Case structure with shielding layer structure

Abstract

The utility model discloses a case structure with a shielding layer structure, which comprises a frame and a conductive pattern, the frame is provided with a plurality of plate bodies and encloses a case body with an accommodating space inside, and the conductive layer is integrally formed with the plate bodies or covers the surfaces of the plate bodies; compared with an existing design, the relatively closed shielding body is defined by the multiple conducting layers, the conducting layers can be formed on all the frame bodies through the arranged conducting layers so that shielding and isolation of electromagnetism can be achieved, and meanwhile the multiple plate bodies can selectively cover or be directly formed in the plate bodies according to different positions; therefore, after a plurality of plate bodies provided with the conducting layers are installed on the frame, a closed virtual shielding body is formed, and the requirement for an existing EMC test is met.

Description

Technical Field

[0001] This utility model relates to the field of computer chassis, and in particular to a chassis structure with a shielding layer. Background Technology

[0002] As a component of a computer, the computer case primarily serves to house and secure these components, providing support and protection. Furthermore, the computer case plays a crucial role in shielding against electromagnetic radiation.

[0003] EMC testing, also known as electromagnetic compatibility (EMC) testing, refers to the comprehensive evaluation of the electromagnetic interference (EMI) and immunity (EMS) capabilities of electronic products. It is one of the most important indicators of product quality. An EMC measurement system consists of a test site and test instruments.

[0004] The purpose of EMC testing is to detect the impact of electromagnetic radiation generated by electrical products on the human body, public power grids, and other normally functioning electrical products.

[0005] The main reasons why existing DIY computer cases generally fail the test are as follows: 1. No shielding layer is set in some areas; 2. Too many transparent plates are used, so the shielding layer cannot be formed into a rectangular shielding cavity (virtual cavity), which affects the test results. Utility Model Content

[0006] The main purpose of this utility model is to propose a chassis structure with a shielding layer, which aims to improve the existing chassis structure, enable the chassis to pass EMC testing, and keep the structure simple without affecting the existing aesthetics.

[0007] To achieve the above objectives, this utility model proposes a chassis structure with a shielding layer, comprising:

[0008] A frame, wherein the frame comprises multiple plates that enclose a box with internal storage space;

[0009] A conductive layer, wherein the conductive layer is integrally formed with the plate body or covers the surface of the plate body;

[0010] Multiple conductive layers form a relatively closed shield.

[0011] Compared to existing designs, by adding conductive layers, conductive layers can be formed in each frame to achieve electromagnetic shielding and isolation. Furthermore, multiple plates can be selected to cover or directly molded within the plate, depending on their location.

[0012] Therefore, when multiple plates with conductive layers are installed on the frame, a closed virtual shield is formed, thus meeting the existing EMC test requirements. Attached Figure Description

[0013] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0014] Figure 2 This is a cross-sectional view of the present invention;

[0015] Figure 3 This is a schematic diagram showing the hidden frame of this utility model;

[0016] Figure 4 This is a schematic diagram of the plate.

[0017] In the picture,

[0018] 1 represents the frame, 10 represents the panel, 11 represents the front panel, 12 represents the rear panel, 13 represents the bottom panel, 14 represents the top panel, and 15 represents the side panel.

[0019] 21 is the conductive layer, and 22 is the adhesive backing. Detailed Implementation

[0020] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0021] It should be noted that if any directional indication (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial, etc.) is involved in the embodiments of this utility model, the directional indication is only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0023] like Figures 1 to 4 As shown, a chassis structure with a shielding layer includes:

[0024] A frame, wherein the frame comprises multiple plates that enclose a box with internal storage space;

[0025] A conductive layer, wherein the conductive layer is integrally formed with the plate body or covers the surface of the plate body;

[0026] Multiple conductive layers form a relatively closed shield.

[0027] Compared to existing designs, by adding conductive layers, conductive layers can be formed in each frame to achieve electromagnetic shielding and isolation. Furthermore, multiple plates can be selected to cover or directly molded within the plate, depending on their location.

[0028] Therefore, when multiple plates with conductive layers are installed on the frame, a closed virtual shield is formed, thus meeting the existing EMC test requirements.

[0029] Specifically, the conductive layer is formed on the surface of the plate by spraying.

[0030] In this embodiment of the invention, when the plate is a metal part, the conductive layer is formed by spraying.

[0031] Specifically, spraying can be done with nanoparticles or as a coating layer to cover the surface, thus meeting different needs.

[0032] Of course, the specific conductive layer can also be directly formed onto the plate, for example, by directly mixing a predetermined conductive material into the metal parts, thereby satisfying the overall electromagnetic shielding of the plate. However, this may also lead to localized unevenness.

[0033] Therefore, considering the coverage of the shielding, it is preferable to form the conductive layer by spraying.

[0034] Specifically, the board body includes a front plate, a rear plate, an upper plate, and a lower plate, each with heat dissipation holes, and the conductive layer is sprayed onto the front plate, rear plate, upper plate, and lower plate. The spraying method is more cost-effective and allows for improved aesthetics of the chassis design (e.g., different colors or patterns) depending on the spraying material.

[0035] In this embodiment of the invention, the plate is a transparent plate, and the conductive layer is a transparent thin-film electromagnetic shielding material.

[0036] Specifically, metallic meshes such as silver, copper, and nickel are typically formed on optical polyester polyethylene terephthalate (PET) films.

[0037] Specifically, the transparent plate is etched with longitudinally and transversely distributed grooves, and the grooves are formed with conductive metal.

[0038] Conductive foam achieves excellent surface conductivity by covering a flame-retardant sponge with conductive fabric and undergoing a special process. This material can be easily fixed to devices requiring shielding using adhesive tape, providing effective electromagnetic shielding for electronic devices.

[0039] In this embodiment of the invention, the conductive layer is made of silver, copper, or nickel.

[0040] Specifically, the portion of the board that contacts the frame is provided with adhesive backing, which is conductive foam or conductive rubber.

[0041] Conductive rubber achieves excellent conductivity by thoroughly mixing conductive particles such as silver-plated glass, silver-plated aluminum, or silver with silicone rubber and then applying pressure to bring the conductive particles into contact. This material not only possesses excellent sealing properties but also provides electromagnetic shielding.

[0042] The design, featuring adhesive backing and magnetic strips, facilitates panel installation and provides cushioning, especially for transparent panels. Furthermore, this design effectively enhances electrical conductivity.

[0043] In this embodiment of the invention, the side panel is the transparent panel.

[0044] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A chassis structure with a shielding layer, characterized in that, include: A frame, wherein the frame comprises multiple plates that enclose a box with internal storage space; A conductive layer, wherein the conductive layer is integrally formed with the plate body or covers the surface of the plate body; Multiple conductive layers form a relatively closed shield.

2. The chassis structure with a shielding layer as described in claim 1, characterized in that: The conductive layer is formed on the surface of the plate by spraying.

3. The chassis structure with a shielding layer as described in claim 1, characterized in that: When the plate is a metal part, the conductive layer is formed by spraying.

4. The chassis structure with a shielding layer as described in claim 1, characterized in that: The plate body includes a front plate, a rear plate, an upper plate, and a lower plate, each with heat dissipation holes, and the conductive layer is sprayed onto the front plate, the rear plate, the upper plate, and the lower plate.

5. The chassis structure with a shielding layer as described in claim 1, characterized in that: The plate is a transparent plate, and the conductive layer is a transparent thin-film electromagnetic shielding material.

6. The chassis structure with a shielding layer as described in claim 1, characterized in that: The transparent plate is etched with longitudinally and transversely distributed grooves, and the grooves are formed with conductive metal.

7. The chassis structure with a shielding layer as described in claim 1, characterized in that: The conductive layer is made of silver, copper, or nickel.

8. The chassis structure with a shielding layer as described in claim 1, characterized in that: The portion of the plate that contacts the frame is provided with adhesive backing, which is conductive foam or conductive rubber.

9. The chassis structure with a shielding layer as described in claim 5, characterized in that: The side panel is the transparent panel.

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