Blister box tray with partition baffles for screen chip

Abstract

The utility model relates to the technical field of chip packaging, and discloses a plastic uptake box tray with partition baffles for screen chips, which comprises a base tray, the surface of the base tray is fixedly connected with a side plate, a chip placing frame is clamped with a plastic buckle through a clamping groove on the lower surface, so that personnel can conveniently place the chips according to different sizes of the chips. The chip placing frames can be easily taken out and replaced with the appropriate chip placing frames, the situation that the chips cannot be firmly attached and shake due to the fact that the sizes of the chip placing frames are not appropriate is avoided, and therefore the chips are protected against damage in the storage and transportation process; according to the technical scheme, people can store the chips in a classified mode according to different purposes or sizes of the chips, mutual influence between the chips is avoided, meanwhile, rapid stacking between the two trays is achieved by inserting the positioning rods into the pre-positioning hole grooves, the stability of connection between the trays is enhanced, and the problems of chip displacement, damage and the like possibly caused by shaking are solved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a blister tray with partitions for screen chips. Background Technology

[0002] Effective packaging and protection of chips are crucial during their production, transportation, and storage. With the continuous development of screen chip technology, the types of chips are increasing, and their sizes and applications are becoming more diverse.

[0003] In traditional chip tray designs, the grooves within the tray are typically fixed, with chips usually embedded inside. This groove structure lacks flexibility when dealing with chips of different sizes. Because the groove size is fixed, it's difficult for the chip to fit snugly into the groove, creating a gap between the chip and the inner wall of the groove. During transportation and storage, this gap causes the chip to easily shake. Over long periods of transportation or storage, the shaking chip will frequently collide with the inner wall of the groove, leading to physical damage to the chip surface, such as scratches and wear. This damage can negatively impact the chip's performance and functionality. Furthermore, traditional chip packaging lacks an effective partitioning mechanism for chip storage. Chips have a wide range of applications, including display and control functions. Different types of chips have different environmental and storage requirements. When chips of different uses and sizes are mixed in packaging without partitioning, they may interfere with each other. For example, chips of different uses may interfere with each other due to electromagnetic compatibility issues, and chips of different sizes may squeeze and collide with each other, causing damage. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a blister tray with partitions for screen chips.

[0005] This utility model is achieved using the following technical solution: a blister tray for screen chips with partitions, comprising a base tray, a side plate fixedly connected to the surface of the base tray, a positioning rod inserted into the interior of the side plate, an extension plate fixedly connected to the surface of the positioning rod, an upper tray fixedly connected to the surface of the extension plate, pre-positioning slots being provided on the surfaces of both the side plate and the extension plate, partition baffles fixedly connected to the inner walls of both the base tray and the upper tray, and several plastic buckles fixedly connected to the inner walls of both the base tray and the upper tray, with chip placement frames snapped onto the surfaces of the plastic buckles.

[0006] Through the above technical solution, the cooperation of the positioning rod and the pre-positioning slot enables rapid stacking of trays and enhances the stability after stacking. This facilitates tray management during storage and transportation. The design of the chip placement frame and the plastic buckle can be snapped together, allowing for the replacement of the appropriate chip placement frame according to the chip size, improving compatibility with chips of different sizes and protecting the chips from shaking inside the box. The partition baffle divides the inside of the tray into multiple areas, which is conducive to the classification and storage of chips of different uses or sizes, making it easier to find and manage chips and improving work efficiency.

[0007] As a further improvement to the above solution, the positioning rod is inserted into the pre-positioning slot.

[0008] As a further improvement to the above solution, the positioning rod is adapted to the pre-positioning hole groove.

[0009] The above technical solutions enhance the stability of pallet stacking, preventing pallets from separating during normal use, such as slight shaking during handling and storage, and improving the overall reliability of the blister box pallet structure.

[0010] As a further improvement to the above solution, a slot is provided on the lower surface of the chip placement frame.

[0011] The above technical solution provides a simple and effective fixing method for the card slot and plastic buckle, which facilitates the installation and removal of the chip placement frame and makes it easy to adjust according to the chip size.

[0012] As a further improvement to the above solution, the slot is adapted to the plastic buckle.

[0013] As a further improvement to the above solution, both the base tray and the upper tray are made of polyvinyl chloride.

[0014] Through the above technical solutions, the PVC material gives the tray good physical and chemical properties, enabling it to maintain structural integrity under normal use conditions and protect the chips stored inside. At the same time, its chemical stability also helps to prevent chemical reactions with the chips, thus improving the service life of the tray.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This utility model's chip placement frame uses a slot on its lower surface to engage with a plastic clip, allowing personnel to easily remove and replace the chip placement frame with a suitable one according to different chip sizes. This prevents chips from not being securely attached due to an unsuitable placement frame size, thus protecting the chips from damage during storage and transportation. The partitioned baffle divides the inside of the tray into multiple areas, allowing personnel to classify and store chips according to their different uses or sizes, preventing chips from interfering with each other. At the same time, the positioning rod inserted into the pre-positioning hole slot enables rapid stacking between two trays and enhances the stability of the connection between trays, avoiding problems such as chip displacement and damage that may be caused by shaking. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the chip placement frame of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the plastic buckle of this utility model;

[0020] Figure 4 This is a schematic diagram of the card slot structure of this utility model.

[0021] Explanation of key symbols:

[0022] 1. Base tray; 2. Side panel; 3. Positioning rod; 4. Extension plate; 5. Upper tray; 6. Pre-positioning hole slot; 7. Partition baffle; 8. Plastic buckle; 9. Chip placement frame; 10. Card slot. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0024] Please combine Figure 1-4This embodiment provides a blister tray for screen chips with partitions, comprising a base tray 1, a side plate 2 fixedly connected to the surface of the base tray 1, a positioning rod 3 inserted into the interior of the side plate 2, an extension plate 4 fixedly connected to the surface of the positioning rod 3, and an upper tray 5 fixedly connected to the surface of the extension plate 4. Both the side plate 2 and the extension plate 4 have pre-positioning slots 6. Partition baffles 7 are fixedly connected to the inner walls of both the base tray 1 and the upper tray 5. Several plastic buckles 8 are fixedly connected to the inner walls of both the base tray 1 and the upper tray 5, and chip placement frames 9 are snapped onto the surfaces of the plastic buckles 8. The operator aligns the extension plate 4 of the upper tray 5 with the side plate 2 of the base tray 1, and then inserts the positioning rod 3 under the extension plate 4 into the pre-positioning slot 6 of the side plate 2. Due to the insertion of the positioning rod 3 into the pre-positioning slot 6... The system enables rapid stacking between two trays. When the positioning rod 3 is inserted into the pre-positioning slot 6, the positioning rod 3 and the pre-positioning slot 6 are compatible, which enhances the stability of the connection between the trays and ensures that the stacked trays will not shake during storage. The chip placement frame 9 is engaged with the plastic buckle 8 through the slot 10 opened on its lower surface. This engagement method allows personnel to remove the chip placement frame 9 according to the different sizes of the chips and replace it with a suitable chip placement frame 9, thereby ensuring that the chips are firmly attached to the chip placement frame 9 and preventing the chips from shaking. The inner walls of the base tray 1 and the upper tray 5 are both fixedly connected with partition baffles 7. The partition baffles 7 divide the inside of the tray into multiple areas, so that personnel can classify and store the chips according to their different uses or sizes, avoiding mutual interference between the chips.

[0025] The positioning rod 3 is inserted into the pre-positioning slot 6.

[0026] The positioning rod 3 and the pre-positioning hole 6 are compatible, which allows the positioning rod 3 to be smoothly inserted into the pre-positioning hole 6 and to fit tightly after insertion, thereby ensuring the firmness of the connection between the trays.

[0027] The chip placement frame 9 has a slot 10 on its lower surface. The slot 10 is designed to engage with the plastic buckle 8, thereby fixing the chip placement frame 9 to the inner wall of the base tray 1 or the upper tray 5.

[0028] The slot 10 is compatible with the plastic buckle 8.

[0029] Both the base tray 1 and the upper tray 5 are made of polyvinyl chloride (PVC). PVC has a certain degree of hardness, toughness, and chemical stability, which can provide basic shape support for the trays and resist a certain degree of external impact and chemical corrosion.

[0030] The implementation principle of a blister tray with partitioned screen chip in this embodiment is as follows: First, personnel check the size of the chip to determine the chip placement frame 9 that needs to be replaced. Since the chip placement frame 9 is engaged with the plastic buckle 8 through a slot 10 on its lower surface, and the slot 10 and the plastic buckle 8 are compatible, the chip placement frame 9 is gently pinched by hand, and appropriate external force is applied to disengage the slot 10 from the plastic buckle 8, thereby removing the chip placement frame 9 that does not conform to the chip size. A chip placement frame 9 of suitable size is selected, and the slot 10 on the lower surface of the chip placement frame 9 is aligned with the plastic buckle 8. Then, the chip placement frame 9 is gently pressed to ensure that the slot 10 and the plastic buckle 8 are firmly engaged, ensuring that the chip and the chip placement frame 9 are firmly attached and preventing the chip from shaking. The inner walls of the base tray 1 and the upper tray 5 are both fixedly connected with partitions. The partition 7 divides the interior of the tray into multiple areas, allowing personnel to classify and store chips according to their different uses or sizes, preventing them from interfering with each other. When stacking is required, the upper tray 5 is picked up, and the extension plate 4 of the upper tray 5 is aligned with the side plate 2 of the base tray 1. Since the positioning rod 3 is fixedly connected to the surface of the extension plate 4, and the side plate 2 has a pre-positioning slot 6, the positioning rod 3 is adapted to the pre-positioning slot 6. The positioning rod 3 under the extension plate 4 is inserted into the pre-positioning slot 6 of the side plate 2. Because of the insertion relationship between the positioning rod 3 and the pre-positioning slot 6, and the adaptation between the positioning rod 3 and the pre-positioning slot 6, the stability of the connection between the trays is enhanced after the positioning rod 3 is inserted into the pre-positioning slot 6, ensuring that the stacked trays will not shake during storage.

[0031] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A blister tray for screen chips with partitions, characterized in that, The device includes a base tray (1), a side plate (2) fixedly connected to the surface of the base tray (1), a positioning rod (3) inserted into the inside of the side plate (2), an extension plate (4) fixedly connected to the surface of the positioning rod (3), an upper tray (5) fixedly connected to the surface of the extension plate (4), a pre-positioning hole groove (6) opened on the surface of both the side plate (2) and the extension plate (4), partition baffles (7) fixedly connected to the inner walls of both the base tray (1) and the upper tray (5), and several plastic buckles (8) fixedly connected to the inner walls of both the base tray (1) and the upper tray (5), with a chip placement frame (9) snapped onto the surface of the plastic buckle (8).

2. The blister tray with partitions for screen chips as described in claim 1, characterized in that: The positioning rod (3) is inserted into the pre-positioning slot (6).

3. The blister tray with partitioned dividers for screen chips as described in claim 1, characterized in that: The positioning rod (3) is adapted to the pre-positioning slot (6).

4. The blister tray with partitions for screen chips as described in claim 1, characterized in that: The chip placement frame (9) has a slot (10) on its lower surface.

5. A blister tray with partitions for screen chips as described in claim 4, characterized in that: The slot (10) is adapted to the plastic buckle (8).

6. The blister tray with partitioned dividers for screen chips as described in claim 1, characterized in that: Both the base tray (1) and the upper tray (5) are made of polyvinyl chloride.

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