Heating ring for etching machine cavity

Abstract

The utility model relates to the technical field of semiconductor equipment, and particularly discloses a heating ring for an etching machine cavity, which comprises an inner ring layer, the inner ring layer is a high-thermal-conductivity ceramic substrate, a plurality of radial grooves are arranged on the surface of the inner ring layer, and the inner ring layer and the inner ring layer are made of metal. A resistance wire array is embedded in the groove, the central area of the cavity is heated in a centralized mode through multiple sets of independent resistance wires, the continuous S-shaped platinum heating film on the outer ring layer is evenly distributed along the edge of the cavity, the heat source coverage range is prolonged through a snake-shaped path, edge heat loss is compensated, temperature is controlled in a partitioned mode, and the temperature uniformity is good. The defect of uneven edge of wafer etching is effectively reduced, a K-type thermocouple on the surface of the inner ring layer and a film temperature sensor on the back of the outer ring layer collect temperature data in real time and feed back the temperature data to an external PID controller, the external PID controller dynamically adjusts power output of a resistance wire array and a platinum heating film according to the temperature difference, and temperature precision adjustment is achieved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and specifically discloses a heating ring for an etching machine cavity. Background Technology

[0002] In the semiconductor manufacturing field, temperature control of the etching machine cavity is one of the core factors affecting process accuracy. As a core temperature control component of the cavity, the heating ring must provide a uniform and stable thermal field during plasma etching to ensure consistent etching rates and wafer processing yield. Traditional heating rings typically employ a ring-shaped resistance wire or a single heating film structure, conducting heat directly onto the cavity surface. Their performance directly impacts the reliability of the etching process and the long-term stability of the equipment.

[0003] However, existing heating ring designs still have significant drawbacks: First, the traditional simple layout of resistance wires or heating films leads to a large temperature difference between the center and edge areas of the cavity, making it difficult to achieve high-precision temperature uniformity. Second, the high integration of the heating element and the cavity necessitates complete disassembly and replacement in case of failure, resulting in high maintenance costs and long downtime. Third, the lack of efficient heat dissipation and heat reflection design allows heat to easily dissipate to non-target areas, causing energy waste. Furthermore, the temperature feedback system of existing structures has a lag in response, making it difficult to meet the dynamic temperature control requirements of advanced etching processes. Therefore, a heating ring solution with optimized structure, precise temperature control, and easy maintenance is urgently needed. Utility Model Content

[0004] This invention proposes a heating ring for the etching machine cavity, which features zoned temperature control, good temperature uniformity, and effectively reduces edge unevenness defects in wafer etching. An external PID controller dynamically adjusts the power output of the resistance wire array and platinum heating film based on the temperature difference to achieve precise temperature regulation.

[0005] This invention is implemented as follows: a heating ring for an etching machine cavity, comprising:

[0006] The inner ring layer is a high thermal conductivity ceramic substrate. The surface of the inner ring layer has multiple radial grooves. A resistance wire array is embedded inside the grooves, and the two ends of the resistance wire are connected to copper electrode plates on the back of the inner ring layer.

[0007] The outer ring layer is a corrosion-resistant aluminum alloy substrate. The surface of the outer ring layer is provided with continuous and S-shaped heating film grooves. A platinum heating film is embedded in the interior of the heating film grooves. The two ends of the platinum heating film are connected to plug-in terminals on the side of the outer ring layer.

[0008] An insulating sheet is provided between the inner ring layer and the outer ring layer.

[0009] As a preferred heating ring for etching machine cavity according to the present invention, the outer surface of the outer ring layer is covered with an aluminum nitride radiation reflective coating with a coating thickness of 50 μm.

[0010] As a preferred embodiment of the heating ring for the etching machine cavity of this utility model, the outer wall of the outer ring layer is fixedly connected to a flange ring, and the outer wall of the flange ring is provided with multiple mounting holes.

[0011] As a preferred heating ring for an etching machine cavity according to the present invention, a plurality of K-type thermocouples are embedded in the surface of the inner ring layer along the circumference, and a plurality of thin-film temperature sensors are provided on the back of the outer ring layer. The plurality of thin-film temperature sensors are connected to an external PID controller through shielded cables.

[0012] As a preferred heating ring for an etching machine cavity according to the present invention, the outer ring layer has multiple heat dissipation holes with a rectangular structure on its sidewall.

[0013] As a preferred embodiment of the heating ring for the etching machine cavity of this utility model, the copper electrode sheet is led out through a silicone-insulated high-temperature resistant wire.

[0014] The beneficial effects of this utility model are:

[0015] The radial grooves of the inner ring layer embed an array of resistance wires, which concentrate the heating of the central area of ​​the cavity through multiple sets of independent resistance wires. The continuous S-shaped platinum heating film of the outer ring layer is evenly distributed along the edge of the cavity. The heat source coverage is extended through a serpentine path to compensate for heat loss at the edge, and the temperature is controlled in zones. The temperature uniformity is good, which effectively reduces the edge unevenness defects of wafer etching. The inner and outer ring layers are isolated by an insulating sheet to avoid thermal interference. Combined with the standardized mounting holes of the flange ring, it supports independent disassembly and replacement of a single layer, making maintenance convenient.

[0016] The K-type thermocouple on the inner ring layer surface and the thin-film temperature sensor on the back of the outer ring layer collect temperature data in real time and feed it back to the external PID controller. The external PID controller dynamically adjusts the power output of the resistance wire array and the platinum heating film according to the temperature difference to achieve precise temperature regulation. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0018] Figure 1 This is a top view of the overall structure of this utility model;

[0019] Figure 2 This is a top view of the back structure of the inner ring layer of this utility model;

[0020] Figure 3 This is a top view of the back structure of the outer ring layer of this utility model;

[0021] Figure 4 This is a cross-sectional view of the outer ring layer of this utility model;

[0022] Figure 5 This is a front view structural diagram of the outer ring layer of this utility model.

[0023] The markings in the diagram are: 1. Inner ring layer; 2. Outer ring layer; 3. Groove; 4. Resistance wire array; 5. Copper electrode sheet; 6. Heating film groove; 7. Platinum heating film; 8. Plug-in terminal; 9. Insulating sheet; 10. Aluminum nitride radiation reflective coating; 11. Flange ring; 12. Mounting hole; 13. K-type thermocouple; 14. Thin-film temperature sensor; 15. Heat dissipation hole. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments to aid in understanding its content. Unless otherwise specified, the methods used in this invention are conventional methods; the raw materials and apparatus used, unless otherwise specified, are conventional commercially available products.

[0025] Please see Figure 1-5 A heating ring for an etching machine cavity, comprising:

[0026] Inner ring layer 1, which is a high thermal conductivity ceramic substrate, has multiple radial grooves 3 on its surface. A resistance wire array 4 is embedded inside the grooves 3, and the two ends of the resistance wire are connected to the copper electrode sheet 5 on the back of the inner ring layer 1.

[0027] Outer ring layer 2, the outer ring layer 2 is a corrosion-resistant aluminum alloy substrate, the surface of the outer ring layer 2 is provided with continuous and S-shaped heating film grooves 6, the interior of the heating film grooves 6 is embedded with a platinum heating film 7, the two ends of the platinum heating film 7 are connected to the plug-in terminals 8 on the side of the outer ring layer 2.

[0028] An insulating sheet 9 is provided between the inner ring layer 1 and the outer ring layer 2.

[0029] In this embodiment: the radial grooves 3 of the inner ring layer 1 are embedded with a resistance wire array 4, which heats the central area of ​​the cavity through multiple sets of independent resistance wires. The continuous S-shaped platinum heating film 7 of the outer ring layer 2 is evenly distributed along the edge of the cavity. The heat source coverage is extended through a serpentine path to compensate for heat loss at the edge, and the temperature is controlled in zones. The temperature uniformity is good, which effectively reduces the edge unevenness defects of wafer etching. The inner and outer ring layers are isolated by an insulating sheet 9 to avoid thermal interference. Combined with the standardized mounting holes 12 of the flange ring 11, it supports independent disassembly and replacement of a single layer, which is convenient for maintenance.

[0030] The K-type thermocouple 13 on the surface of the inner ring layer 1 and the thin-film temperature sensor 14 on the back of the outer ring layer 2 collect temperature data in real time and feed it back to the external PID controller. The external PID controller dynamically adjusts the power output of the resistance wire array 4 and the platinum heating film 7 according to the temperature difference to achieve precise temperature regulation.

[0031] As a technical optimization of this utility model, the outer surface of the outer ring layer 2 is covered with an aluminum nitride radiation reflection coating 10, the coating thickness of which is 50μm.

[0032] In this embodiment, the outer surface of the outer ring layer 2 is covered with an aluminum nitride radiation reflective coating 10, which reflects heat back into the cavity and reduces ineffective heat dissipation.

[0033] As a technical optimization of this utility model, a flange ring 11 is fixedly connected to the outer wall of the outer ring layer 2, and a plurality of mounting holes 12 are opened through the outer wall of the flange ring 11.

[0034] In this embodiment, the outer wall of the flange ring 11 is provided with multiple mounting holes 12, which facilitates disassembly and assembly.

[0035] As a technical optimization of this utility model, multiple K-type thermocouples 13 are embedded along the circumference on the surface of the inner ring layer 1, and multiple thin-film temperature sensors 14 are provided on the back of the outer ring layer 2. The multiple thin-film temperature sensors 14 are connected to an external PID controller through shielded cables.

[0036] In this embodiment: the K-type thermocouple 13 on the surface of the inner ring layer 1 and the thin film temperature sensor 14 on the back of the outer ring layer 2 collect temperature data in real time and feed it back to the external PID controller. The external PID controller dynamically adjusts the power output of the resistance wire array 4 and the platinum heating film 7 according to the temperature difference to achieve precise temperature regulation.

[0037] As a technical optimization of this utility model, the outer ring layer 2 has multiple rectangular heat dissipation holes 15 on its sidewall.

[0038] In this embodiment, the outer ring layer 2 has multiple rectangular heat dissipation holes 15 on its sidewall, which work together with the high thermal conductivity of the aluminum alloy substrate of the outer ring layer 2 to avoid local overheating.

[0039] As a technical optimization of this utility model, the copper electrode sheet 5 is led out through a silicone-insulated high-temperature resistant wire.

[0040] In this embodiment, the copper electrode 5 is led out through a silicone-insulated high-temperature resistant wire, which can withstand a high temperature of 300°C and eliminate the risk of short circuit.

[0041] The working principle and usage process of this utility model are as follows: The radial grooves 3 of the inner ring layer 1 are embedded with a resistance wire array 4, which heats the central area of ​​the cavity through multiple sets of independent resistance wires. The continuous S-shaped platinum heating film 7 of the outer ring layer 2 is evenly distributed along the edge of the cavity. The heat source coverage is extended through a serpentine path to compensate for heat loss at the edge, and the temperature is controlled in zones. The temperature uniformity is good, which effectively reduces the unevenness defects at the edge of the wafer etching. The inner and outer ring layers are isolated by an insulating sheet 9 to avoid thermal interference. Combined with the standardized mounting holes 12 of the flange ring 11, it supports independent disassembly and replacement of a single layer, which is convenient for maintenance.

[0042] The K-type thermocouple 13 on the surface of the inner ring layer 1 and the thin-film temperature sensor 14 on the back of the outer ring layer 2 collect temperature data in real time and feed it back to the external PID controller. The external PID controller dynamically adjusts the power output of the resistance wire array 4 and the platinum heating film 7 according to the temperature difference to achieve precise temperature regulation.

[0043] In the description of this utility model, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "back", "inner", "outer", "back", "middle", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0044] However, the above description is only a specific embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Therefore, any substitution of equivalent components or equivalent changes and modifications made in accordance with the scope of protection of this utility model should still fall within the scope of the claims of this utility model.

Claims

1. A heating ring for an etching machine cavity, characterized in that: include: Inner ring layer (1), the inner ring layer (1) is a high thermal conductivity ceramic substrate, the surface of the inner ring layer (1) is provided with a plurality of radial grooves (3), the grooves (3) are embedded with a resistance wire array (4), and the two ends of the resistance wire are connected to the copper electrode sheet (5) on the back of the inner ring layer (1). The outer ring layer (2) is a corrosion-resistant aluminum alloy substrate. The surface of the outer ring layer (2) is provided with continuous and S-shaped heating film grooves (6). A platinum heating film (7) is embedded inside the heating film grooves (6). The two ends of the platinum heating film (7) are connected to the plug-in terminals (8) on the side of the outer ring layer (2). An insulating sheet (9) is provided between the inner ring layer (1) and the outer ring layer (2).

2. A heating ring for an etching machine cavity according to claim 1, characterized in that: The outer surface of the outer ring layer (2) is covered with an aluminum nitride radiation reflective coating (10) with a coating thickness of 50 μm.

3. A heating ring for an etching machine cavity according to claim 1, characterized in that: The outer wall of the outer ring layer (2) is fixedly connected to a flange ring (11), and the outer wall of the flange ring (11) is provided with multiple mounting holes (12).

4. A heating ring for an etching machine cavity according to claim 1, characterized in that: Multiple K-type thermocouples (13) are embedded around the surface of the inner ring layer (1), and multiple thin-film temperature sensors (14) are provided on the back of the outer ring layer (2). The multiple thin-film temperature sensors (14) are connected to an external PID controller through shielded cables.

5. A heating ring for an etching machine cavity according to claim 1, characterized in that: The outer ring layer (2) has multiple rectangular heat dissipation holes (15) on its sidewall.

6. A heating ring for an etching machine cavity according to claim 1, characterized in that: The copper electrode sheet (5) is led out through a silicone-insulated high-temperature resistant wire.

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