Dustproof and heat dissipation device for memory bank of communication equipment

Abstract

The utility model provides a dustproof and heat dissipation device for a memory bank of communication equipment. The dustproof and heat dissipation device for the memory bank of the communication equipment comprises a memory socket, the memory bank, a memory heat dissipation and dustproof device and a dustproof shielding strip, the memory bank is installed on the memory socket, the memory bank is provided with a memory heat dissipation and dust prevention device, and a dust prevention shielding strip is installed at a gap where the memory bank and the memory socket are installed; the memory heat dissipation and dust prevention device is provided with a dust prevention plate, heat dissipation protrusions, installation buckles, fixing buckle installation grooves and side fixing grooves. The memory heat dissipation and dust prevention device is mounted on the memory bank through the mounting buckles, the fixing buckle mounting grooves and the side fixing grooves; the dustproof and heat dissipation device for the memory bank of the communication equipment is designed and manufactured according to the special memory bank installation layout of the communication equipment, and has the characteristics of good dustproof and heat dissipation effects, convenience and rapidness in installation and disassembly, low cost and high applicability, and is suitable for the existing memory bank.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for communication equipment, specifically a dustproof and heat dissipation device for memory modules in communication equipment. Background Technology

[0002] In communication equipment, memory modules are plug-and-play assembled. When installed in the memory socket, there is a certain gap. Over time, dust or other tiny particles inevitably enter this gap. These dust or particles can accumulate static electricity, leading to electrostatic discharge and potentially damaging the memory module. They also increase electromagnetic interference, affecting signal integrity and causing performance failures. Furthermore, they can block heat dissipation channels, affecting the memory module's heat dissipation performance and causing overheating. This is especially true in certain types of communication equipment where the overall airflow is front-facing and rear-exhaust, with the front typically housing ports. For key components, the remaining space is used to house most of the ventilation holes required for heat dissipation. These ventilation holes are typically smaller in area compared to the ports. A fan is placed at the rear of the system to overcome air resistance, allowing most airflow to enter from the front panel and exit through a rear-mounted fan – a direct ventilation duct configuration. Because this type of equipment uses an exhaust system, the internal environment is under negative pressure, making it prone to dust accumulation on the inner surface of the circuit boards. This is especially true in narrow crevices, where dust or fine particles can gradually adhere to or accumulate over time, potentially leading to equipment malfunctions. Therefore, measures such as dust prevention for the equipment itself, the cabinet doors, and the memory modules are implemented during installation.

[0003] Dust prevention for equipment: Adding dust filters to the air vents is a standard dust prevention solution for equipment. The dust filter is cleaned regularly to achieve the dust prevention effect. For our small or frame-type equipment, the air intake mainly enters from the opening on the front panel. However, the air intake area at this point is very small, and even a slight blockage can have a significant impact on the equipment's heat dissipation performance. In addition, compared with side air intake, the dust removal frequency is increased, and maintenance is more frequent. Therefore, dust filter devices are generally not visible on front-entry air intake equipment.

[0004] Dust prevention for rack doors; dust screens are usually installed on rack doors to prevent dust from entering the entire rack. Some racks do not have dust screens installed, so dust screens need to be designed and installed according to the rack's shape. The dust screens on the rack doors should be cleaned regularly.

[0005] Dust prevention for memory modules; Currently, no dust prevention devices are found in existing memory module products; although some patents mention dust prevention for memory modules, they differ significantly from this patent. This patent not only solves the problem of dust prevention for memory modules but also solves the problem of heat dissipation for memory modules.

[0006] Among the dust prevention technologies mentioned above, equipment dust prevention is not applicable to front-ventilation equipment. Because the front panel of such equipment has densely packed ports, leaving very little space for air intake, blockage of the ventilation holes can fatally impact the overall heat dissipation. Adding dust filters to the front panel ventilation holes further increases the probability of blockage. Therefore, adding equipment-level dust filters is not suitable for this type of specialized equipment. While rack-level dust prevention can provide some dust protection for the entire unit in practical applications, not all rack doors are equipped with dust filters, and it's impossible to require customers to uniformly purchase racks with dust filters, thus limiting its practical application. Furthermore, some core computer rooms have very high cleanliness requirements, typically requiring ISO 5 to ISO 7 levels. This special environment is beneficial for improving equipment stability and reliability. Due to the high cost, many other types of computer rooms cannot meet these requirements, while memory module dust prevention is more feasible and economical. Therefore, the applicant proposes a dust prevention and heat dissipation device for communication equipment memory modules, which can effectively prevent dust and dissipate heat from memory modules, ensuring reliable equipment operation. Utility Model Content

[0007] To address the aforementioned technical problems, this utility model proposes a dustproof and heat dissipation device for a communication device's memory module. The device involves installing the memory module on a memory socket, mounting a dustproof and heat dissipation device on the memory module, and installing a dustproof shielding strip at the gap between the memory module and the memory socket. The dustproof and heat dissipation device includes a dustproof plate, heat dissipation protrusions, mounting clips, a fixing clip mounting slot, and a side fixing slot. The device is installed on the memory module using the mounting clips, fixing clip mounting slot, and side fixing slot. This dustproof and heat dissipation device is designed and manufactured specifically for the unique memory module installation layout of a certain type of communication equipment. It features excellent dustproof and heat dissipation performance, convenient and quick installation and disassembly, compatibility with existing memory modules, low cost, and strong applicability.

[0008] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0009] A dustproof and heat dissipation device for a communication device memory module includes a memory socket, a memory module, a memory heat dissipation and dustproof device, and a dustproof shielding strip. The device is characterized in that the memory module is mounted on the memory socket, the memory heat dissipation and dustproof device is installed on the memory module, and a dustproof shielding strip is installed at the gap between the memory module and the memory socket.

[0010] Furthermore, the communication device's memory module dustproof and heat dissipation device is equipped with a memory heat dissipation and dustproof device. The memory heat dissipation and dustproof device has a structure including a dustproof plate, heat dissipation protrusions, mounting clips, fixing clip mounting slots, and side fixing slots. The dustproof plate is split in the middle, and heat dissipation protrusions are provided on the dustproof plate at the chip positions corresponding to the memory module. Mounting clips are provided on both sides of the top of the dustproof plate, and side fixing slots are provided at both ends of the dustproof plate. A pair of fixing clip mounting slots are provided on the top of the dustproof plate and are fixed by fixing clips or by using heat dissipation adhesive.

[0011] Furthermore, the dustproof and heat dissipation device for the memory module of the communication device is equipped with a dustproof shielding strip, which is made of heat-dissipating flexible material or plastic.

[0012] Furthermore, the communication device's memory module dustproof and heat dissipation device is equipped with a memory heat dissipation and dustproof device, which is made of heat dissipation material by integral casting, machining, or stamping.

[0013] The benefits of this application are:

[0014] 1. The dustproof and heat dissipation device for the memory modules of communication equipment is designed for the installation and layout of memory modules in a certain type of communication equipment, and has strong applicability, dustproof and heat dissipation properties.

[0015] 2. The dustproof and heat dissipation device for the memory module of the communication equipment is made according to the characteristics of the memory module, is applicable to existing memory modules, has low cost and good performance;

[0016] 3. The dustproof and heat dissipation device for the memory module of the communication equipment adopts a split structure design, which is convenient for installation and disassembly;

[0017] 4. The dustproof and heat dissipation device for the memory modules of communication equipment will not affect the existing memory module layout or use, and will enhance the heat dissipation of the memory modules, effectively solve the existing dustproof problem of memory modules, and facilitate the modification of the dustproof of existing equipment memory modules. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a partial structural diagram of the present invention;

[0020] Figure 3 This is a schematic diagram of a type of communication equipment scenario to which this utility model is applicable;

[0021] Figure 4 This is a schematic diagram of the memory module arrangement of a type of communication device to which this utility model applies;

[0022] Figure 5 This is a schematic diagram of the memory socket of this utility model;

[0023] Figure 6 This is a schematic diagram of the memory module of this utility model being installed on the memory socket.

[0024] The markings in the diagram are as follows: 1. Memory socket; 2. Memory module; 3. Memory heat dissipation and dust prevention device; 3-1. Dustproof plate; 3-2. Heat dissipation protrusion; 3-3. Mounting clip; 3-4. Fixing clip mounting slot; 3-5. Side fixing slot; 4. Dustproof shielding strip; 5. Class I equipment air inlet; 6. PCB board; 7. Class I equipment; 8. Fan; 10. Fixing clip. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments:

[0026] like Figure 1 As shown, this is a dustproof and heat dissipation device for a communication device's memory module, including a memory socket 1, a memory module 2, a memory heat dissipation and dustproof device 3, and a dustproof shielding strip 4. The memory module 2 is mounted on the memory socket 1, the memory heat dissipation and dustproof device 3 is mounted on the memory module 2, and the dustproof shielding strip 4 is installed at the gap between the memory module 2 and the memory socket 1. Its design is based on... Figure 3 , Figure 4 One type of ventilation equipment is used in scenarios where Figure 3 and Figure 4 In the scenario depicted, the PCB board 6 of device 7 is installed in the middle. An air inlet 5 is located at the front of device 7, and a fan 8 is located at the rear. The memory module 2 is mounted on the PCB board 6. The overall airflow cooling system of this type of device is a front-facing, primarily front-facing, rear-exhaust airflow configuration. The front of the device typically houses the main components, with the remaining space used for most of the ventilation holes required for heat dissipation. These ventilation holes are usually relatively small compared to the area occupied by the ports. Simultaneously, a fan is placed at the rear of the device system to overcome air resistance, thus achieving a direct ventilation duct configuration where most airflow enters from the front panel and exits through the rear fan. Because this type of device uses an exhaust system, the internal environment is under negative pressure. Therefore, dust easily accumulates on the inner surface of the equipment board, especially in narrow gaps. Over time, dust or fine particles will gradually adhere to or deposit on the surface, leading to equipment failure. This invention addresses this issue by solving the dust prevention and heat dissipation requirements of memory modules. It is made of flexible heat-dissipating material or plastic. Before the memory module 2 is installed on the memory socket 1, a dustproof shielding strip 4 is inserted into the gap between the memory module 2 and the memory socket 1 to effectively prevent dust from entering. After the memory module is installed, the lower part of the memory heat dissipation and dust prevention device 3 installed on the memory module 2 fits against the top of the dustproof shielding strip 4, effectively preventing dust from entering the memory module.

[0027] like Figure 2 As shown, the memory heat dissipation and dust prevention device 3 has a structure including a dustproof plate 3-1, a heat dissipation protrusion 3-2, a mounting clip 3-3, a fixing clip mounting groove 3-4, and a side fixing groove 3-5. The dustproof plate 3-1 is split in the middle. The dustproof plate 3-1 has a heat dissipation protrusion 3-2 at the chip position corresponding to the memory module. The dustproof plate 3-1 has mounting clips 3-3 on both sides near the top. The top of the dustproof plate 3-1 has a pair of fixing clip mounting grooves 3-4 and is fixed by fixing clips 10. Alternatively, a new type of adhesive can be used for fixing. The dustproof plate 3-1 shown has side fixing grooves 3-5 at both ends. When the memory heat dissipation and dustproof device 3 is installed on the memory module 2, thermal grease is applied between the heat dissipation protrusion 3-2 and the chip on the memory module 2 that needs heat dissipation to eliminate the gap between the memory module 2 and the memory heat dissipation and dustproof device 3. The memory heat dissipation and dustproof device 3 shown is made of heat dissipation material by integral casting, machining or stamping, and has a good external heat dissipation structure, which has good dust prevention and heat dissipation function.

[0028] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any modifications or equivalent changes made based on the technical essence of the present utility model shall still fall within the scope of protection claimed by the present utility model.

Claims

1. A dustproof and heat dissipation device for a communication device memory module, comprising a memory socket (1), a memory module (2), a memory heat dissipation and dustproof device (3), and a dustproof shielding strip (4), characterized in that: The memory module (2) of the communication device is installed on the memory socket (1), and the memory heat dissipation and dust prevention device (3) is installed on the memory module (2). A dustproof shielding strip (4) is installed at the gap between the memory module (2) and the memory socket (1).

2. The dustproof and heat dissipation device for a communication device memory module according to claim 1, characterized in that: The communication device's memory module dustproof and heat dissipation device is equipped with a memory heat dissipation and dustproof device (3). The memory heat dissipation and dustproof device (3) has a structure including a dustproof plate (3-1), a heat dissipation protrusion (3-2), a mounting buckle (3-3), a fixing buckle mounting groove (3-4), and a side fixing groove (3-5). The dustproof plate (3-1) is split in the middle. The dustproof plate (3-1) has a heat dissipation protrusion (3-2) at the chip position corresponding to the memory module. The dustproof plate (3-1) has mounting buckles (3-3) on both sides near the top. The dustproof plate (3-1) has side fixing grooves (3-5) at both ends.

3. The dustproof and heat dissipation device for a communication device memory module according to claim 2, characterized in that: The dustproof plate (3-1) is provided with a pair of fixing buckle mounting slots (3-4) on the top and is fixed by fixing buckle (10) or by heat dissipation adhesive.

4. The dustproof and heat dissipation device for a communication device memory module according to claim 1, characterized in that: The communication device's memory module dustproof and heat dissipation device is equipped with a dustproof shielding strip (4).

5. The dustproof and heat dissipation device for a communication device memory module according to claim 1, characterized in that: The dustproof shielding strip (4) is made of heat-dissipating flexible material or plastic material.

6. The dustproof and heat dissipation device for a communication device memory module according to claim 1, characterized in that: The communication device's memory module dustproof and heat dissipation device is equipped with a memory heat dissipation and dustproof device (3), which is made of heat dissipation material by integral casting, machining or stamping.

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