Silicon-based microneedle mold convenient to demold

Abstract

The silicon-based microneedle mold comprises a base, a silicon-based microneedle upper mold body, a silicon-based microneedle lower mold body, a ball nut and a demolding plate, a motor is installed in the base, a screw rod is installed at the power shaft end of the motor, the ball nut is installed on the screw rod in a threaded mode, a supporting rod is installed on the ball nut, and the silicon-based microneedle upper mold body and the silicon-based microneedle lower mold body are installed on the supporting rod. A supporting rod is installed on the base, a mounting table is installed at the top end of the supporting rod, a silicon-based microneedle lower mold is installed on the table top of the mounting table, a support is installed on the base, a linear motor set is installed on the support, an electric telescopic rod C is installed on the linear motor set, a demolding plate is installed at one end of the electric telescopic rod C, and a suction pump is installed on the demolding plate. A suction cup is installed on the bottom face of the demolding plate, and the suction pump is connected with the suction cup. According to the silicon-based microneedle demoulding device, the complexity and low efficiency of manual demoulding are avoided, the problem of adhesive residue caused by demoulding by using adhesive is also avoided, and the production efficiency and the product quality of the silicon-based microneedle are improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon-based microneedle molds, specifically a silicon-based microneedle mold that is easy to demold. Background Technology

[0002] Microneedle injection can be performed via direct injection or via patches. Microneedles on microneedle patches are typically soluble. A microneedle is a micrometer-scale array of needles. As a novel drug delivery system, it has wide applications in biomedical fields such as drug delivery, wound healing, biosensing, and body fluid sampling. Microneedles can penetrate the stratum corneum non-invasively, painlessly, and easily and controllably to produce systemic or local effects, avoiding some of the inconveniences associated with oral administration, such as the first-pass effect of the liver, gastric acid hydrolysis, poor drug absorption, and fear of needles. Silicon-based microneedles are generally prepared using molds.

[0003] The existing devices have the following shortcomings when in use: When demolding silicon-based microneedles, they are usually removed from the mold by manual means or by using adhesive. However, manual demolding is inefficient and can easily damage the silicon-based microneedles. Using adhesive for demolding leaves adhesive residue, which affects the quality of the silicon-based microneedles. At the same time, cleaning the adhesive increases the workload and affects the efficiency of silicon-based microneedle production. Utility Model Content

[0004] The purpose of this invention is to provide a silicon-based microneedle mold that is easy to demold, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a silicon-based microneedle mold for easy demolding, comprising a base, an upper silicon-based microneedle mold, a lower silicon-based microneedle mold, a ball bearing nut, and a demolding template. A motor is installed in the base, a lead screw is installed at the motor's power shaft end, a ball bearing nut is threaded onto the lead screw, a support rod is installed on the ball bearing nut, an mounting platform is installed at the top of the support rod, the lower silicon-based microneedle mold is installed on the mounting platform, a bracket is installed on the base, a linear motor assembly is installed on the bracket, an electric telescopic rod C is installed on the linear motor assembly, a demolding template is installed at one end of the electric telescopic rod C, a suction pump is installed on the demolding template, a suction cup is installed on the bottom surface of the demolding template, and the suction pump is connected to the suction cup.

[0006] Using the above technical solution, the silicon-based material to be processed is placed on the lower mold of the silicon-based microneedle, and then molded in conjunction with the upper mold of the silicon-based microneedle. After the silicon-based microneedle is produced, the upper mold of the silicon-based microneedle moves upward, the motor starts and drives the lead screw to rotate. When the lead screw rotates, the ball nut moves linearly on the lead screw, and the ball nut drives the support rod and the mounting table to move. The mounting table moves the lower mold of the silicon-based microneedle to below the demolding plate. The electric telescopic rod C starts and pushes the demolding plate down, so that the suction cup on the bottom of the demolding plate is attracted to the silicon-based microneedle by the suction pump. Then the electric telescopic rod C retracts and removes the silicon-based microneedle from the lower mold of the silicon-based microneedle. Then, through the linear motor group, the demolding plate and the attracted silicon-based microneedle are moved to the top of the collection box. The electric telescopic rod B is started to lower the support plate and put the silicon-based microneedle into the collection box for collection. This realizes the automatic demolding of silicon-based microneedles, avoiding the tediousness and inefficiency of manual demolding, and also avoiding the adhesive residue problem caused by using adhesive demolding, thus improving the production efficiency and product quality of silicon-based microneedles.

[0007] Preferably, an electric telescopic rod B is installed on the base, a support plate is installed at one end of the electric telescopic rod B, a connecting plate is installed on the rod, and the rod is slidably connected to the opening of the support plate.

[0008] Using the above technical solution, after the silicon-based microneedles are demolded, the motor rotates in the reverse direction, driving the lower mold of the silicon-based microneedles back to its initial position, ready for the next molding operation. At this time, the support rod, through the opening on the support plate, drives the connecting plate to the top of the support plate, and the electric telescopic rod B is activated to extend, so that the top of the support plate fits against the bottom of the connecting plate. The connecting plate is supported by the support plate, and the support rod and the lower mold of the silicon-based microneedles on the mounting platform are stabilized, enhancing the stability of the mold during molding and ensuring the production efficiency and quality of silicon-based microneedles.

[0009] Preferably, an electric telescopic rod A is installed on the bracket, and a silicon-based microneedle mold is installed at one end of the electric telescopic rod A.

[0010] Using the above technical solution, the telescopic movement of the electric telescopic rod A controls the up-and-down movement of the upper mold of the silicon-based microneedle. During the compression molding process, the electric telescopic rod A extends, causing the upper mold and the lower mold of the silicon-based microneedle to fit tightly together, applying pressure to the material placed in the mold and shaping it into a silicon-based microneedle. After compression molding is completed, the electric telescopic rod A retracts, separating the upper and lower molds of the silicon-based microneedle, preparing for demolding of the silicon-based microneedle and ensuring the accuracy and stability of the compression molding process.

[0011] Preferably, a collection box is installed on the base.

[0012] By adopting the above technical solution, the collection box facilitates the collection, storage and transportation of silicon-based microneedles, and facilitates subsequent counting, packaging and use, while maintaining a clean working environment.

[0013] Preferably, the slide bar installed on the silicon-based microneedle mold is slidably connected to the track opened on the bracket.

[0014] By adopting the above technical solution, the sliding rod installed on the silicon-based microneedle mold is slidably connected to the track opened on the support, making the silicon-based microneedle mold more stable when moving up and down, reducing the shaking of the mold during the movement, and further improving the accuracy and stability of compression molding.

[0015] Preferably, the protrusion installed on the ball nut is slidably connected to the groove opened in the base.

[0016] By adopting the above technical solution, the protrusion installed on the ball nut is slidably connected to the groove opened in the base, which restricts the rotation of the ball nut and makes the movement of the collection box on the base smoother and more stable.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: the suction cup on the bottom surface of the demolding template is used to adsorb the silicon-based microneedles under the action of the suction pump. Then, the electric telescopic rod C retracts to remove the silicon-based microneedles from the lower mold. Then, the demolding template and the adsorbed silicon-based microneedles are moved to the top of the collection box by the linear motor group. The electric telescopic rod B is activated to lower the support plate and put the silicon-based microneedles into the collection box for collection. This realizes the automatic demolding of silicon-based microneedles, avoiding the tediousness and inefficiency of manual demolding, and also avoiding the adhesive residue problem caused by using adhesive demolding. This improves the production efficiency and product quality of silicon-based microneedles. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0020] Figure 3 This is a schematic diagram of the demolding structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the placement structure of this utility model.

[0022] In the diagram: 1. Base; 2. Bracket; 3. Collection box; 4. Electric telescopic rod A; 5. Upper mold of silicon-based microneedles; 6. Lower mold of silicon-based microneedles; 7. Motor; 8. Lead screw; 9. Ball nut; 10. Support rod; 11. Mounting platform; 12. Connecting plate; 13. Support plate; 14. Electric telescopic rod B; 15. Linear motor assembly; 16. Electric telescopic rod C; 17. Demolding template; 18. Suction pump; 19. Suction cup. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] Please see Figure 1-4 This utility model provides an embodiment of a silicon-based microneedle mold that is easy to demold, comprising a base 1, an upper silicon-based microneedle mold 5, a lower silicon-based microneedle mold 6, a ball nut 9, and a demolding template 17. A motor 7 is installed in the base 1, a lead screw 8 is installed at the power shaft end of the motor 7, a ball nut 9 is threaded onto the lead screw 8, a support rod 10 is installed on the ball nut 9, an mounting platform 11 is installed at the top of the support rod 10, the lower silicon-based microneedle mold 6 is installed on the platform of the mounting platform 11, a bracket 2 is installed on the base 1, a linear motor assembly 15 is installed on the bracket 2, an electric telescopic rod C16 is installed on the linear motor assembly 15, a demolding template 17 is installed at one end of the electric telescopic rod C16, a suction pump 18 is installed on the demolding template 17, a suction cup 19 is installed on the bottom surface of the demolding template 17, and the suction pump 18 is connected to the suction cup 19.

[0025] The silicon-based material to be processed is placed on the lower mold 6 of the silicon-based microneedle and molded in conjunction with the upper mold 5 of the silicon-based microneedle. After the silicon-based microneedle is fabricated, the upper mold 5 of the silicon-based microneedle moves upward, and the motor 7 starts to drive the lead screw 8 to rotate. When the lead screw 8 rotates, the ball nut 9 moves linearly on the lead screw 8. The ball nut 9 drives the support rod 10 and the mounting platform 11 to move. The mounting platform 11 moves the lower mold 6 of the silicon-based microneedle to below the ejector plate 17. The electric telescopic rod C16 starts and pushes the ejector plate 17 down, so that the suction cup 19 on the bottom surface of the ejector plate 17 is in contact with the suction pump 18. Under the action of the motor, silicon-based microneedles are adsorbed. Then, the electric telescopic rod C16 retracts, removing the silicon-based microneedles from the lower mold 6. Then, through the linear motor 15, the demolding plate 17 and the adsorbed silicon-based microneedles are moved to the top of the collection box 3. The electric telescopic rod B14 is activated to lower the support plate 13, placing the silicon-based microneedles into the collection box 3 for collection. This realizes automatic demolding of silicon-based microneedles, avoiding the tediousness and inefficiency of manual demolding, and also avoiding the adhesive residue problem caused by using adhesive demolding, thus improving the production efficiency and product quality of silicon-based microneedles.

[0026] An electric telescopic rod B14 is installed on the base 1. A support plate 13 is installed at one end of the electric telescopic rod B14. A connecting plate 12 is installed on the support rod 10. The support rod 10 is slidably connected to the opening of the support plate 13. After the silicon-based microneedles are demolded, the motor 7 rotates in the reverse direction to drive the lower mold 6 of the silicon-based microneedles back to its initial position, ready for the next molding operation. At this time, the support rod 10, through the opening on the support plate 13, drives the connecting plate 12 to come above the support plate 13. The electric telescopic rod B14 is activated to extend, so that the top of the support plate 13 fits against the bottom of the connecting plate 12. The connecting plate 12 is supported by the support plate 13, and the support rod 10 and the lower mold 6 of the silicon-based microneedles on the mounting platform 11 are stabilized, enhancing the stability of the mold during molding and ensuring the production efficiency and quality of the silicon-based microneedles.

[0027] An electrically operated telescopic rod A4 is mounted on the support 2, and a silicon-based microneedle upper mold 5 is attached to one end of the electric telescopic rod A4. The telescopic movement of the electric telescopic rod A4 controls the up-and-down movement of the silicon-based microneedle upper mold 5. During the compression molding process, the electric telescopic rod A4 extends, causing the silicon-based microneedle upper mold 5 to fit tightly against the silicon-based microneedle lower mold 6, applying pressure to the material placed in the mold and shaping it into silicon-based microneedles. After compression molding is completed, the electric telescopic rod A4 retracts, separating the silicon-based microneedle upper mold 5 from the silicon-based microneedle lower mold 6, preparing for the demolding of the silicon-based microneedles and ensuring the accuracy and stability of the compression molding process.

[0028] A collection box 3 is installed on the base 1. The collection box 3 facilitates the collection, storage and transportation of silicon-based microneedles, and facilitates subsequent counting, packaging and use, while maintaining a clean working environment.

[0029] The sliding rod installed on the silicon-based microneedle mold 5 is slidably connected to the track opened on the support 2. The sliding connection between the sliding rod installed on the silicon-based microneedle mold 5 and the track opened on the support 2 makes the silicon-based microneedle mold 5 more stable when moving up and down, reduces the shaking of the mold during the movement, and further improves the accuracy and stability of compression molding.

[0030] The protrusion installed on the ball nut 9 is slidably connected to the groove in the base 1. By sliding the protrusion on the ball nut 9 to the groove in the base 1, the rotation of the ball nut 9 is restricted, making the movement of the collection box 3 on the base 1 smoother and more stable.

[0031] The circuit modules and electronic components involved in this application are all existing mature technologies, with many products on the market. They are all general standard parts or components known to those skilled in the art. Their structure and principles can be learned by those skilled in the art through technical manuals or conventional use. The scope of protection of this application does not involve improvements to the software and methods, so the models of electronic components and the control flow of the control system are not described in detail here. The motors are equipped with circuit controllers and brake mechanisms, which enable the motors to flexibly adjust the rotation direction and angle according to actual operating requirements, significantly improving the operational flexibility and safety performance of the equipment. The brake mechanism reliably locks the position when the motor stops, preventing accidental displacement caused by inertia and ensuring the stability and safety of the device in the stopped state.

[0032] Working principle: The silicon-based material to be processed is placed on the lower mold 6 of the silicon-based microneedle. The electric telescopic rod A4 extends, so that the upper mold 5 of the silicon-based microneedle and the lower mold 6 of the silicon-based microneedle fit tightly together, applying pressure to the material placed in the mold to form silicon-based microneedles. After molding, the electric telescopic rod A4 retracts, and the upper mold 5 of the silicon-based microneedle and the lower mold 6 of the silicon-based microneedle separate, preparing for demolding of the silicon-based microneedles. Then, the motor 7 is started to drive the lead screw 8 to rotate. When the lead screw 8 rotates, the ball nut 9 moves linearly on the lead screw 8. The ball nut 9 drives the support rod 10 and the mounting platform 11 to move. The mounting platform 11 moves the lower mold 6 of the silicon-based microneedle to below the demolding template 17. The electric telescopic rod C16 is started, pushing the demolding template 17 down, so that the suction cup 19 on the bottom surface of the demolding template 17 is attracted to the silicon-based microneedles by the suction pump 18. Then, the electric telescopic rod C16 retracts, and the silicon-based microneedles are removed from the mold. The needle is removed from the silicon-based microneedle lower mold 6, and then the demolding template 17 and the adsorbed silicon-based microneedles are moved to the collection box 3 via the linear motor group 15. The electric telescopic rod B14 is activated to lower the support plate 13 and put the silicon-based microneedles into the collection box 3 for collection. After the silicon-based microneedles are demolded, the motor 7 rotates in the opposite direction to drive the silicon-based microneedle lower mold 6 back to the initial position, ready for the next molding operation. This realizes automatic demolding of silicon-based microneedles, avoiding the tediousness and inefficiency of manual demolding, and also avoiding the adhesive residue problem caused by using adhesive demolding, thus improving the production efficiency and product quality of silicon-based microneedles.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A silicon-based microneedle mold for easy demolding, comprising a base (1), an upper silicon-based microneedle mold (5), a lower silicon-based microneedle mold (6), a ball nut (9), and a demolding template (17), characterized in that: A motor (7) is installed in the base (1). A lead screw (8) is installed on the power shaft end of the motor (7). A ball nut (9) is threaded on the lead screw (8). A support rod (10) is installed on the ball nut (9). An installation platform (11) is installed on the top of the support rod (10). A silicon-based microneedle mold (6) is installed on the platform of the installation platform (11). A bracket (2) is installed on the base (1). A linear motor assembly (15) is installed on the bracket (2). An electric telescopic rod C (16) is installed on the linear motor assembly (15). A demolding template (17) is installed at one end of the electric telescopic rod C (16). A suction pump (18) is installed on the demolding template (17). A suction cup (19) is installed on the bottom surface of the demolding template (17). The suction pump (18) is connected to the suction cup (19).

2. The silicon-based microneedle mold for easy demolding according to claim 1, characterized in that: An electric telescopic rod B (14) is installed on the base (1). A support plate (13) is installed at one end of the electric telescopic rod B (14). A connecting plate (12) is installed on the support rod (10). The support rod (10) is slidably connected to the opening of the support plate (13).

3. The silicon-based microneedle mold for easy demolding according to claim 1, characterized in that: An electric telescopic rod A (4) is installed on the bracket (2), and a silicon-based microneedle mold (5) is installed at one end of the electric telescopic rod A (4).

4. The silicon-based microneedle mold for easy demolding according to claim 1, characterized in that: A collection box (3) is installed on the base (1).

5. A silicon-based microneedle mold for easy demolding according to claim 1, characterized in that: The slide rod installed on the silicon-based microneedle mold (5) is slidably connected to the track opened on the bracket (2).

6. A silicon-based microneedle mold for easy demolding according to claim 1, characterized in that: The protrusion installed on the ball nut (9) is slidably connected to the groove opened in the base (1).

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