Silicon core grinding mechanism and silicon core chamfering device

Abstract

The utility model relates to the technical field of silicon core machining, in particular to a silicon core grinding mechanism and a silicon core chamfering device, the silicon core grinding mechanism comprises a first guide rail, a walking support, a mounting support and a grinding wheel, and the length direction of the first guide rail is parallel to the placing direction of a silicon core; the walking support is installed on the first guide rail in a sliding mode. The installation support is slidably installed on the walking support, the moving direction of the installation support is perpendicular to the length direction of the first guide rail, and the grinding wheel is installed on the installation support. According to the utility model, the mounting bracket of which the moving direction is vertical to the length direction of the first guide rail is arranged, so that the grinding wheel can perform left-right reciprocating motion relative to the silicon core based on the mounting bracket while performing chamfering grinding on the whole silicon core along the placing direction of the silicon core along with the walking bracket; the usable area of the grinding surface of the grinding wheel can be fully utilized, the service life of the grinding wheel is guaranteed, the production cost is reduced, the machining precision is prevented from being reduced, and the grinding and chamfering quality is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of silicon core processing technology, and in particular to a silicon core grinding mechanism and a silicon core chamfering device. Background Technology

[0002] After silicon rods are cut into thin strips of silicon cores, the cores typically need to be ground and chamfered. Currently, conventional silicon core chamfering devices use a grinding wheel within the silicon core grinding mechanism to perform the grinding and chamfering. When grinding and chamfering a single silicon core B, since silicon core B is mostly stationary, the contact area between the grinding wheel A and silicon core B is mostly concentrated in the central area of ​​the grinding surface C. Figure 1 As shown, the grinding surface C of the grinding wheel is difficult to fully utilize except for the central area. Moreover, after long-term operation, uneven wear on the grinding surface C will not only shorten the service life of the grinding wheel A, but also lead to a decrease in machining accuracy and affect the quality of grinding chamfers. In order to ensure the quality of grinding chamfers, the grinding wheel needs to be replaced frequently, resulting in high production costs. Utility Model Content

[0003] This invention solves the problems in related technologies and proposes a silicon core grinding mechanism and a silicon core chamfering device, which can make full use of the usable area of ​​the grinding wheel surface, ensure the service life of the grinding wheel, reduce production costs, avoid the decline in processing accuracy, and ensure the quality of grinding and chamfering.

[0004] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0005] A silicon core grinding mechanism includes: a first guide rail, the length direction of which is parallel to the placement direction of the silicon core; a traveling bracket slidably mounted on the first guide rail; a mounting bracket slidably mounted on the traveling bracket, the direction of movement of the mounting bracket being perpendicular to the length direction of the first guide rail; and a grinding wheel mounted on the mounting bracket.

[0006] According to one embodiment of the present invention, the first guide rail is a roller guide rail, and a rack parallel to the roller guide rail and a gear cooperating with the rack are provided on one side of the roller guide rail. The traveling bracket is equipped with a slider suitable for sliding on the roller guide rail and a first drive module for driving the gear to rotate.

[0007] According to one embodiment of the present invention, the mounting bracket is slidably mounted on the traveling bracket via a second guide rail. A second drive module is mounted on the traveling bracket. The second drive module is used to drive the mounting bracket to move along the length direction of the second guide rail, and the length direction of the second guide rail is perpendicular to the length direction of the first guide rail.

[0008] According to one embodiment of the present invention, the walking bracket is provided with a distance adjustment module, and the mounting bracket is slidably mounted on the distance adjustment module. The distance adjustment module is used to adjust the distance between the mounting bracket and the silicon core.

[0009] According to one embodiment of the present invention, the distance adjustment module includes: a lifting bracket, which includes a first platform bracket and a second platform bracket, the first platform bracket and the second platform bracket being connected by a guide shaft, the guide shaft being movably connected to the traveling bracket via a linear bearing, and the mounting bracket being slidably mounted on the second platform bracket; and a lead screw motor, which is mounted on the first platform bracket and is used to drive the lifting bracket to move up and down relative to the traveling bracket along the guide shaft.

[0010] According to one embodiment of the present invention, it further includes a grinding wheel motor, which is mounted on the mounting bracket, and the output shaft of the grinding wheel motor is flexibly connected to the rotation shaft of the grinding wheel.

[0011] According to one embodiment of the present invention, the grinding wheel motor is mounted on a motor mounting plate, and the motor mounting plate is mounted on the mounting bracket via a shock absorber.

[0012] According to one embodiment of the present invention, a cooling module is further included. The cooling module is mounted on the walking bracket or the mounting bracket. The cooling module includes a water supply pipe and a nozzle connected to the water supply pipe. The nozzle is used to spray water to cool the grinding wheel and / or the silicon core.

[0013] According to one embodiment of the present invention, a clamping module is further included. The clamping module is located on the front and rear sides of the grinding wheel. The clamping module includes a clamping wheel and a clamping force adjusting unit. The radial outer surface of the clamping wheel is formed with a chamfered groove that matches the chamfer of the silicon core. The clamping wheel is mounted on the clamping force adjusting unit, which is mounted on the mounting bracket. The clamping force adjusting unit is used to adjust the clamping force of the clamping wheel relative to the silicon core.

[0014] According to one embodiment of the present invention, the clamping force adjusting unit includes: a mounting plate mounted on the mounting bracket; a movable plate rotatably connected to the mounting plate via a rotating shaft, wherein the clamping wheel is rotatably mounted on the wheel connecting portion of the movable plate, and the adjusting portion of the movable plate is located on one side of the limiting portion of the mounting plate; a support column, one end of which is located on the side of the limiting portion away from the adjusting portion, and the other end of which is limited by a limiting block on the side of the adjusting portion away from the limiting portion, wherein a limiting space suitable for the movement of the adjusting portion is formed between the limiting portion and the limiting block; and a spring, one end of which abuts against the limiting portion, and the other end of which is provided with an adjusting nut threadedly connected to the support column.

[0015] In addition, to achieve the above objectives, this utility model also provides a silicon core chamfering device.

[0016] A silicon core chamfering device includes: a silicon core grinding mechanism as described above and a silicon core placement rack, wherein the silicon core placement rack is used to place silicon cores, and the length direction of the first guide rail of the silicon core grinding mechanism is parallel to the placement direction of the silicon cores.

[0017] According to one embodiment of the present invention, it further includes: two sets of loading and unloading assemblies located on both sides of the silicon core placement frame, the loading and unloading assemblies including: a first loading module, the first loading module including a first placement frame and a first silicon core placement block disposed on the placement frame, the first silicon core placement block having a plurality of first grooves suitable for placing the silicon core at equal intervals; a second loading module, the second loading module including a second silicon core placement block, the second silicon core placement block having a plurality of second grooves suitable for placing the silicon core at equal intervals, the second grooves and the first grooves forming a channel suitable for the silicon core to pass through; a lifting module, the lifting module including a lifting bracket and a lifting cylinder mounted on the lifting bracket, the lifting cylinder being used to drive the second loading module to rise and fall; a traverse module, the traverse module including a traverse cylinder, the traverse cylinder being used to drive the lifting bracket to move along the loading or unloading direction of the silicon core.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting a mounting bracket whose movement direction is perpendicular to the length direction of the first guide rail, the grinding wheel can perform chamfer grinding on the silicon core along the placement direction of the silicon core while following the walking bracket. At the same time, it can also move back and forth relative to the silicon core based on the mounting bracket. This can make full use of the usable area of ​​the grinding surface of the grinding wheel, ensure the service life of the grinding wheel, reduce production costs, avoid the decline in processing accuracy, and ensure the quality of grinding chamfer. Attached Figure Description

[0019] Figure 1This is a schematic diagram of grinding and chamfering a silicon core using a grinding wheel in existing technology;

[0020] Figure 2 This is a schematic diagram of the silicon core grinding mechanism according to Embodiment 1 of this utility model;

[0021] Figure 3 This is a schematic diagram of the cooperation between the roller guide rail and the traveling bracket in Embodiment 1 of this utility model;

[0022] Figure 4 This is a schematic diagram of the silicon core grinding mechanism of Embodiment 1 of this utility model, omitting the first guide rail;

[0023] Figure 5 This is a side view of the silicon core grinding mechanism according to Embodiment 1 of this utility model, omitting the first guide rail;

[0024] Figure 6 This is a schematic diagram of the silicon core grinding mechanism according to Embodiment 2 of this utility model, omitting the first guide rail;

[0025] Figure 7 This is a schematic diagram of the structure of the mounting bracket, cooling module, and clamping module in Embodiment 2 of this utility model;

[0026] Figure 8 This is a schematic diagram of the clamping module in Embodiment 2 of this utility model;

[0027] Figure 9 This is a schematic diagram of the silicon core chamfering device according to Embodiment 3 of this utility model;

[0028] Figure 10 This is a schematic diagram of the loading and unloading assembly of Embodiment 3 of this utility model;

[0029] Figure 11 This is a top view of the loading and unloading assembly of Embodiment 3 of this utility model.

[0030] In the picture:

[0031] 1. First guide rail; 11. Linear guide rail; 12. Rack; 13. Roller; 14. Slider; 2. Traveling bracket; 21. First drive module; 3. Mounting bracket; 31. Second guide rail; 32. Second drive module; 321. Drive end; 4. Grinding wheel; 41. Rotary shaft; 5. Frame; 6. Distance adjustment module; 61. Lifting bracket; 611. First platform bracket; 612. Second platform bracket; 613. Guide shaft; 614. Locking nut; 615. Guide shaft fixing seat; 616. Linear bearing; 62. Lead screw. 7. Grinding wheel motor; 71. Output shaft; 72. Motor pulley; 73. Grinding wheel pulley; 74. V-belt; 75. Motor mounting plate; 76. Shock absorber; 8. Cooling module; 81. Water pipe; 82. Nozzle; 9. Pressing module; 91. Pressing wheel; 92. Pressing force adjustment unit; 921. Mounting plate; 921a. Limiting part; 922. Rotating shaft; 923. Movable plate; 923a. Wheel connection part; 923b. Adjusting part; 924. Support column; 925. Limiting block; 926. Spring; 927. Adjusting nut;

[0032] 10. Silicon core grinding mechanism; 20. Silicon core placement rack; 30. Loading and unloading assembly; 301. First loading module; 3011. First placement rack; 3012. First silicon core placement block; 3012a. First groove; 302. Second loading module; 3021. Second silicon core placement block; 3021a. Second groove; 303. Lifting module; 3031. Lifting bracket; 3032. Lifting cylinder; 304. Lateral movement module; 3041. Lateral movement cylinder; 3042. Lateral movement limit block; 3043. Lateral movement buffer; 3044. Lateral movement slide rail. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0034] Example 1

[0035] First refer to Figures 2 to 5 This invention describes the silicon core grinding mechanism of Embodiment 1 of the present invention.

[0036] like Figure 2As shown, the silicon core grinding mechanism of Embodiment 1 of this utility model includes: a first guide rail 1, a traveling bracket 2, a mounting bracket 3, and a grinding wheel 4. The length direction of the first guide rail 1 is parallel to the placement direction of the silicon core. The traveling bracket 2 is slidably mounted on the first guide rail 1. The mounting bracket 3 is slidably mounted on the traveling bracket 2, and the direction of movement of the mounting bracket 3 is perpendicular to the length direction of the first guide rail 1. The grinding wheel 4 is mounted on the mounting bracket 3. The first guide rail 1 can be mounted on a frame 5. The first guide rail 1 can be selected from ball bearing guides or roller guides according to actual needs; this embodiment does not impose any limitations.

[0037] It is understood that the silicon core grinding mechanism of this utility model embodiment, by setting a mounting bracket 3 whose movement direction is perpendicular to the length direction of the first guide rail 1, allows the grinding wheel 4 to perform chamfer grinding on the entire silicon core along the placement direction of the silicon core while following the walking bracket 2. At the same time, it can also move back and forth relative to the silicon core based on the mounting bracket 3. This can make full use of the usable area of ​​the grinding surface of the grinding wheel 4, ensure the service life of the grinding wheel 4, reduce production costs, avoid the decline in processing accuracy, and ensure the quality of grinding chamfer.

[0038] Considering the large amount of dust generated during the grinding and chamfering process, and for ease of later maintenance, the first guide rail 1 can be a roller guide rail 11. Specifically, as shown... Figure 3 As shown, a rack 12 parallel to the roller guide rail 11 and a gear 13 cooperating with the rack 12 can be provided on one side of the roller guide rail 11. A slider 14 suitable for sliding on the roller guide rail 11 and a first drive module 21 driving the gear 13 to rotate can be mounted on the walking bracket 2. The first drive module 21 can be a servo motor, the gear 13 can be a helical gear, and the rack 12 can be a helical rack cooperating with the helical gear. The drive motor drives the helical gear to rotate, causing the helical gear to move forward or backward along the helical rack while simultaneously driving the slider 14 mounted on the walking bracket 2 to move on the roller guide rail 11, thereby achieving overall sliding of the walking bracket 2. In some other embodiments of this utility model, the first drive module 21 can also be a stepper motor, etc., and the rack and gear can be replaced with a ball screw, etc. This embodiment is not limited in this respect.

[0039] In the silicon core grinding mechanism of Embodiment 1, a distance adjustment module 6 can be provided on the traveling bracket 2, and the mounting bracket 3 can be slidably mounted on the distance adjustment module 6. The distance adjustment module 6 is used to adjust the distance between the mounting bracket 3 and the silicon core, thereby realizing the adjustment of the distance between the grinding wheel 4 and the silicon core, and thus realizing the adjustment of the chamfering grinding amount.

[0040] Specifically, such as Figure 4As shown, the distance adjustment module 6 may include a lifting bracket 61 and a lead screw motor 62. The lifting bracket 61 includes a first platform bracket 611 and a second platform bracket 612, which are connected by a guide shaft 613 to form a three-beam four-column structure together with the traveling bracket 2. The guide shaft 613 may be provided with locking nuts 614 and guide shaft fixing seats 615 at both ends to fix the position of the guide shaft 613 relative to the first platform bracket 611 and the second platform bracket 612. The guide shaft 613 may also be movably connected to the traveling bracket 2 through a linear bearing 616. The mounting bracket 3 is slidably mounted on the second platform bracket 612. The lead screw motor 62 is mounted on the first platform bracket 611 and is used to drive the lifting bracket 61 to move up and down relative to the traveling bracket 2 along the guide shaft 613. When the second platform bracket 612 moves up and down, the grinding wheel 4 mounted on the mounting bracket 3 moves up and down synchronously with the second platform bracket 612, thereby adjusting the distance between the grinding wheel 4 and the silicon core, and thus adjusting the chamfering grinding amount. In some other embodiments of this utility model, a gear rack or other mechanism can be provided on one side of the lifting bracket 61 to drive the lifting bracket 51 to move up and down relative to the traveling bracket 2 along the guide shaft 613. This embodiment does not limit this.

[0041] Specifically, the mounting bracket 3 is slidably mounted on the second platform bracket 612 via the second guide rail 31. A second drive module 32 is mounted on the second platform bracket 612. The second drive module 32 drives the mounting bracket 3 to move along the length direction of the second guide rail 31, which is perpendicular to the length direction of the first guide rail 1, so that the direction of movement of the mounting bracket 3 is perpendicular to the length direction of the first guide rail 1. The second drive module 32 can be a cylinder mounted on the second platform bracket 612, with its drive end 321 connected to the mounting bracket 3. Since the mounting bracket 3 is slidably mounted on the second platform bracket 612 via the second guide rail 31, the cylinder only needs to provide a force parallel to the length direction of the second guide rail 31 to drive the mounting bracket 3 and the grinding wheel 4 mounted on the mounting bracket 3 to reciprocate left and right relative to the silicon core.

[0042] On the other hand, although not shown, the mounting bracket 3 in Embodiment 1 is also slidably mounted on the walking bracket 2 using a second guide rail 31 similar to that described above. The walking bracket 2 may be equipped with a second drive module for driving the mounting bracket 3 to move along the length direction of the second guide rail 31. The length direction of the second guide rail 31 is perpendicular to the length direction of the first guide rail 1, so that the movement direction of the mounting bracket 3 is perpendicular to the length direction of the first guide rail 1.

[0043] In the silicon core grinding mechanism of Embodiment 1, the silicon core grinding mechanism also includes a grinding wheel motor 7, which is mounted on the mounting bracket 3, and the output shaft 71 of the grinding wheel motor 7 is flexibly connected to the rotation shaft 41 of the grinding wheel 4.

[0044] Specifically, such as Figure 5 As shown, a motor pulley 72 can be fitted onto one side of the output shaft 71 of the grinding wheel motor 7, and a grinding wheel pulley 73 can be fitted onto one side of the rotating shaft 41 of the grinding wheel 4. The motor pulley 72 and the grinding wheel pulley 73 can rotate synchronously through a V-belt 74, thereby achieving synchronous rotation of the grinding wheel motor 7 and the grinding wheel 4. In some other embodiments of the present invention, the grinding wheel motor 7 can also be installed near the grinding wheel 4 as needed, and the motor pulley 72 and the grinding wheel 73 can also be driven by a synchronous belt or other transmission belt. The output shaft 71 of the grinding wheel motor 7 can also be directly connected to the rotating shaft 41 of the grinding wheel 4, etc. This embodiment does not impose any limitations.

[0045] Since the mounting bracket 3 can be slidably mounted on the traveling bracket 2, if the grinding wheel motor 7 is directly mounted on the mounting bracket 3, the vibration of the grinding wheel motor 7 during operation will have a certain impact on the working stability of the grinding wheel 4.

[0046] Therefore, in the silicon core grinding mechanism of Embodiment 1, the grinding wheel motor 7 can be mounted on the motor mounting plate 75, and the motor mounting plate 75 can be set on the mounting bracket 3 through the shock absorber 76 to ensure that the grinding wheel 4 runs smoothly and avoids affecting the chamfering quality.

[0047] Example 2

[0048] Next, refer to Figures 6 to 8 This invention describes the silicon core grinding mechanism of Embodiment 2 of the present invention.

[0049] like Figure 6 and 7As shown, the silicon core grinding mechanism in Embodiment 2 of this utility model, based on the silicon core grinding mechanism in Embodiment 1, may further include a cooling module 8. The cooling module 8 can be installed on the traveling support 2, or on the mounting support 3, or on the second platform support 612, so that the cooling module 8 can follow the movement of the traveling support 2 and spray water on the grinding wheel 4 and / or the silicon core in real time along the placement direction of the silicon core to achieve cooling. By timely heat dissipation of the silicon core and the grinding wheel 4, the accuracy of chamfering grinding is ensured, the friction temperature between the grinding wheel 4 and the silicon core is reduced, the wear and adhesion of the grinding wheel 4 are reduced, and the passivation of the grinding wheel 4 is delayed, thereby reducing the replacement frequency and tool cost. Specifically, a cooling module 8 can be set on the front and rear sides of the grinding wheel 4 respectively. Regardless of whether the traveling support 2 moves from front to back or from back to front, one cooling module 8 can spray water to cool the grinding wheel 4 or the silicon core in a timely manner. The cooling module 8 may include a water supply pipe 81 and a nozzle 82 connected to the water supply pipe 81. The nozzle 82 is used to spray water to cool the grinding wheel and / or the silicon core. The water supply pipe 81 can be uniformly installed on a fixed position on the walking support 2 or the mounting support 3 through the water distribution block, or it can be directly installed on the walking support 2 or the mounting support 3. This embodiment does not impose any restrictions.

[0050] To prevent the grinding wheel 4 from moving the silicon core and affecting the chamfering effect when it moves left and right, the silicon core grinding mechanism in Embodiment 2 of this utility model may further include clamping modules 9 located on the front and rear sides of the grinding wheel 4, which are used to provide clamping force to the silicon core. Specifically, the clamping module 9 includes a clamping wheel 91 and a clamping force adjusting unit 92. The radial outer surface of the clamping wheel 91 is formed with a chamfering groove that matches the chamfer of the silicon core. The clamping wheel 91 is mounted on the clamping force adjusting unit 92, which is mounted on the mounting bracket 3. The clamping force adjusting unit 92 is used to adjust the clamping force of the clamping wheel 91 relative to the silicon core.

[0051] like Figure 7 and 8As shown, in the silicon core grinding mechanism of Embodiment 2 of this utility model, the clamping force adjustment unit 92 may include: a mounting plate 921, a rotating shaft 922, a movable plate 923, a support column 924, a limiting block 925, a spring 926, and an adjusting nut 927 mounted on the mounting bracket 3. The movable plate 923 is rotatably connected to the mounting plate 921 via the rotating shaft 922. A clamping wheel 91 is rotatably mounted on the wheel connection portion 923a of the movable plate 923. The adjusting portion 923b of the movable plate 923 is located on one side of the limiting portion 921a of the mounting plate 921. One end of the support column 924 is located on the side of the limiting part 921a away from the adjusting part 923b, and the other end of the support column 924 passes through the adjusting part 923b and the limiting part 921a in sequence. It is limited by the limiting block 925 to the side of the adjusting part 923b away from the limiting part 921a. A limiting space suitable for the movement of the adjusting part 923b is formed between the limiting part 921a and the limiting block 925. One end of the spring 926 abuts against the limiting part 921a, and the other end of the spring 926 is provided with an adjusting nut 927 that is threadedly connected to the support column 924.

[0052] Understandably, based on the above configuration, in its natural state, the spring 926 has a certain amount of compression between the limiting part 921a and the adjusting nut 927. When the silicon core applies force to the clamping wheel 91, through force transmission, the spring 926 will provide a counter-pressure force to the silicon core through the clamping wheel 91, achieving adaptive clamping and preventing changes in the silicon core's posture. The compression of the spring 926 can be adjusted by adjusting the position of the adjusting nut 927, thereby adjusting the clamping force of the clamping wheel 91 relative to the silicon core to adapt to actual needs. In some other embodiments of this utility model, the clamping force adjustment unit 92 can also be configured as a lever structure similar to that of this embodiment, with the clamping wheel located at the free end of the lever structure, and the spring or other elastic reset structure providing the clamping force to the silicon core to the clamping wheel located at the other end of the lever structure (i.e., the adjustable end), to achieve adaptive clamping of the clamping wheel, etc. This embodiment does not impose any limitations.

[0053] In addition, to achieve the above objectives, this utility model also proposes a silicon core chamfering device.

[0054] Example 3

[0055] Next refer to Figures 9 to 11 This invention describes the silicon core chamfering device of Embodiment 3.

[0056] like Figure 9As shown, the silicon core chamfering device of Embodiment 3 of this utility model includes a silicon core grinding mechanism 10 and a silicon core placement rack 20 as described above. The silicon core placement rack 20 is used to place silicon cores, and the length direction of the first guide rail 1 of the silicon core grinding mechanism 10 is parallel to the placement direction of the silicon core. Specifically, the silicon core placement rack 20 may have grooves suitable for placing silicon cores, or may be equipped with slot blocks suitable for placing silicon cores. The silicon core grinding mechanism 10 may have multiple grinding wheels 4, and the grooves or slot blocks may be arranged in multiple rows to facilitate the silicon core grinding mechanism 10 to grind and chamfer multiple silicon cores simultaneously. This embodiment does not impose any limitations on this.

[0057] In addition, in the silicon core chamfering device of the third embodiment of this utility model, a rotating mechanism (not shown) that clamps the silicon core and drives the silicon core to rotate can also be provided on both sides of the silicon core placement frame 20, so that the silicon core rotates at a certain angle, thereby exposing the different chamfers of the silicon core in the grinding area of ​​the grinding wheel 4 in the silicon core grinding mechanism 10, so as to realize the chamfering grinding process of multiple chamfers of the silicon core.

[0058] The silicon core chamfering device of this invention, since it includes the silicon core grinding mechanism 10 as described above, also has the above-mentioned beneficial effects.

[0059] In the silicon core chamfering device of Embodiment 3 of this utility model, the silicon core chamfering device may further include: two sets of loading and unloading components 30 located on both sides of the silicon core placement rack 20, for delivering the silicon core to the vicinity of the silicon core placement rack 20, or placing it directly on the silicon core placement rack 20, or sending the silicon core away from the silicon core placement rack 20, or taking the silicon core directly from the silicon core placement rack 20 and sending it away.

[0060] Specifically, such as Figure 10 and 11As shown, the loading and unloading assembly 30 may include: a first unloading module 301, a second unloading module 302, a lifting module 303, and a transverse module 304. The first unloading module 301 may include a first placement frame 3011 and a first silicon core placement block 3012 disposed on the first placement frame 3011. The first silicon core placement block 3012 has multiple equally spaced first grooves 3012a suitable for placing silicon cores. The second unloading module 302 includes a second silicon core placement block 3021. The second silicon core placement block 3021 has multiple equally spaced second grooves 3021a suitable for placing silicon cores. The second grooves 3021a and the first grooves 3012a form a channel suitable for the passage of silicon cores. The lifting module 303 may include a lifting bracket. The lifting module 3031 and the lifting cylinder 3032 mounted on the lifting bracket 3031 are used to drive the second feeding module 302 to rise and fall. The lateral movement module 304 includes a lateral movement cylinder 3041 and optional lateral movement limiting block 3042, lateral movement buffer 3043 and lateral movement slide rail 3044. The lateral movement cylinder 3041 is used to drive the lifting bracket 3031 to move along the feeding or unloading direction of the silicon core. The lateral movement limiting block 3042 and the lateral movement buffer 3043 can be located on one side of the connection between the driving end of the lateral movement cylinder 3041 and the lifting bracket 3031, and are used to limit the lateral movement distance of the lifting bracket 3031. The lateral movement slide rail 3044 can be installed at the bottom of the lifting bracket 3031 to ensure the stability of the lifting bracket 3031 in the direction of movement. Both the lifting module 303 and the lateral movement module 304 can be installed on the first placement frame 3011 to ensure the stability of the lateral movement of the silicon core.

[0061] When the loading / unloading assembly 30 delivers the silicon core to the silicon core placement rack 20, the lifting cylinder 3032 drives the second unloading module 302 to rise, so that the silicon core placed on the second unloading module 302 leaves the first silicon core placement block 3012 and is positioned above the first silicon core placement block 3012; then, the lateral cylinder 3041 drives the lifting bracket 3031 to move along the silicon core loading direction, so that the second unloading module 302 on the lifting cylinder 3032 moves the silicon core along the loading direction; when the silicon core is above the first groove 3012a, which is closer to the silicon core placement rack 20, the lifting cylinder 3032 descends, placing the silicon core in the channel formed by the second groove 3021a and the first groove 3012a. Similarly, the silicon core can be delivered and removed through similar steps, which will not be repeated here. Understandably, because the first groove 3012a and the second groove 3021a are equally spaced, the loading and unloading assembly 30 can simultaneously transport multiple silicon cores for loading or unloading, and adjacent silicon cores will not affect each other, resulting in high loading and unloading efficiency and a high safety factor.

[0062] In addition, in embodiments not shown in this utility model, there may be multiple second silicon core placement blocks in the second feeding module 302, which are set on one or more second placement frames for assembly and subsequent maintenance. In this case, the lifting cylinder 3032 can also drive the lifting and lowering of the second placement frame to realize the overall lifting and lowering of the second feeding module 302.

[0063] In the silicon core chamfering device of Embodiment 3 of this utility model, the silicon core placement rack 20 may also be provided with a space suitable for the second feeding module 302 to extend into, so that the second feeding module 302 can place the silicon core directly on the groove or slot of the silicon core placement rack 20 when the lifting cylinder descends after the lateral movement, or directly remove the silicon core from the groove or slot of the silicon core placement rack 20 when the lifting cylinder 3032 rises after the lateral movement, so as to realize automatic feeding. In some other embodiments of this utility model, automated devices such as robotic arms are also used to grab silicon cores from the loading and unloading assembly 30 or place silicon cores on the loading and unloading assembly 30, and this embodiment does not limit this.

[0064] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0065] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0066] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0067] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0068] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A silicon core grinding mechanism, characterized in that, include: The first guide rail (1) has a length direction parallel to the placement direction of the silicon core; A traveling bracket (2) is slidably mounted on the first guide rail (1); Mounting bracket (3) is slidably mounted on the walking bracket (2), and the direction of movement of the mounting bracket (3) is perpendicular to the length direction of the first guide rail (1); A grinding wheel (4) is mounted on the mounting bracket (3).

2. The silicon core grinding mechanism according to claim 1, characterized in that, The first guide rail (1) is a roller guide rail (11). A rack (12) parallel to the roller guide rail (11) and a gear (13) cooperating with the rack (12) are provided on one side of the roller guide rail (11). A slider (14) suitable for sliding on the roller guide rail (11) and a first drive module (21) for driving the gear (13) to rotate are installed on the walking bracket (2).

3. The silicon core grinding mechanism according to claim 1, characterized in that, The mounting bracket (3) is slidably mounted on the walking bracket (2) via the second guide rail (31). The walking bracket (2) is equipped with a second drive module (32). The second drive module (32) is used to drive the mounting bracket (3) to move along the length direction of the second guide rail (31). The length direction of the second guide rail (31) is perpendicular to the length direction of the first guide rail (1).

4. The silicon core grinding mechanism according to claim 1, characterized in that, The walking bracket (2) is provided with a distance adjustment module (6), and the mounting bracket (3) is slidably mounted on the distance adjustment module (6). The distance adjustment module (6) is used to adjust the distance between the mounting bracket (3) and the silicon core.

5. The silicon core grinding mechanism according to claim 4, characterized in that, The distance adjustment module (6) includes: a lifting bracket (61), which includes a first platform bracket (611) and a second platform bracket (612), the first platform bracket (611) and the second platform bracket (612) being connected by a guide shaft (613), the guide shaft (613) being movably connected to the walking bracket (2) through a linear bearing (616), and the mounting bracket (3) being slidably mounted on the second platform bracket (612); and a lead screw motor (62), which is mounted on the first platform bracket (611) and is used to drive the lifting bracket (61) to move up and down relative to the walking bracket (2) along the guide shaft (613).

6. The silicon core grinding mechanism according to claim 1 or 4, characterized in that, It also includes a grinding wheel motor (7) mounted on the mounting bracket (3), the output shaft (71) of the grinding wheel motor (7) being connected to the rotation shaft (41) of the grinding wheel (4).

7. The silicon core grinding mechanism according to claim 6, characterized in that, The grinding wheel motor (7) is mounted on the motor mounting plate (75), which is mounted on the mounting bracket (3) via a shock absorber (76).

8. The silicon core grinding mechanism according to claim 1, characterized in that, It also includes a cooling module (8) installed on the walking bracket (2) or the mounting bracket (3), the cooling module (8) including a water supply pipe (81) and a nozzle (82) connected to the water supply pipe (81), the nozzle (82) being used to spray water to cool the grinding wheel (4) and / or the silicon core.

9. The silicon core grinding mechanism according to claim 1, characterized in that, It also includes clamping modules (9) located on the front and rear sides of the grinding wheel (4). The clamping module (9) includes a clamping wheel (91) and a clamping force adjusting unit (92) mounted on the mounting bracket (3). The outer radial surface of the clamping wheel (91) is formed with a chamfered groove. The clamping wheel (91) is mounted on the clamping force adjusting unit (92). The clamping force adjusting unit (92) is used to adjust the clamping force of the clamping wheel (91) relative to the silicon core.

10. The silicon core grinding mechanism according to claim 9, characterized in that, The clamping force adjusting unit (92) includes: a mounting plate (921) mounted on the mounting bracket (3); a movable plate (923), which is rotatably connected to the mounting plate (921) via a rotating shaft (922), wherein the clamping wheel (91) is rotatably mounted on the wheel connecting part (923a) of the movable plate (923), and the adjusting part (923b) of the movable plate (923) is located on one side of the limiting part (921a) of the mounting plate (921); and a support column (924), one end of which is located on the limiting part (921a). a) On the side away from the adjusting part (923b), the other end of the support column (924) is limited by the limiting block (925) to the side of the adjusting part (923b) away from the limiting part (921a), and a limiting space suitable for the movement of the adjusting part (923b) is formed between the limiting part (921a) and the limiting block (925); a spring (926), one end of the spring (926) abuts against the limiting part (921a), and the other end of the spring (926) is provided with an adjusting nut (927) that is threadedly connected to the support column (924).

11. A silicon core chamfering device, characterized in that, include: The silicon core grinding mechanism (10) and silicon core placement rack (20) as described in any one of claims 1-10, wherein the silicon core placement rack (20) is used to place silicon cores, and the length direction of the first guide rail (1) of the silicon core grinding mechanism (10) is parallel to the placement direction of the silicon cores.

12. The silicon core chamfering device according to claim 11, characterized in that, Also includes: Two sets of loading and unloading assemblies (30) are located on both sides of the silicon core placement frame (20). The loading and unloading assembly (30) includes: a first unloading module (301), which includes a first placement frame (3011) and a first silicon core placement block (3012) disposed on the first placement frame (3011). The first silicon core placement block (3012) has a plurality of first grooves (3012a) at equal intervals on it, which are suitable for placing the silicon core; and a second unloading module (302), which includes a second silicon core placement block (3021). The second silicon core placement block (3021) has a plurality of grooves at equal intervals on it, which are suitable for placing the silicon core. The second groove (3021a) of the silicon core and the first groove (3012a) form a channel suitable for the silicon core to pass through; the lifting module (303) includes a lifting bracket (3031) and a lifting cylinder (3032) mounted on the lifting bracket (3031), the lifting cylinder (3032) is used to drive the second feeding module (302) to rise and fall; the transverse module (304) includes a transverse cylinder (3041), the transverse cylinder (3041) is used to drive the lifting bracket (3031) to move along the feeding or unloading direction of the silicon core.

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