Energy storage radiator

Abstract

The utility model relates to an energy storage radiator. The energy storage radiator comprises a heat conduction shell and a semiconductor refrigerator. A heat dissipation cavity is formed in the heat conduction shell, and the heat dissipation cavity is filled with graphene modified paraffin; the first end of the semiconductor cooler is used for being connected with the heat conduction shell, and the second end of the semiconductor cooler is used for being connected with a to-be-cooled piece. The semiconductor cooler can rapidly start to refrigerate after being electrified, the graphene modified paraffin can also rapidly absorb heat, the whole radiator can respond to heat change in a short time, and it is guaranteed that a part to be cooled can be effectively cooled in time when started to work. The energy storage radiator can be stored for a long time and can realize heat dissipation in a narrow space.

Description

Technical Field

[0001] This application relates to the field of new material heat dissipation technology, and in particular to an energy storage heat sink. Background Technology

[0002] Some electronic components have extremely stringent operating temperature requirements, needing to operate within a precise temperature range, and continuously generate heat during operation. In normal environments, a heat sink combined with an air conditioner can meet their temperature control needs, but this conventional cooling combination is impractical in confined, enclosed spaces due to space constraints. Current cryogenic liquid cooling methods used in confined spaces, such as liquid nitrogen and liquid CO2, also have many drawbacks. These cryogenic liquids are volatile, difficult to store, and cannot be preserved for long periods. Adding refrigerant before use is cumbersome and time-consuming, and they cannot quickly respond to the heat dissipation needs of electronic components. In other cases, long-term storage is required, but the actual usage time is short. The fans and similar cooling devices used are prone to aging of components such as bearings during long-term storage, making it difficult to guarantee stable operation for even a few minutes.

[0003] In conclusion, it is urgent to develop a heat dissipation technology that can efficiently dissipate heat in confined spaces, requires no complicated preparation, can be stored reliably for a long time, and has a rapid response. This is crucial for ensuring the stable operation of various electronic device chips and improving the overall performance of electronic devices. Utility Model Content

[0004] Therefore, it is necessary to provide an energy storage radiator to address the shortcomings of current radiators.

[0005] An energy storage radiator, comprising:

[0006] Thermal housing and semiconductor cooler,

[0007] The heat-conducting shell has a heat dissipation chamber inside, which is filled with graphene-modified paraffin.

[0008] The first end of the semiconductor cooler is used to connect to the heat-conducting housing, and the second end of the semiconductor cooler is used to connect to the component to be cooled.

[0009] In one embodiment, the interior of the heat dissipation chamber includes a heat-conducting inner wall, which is located near the first end of the semiconductor cooler, and several heat-conducting sheets extending into the graphene-modified paraffin are disposed on the heat-conducting inner wall.

[0010] In one embodiment, the first end of the semiconductor cooler is connected to the outer heat conduction wall of the heat-conducting housing, and a heat spreader is sandwiched between the inner heat conduction wall and the outer heat conduction wall.

[0011] In one embodiment, a heat transfer connector is provided on the second end of the semiconductor cooler. The heat transfer connector is used to connect the heat-dissipating component and the second end of the semiconductor cooler, and the heat transfer connector conforms to the surface of the heat-dissipating component.

[0012] In one embodiment, the area of ​​the first end of the semiconductor cooler is smaller than the area of ​​the heat-conducting outer wall.

[0013] In one embodiment, the heat spreader is evenly distributed on the inner wall of the heat conduction system.

[0014] In one embodiment, the heat-conducting sheet and the heat-conducting housing are integrally formed.

[0015] In one embodiment, the heat spreader is configured as one of a pure diamond plate, a graphene-aluminum composite plate, a diamond-aluminum composite plate, or a graphene plate.

[0016] And / or,

[0017] The heat-conducting sheet is set as one of the following: aluminum alloy sheet, diamond sheet, graphene aluminum composite sheet, and diamond aluminum composite sheet.

[0018] In one embodiment, the heat dissipation chamber is sealed.

[0019] In one embodiment, a power supply system is also included, which is electrically connected to the thermoelectric cooler.

[0020] The aforementioned energy storage radiator includes a heat-conducting shell and a semiconductor cooler. The heat-conducting shell has an internal heat dissipation chamber filled with graphene-modified paraffin wax. The first end of the semiconductor cooler connects to the heat-conducting shell, and the second end connects to the component to be cooled. The heat-conducting shell is typically made of materials with good thermal conductivity, such as aluminum alloy. Aluminum alloy has low density, high strength, and good thermal conductivity, enabling rapid heat transfer while maintaining structural strength. The first end of the semiconductor cooler connects to the heat-conducting shell, and the second end connects to the component to be cooled. The semiconductor cooler operates based on the Peltier effect; when current flows, a temperature difference is generated across the two ends of the semiconductor cooler, achieving a directional transfer of heat from one end to the other. When the component to be cooled generates heat, the semiconductor cooler actively cools it, transferring the heat from the second end connected to the component to the first end connected to the heat-conducting shell, and then through the heat-conducting shell to the internal graphene-modified paraffin wax. The active cooling function of a thermoelectric cooler can rapidly reduce the temperature of the component to be cooled. The high thermal conductivity and phase change energy storage characteristics of graphene-modified paraffin allow it to quickly absorb and store the heat transferred from the thermoelectric cooler, effectively preventing heat accumulation and improving the overall heat dissipation efficiency of the radiator. The thermoelectric cooler can begin cooling rapidly after being powered on, and the graphene-modified paraffin can also quickly absorb heat. The entire radiator can respond to changes in heat in a short time, ensuring that the component to be cooled receives effective heat dissipation promptly upon startup. Attached Figure Description

[0021] Figure 1 This is a cross-sectional view of the energy storage radiator provided in an embodiment of this application.

[0022] Figure 2 This is a schematic diagram of the structure of the energy storage radiator provided in the embodiment of this application.

[0023] Figure 3 This is a cross-sectional view of the heat-conducting housing provided in an embodiment of this application.

[0024] Icon labels:

[0025] 1000, Heat-conducting shell; 1001, Heat dissipation chamber; 1002, Inner heat-conducting wall; 1003, Outer heat-conducting wall;

[0026] 2000, Semiconductor cooler; 3000, Component to be cooled; 4000, Heat-conducting sheet; 5000, Heat spreader; 6000, Heat transfer connector. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0028] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0033] See Figures 1-3 As shown, Figure 1 This is an internal cross-sectional view of the energy storage radiator provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of the energy storage radiator provided in the embodiment of this application. Figure 3 This is a cross-sectional view of the heat-conducting housing provided in an embodiment of this application. The energy storage radiator shown includes: a heat-conducting housing 1000 and a semiconductor cooler 2000. The heat-conducting housing 1000 has a heat dissipation chamber 1001 inside, which is filled with graphene-modified paraffin. A first end of the semiconductor cooler 2000 is used to connect to the heat-conducting housing 1000, and a second end of the semiconductor cooler 2000 is used to connect to the component 3000 to be cooled.

[0034] The heat-conducting housing 1000 has a heat dissipation chamber 1001 inside, which is filled with graphene-modified paraffin wax. The heat-conducting housing 1000 is typically made of materials with good thermal conductivity, such as aluminum alloy. Aluminum alloy has the characteristics of low density, high strength, and good thermal conductivity, which can achieve rapid heat transfer while ensuring structural strength. The first end of the thermoelectric cooler 2000 is used to connect to the heat-conducting housing 1000, and the second end is used to connect to the component to be cooled 3000. The thermoelectric cooler 2000 operates based on the Peltier effect. When current flows, a temperature difference is generated at both ends of the thermoelectric cooler 2000, realizing the directional transfer of heat from one end to the other. When the component to be cooled 3000 generates heat, the thermoelectric cooler 2000 can actively cool, transferring the heat from the second end connected to the component to be cooled 3000 to the first end connected to the heat-conducting housing 1000, and then through the heat-conducting housing 1000 to the graphene-modified paraffin wax inside.

[0035] The active cooling function of the thermoelectric cooler 2000 can rapidly reduce the temperature of the heat-dissipating component 3000. The high thermal conductivity and phase change energy storage characteristics of graphene-modified paraffin allow it to quickly absorb and store the heat transferred from the thermoelectric cooler 2000, effectively preventing heat accumulation and improving the overall heat dissipation efficiency of the heat sink. The thermoelectric cooler 2000 can quickly begin cooling after being powered on, and the graphene-modified paraffin can also rapidly absorb heat. The entire heat sink can respond to changes in heat in a short time, ensuring that the heat-dissipating component 3000 receives effective heat dissipation in a timely manner when it starts up.

[0036] When the heat sink 3000 starts generating heat, the thermoelectric cooler 2000 begins operating under external power. The thermoelectric cooler 2000 absorbs the heat generated by the heat sink 3000 from its second end and transfers it to its first end. The heat is then transferred through the heat-conducting housing 1000 to the graphene-modified paraffin inside. Due to the high thermal conductivity of the graphene-modified paraffin, heat can rapidly diffuse within it. When the temperature reaches the melting point of the paraffin, the graphene-modified paraffin begins to change from a solid to a liquid state, absorbing a large amount of latent heat, thereby effectively reducing the temperature inside the heat sink. After the heat sink 3000 stops operating, as the temperature decreases, the graphene-modified paraffin changes from a liquid to a solid state again, releasing the previously stored heat.

[0037] Graphene-modified paraffin is composed of paraffin wax and 5%-10% high thermal conductivity graphene powder. Paraffin wax exhibits solid-liquid phase transition characteristics, absorbing or releasing a large amount of latent heat during the phase transition. When the temperature rises, paraffin wax changes from a solid to a liquid state, absorbing heat from the surrounding environment; when the temperature decreases, it changes from a liquid to a solid state, releasing the previously stored heat. Graphene, with its excellent thermal conductivity, when uniformly dispersed in paraffin wax, can form a highly efficient heat conduction network within the paraffin wax, greatly improving the thermal conductivity of the paraffin wax and enabling faster heat conduction within the material, thus enhancing heat dissipation efficiency.

[0038] The aforementioned energy storage radiator is designed to address the problems of poor heat dissipation in confined spaces, poor reliability of rotating parts during long-term storage, and inconvenience of using cryogenic refrigerants such as liquid nitrogen, which are traditional heat dissipation methods. It meets the needs of electronic devices for short-term heat dissipation, long-term storage, and rapid response in confined spaces. At the same time, it adopts a reasonable structural design and material selection to improve heat dissipation efficiency and stability.

[0039] In some embodiments of this application, the interior of the heat dissipation chamber 1001 includes a heat-conducting inner wall 1002, which is located near the first end of the thermoelectric cooler 2000. Several heat-conducting sheets 4000 extending into the graphene-modified paraffin are disposed on the heat-conducting inner wall 1002. The heat-conducting inner wall 1002 is located near the first end of the thermoelectric cooler 2000 because the thermoelectric cooler 2000 transfers heat from the heat-dissipating component 3000 to the heat-conducting housing 1000. The area near the first end is where heat first arrives; therefore, placing the heat-conducting sheets 4000 here allows for immediate capture and transfer of heat.

[0040] The length of the heat-conducting plate 4000 should be determined based on the size of the heat dissipation chamber 1001 and the amount of graphene-modified paraffin filling. Generally, it should be ensured that the heat-conducting plate 4000 can penetrate to a certain depth into the graphene-modified paraffin to fully utilize its thermal conductivity. However, it should not be too long, as this may affect the installation of other components or lead to structural instability. The width and thickness should be considered in conjunction with thermal conductivity and structural strength. Typically, while ensuring sufficient strength, the thickness should be minimized to increase the number of heat-conducting plates 4000 per unit area, thereby improving thermal conductivity.

[0041] The heat-conducting plate 4000 can be designed in various shapes, such as sheet, needle, or wavy. The sheet-shaped heat-conducting plate 4000 has a large heat dissipation area, which can quickly transfer heat to the graphene-modified paraffin; the needle-shaped heat-conducting plate 4000 can penetrate the graphene-modified paraffin more deeply, expanding the range of heat transfer; the wavy heat-conducting plate 4000 not only increases the surface area, but also disrupts the heat flow distribution inside the graphene-modified paraffin to a certain extent, promoting uniform heat diffusion.

[0042] The heat-conducting plate 4000 extends into the graphene-modified paraffin, significantly increasing the contact area between the heat-conducting inner wall 1002 and the graphene-modified paraffin. According to the principle of heat conduction, the larger the heat exchange area, the faster the heat transfer rate. Therefore, the heat-conducting plate 4000 enables heat to be transferred more quickly from the heat-conducting inner wall 1002 to the graphene-modified paraffin, improving the overall heat transfer efficiency of the radiator.

[0043] The presence of the heat-conducting plate 4000 can form a more efficient heat conduction channel inside the graphene-modified paraffin, improve the heat flow distribution, and allow heat to be diffused more evenly throughout the heat dissipation chamber 1001, avoiding the problem of uneven heat dissipation caused by local heat accumulation.

[0044] When the thermoelectric cooler 2000 transfers heat to the heat-conducting inner wall 1002, the heat-conducting plate 4000 can quickly transfer the heat to the interior of the graphene-modified paraffin, causing the paraffin to reach its melting point and undergo a phase change more rapidly. During the phase change, the paraffin absorbs a large amount of latent heat, thus effectively storing heat. The placement of the heat-conducting plate 4000 accelerates this process and improves the phase change energy storage efficiency of the graphene-modified paraffin.

[0045] With the uniformly distributed heat-conducting plates 4000, heat can be transferred more evenly to all parts of the graphene-modified paraffin, allowing the paraffin to undergo a more uniform phase change within the entire heat dissipation chamber 1001. This not only improves energy storage efficiency but also ensures a more stable release of heat during the heat dissipation process, extending the effective heat dissipation time of the radiator.

[0046] In some embodiments of this application, the vapor chamber 5000 is precisely installed between the inner heat-conducting wall 1002 and the outer heat-conducting wall 1003, ensuring a tight fit with both walls. The outer heat-conducting wall 1003 connects to the first end of the thermoelectric cooler 2000, and the inner heat-conducting wall 1002 is located near the graphene-modified paraffin inside the heat dissipation chamber 1001. The fit of the vapor chamber 5000 to the two walls ensures efficient heat transfer. The dimensions of the vapor chamber 5000 are adapted to the areas of the inner heat-conducting wall 1002 and the outer heat-conducting wall 1003. Typically, the area of ​​the vapor chamber 5000 should be slightly smaller than the contact area between the two walls to ensure stable installation and not obstruct the normal operation of other components.

[0047] When the first end of the semiconductor cooler 2000 transfers heat to the outer heat-conducting wall 1003, the heat distribution may be uneven due to factors such as the contact area. The vapor chamber 5000, with its excellent thermal conductivity, can quickly and evenly distribute the concentrated heat to the inner heat-conducting wall 1002, allowing for more uniform heat transfer to the graphene-modified paraffin. This avoids localized overheating, ensuring that the graphene-modified paraffin can absorb heat more efficiently and improving overall heat dissipation efficiency.

[0048] In some embodiments of this application, a heat transfer connector 6000 is provided on the second end of the semiconductor cooler 2000. The heat transfer connector 6000 is used to connect the heat-dissipating component 3000 and the second end of the semiconductor cooler 2000, and the heat transfer connector 6000 conforms to the surface of the heat-dissipating component 3000.

[0049] When the heat transfer connector 6000 is installed between the second end of the thermoelectric cooler 2000 and the heat sink 3000, thermal grease is first applied to the contact surface between the heat transfer connector 6000 and the second end of the thermoelectric cooler 2000 to reduce thermal resistance. Then, mechanical fastening devices such as screws and clips are used to connect them, ensuring a firm connection. When connecting to the heat sink 3000, thermal grease is also applied. A suitable fixing method is then adopted according to the structural characteristics of the heat sink 3000. For example, for the heat sink 3000 with mounting holes, screws can be used to pass through the mounting holes of the heat transfer connector 6000 and the heat sink 3000 for fixing; for the heat sink 3000 with a smooth surface, a special adhesive method can be used for fixing, but an adhesive with good thermal conductivity and high temperature resistance must be selected.

[0050] The heat transfer connector 6000 conforms to the surface of the component to be cooled 3000, greatly increasing the contact area between them. According to the principle of heat conduction, the larger the contact area, the higher the heat transfer efficiency. This allows the heat generated by the component to be cooled 3000 to be transferred to the thermoelectric cooler 2000 more quickly and fully, and then dissipated through subsequent heat dissipation components.

[0051] In some embodiments of this application, the area of ​​the first end of the thermoelectric cooler 2000 is smaller than the area of ​​the heat-conducting outer wall 1003. When designing and manufacturing this energy storage heat sink, the dimensions of the first end of the thermoelectric cooler 2000 and the heat-conducting outer wall 1003 are precisely controlled according to the specifications of the thermoelectric cooler 2000 and the heat-conducting housing 1000. For example, if the first end of the thermoelectric cooler 2000 is rectangular, its length and width can be set to be smaller than the corresponding side length of the heat-conducting outer wall 1003 by adjusting the production mold or cutting process. During installation, the first end of the thermoelectric cooler 2000 is accurately positioned on the heat-conducting outer wall 1003, ensuring that their centers coincide as much as possible, so that the first end of the thermoelectric cooler 2000 completely covers the effective heat-conducting area of ​​the heat-conducting outer wall 1003. Simultaneously, appropriate connection methods, such as welding or applying thermally conductive adhesive, are used to ensure a tight connection between the two, thereby reducing thermal resistance during heat transfer.

[0052] The area of ​​the first end of the thermoelectric cooler 2000 is smaller than the area of ​​the outer heat conduction wall 1003. This allows the outer heat conduction wall 1003 to have some spare area for natural heat dissipation while simultaneously receiving heat from the thermoelectric cooler 2000. This extra heat dissipation area can directly exchange heat with the surrounding air, increasing the heat dissipation pathways of the radiator and improving the overall heat dissipation efficiency.

[0053] In some embodiments of this application, the heat-conducting plates 4000 should be distributed as evenly as possible on the heat-conducting inner wall 1002. For example, if the heat-conducting inner wall 1002 is circular, the heat-conducting plates 4000 can be arranged at equal angular intervals along the circumference; if it is a square inner wall, they can be arranged in a matrix. This ensures that heat is evenly diffused to all parts of the graphene-modified paraffin, avoiding local overheating or undercooling.

[0054] In some embodiments of this application, the heat-conducting sheet 4000 and the heat-conducting inner wall 1002 should be connected in a robust manner with good thermal conductivity, such as welding or integral molding. Welding can ensure close contact between the heat-conducting sheet 4000 and the heat-conducting inner wall 1002, reduce thermal resistance, and improve heat transfer efficiency; integral molding can further reduce thermal resistance while ensuring the stability and reliability of the structure.

[0055] In some embodiments of this application, the heat spreader 5000 is configured as one of a pure diamond plate, a graphene aluminum composite plate, a diamond aluminum composite plate, or a graphene plate.

[0056] The heat-conducting sheet 4000 is configured as one of the following: aluminum alloy sheet, diamond sheet, graphene aluminum composite sheet, or diamond aluminum composite sheet.

[0057] The choice of material for the 4000 heatsink also depends on heat dissipation requirements and cost factors. Aluminum alloy sheets are relatively inexpensive and suitable for general heat dissipation scenarios; diamond sheets have excellent thermal conductivity but are more expensive and can be used in applications with extremely high heat dissipation requirements; graphene-aluminum composite sheets and diamond-aluminum composite sheets combine the advantages of different materials, achieving a better balance between performance and cost.

[0058] The material of the vapor chamber 5000 should be selected based on the specific application and performance requirements of the heat sink. If extremely high heat dissipation efficiency is required and cost is acceptable, pure diamond plate can be used, which has an extremely high thermal conductivity. If a balance between cost and performance is considered, graphene aluminum composite plate or diamond aluminum composite plate can be used. For some applications that are more sensitive to weight and cost, graphene plate can be used.

[0059] In one embodiment of this application, the heat-dissipating component 3000 is a sensor. The heat transfer connector 6000 is a sensor backplate.

[0060] A graphene heat spreader with a power output of 800 W / (m·K) and an aluminum alloy internal heat-conducting sheet (4000) are used as the heat conductor. 8 g of graphene-modified paraffin is added. A 2000 semiconductor cooler with a power output of 5 W is used. The entire heat sink weighs approximately 50 g. At an ambient temperature of 30°C, the 5 W sensor can be cooled to below 15°C and maintained for 2 minutes.

[0061] In some embodiments of this application, during the fabrication of the heat dissipation chamber 1001, the various components of the heat-conducting shell 1000 (such as the outer shell, cover plate, etc.) are designed as a single unit or processed using high-precision techniques to minimize gaps at the joints. For example, the heat-conducting shell 1000 is injection molded to ensure tight connections between parts and reduce potential leakage points. For parts that need to be joined, welding, laser welding, or other methods are used for sealing connections to form a seamless integral structure, eliminating the possibility of filler leakage at the source.

[0062] The energy storage radiator uses graphene-modified paraffin as the energy storage medium. Paraffin exhibits solid-liquid phase change properties, absorbing heat as it changes from a solid to a liquid state when the temperature rises and releasing heat as it changes from a liquid to a solid state when the temperature drops. This characteristic allows the graphene-modified paraffin to absorb and release heat through phase change during long-term storage, even with fluctuations in ambient temperature. This maintains a relatively stable internal temperature for the radiator, preventing adverse effects from large temperature changes on the radiator and its connected components, thus extending its overall lifespan and facilitating long-term storage.

[0063] The heat dissipation chamber 1001 has an internal heat conduction wall 1002. The heat-conducting fins 4000 mounted on the wall are connected to the heat conduction wall 1002 using a robust and thermally conductive connection method, such as welding or integral molding. This connection method not only reduces thermal resistance and improves heat transfer efficiency, but also ensures the stability and reliability of the structure. During long-term storage, components will not loosen or fall off due to vibration, temperature changes, or other factors, ensuring that the heat sink maintains good performance and is suitable for long-term storage.

[0064] During the fabrication of the heat dissipation chamber 1001, all components of the heat-conducting shell 1000 are designed as a single unit or manufactured using high-precision machining processes. The gaps at the joints are extremely small, and sealing connections are achieved through welding, laser welding, or other methods. This design and process eliminates the possibility of leakage of fillers such as graphene-modified paraffin from the outset, preventing damage to the heat dissipation performance due to leakage and ensuring the long-term storage of the heat sink.

[0065] The semiconductor cooler 2000 operates based on the Peltier effect and is capable of active cooling, transferring heat generated by the heat-dissipating component 3000 from the end connected to the heat-dissipating component 3000 to the end connected to the heat-conducting housing 1000. In confined spaces, traditional heat dissipation methods may be ineffective due to space limitations, but the active cooling function of the semiconductor cooler 2000 is not affected by space constraints and can quickly reduce the temperature of the heat-dissipating component 3000, effectively solving the heat dissipation problem in confined spaces.

[0066] In some embodiments of this application, a power supply system is also included, which is electrically connected to the thermoelectric cooler 2000. The thermoelectric cooler 2000 operates based on the Peltier effect; when current flows through it, a temperature difference is generated across its two ends, enabling directional heat transfer from one end to the other. For temperature-sensitive optical sensor chips, the thermoelectric cooler 2000 can actively cool when the ambient temperature is higher than its optimal operating temperature.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. An energy storage radiator, characterized in that, The energy storage radiator includes: Thermally conductive housing (1000) and semiconductor cooler (2000). The heat-conducting housing (1000) has a heat dissipation chamber (1001) inside, and the heat dissipation chamber (1001) is filled with graphene-modified paraffin. The first end of the semiconductor cooler (2000) is used to connect to the heat-conducting housing (1000), and the second end of the semiconductor cooler (2000) is used to connect to the heat-dissipating component (3000).

2. The energy storage radiator according to claim 1, characterized in that, The interior of the heat dissipation chamber (1001) includes a heat-conducting inner wall (1002), which is located near the first end of the semiconductor cooler (2000). Several heat-conducting sheets (4000) extending into the graphene-modified paraffin are provided on the heat-conducting inner wall (1002).

3. The energy storage radiator according to claim 2, characterized in that, The first end of the semiconductor cooler (2000) is connected to the outer heat conduction wall (1003) of the heat conduction housing (1000), and a heat spreader (5000) is sandwiched between the inner heat conduction wall (1002) and the outer heat conduction wall (1003).

4. The energy storage radiator according to claim 2, characterized in that, A heat transfer connector (6000) is provided on the second end of the semiconductor cooler (2000). The heat transfer connector (6000) is used to connect the heat-dissipating component (3000) and the second end of the semiconductor cooler (2000). The heat transfer connector (6000) conforms to the surface of the heat-dissipating component (3000).

5. The energy storage radiator according to claim 3, characterized in that, The area of ​​the first end of the semiconductor cooler (2000) is smaller than the area of ​​the heat-conducting outer wall (1003).

6. The energy storage radiator according to claim 3, characterized in that, The heat spreader (5000) is uniformly distributed on the inner heat conduction wall (1002).

7. The energy storage radiator according to claim 2, characterized in that, The heat-conducting sheet (4000) and the heat-conducting shell (1000) are integrally formed.

8. The energy storage radiator according to claim 3, characterized in that, The heat spreader (5000) is configured as one of a pure diamond plate, a graphene aluminum composite plate, a diamond aluminum composite plate, or a graphene plate. And / or, The heat-conducting sheet (4000) is configured as one of the following: aluminum alloy sheet, diamond sheet, graphene aluminum composite sheet, and diamond aluminum composite sheet.

9. The energy storage radiator according to claim 1, characterized in that, The heat dissipation chamber (1001) is sealed.

10. The energy storage radiator according to claim 1, characterized in that, It also includes a power supply system electrically connected to the semiconductor cooler (2000).

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