IGBT pin gluing device

Abstract

The utility model belongs to the technical field of electrical elements, and particularly relates to an IGBT pin gluing device. The IGBT pin gluing device comprises a vertical moving pair which is arranged on the side wall of a moving sliding block of a horizontal moving pair; the gluing gun is vertically arranged on the side wall of the sliding plate of the vertical moving pair and communicates with the glue barrel; a buffer cavity is formed in the gluing gun; the gluing head is detachably arranged on the bottom wall of the outer end of the gluing gun in a sleeving manner, and a plurality of stepped slow flow apertures are formed in the gluing head in a matrix manner; wherein the glue solution flows into the buffer cavity, and the buffer cavity is suitable for balancing the flow velocity and pressure distribution of the glue solution; when the glue solution flows downwards through the stepped slow flow hole diameter, the flow speed of the glue solution is further reduced by the stepped slow flow hole diameter; and through the buffer cavity and the stepped slow flow hole diameter, the flowing speed of the glue solution can be slowed down, and the glue is prevented from dripping downwards when gluing is stopped.

Description

Technical Field

[0001] This utility model belongs to the field of electrical component technology, and in particular relates to an IGBT pin adhesive application device. Background Technology

[0002] The IGBT (Insulated Gate Bipolar Transistor) pin insertion machine is a key piece of equipment used in the IGBT module assembly process. It is responsible for inserting pins into designated positions on the IGBT module.

[0003] In related technologies, after the pin insertion process is completed, the chip surface needs to be coated with adhesive and sealed. However, when the adhesive applicator is applying adhesive to the chip surface, excess adhesive will drip onto the chip, resulting in adhesive overflow during sealing. This adhesive overflow can affect the signal transmission path.

[0004] Therefore, how to avoid excess glue dripping onto the chip during the application of adhesive is a technical problem that urgently needs to be solved in this field.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore, the above description is not considered to constitute information related to the technology. Utility Model Content

[0006] This disclosure provides at least one IGBT pin adhesive application device.

[0007] In a first aspect, embodiments of this disclosure provide an IGBT pin adhesive application apparatus, comprising:

[0008] Horizontal sliding joint;

[0009] A vertical sliding joint is disposed on the side wall of the sliding slider of the horizontal sliding joint;

[0010] The glue gun is vertically mounted on the side wall of the slide plate of the vertical moving joint and is connected to the glue cartridge.

[0011] The glue gun is equipped with a buffer chamber.

[0012] The glue applicator head is detachably fitted onto the bottom wall of the glue applicator gun and located below the buffer chamber. It has several stepped slow-flow orifices arranged in a matrix through it.

[0013] In one optional embodiment, a plurality of guide fins are arranged axially within the buffer cavity.

[0014] In one alternative embodiment, the guide fins are inclined and form a 15° angle with the horizontal plane.

[0015] In one optional embodiment, the length of the guide fin is 2 / 3 to 4 / 5 of the height of the buffer cavity, so that the adhesive can fully contact the guide fin.

[0016] In one alternative implementation, the stepped flow aperture is divided into three levels from the inlet to the outlet, with the aperture gradually decreasing.

[0017] In one alternative implementation, the depth gradient of each aperture level in the stepped flow aperture increases.

[0018] In one alternative embodiment, the stepped flow-slowing apertures are arranged in a honeycomb hexagonal pattern, and the distance between two adjacent apertures is greater than 1.5 times the diameter of the aperture.

[0019] Secondly, this disclosure also provides an IGBT pin adhesive application device, comprising:

[0020] The workbench has a rotating rubber-spreading turntable on it.

[0021] The loading robot is located on one side of the glue-spreading turntable and is suitable for placing workpieces into the workstation of the glue-spreading turntable.

[0022] The glue-applying device is located above the glue-applying turntable and is suitable for applying glue to the workpiece.

[0023] The glue gun is located at the lower end of the glue application device;

[0024] The detection device, located on one side of the glue-applying turntable, is suitable for detecting whether the glue application on the workpiece surface is qualified.

[0025] In one alternative embodiment, a lifting mechanism is provided on one side of the workbench near the loading robot, the lifting mechanism being adapted to drive the pallet carrying the workpiece to move up and down.

[0026] The beneficial effects of this utility model are that it provides an IGBT pin coating device. By setting a buffer chamber in the coating gun and a stepped slow-flow orifice in the coating head, it can not only prevent the instantaneous amount of glue during coating and prevent pulsed glue overflow, but also prevent glue from dripping downwards when coating stops, thus avoiding excess glue dripping onto the chip and improving the coating quality.

[0027] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of this utility model, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 A perspective view of the IGBT pin adhesive application apparatus provided in an embodiment of this disclosure;

[0031] Figure 2 A perspective view of the dispensing head provided in an embodiment of this disclosure;

[0032] Figure 3 A cross-sectional perspective view of the dispensing head provided in an embodiment of this disclosure;

[0033] Figure 4 A cross-sectional front view of the glue gun and glue head provided in an embodiment of this disclosure;

[0034] Figure 5 A perspective view of the IGBT pin adhesive application apparatus provided in an embodiment of this disclosure.

[0035] In the picture:

[0036] 1. Vertical moving pair; 10. Glue tube; 11. Horizontal moving pair; 12. Moving slider; 13. Slide plate; 2. Glue gun; 20. Buffer chamber; 21. Guide fin; 3. Glue head; 30. Stepped slow flow orifice; 4. Worktable; 5. Feeding robot; 6. Glue application device; 7. Lifting mechanism; 8. Glue application turntable. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0038] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0039] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0040] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0041] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0042] Research has revealed that, among related technologies, the IGBT (Insulated Gate Bipolar Transistor) pin insertion machine is a key piece of equipment used in the IGBT module assembly process. It is responsible for inserting pins into designated positions on the IGBT module.

[0043] In related technologies, after the pin insertion process is completed, the chip surface needs to be coated with adhesive and sealed. However, when the adhesive applicator is applying adhesive to the chip surface, excess adhesive will drip onto the chip, resulting in adhesive overflow during sealing. This adhesive overflow can affect the signal transmission path.

[0044] Therefore, how to avoid excess glue dripping onto the chip during the application of adhesive is a technical problem that urgently needs to be solved in this field.

[0045] The defects in the above solutions and the reasons for their occurrence are the results of the inventors' practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventors' contributions to this disclosure.

[0046] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0047] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0048] like Figures 1 to 5 As shown, at least one embodiment provides an IGBT pin coating device, comprising: a vertical moving pair 1, which is disposed on the side wall of the moving slider 12 of the horizontal moving pair 11; the vertical moving pair 1 is adapted to drive the coating gun 2 to move vertically, so as to apply adhesive to the chip. The coating gun 2 is vertically disposed on the side wall of the sliding plate 13 of the vertical moving pair 1 and communicates with the adhesive cartridge 10; a buffer chamber 20 is provided inside the coating gun 2; the inner wall of the buffer chamber 20 is coated with a silicon nitride ceramic coating (friction coefficient <0.1) to reduce adhesive residue. The coating head 3 is detachably sleeved on the bottom wall of the outer end of the coating gun 2, and has a plurality of stepped slow-flow orifices 30 arranged in a matrix inside; wherein, the adhesive flows into the buffer chamber 20, the buffer chamber 20 is adapted to balance the flow rate and pressure distribution of the adhesive; when the adhesive flows downward through the stepped slow-flow orifices 30, the flow rate of the adhesive is further reduced by the stepped slow-flow orifices 30. By setting a buffer chamber 20 in the glue gun 2 and a stepped slow-flow orifice 30 in the glue head 3, it is possible not only to prevent the instantaneous glue dispensing volume during glue application and prevent pulse-type glue overflow, but also to prevent glue from dripping downwards when glue application is stopped, thus avoiding excess glue dripping onto the chip and improving the glue application quality.

[0049] Reference Appendix Figure 4 The buffer cavity 20 has a plurality of flow-guiding fins 21 arranged axially within it. These fins are adapted to balance the flow rate and pressure distribution of the adhesive liquid. The flow-guiding fins 21 are inclined and form a 15° angle with the horizontal plane. The length of each flow-guiding fin 21 is 2 / 3 to 4 / 5 of the height of the buffer cavity 20. Figure 4In this context, h1 represents the length of a single guide fin 21. This ensures that the adhesive fully contacts the guide fin 21. The surface of the guide fin 21 is coated with a polytetrafluoroethylene (PTFE) coating to prevent adhesive residue from curing. The tilt angle of the guide fin 21 guides the adhesive to flow smoothly, avoiding turbulence and air bubbles, and also prevents excessively high local flow velocities. The polished surface of the guide fin 21 reduces the viscous resistance of the adhesive, preventing residual adhesive buildup. This embodiment is applicable to adhesive viscosities in the range of 1000-5000 mPa·s.

[0050] Reference Appendix Figure 3 The stepped flow-slowing orifice 30 is divided into three levels from inlet to outlet, with the orifice diameter gradually decreasing; the number of orifices in each level gradually increases. The depth gradient of each level of the stepped flow-slowing orifice 30 increases. The stepped flow-slowing orifice 30 is arranged in a honeycomb hexagonal pattern, and the distance between two adjacent orifices is greater than 1.5 times the diameter of the orifice. Figure 3 In this diagram, h2 represents the spacing between two adjacent orifices. After the adhesive flows through the guide fins 21 into the stepped flow-slowing orifice 30, its flow rate and pressure fluctuations are slowed down by the guide fins 21. As the adhesive passes through the stepped flow-slowing orifice 30, its flow rate is further homogenized, while eliminating the influence of pulsed adhesive supply fluctuations. Furthermore, setting the stepped flow-slowing orifice 30 to three layers with progressively increasing orifice numbers and depths further reduces the adhesive flow rate and ensures more uniform distribution, guaranteeing smooth and stable adhesive dispensing. When adhesive application stops, the adhesive in the dispensing gun 2 will not drip downwards from the dispensing head 3, preventing the adhesive from dripping downwards.

[0051] Reference Appendix Figure 5 At least one embodiment provides an IGBT pin coating device, comprising: a worktable 4 on which a coating turntable 8 is rotatably mounted; a lifting mechanism 7 is provided on one side of the worktable 4 near a loading robot 5, the lifting mechanism 7 being adapted to drive a workpiece-bearing tray to move up and down. The lifting mechanism 7 is adapted to move the worktable 4 when the tray is moved. The loading robot 5 is located on one side of the coating turntable 8 and is adapted to place the workpiece on the workstation of the coating turntable 8; the loading robot 55 picks up the workpiece (IGBT module substrate) from the tray and places it on the workstation of the coating turntable 8. The loading robot 5 includes: a six-axis articulated robot, with a vacuum suction cup as the end effector. Visual positioning: integrated CCD camera + ring LED light source to achieve workpiece position compensation. A coating device 6 is located above the coating turntable 8 and is adapted to coat the workpiece with adhesive; the coating device 6 includes the coating gun 2 and coating head 3 mentioned in the above embodiments, which will not be described again here. A detection device is located on one side of the coating turntable 8 and is adapted to detect whether the coating on the workpiece surface is qualified. The glue-applying turntable 8 continues to rotate to the testing station, where the optical detection module determines whether the continuity, width, and amount of glue overflow of the glue layer are up to standard.

[0052] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0053] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0054] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An IGBT pin adhesive application device, characterized in that, include: Horizontal translation joint (11); A vertical sliding joint (1) is disposed on the side wall of the sliding block (12) of the horizontal sliding joint (11); The glue gun (2) is vertically mounted on the side wall of the slide plate (13) of the vertical moving pair (1) and is connected to the glue cylinder (10). The glue gun (2) is provided with a buffer chamber (20); The glue applicator (3) is detachably mounted on the bottom wall of the glue applicator (2) and located below the buffer chamber (20), and has several stepped slow-flow orifices (30) arranged in a matrix.

2. The IGBT pin adhesive application device as described in claim 1, characterized in that, The buffer cavity (20) is provided with several guide fins (21) along the axial direction.

3. The IGBT pin adhesive application device as described in claim 2, characterized in that, The guide fins (21) are inclined and form a 15° angle with the horizontal plane.

4. The IGBT pin adhesive application device as described in claim 2, characterized in that, The length of the guide fin (21) is 2 / 3 to 4 / 5 of the height of the buffer cavity (20) so that the adhesive can fully contact the guide fin (21).

5. The IGBT pin adhesive application device as described in claim 1, characterized in that, The stepped slow-flow orifice (30) is divided into three levels from the inlet to the outlet, and the orifice diameter gradually decreases.

6. The IGBT pin adhesive application device as described in claim 5, characterized in that, The depth gradient of each aperture of the stepped flow-slowing aperture (30) increases.

7. The IGBT pin coating apparatus as described in claim 6, characterized in that, The stepped flow apertures (30) are arranged in a honeycomb hexagonal pattern, and the distance between two adjacent apertures is greater than 1.5 times the diameter of the aperture.

8. An IGBT pin adhesive application device, characterized in that, include: A workbench (4) is provided with a rotating glue-spreading turntable (8). The loading robot (5) is set on one side of the glue-spreading turntable (8) and is suitable for placing the workpiece on the workstation of the glue-spreading turntable (8); The glue application device (6) is set above the glue application turntable (8) and is suitable for applying glue to the workpiece; The glue gun (2) is located at the lower end of the glue application device; The detection device is set on one side of the glue-applying turntable (8) and is suitable for detecting whether the glue coating on the surface of the workpiece is qualified.

9. The IGBT pin coating apparatus as described in claim 8, characterized in that, A lifting mechanism (7) is provided on one side of the workbench (4) near the loading robot (5). The lifting mechanism (7) is suitable for driving the pallet carrying the workpiece to move up and down.

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