure application mechanism 1, the substrate and the semiconductor wafer will bond together. The action time is 5-10 minutes. Then the pressure application mechanism 1 is removed, and the pre-bonded wafer assembly is taken out and cooled using a suction pen to complete the pre-bonding process. The heating temperature and pressure are set according to the characteristics of the temporary bonding adhesive.

[0032] S4. Formal Bonding: The pre-bonded wafer assembly is transferred to the formal bonding equipment for formal bonding under higher temperature and pressure conditions, so that the temporary bonding adhesive is completely cured, achieving a firm bond between the semiconductor wafer and the carrier substrate. The formal bonding temperature can be set at 120-180℃, the pressure can be set at 0.5-1.5MPa, and the bonding time is 5-10 minutes.

[0033] This invention utilizes a wafer positioning mechanism in a pre-bonding fixture to precisely position the thinned wafer, especially wafers with significant warpage, and the supporting substrate. This ensures accurate alignment of the two during the pre-bonding process, greatly reducing bonding misalignment and improving bonding accuracy and the quality of semiconductor devices.

[0034] During the pre-bonding process, the combined use of the pressure application mechanism and the heating unit allows the temporary bonding adhesive to initially cure under appropriate pressure and temperature conditions, forming a pre-bonded structure. This reduces the generation of defects such as bubbles, provides a good foundation for formal bonding, and further improves the stability and reliability of the bonding.

[0035] This invention simplifies the bonding process, reduces adjustment and repair time during bonding, and improves semiconductor manufacturing efficiency by providing stable bonding results and lowering the scrap rate. The invention has a simple structure, low cost, and is easier to operate compared to some complex existing bonding equipment.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor wafer pre-bonding fixture, characterized in that, include; The pressure application mechanism (1) uses gravity as a power source and applies pressure to the wafer during the pre-bonding process through a connected pressure plate. The wafer carrier unit (2) consists of several units disposed on the carrier substrate and is used to carry the wafer to be bonded. The wafer positioning mechanism (3) includes a positioning bearing and a slider guide rail mechanism. Each wafer carrier unit is provided with a positioning bearing mechanism on both sides. The positioning bearing mechanism is moved by the slider guide rail mechanism to achieve the alignment and positioning of the wafer. Spring mechanism (4): When the guide rail slider mechanism is manually pushed to move, the spring mechanism (4) causes the wafer positioning mechanism (3) to automatically return to the original position. The buffer mechanism (5) works in conjunction with the spring mechanism (4) to provide a buffering effect; The heating mechanism (6) is used to heat the carrier substrate and the wafer carrier unit (2) and maintain a constant temperature. During the pre-bonding process, the bonding adhesive on the surface of the carrier substrate is softened, thereby allowing the wafer to adhere to the carrier substrate.

2. The semiconductor wafer pre-bonding fixture according to claim 1, characterized in that, The wafer carrier unit (2) includes a wafer positioning groove (7), a wafer picking station (8), and two positioning bearing grooves (9), which are adapted to the positioning bearing mechanism.

3. The semiconductor wafer pre-bonding fixture according to claim 1, characterized in that, The pressure application mechanism (1) is provided with a wafer pressing sheet that is adapted to the wafer positioning groove (7).

4. A semiconductor wafer pre-bonding fixture according to claim 1, characterized in that, The heating mechanism (6) heats the wafer carrier unit (2) and maintains it at 100°C-200°C.

5. A semiconductor wafer pre-bonding fixture according to claim 1, characterized in that, The buffer mechanism (5) is mounted on the spring mechanism (4) and used in conjunction with the spring mechanism (4) to provide a buffering effect.

6. A semiconductor wafer pre-bonding fixture according to claim 1, characterized in that, The spring mechanism (4) is located on the support substrate.

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