Package structure

Abstract

The utility model relates to a packaging structure, and relates to the technical field of solar cells, the packaging structure can comprise a flexible substrate, a flexible cover plate, a perovskite assembly and packaging glue, the perovskite assembly is arranged between the flexible substrate and the flexible cover plate, and the flexible substrate, the perovskite assembly and the flexible cover plate are stacked in a first direction; wherein the projection of the perovskite assembly on the flexible substrate in the first direction is completely located in the outer contour of the flexible substrate, and the projection of the perovskite assembly on the flexible cover plate in the first direction is completely located in the outer contour of the flexible cover plate; the packaging adhesive is filled between the flexible substrate and the flexible cover plate; wherein the minimum width of the packaging adhesive which surrounds the periphery of the perovskite assembly and continuously extends along the second direction is A, and A is greater than or equal to 3mm. According to the packaging structure, the sealing effect can be enhanced, the problem that water vapor easily intrudes into the perovskite assembly is solved, and the damp-heat stability of the perovskite assembly is improved.

Description

Technical Field

[0001] This application relates to the field of perovskite solar cell technology, specifically to a packaging structure. Background Technology

[0002] Flexible perovskite solar cells typically employ a sandwich structure, where the encapsulation includes a substrate, a cover plate, and a perovskite module, bonded together using adhesive materials. However, this method leaves gaps between layers as pathways for moisture intrusion. In practical use, the flexible perovskite solar cells are prone to delamination at bends, resulting in poor sealing and easy moisture penetration. This moisture contact with the perovskite module can easily lead to its degradation. Utility Model Content

[0003] To address the aforementioned technical problems, embodiments of this application provide an encapsulation structure that enhances the sealing effect, mitigates the problem of moisture easily penetrating perovskite modules, and improves the humid heat stability of perovskite modules.

[0004] Firstly, a packaging structure is provided, including:

[0005] Flexible substrate;

[0006] Flexible cover plate;

[0007] A perovskite module is disposed between the flexible substrate and the flexible cover plate. The flexible substrate, the perovskite module, and the flexible cover plate are stacked along a first direction. The perovskite module is used to convert light energy into electrical energy. The projection of the perovskite module onto the flexible substrate along the first direction is completely within the outer contour of the flexible substrate, and the projection of the perovskite module onto the flexible cover plate along the first direction is completely within the outer contour of the flexible cover plate.

[0008] An encapsulating adhesive is filled between the flexible substrate and the flexible cover plate. The perovskite module has a first surface facing the flexible cover plate. The first surface includes a first central portion and a first edge portion surrounding the first central portion. A first portion of the encapsulating adhesive covers the first edge portion, and a second portion of the encapsulating adhesive surrounds the periphery of the perovskite module.

[0009] Wherein, the minimum width of the second part of the encapsulating adhesive extending continuously along the second direction is A, and A satisfies: A≥3mm.

[0010] According to the first aspect of this application, A satisfies: A≤50mm.

[0011] According to a first aspect of this application, the encapsulation structure further includes a first light-transmitting layer, which is sandwiched between the flexible cover plate and the first central portion, and the encapsulating adhesive is disposed around the periphery of the first light-transmitting layer.

[0012] According to a first aspect of this application, the packaging structure further includes:

[0013] The second light-transmitting layer is sandwiched between the perovskite component and the flexible substrate, and the encapsulating adhesive is surrounding the periphery of the second light-transmitting layer.

[0014] According to a first aspect of this application, the two opposing surfaces of the second light-transmitting layer and the perovskite component have the same area, and the two opposing surfaces of the second light-transmitting layer and the perovskite component are arranged to overlap.

[0015] According to a first aspect of this application, the perovskite component has a second surface facing the flexible substrate, the second surface including a second central portion and a second edge portion surrounding the second central portion, the second light-transmitting layer being sandwiched between the second central portion and the flexible substrate, and the encapsulating adhesive being filled between the second edge portion and the flexible substrate.

[0016] According to a first aspect of this application, the encapsulating adhesive comprises one of butyl rubber, epoxy resin, and polysiloxane; and / or,

[0017] The first and / or second light-transmitting layer comprises one of the following: polyolefin elastomer, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyvinyl butyral, polyoxyethylene, polyurethane, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, fluorinated polyacrylate, polyacrylic acid, polyimide, polycarbonate, polystyrene, parylene, polylactic acid, polyethylene, polypropylene, fluorinated polymer, silicon oxide, tin oxide, aluminum oxide, zirconium oxide, nickel oxide, zinc oxide, titanium oxide, silicon nitride, and titanium nitride.

[0018] According to a first aspect of this application, the encapsulating adhesive is filled between the first central portion and the flexible cover plate.

[0019] According to a first aspect of this application, the encapsulating adhesive completely encapsulates the perovskite component.

[0020] According to a first aspect of this application, the packaging structure further includes:

[0021] The second light-transmitting layer is sandwiched between the perovskite component and the flexible substrate, and the encapsulating adhesive is surrounding the periphery of the second light-transmitting layer. The second light-transmitting layer is formed by slit-coating a layer of polymethyl methacrylate on the flexible substrate.

[0022] The encapsulation structure provided in this application embodiment ensures that the projection of the perovskite module along the first direction onto the flexible substrate is completely within the outer contour of the flexible substrate, and the projection of the perovskite module along the first direction onto the flexible cover plate is completely within the outer contour of the flexible cover plate. Encapsulating adhesive surrounds the periphery of the perovskite module. Thus, under the combined encapsulation effect of the flexible cover plate, flexible substrate, and encapsulating adhesive, the outer boundary of the perovskite module is not exposed to the external environment. The flexible cover plate, flexible substrate, and encapsulating adhesive all provide water-blocking properties. Furthermore, because the encapsulating adhesive surrounds the periphery of the perovskite module, it effectively reduces water penetration. This design eliminates the path for moisture intrusion, thereby improving sealing performance. Furthermore, by ensuring that the minimum distance A along the second direction of the encapsulant surrounding the perovskite module (the second part of the encapsulant) satisfies A≥3mm, the edge of the perovskite module will not be too close to the edge of the flexible substrate and the edge of the flexible cover plate. This enhances the sealing effect of the encapsulant, mitigates the problem of moisture easily intruding into the perovskite module, further improves the damp heat stability of the perovskite module, and ensures that the encapsulant has sufficient bonding area, making it less prone to delamination of the flexible perovskite solar cell under bending conditions. Attached Figure Description

[0023] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0024] Figure 1 This is a schematic diagram of an encapsulation structure provided for an exemplary embodiment of this application.

[0025] Figure 2 A schematic diagram of an encapsulation structure provided for another exemplary embodiment of this application.

[0026] Figure 3 A schematic diagram of an encapsulation structure provided for another exemplary embodiment of this application.

[0027] Figure 4 A schematic diagram of an encapsulation structure provided for another exemplary embodiment of this application.

[0028] Figure 5 A schematic diagram of an encapsulation structure provided for another exemplary embodiment of this application.

[0029] Figure 6 A schematic diagram of a package structure provided in proportion to a single embodiment of this application.

[0030] Reference numerals: 100-Encapsulation structure; 110-Flexible substrate; 120-Flexible cover plate; 130-Perovskite component; 131-First surface; 1311-First center portion; 1312-First edge portion; 132-Second surface; 1321-Second center portion; 1322-Second edge portion; 133-Transparent conductive layer; 134-Main layer; 140-Encapsulating adhesive; 141-First part; 142-Second part; 150-First light-transmitting layer; 160-Second light-transmitting layer; 170-Positive electrode. Detailed Implementation

[0031] Hereinafter, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.

[0032] Figure 1 This is a schematic diagram of an encapsulation structure provided for an exemplary embodiment of this application. For example... Figure 1 As shown, the encapsulation structure 100 provided in this application embodiment may include a flexible substrate 110, a flexible cover plate 120, and a perovskite module 130. The flexible substrate 110 and the flexible cover plate 120 are spaced apart, and the perovskite module 130 is disposed between the flexible substrate 110 and the flexible cover plate 120. The perovskite module 130 can convert light energy into electrical energy. The flexible substrate 110, the perovskite module 130, and the flexible cover plate 120 are arranged along a first direction (refer to...). Figure 1 (Y-axis direction) stacking settings.

[0033] It should be noted that the flexible substrate 110 can provide stable support for the perovskite module 130 and the flexible cover plate 120, and the flexible substrate 110 generally has good waterproof performance, which can prevent moisture from penetrating the perovskite module 130.

[0034] In one embodiment, the water vapor transmission rate varies depending on the material used for the flexible substrate 110. However, in practical applications, the water vapor transmission rate of the flexible substrate 110 is typically maintained between 0 and 5 × 10⁻⁶. 3 g / m 2 Between / days.

[0035] It should be noted that the flexible substrate 110 typically has high light transmittance to ensure that incident light can reach the perovskite module 130 efficiently.

[0036] In one embodiment, the flexible substrate 110 has an average transmittance of over 75% in the 400nm-800nm ​​wavelength band.

[0037] In one embodiment, the flexible substrate 110 may be selected from transparent membranes, TPT (fluoroplastic composite film), PET (polyethylene terephthalate), etc.

[0038] It should be noted that the flexible cover plate 120 generally serves to protect the perovskite module 130, preventing damage to the perovskite module 130 from external foreign objects. Furthermore, the flexible cover plate 120 typically has high light transmittance to ensure that incident light can reach the perovskite module 130 efficiently.

[0039] In one embodiment, the water vapor transmission rate varies depending on the material used for the flexible cover 120. However, in practical applications, the water vapor transmission rate of the flexible cover 120 is typically maintained between 0 and 5 × 10⁻⁶. 3 g / m 2 Between / days.

[0040] In one embodiment, the flexible cover 120 may be made of tempered glass, transparent polymer (e.g., polycarbonate), etc.

[0041] It should be noted that the perovskite component 130 is typically a semiconductor material that can convert light energy into electrical energy and generate current.

[0042] In one embodiment, the perovskite module 130 may be selected from crystalline silicon (including monocrystalline and polycrystalline), thin film (e.g., cadmium telluride, copper indium gallium selenide, etc.), perovskite modules, etc.

[0043] like Figure 1 As shown, the encapsulation structure 100 may further include encapsulating adhesive 140, which is filled between the flexible substrate 110 and the flexible cover plate 120. The encapsulating adhesive 140 can be used to fix the flexible substrate 110, the flexible cover plate 120 and the perovskite component 130 relative to each other.

[0044] like Figure 1 As shown, the perovskite assembly 130 is along the first direction (reference). Figure 1The projection of the perovskite component 130 (in the Y-axis direction) onto the flexible substrate 110 lies entirely within the outer contour of the flexible substrate 110, meaning the flexible substrate 110 can completely cover the perovskite component 130. Similarly, the projection of the perovskite component 130 along the first direction onto the flexible cover plate 120 lies entirely within the outer contour of the flexible cover plate 120, meaning the flexible cover plate 120 can completely cover the perovskite component 130. Furthermore, the perovskite component 130 has a first surface 131 facing the flexible cover plate 120. The first surface 131 includes a first central portion 1311 and a first edge portion 1312. The first edge portion 1312 is disposed around the first central portion 1311. A first portion 141 of the encapsulant 140 covers the first edge portion 1312, and a second portion 142 of the encapsulant 140 surrounds the periphery of the perovskite component 130. Therefore, at least one of the encapsulant 140, the flexible substrate 110, and the flexible cover plate 120 is always present on the outer side of the perovskite component 130.

[0045] It should be understood that, under the combined covering effect of the flexible cover plate 120, the flexible substrate 110, and the encapsulating adhesive 140, the outer boundary of the perovskite module 130 will not be exposed to the external environment. The flexible cover plate 120, the flexible substrate 110, and the encapsulating adhesive 140 can all play a water-blocking role. Furthermore, since the encapsulating adhesive 140 surrounds the periphery of the perovskite module 130, it can effectively reduce the path of moisture intrusion, thereby improving the sealing performance.

[0046] like Figure 1 As shown, the second portion 142 of the encapsulating adhesive 140 is along the second direction (reference). Figure 1 The minimum distance that can be continuously extended along the X-axis direction is A.

[0047] It should be understood that if the minimum distance A is too small, the edge of the perovskite module 130 will be too close to the edge of the flexible substrate 110 and the edge of the flexible cover plate 120, resulting in poor sealing of the encapsulant 140. This will make it easy for moisture from the external environment to penetrate the perovskite module 130 and affect its performance.

[0048] Therefore, in this embodiment, the minimum distance A satisfies: A≥3mm. This ensures that the edge of the perovskite module 130 does not get too close to the edges of the flexible substrate 110 and the flexible cover plate 120, enhancing the sealing effect of the encapsulant 140, mitigating the problem of moisture easily penetrating the perovskite module 130, and further improving the damp heat stability of the perovskite module 130. Furthermore, this arrangement ensures that the encapsulant 140 has sufficient bonding area, making it less prone to delamination of the flexible perovskite solar cell under bending conditions.

[0049] It should be understood that if the minimum distance A is too large, the second part 142 of the encapsulation structure 100 will occupy a large amount of space in the second direction, and the amount of materials used for the flexible substrate 110, encapsulation adhesive 140 and flexible cover plate 120 will increase, which will increase manufacturing costs.

[0050] Therefore, in this embodiment, the minimum distance A also satisfies: A≤50mm. This effectively improves the problem that the second part 142 of the packaging structure 100 occupies a large amount of space in the second direction due to an excessively large minimum distance A, thereby reducing material usage and lowering manufacturing costs.

[0051] In one embodiment, the minimum distance A can be selected as 3mm, 20mm, 30mm, 50mm, etc.

[0052] like Figure 1 As shown, the encapsulation structure 100 may further include a first light-transmitting layer 150, which is sandwiched between the flexible cover plate 120 and the first central portion 1311, and the encapsulating adhesive 140 is disposed around the periphery of the first light-transmitting layer 150.

[0053] It should be noted that the first light-transmitting layer 150 can be bonded between the bottom wall of the flexible cover plate 120 and the top wall of the perovskite module 130. On the one hand, the first light-transmitting layer 150 can fix the flexible cover plate 120 and the perovskite module 130. On the other hand, the first light-transmitting layer 150 is usually made of a material with high light transmittance. In this way, even if the first light-transmitting layer 150 is located between the bottom wall of the flexible cover plate 120 and the top wall of the perovskite module 130, the obstruction of the first light-transmitting layer 150 to the incident light can be reduced, ensuring that the perovskite module 130 can receive sufficient light.

[0054] In one embodiment, based on the function and application scenario of the aforementioned flexible cover plate 120, the first light-transmitting layer 150 can be made of materials with strong UV resistance and strong chemical corrosion resistance, such as fluorinated polyacrylate, polyimide, etc.

[0055] like Figure 1 As shown, the encapsulation structure 100 may further include a second light-transmitting layer 160, which is sandwiched between the perovskite component 130 and the flexible substrate 110, and the encapsulating adhesive 140 is disposed around the periphery of the second light-transmitting layer 160.

[0056] It should be noted that the second light-transmitting layer 160 can be bonded between the top wall of the flexible substrate 110 and the bottom wall of the perovskite module 130. Furthermore, the second light-transmitting layer 160 serves two purposes: firstly, it can fix the flexible substrate 110 and the perovskite module 130; secondly, it is typically made of a high-transmittance material. Thus, even though the second light-transmitting layer 160 is positioned between the top wall of the flexible substrate 110 and the bottom wall of the perovskite module 130, it can reduce the obstruction of incident light, ensuring that the perovskite module 130 receives sufficient light.

[0057] In one embodiment, depending on the function and application scenario of the aforementioned flexible substrate 110, the second light-transmitting layer 160 can be selected from a material with high light transmittance and low modulus elastomer (absorbing thermal stress), such as POE.

[0058] In one embodiment, the encapsulating adhesive 140 surrounding the first light-transmitting layer 150, the encapsulating adhesive 140 surrounding the second light-transmitting layer 160, and the encapsulating adhesive 140 surrounding the perovskite component 130 can be made of the same material or different materials.

[0059] In one embodiment, the encapsulant 140 surrounding the first light-transmitting layer 150, the encapsulant 140 surrounding the second light-transmitting layer 160, and the encapsulant 140 surrounding the perovskite module 130 are all made of the same material with good water-blocking properties, such as butyl rubber. In this way, the encapsulant 140 has a better overall sealing effect and can effectively prevent external moisture from entering the perovskite module 130, thereby improving the protection effect on the perovskite module 130.

[0060] It should be noted that the "top wall of the flexible substrate 110", "bottom wall of the perovskite module 130", "top wall of the perovskite module 130" and "bottom wall of the flexible cover plate 120" involved in the embodiments of this application are all based on the normal placement state of the encapsulation structure 100, for example Figures 1 to 5 The placement state of the package structure shown can be considered as the normal placement state of the package structure 100.

[0061] like Figure 1 As shown, the perovskite component 130 has a second surface 132 facing the flexible substrate 110. The second surface 132 includes a second central portion 1321 and a second edge portion 1322. The second edge portion 1322 surrounds the second central portion 1321. A second light-transmitting layer 160 is sandwiched between the second central portion 1321 and the flexible substrate 110. The space between the second edge portion 1322 and the flexible substrate 110 is filled with encapsulating adhesive 140.

[0062] It should be understood that the encapsulating adhesive 140 between the second edge portion 1322 and the flexible substrate 110 can prevent moisture from penetrating the second edge portion 1322. The second light-transmitting layer 160 is sandwiched between the second center portion 1321 and the flexible substrate 110, that is, the projection of the second light-transmitting layer 160 on the perovskite module 130 is located within the outer contour of the perovskite module 130. In this way, the second light-transmitting layer 160 can reduce material usage and save manufacturing costs while ensuring that the perovskite module 130 can receive sufficient light.

[0063] Figure 2 A schematic diagram of a packaging structure provided for another exemplary embodiment of this application. (See diagram below.) Figure 2 As shown, the two opposing surfaces of the second light-transmitting layer 160 and the perovskite component 130 have the same area, and the two opposing surfaces of the second light-transmitting layer 160 and the perovskite component 130 are arranged to overlap. Compared to Figure 1 The scheme shown (the projection of the second light-transmitting layer 160 is located within the outer contour of the perovskite component 130) has one advantage: Figure 2 The illustrated scheme can increase the light-transmitting area of ​​the second light-transmitting layer 160, allowing the surface of the perovskite module 130 near the second light-transmitting layer 160 to receive more light, which is beneficial for improving photoelectric conversion efficiency; on the other hand, Figure 2 The proposed solution increases the contact area between the second light-transmitting layer 160 and the perovskite component 130, thereby improving the connection strength between the second light-transmitting layer 160 and the perovskite component 130.

[0064] In one embodiment, the encapsulating adhesive 140 may include one of butyl rubber, epoxy resin, and polysiloxane, all of which have good adhesive properties.

[0065] In one embodiment, the first light-transmitting layer 150 and / or the second light-transmitting layer 160 may include one of the following: polyolefin elastomer (POE), ethylene-vinyl acetate copolymer (EVA), polyvinyl alcohol, polyvinyl butyral, polyethylene oxide, polyurethane, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), fluorinated polyacrylate, polyacrylic acid, polyimide, polycarbonate, polystyrene, parylene, polylactic acid, polyethylene, polypropylene, fluorinated polymers, silicon oxide, tin oxide, aluminum oxide, zirconium oxide, nickel oxide, zinc oxide, titanium oxide, silicon nitride, and titanium nitride. These materials all possess high light transmittance, reducing the obstruction of incident light by the first light-transmitting layer 150 and / or the second light-transmitting layer 160, ensuring that incident light can pass through the first light-transmitting layer 150 and / or the second light-transmitting layer 160 to reach the perovskite module 130.

[0066] It should be noted that when the first light-transmitting layer 150 and / or the second light-transmitting layer 160 are made of polyolefin elastomer (POE), ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral, polyurethane, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), fluorinated polyacrylate, polyimide, polycarbonate, polystyrene, parylene, polylactic acid, polyethylene, polypropylene, fluorinated polymer, silicon oxide, tin oxide, aluminum oxide, zirconium oxide, nickel oxide, zinc oxide, titanium oxide, silicon nitride, or titanium nitride, they can still have good water-blocking properties, improve sealing performance, and effectively prevent water vapor from entering the perovskite module 130.

[0067] Figure 3 A schematic diagram of an encapsulation structure provided for another exemplary embodiment of this application. Figure 4 A schematic diagram of an encapsulation structure provided for another exemplary embodiment of this application. Figure 5 A schematic diagram of a packaging structure provided for another exemplary embodiment of this application. (See diagram below.) Figures 3 to 5 As shown, the space between the first central portion 1311 and the flexible cover plate 120 can also be filled with encapsulating adhesive 140. Combining this with the preceding statement that the encapsulating adhesive 140 covers the first edge portion 1312, it can be inferred that the area between the first surface 131 and the flexible cover plate 120 is filled with encapsulating adhesive 140. This results in two advantages: firstly, the area of ​​the encapsulating adhesive 140 bonding the flexible cover plate 120 and the perovskite module 130 is increased, thereby improving the connection strength between the flexible cover plate 120 and the perovskite module 130; secondly, the encapsulating adhesive 140 occupies a larger area between the flexible cover plate 120 and the first surface 131, further enhancing the sealing performance.

[0068] like Figure 3 As shown, in one embodiment, the encapsulant 140 completely covers the perovskite module 130. Compared with the previous solution of setting the first light-transmitting layer 150 and / or the second light-transmitting layer 160, firstly, the manufacturing process can be simplified and production efficiency can be improved; secondly, the interface between the encapsulant 140 and the first light-transmitting layer 150, and / or the interface between the encapsulant 140 and the second light-transmitting layer 160 can be removed, thereby further improving the sealing performance and further preventing external moisture from entering the perovskite module 130.

[0069] In one embodiment, Figure 3 The encapsulating adhesive 140 in the illustrated embodiment can be made by curing epoxy resin.

[0070] like Figure 4As shown, in one embodiment, when encapsulating adhesive 140 is filled between the first central portion 1311 and the flexible cover plate 120, and the encapsulating adhesive 140 covers the first edge portion 1312 (that is, when the area between the first surface 131 and the flexible cover plate 120 is filled with encapsulating adhesive 140), the perovskite component 130 may include a transparent conductive layer 133 and a main body layer 134. The transparent conductive layer 133 is disposed on one side surface of the flexible substrate 110, and the main body layer 134 is disposed on the side of the transparent conductive layer 133 away from the flexible substrate 110.

[0071] It should be noted that the surface of the flexible substrate 110 is not smooth and has multiple pinholes. If the main layer 134 is directly prepared on the flexible substrate 110, it is easy to affect the deposition effect, generate leakage current, and thus affect the battery performance of the main layer 134.

[0072] Therefore, in Figure 4 In the embodiment shown, a transparent conductive layer 133 is first prepared on one side surface of the flexible substrate 110, so that a dense, pinhole-free thin film structure can be formed on one side surface of the flexible substrate 110. Then, the main layer 134 is prepared on the transparent conductive layer 133, which can effectively reduce leakage current and improve the battery performance of the main layer 134.

[0073] It should be noted that the transparent conductive layer 133 typically has the characteristics of high light transmittance and low resistivity, which can ensure that the main body can fully receive light and efficiently collect current, thereby improving the battery efficiency of the main body layer 134.

[0074] In one embodiment, the transparent conductive layer 133 can be selected from indium tin oxide (ITO), AZO (aluminum-doped zinc oxide), etc.

[0075] In one embodiment, a transparent conductive layer 133 is formed on one side surface of the flexible substrate 110 by magnetron sputtering.

[0076] It should be noted that, Figure 4 In the illustrated embodiment, the encapsulating adhesive 140 bonds the flexible substrate 110, the flexible cover plate 120, the transparent conductive layer 133, and the main body layer 134 to fix the flexible substrate 110, the flexible cover plate 120, the transparent conductive layer 133, and the main body layer 134 to each other.

[0077] like Figure 5As shown, in one embodiment, when encapsulating adhesive 140 is filled between the first central portion 1311 and the flexible cover plate 120, and the encapsulating adhesive 140 covers the first edge portion 1312 (that is, when the area between the first surface 131 and the flexible cover plate 120 is filled with encapsulating adhesive 140), a second light-transmitting layer 160 is disposed between the perovskite component 130 and the flexible substrate 110. The encapsulating adhesive 140 surrounds the periphery of the second light-transmitting layer 160. The second light-transmitting layer 160 is formed by slit-coating a layer of PMMA (polymethyl methacrylate) on the flexible substrate 110.

[0078] It should be noted that PMMA, as the second light-transmitting layer 160, has the characteristics of high light transmittance, strong weather resistance, and easy processing. It can adapt to complex working environments while significantly improving light capture efficiency.

[0079] It should be noted that slit coating is a high-precision thin film preparation technology, which has been described in related technologies and will not be repeated here.

[0080] Optionally, Figure 5 In the illustrated embodiment, the encapsulating adhesive 140 can be prepared on the flexible cover plate 120 by screen printing, using PDMS (polydimethylsiloxane) as the encapsulating adhesive 140. PDMS has the advantages of excellent flexibility, fatigue resistance, high light transmittance, easy processing, easy curing and molding, and convenient bonding and fixing function.

[0081] exist Figure 5 In the illustrated embodiment, the perovskite component 130 may also include a transparent conductive layer 133 and a main body layer 134. The transparent conductive layer 133 is disposed on the side of the second light-transmitting layer 160 away from the flexible substrate 110, and the main body layer 134 is disposed on the side of the transparent conductive layer 133 away from the second light-transmitting layer 160.

[0082] It should be understood that, compared to Figure 4 The embodiment shown describes a method for directly fabricating a transparent conductive layer 133 on a flexible substrate 110. Figure 5 The second light-transmitting layer 160 in the illustrated embodiment can be used to fix the transparent conductive layer 133 and the flexible substrate 110, thereby improving the relative stability between the transparent conductive layer 133 and the flexible substrate 110.

[0083] like Figures 1 to 5As shown, the encapsulation structure 100 may further include a positive electrode 170 and a negative electrode (not shown in the figure). A portion of the positive electrode 170 and a portion of the negative electrode are connected to the perovskite component 130. Another portion of the positive electrode 170 and another portion of the negative electrode extend beyond the coverage of the encapsulant 140 and are located outside the coverage of the flexible substrate 110 and the flexible cover plate 120. Thus, the portions of the positive electrode 170 and the negative electrode located outside the coverage of the flexible substrate 110 and the flexible cover plate 120 can be used to connect external components to achieve current transmission.

[0084] In one embodiment, two conductive adhesives are provided on one side surface of the perovskite module 130. The two conductive adhesives can serve as the positive and negative electrodes of the battery. The two conductive adhesives are electrically connected to the positive electrode 170 and the negative electrode, respectively, thereby forming a current loop.

[0085] In one embodiment, the material of the positive electrode 170 and / or the negative electrode may be at least one of copper, silver, tin, nickel, titanium, magnesium, aluminum, carbon, ITO (indium tin oxide), IZO (indium zinc oxide), IWO (indium tungsten oxide), and AZO (aluminum-doped zinc oxide).

[0086] The present application will be further described below with reference to specific embodiments and comparative examples.

[0087] Example 1

[0088] refer to Figure 1 As shown, the encapsulation structure 100 includes a flexible substrate 110, a flexible cover plate 120, a perovskite component 130, and an encapsulating adhesive 140. The perovskite component 130 is disposed between the flexible substrate 110 and the flexible cover plate 120. The flexible substrate 110, the perovskite component 130, and the flexible cover plate 120 are stacked along a first direction. The projection of the perovskite component 130 along the first direction onto the flexible substrate 110 is completely within the outer contour of the flexible substrate 110. The projection of the perovskite component 130 along the first direction onto the flexible cover plate 120 is also completely within the outer contour of the flexible cover plate 120. The encapsulating adhesive 140 fills the space between the flexible substrate 110 and the flexible cover plate 120. The perovskite component 130 has a first surface 131 facing the flexible cover plate 120. The first surface 131 includes a first central portion 1311 and a first edge portion 1312 surrounding the first central portion 1311. A first portion 141 of the encapsulant 140 covers the first edge portion 1312, and a second portion 142 of the encapsulant 140 surrounds the periphery of the perovskite component 130.

[0089] The minimum width of the second part 142 of the encapsulating adhesive 140, which extends continuously along the second direction, is A, and A satisfies: A≥3mm.

[0090] In this embodiment, the encapsulation structure 100 further includes a first light-transmitting layer 150, which is sandwiched between the flexible cover plate 120 and the first central portion 1311, and the encapsulating adhesive 140 is disposed around the periphery of the first light-transmitting layer 150.

[0091] In this embodiment, the encapsulation structure 100 further includes a second light-transmitting layer 160. The perovskite component 130 has a second surface 132 facing the flexible substrate 110. The second surface 132 includes a second central portion 1321 and a second edge portion 1322. The second edge portion 1322 surrounds the second central portion 1321. The second light-transmitting layer 160 is sandwiched between the second central portion 1321 and the flexible substrate 110. The space between the second edge portion 1322 and the flexible substrate 110 is filled with encapsulating adhesive 140.

[0092] The preparation process in this embodiment is as follows:

[0093] Flexible perovskite solar cells with dimensions of 0.01 cm * 15 cm * 20 cm were fabricated based on PET / I TO substrates as perovskite module 130.

[0094] A transparent barrier film with dimensions of 15.5cm*20.5cm is cut out as a flexible substrate 110, and an aluminum-plastic film with the same dimensions as the flexible substrate 110 is cut out as a flexible cover plate 120.

[0095] A piece of POE with dimensions of 0.06cm*14.5cm*19.5cm is cut out as the second light-transmitting layer 160. Butyl rubber with a thickness of 0.08cm and a width of 0.5cm is used as the first colloid of the encapsulating adhesive 140. The second light-transmitting layer 160 and the first colloid of the prepared encapsulating adhesive 140 are placed on the flexible substrate 110.

[0096] The aforementioned perovskite component 130 is placed above the second light-transmitting layer 160 and the first colloid of the prepared encapsulating adhesive 140, and two conductive tapes are applied as positive and negative electrodes to lead out the positive electrode 170 and the negative electrode, respectively.

[0097] A piece of POE measuring 0.06cm*14.5cm*19.5cm is cut to serve as the first light-transmitting layer 150. Butyl rubber with a thickness of 0.08cm and a width of 0.5cm is used as the second adhesive for the encapsulant 140. The first light-transmitting layer 150 and the second adhesive for the encapsulant 140 are placed above the perovskite module 130, the positive electrode 170, and the negative electrode.

[0098] The aforementioned flexible cover plate 120 is applied over the first light-transmitting layer 150 and the second adhesive of the encapsulating adhesive 140.

[0099] Vacuum thermal lamination is performed to obtain the encapsulation structure 100 in this embodiment.

[0100] Example 2

[0101] refer to Figure 2 As shown, the encapsulation structure 100 includes a flexible substrate 110, a flexible cover plate 120, a perovskite component 130, and an encapsulating adhesive 140. The perovskite component 130 is disposed between the flexible substrate 110 and the flexible cover plate 120. The flexible substrate 110, the perovskite component 130, and the flexible cover plate 120 are stacked along a first direction. The projection of the perovskite component 130 along the first direction onto the flexible substrate 110 is completely within the outer contour of the flexible substrate 110. The projection of the perovskite component 130 along the first direction onto the flexible cover plate 120 is also completely within the outer contour of the flexible cover plate 120. The encapsulating adhesive 140 fills the space between the flexible substrate 110 and the flexible cover plate 120. The perovskite component 130 has a first surface 131 facing the flexible cover plate 120. The first surface 131 includes a first central portion 1311 and a first edge portion 1312 surrounding the first central portion 1311. A first portion 141 of the encapsulant 140 covers the first edge portion 1312, and a second portion 142 of the encapsulant 140 surrounds the periphery of the perovskite component 130.

[0102] The minimum width of the second part 142 of the encapsulating adhesive 140, which extends continuously along the second direction, is A, and A satisfies: A≥3mm.

[0103] In this embodiment, the encapsulation structure 100 further includes a first light-transmitting layer 150, which is sandwiched between the flexible cover plate 120 and the first central portion 1311, and the encapsulating adhesive 140 is disposed around the periphery of the first light-transmitting layer 150.

[0104] In this embodiment, the encapsulation structure 100 further includes a second light-transmitting layer 160. The two opposing surfaces of the second light-transmitting layer 160 and the perovskite component 130 have the same area, and the two opposing surfaces of the second light-transmitting layer 160 and the perovskite component 130 are arranged to overlap.

[0105] The preparation process in this embodiment is as follows:

[0106] Flexible perovskite solar cells with dimensions of 0.005cm*15cm*20cm were fabricated based on a CP I / I TO substrate as perovskite module 130.

[0107] A transparent barrier film with dimensions of 15.5cm*20.5cm is cut out as a flexible substrate 110, and an aluminum-plastic film with the same dimensions as the flexible substrate 110 is cut out as a flexible cover plate 120.

[0108] A piece of POE with dimensions of 0.04cm*15cm*20cm is cut out as the second light-transmitting layer 160, and the second light-transmitting layer 160 is placed on top of the flexible substrate 110.

[0109] The aforementioned perovskite component 130 is placed above the second light-transmitting layer 160, and two conductive tapes are applied as positive and negative electrodes to lead out the positive electrode 170 and the negative electrode, respectively.

[0110] A piece of POE measuring 0.04cm*14.5cm*19.5cm is cut as the first light-transmitting layer 150. Butyl rubber with a thickness of 0.08cm and a width of 0.5cm is used as the encapsulating adhesive 140. The first light-transmitting layer 150 and the encapsulating adhesive 140 are placed on top of the perovskite component 130, the positive electrode 170, the negative electrode, and part of the flexible substrate 110.

[0111] The aforementioned flexible cover plate 120 is applied over the first light-transmitting layer 150 and the encapsulating adhesive 140.

[0112] Vacuum thermal lamination is performed to obtain the encapsulation structure 100 in this embodiment.

[0113] Example 3

[0114] refer to Figure 3 As shown, the encapsulation structure 100 includes a flexible substrate 110, a flexible cover plate 120, a perovskite component 130, and an encapsulating adhesive 140. The perovskite component 130 is disposed between the flexible substrate 110 and the flexible cover plate 120. The flexible substrate 110, the perovskite component 130, and the flexible cover plate 120 are stacked along a first direction. The projection of the perovskite component 130 along the first direction onto the flexible substrate 110 is completely within the outer contour of the flexible substrate 110. The projection of the perovskite component 130 along the first direction onto the flexible cover plate 120 is also completely within the outer contour of the flexible cover plate 120. The encapsulating adhesive 140 fills the space between the flexible substrate 110 and the flexible cover plate 120. The perovskite component 130 has a first surface 131 facing the flexible cover plate 120. The first surface 131 includes a first central portion 1311 and a first edge portion 1312 surrounding the first central portion 1311. A first portion 141 of the encapsulant 140 covers the first edge portion 1312, and a second portion 142 of the encapsulant 140 surrounds the periphery of the perovskite component 130.

[0115] The minimum width of the second part 142 of the encapsulating adhesive 140, which extends continuously along the second direction, is A, and A satisfies: A≥3mm.

[0116] In this embodiment, the space between the first central portion 1311 and the flexible cover plate 120 is filled with encapsulating adhesive 140, which completely covers the perovskite component 130.

[0117] The preparation process in this embodiment is as follows:

[0118] Flexible perovskite solar cells with dimensions of 0.0125cm*15cm*20cm were fabricated based on PEN / I TO substrates as perovskite module 130.

[0119] A transparent barrier film with dimensions of 15.5cm*20.5cm is cut out as a flexible substrate 110, and an aluminum-plastic film with the same dimensions as the flexible substrate 110 is cut out as a flexible cover plate 120.

[0120] A layer of thermosetting epoxy adhesive with a thickness of 0.01 cm was prepared on the top of the flexible substrate 110 and the bottom of the flexible cover plate 120 by screen printing, respectively, to obtain the first colloid and the second colloid of the encapsulating adhesive 140.

[0121] The aforementioned perovskite component 130 is placed on top of the first colloid of the encapsulating adhesive 140, and two conductive tapes are applied as positive and negative electrodes to lead out the positive electrode 170 and the negative electrode, respectively.

[0122] A flexible cover plate 120 covered with the second encapsulant 140 is placed above the perovskite module 130, the positive electrode 170, the negative electrode, and the first encapsulant 140. A roller press is used to remove bubbles and fuse the first and second encapsulants 140 into a whole.

[0123] The encapsulation structure 100 of this embodiment is obtained by curing in a vacuum oven at 70°C for 4 hours.

[0124] Example 4

[0125] refer to Figure 4 As shown, the encapsulation structure 100 includes a flexible substrate 110, a flexible cover plate 120, a perovskite component 130, and an encapsulating adhesive 140. The perovskite component 130 is disposed between the flexible substrate 110 and the flexible cover plate 120. The flexible substrate 110, the perovskite component 130, and the flexible cover plate 120 are stacked along a first direction. The projection of the perovskite component 130 along the first direction onto the flexible substrate 110 is completely within the outer contour of the flexible substrate 110. The projection of the perovskite component 130 along the first direction onto the flexible cover plate 120 is also completely within the outer contour of the flexible cover plate 120. The encapsulating adhesive 140 fills the space between the flexible substrate 110 and the flexible cover plate 120. The perovskite component 130 has a first surface 131 facing the flexible cover plate 120. The first surface 131 includes a first central portion 1311 and a first edge portion 1312 surrounding the first central portion 1311. A first portion 141 of the encapsulant 140 covers the first edge portion 1312, and a second portion 142 of the encapsulant 140 surrounds the periphery of the perovskite component 130.

[0126] The minimum width of the second part 142 of the encapsulating adhesive 140, which extends continuously along the second direction, is A, and A satisfies: A≥3mm.

[0127] In this embodiment, the space between the first central portion 1311 and the flexible cover plate 120 is filled with encapsulating adhesive 140, and the encapsulating adhesive 140 covers the first edge portion 1312 (that is, the area between the first surface 131 and the flexible cover plate 120 is filled with encapsulating adhesive 140). The perovskite component 130 includes a transparent conductive layer 133 and a main body layer 134. The transparent conductive layer 133 is disposed on one side surface of the flexible substrate 110, and the main body layer 134 is disposed on the side of the transparent conductive layer 133 away from the flexible substrate 110.

[0128] The preparation process in this embodiment is as follows:

[0129] A silicon nitride layer was prepared on a 0.01 cm thick PET film using CVD, resulting in a water vapor permeability as low as 5×10-3 g / m2 / day. The film was then cut to a size of 15cm*20cm to obtain a flexible substrate 110.

[0130] A 60 nm thick ITO layer is magnetron sputtered on the flexible substrate 110 as a transparent conductive layer 133. Based on the transparent conductive layer 133, a main layer 134 is prepared. The edges are cleaned using a laser, so that the size of the perovskite component 130 (including the transparent conductive layer 133 and the main layer 134) is 14 cm * 19 cm, and the distance between the edge of the perovskite component 130 and the edge of the flexible substrate 110 is 0.5 cm.

[0131] Two conductive tapes are attached to the perovskite module 130 to serve as the positive and negative electrodes, respectively, leading out the positive electrode 170 and the negative electrode.

[0132] A 15cm*20cm aluminum-plastic film is cut to serve as a flexible cover plate 120. A 0.02cm thick thermosetting epoxy adhesive is then applied to the flexible cover plate 120 using a dispensing method to serve as an encapsulating adhesive 140.

[0133] With the encapsulating adhesive 140 facing down, it is placed above the perovskite component 130, the positive electrode 170, and the negative electrode. After degassing using a roller press, it is placed in a vacuum oven at 70°C for 0.5 hours to cure, thus obtaining the encapsulation structure 100 in this embodiment.

[0134] Example 5

[0135] refer to Figure 5As shown, the encapsulation structure 100 includes a flexible substrate 110, a flexible cover plate 120, a perovskite component 130, and an encapsulating adhesive 140. The perovskite component 130 is disposed between the flexible substrate 110 and the flexible cover plate 120. The flexible substrate 110, the perovskite component 130, and the flexible cover plate 120 are stacked along a first direction. The projection of the perovskite component 130 along the first direction onto the flexible substrate 110 is completely within the outer contour of the flexible substrate 110. The projection of the perovskite component 130 along the first direction onto the flexible cover plate 120 is also completely within the outer contour of the flexible cover plate 120. The encapsulating adhesive 140 fills the space between the flexible substrate 110 and the flexible cover plate 120. The perovskite component 130 has a first surface 131 facing the flexible cover plate 120. The first surface 131 includes a first central portion 1311 and a first edge portion 1312 surrounding the first central portion 1311. A first portion 141 of the encapsulant 140 covers the first edge portion 1312, and a second portion 142 of the encapsulant 140 surrounds the periphery of the perovskite component 130.

[0136] The minimum width of the second part 142 of the encapsulating adhesive 140, which extends continuously along the second direction, is A, and A satisfies: A≥3mm.

[0137] In this embodiment, encapsulating adhesive 140 is filled between the first central portion 1311 and the flexible cover plate 120, and the encapsulating adhesive 140 covers the first edge portion 1312 (that is, the area between the first surface 131 and the flexible cover plate 120 is filled with encapsulating adhesive 140). A second light-transmitting layer 160 is disposed between the perovskite component 130 and the flexible substrate 110. The encapsulating adhesive 140 surrounds the periphery of the second light-transmitting layer 160, which is formed by slitting a layer of PMMA (polymethyl methacrylate) onto the flexible substrate 110. The perovskite component 130 includes a transparent conductive layer 133 and a main body layer 134. The transparent conductive layer 133 is disposed on the side of the second light-transmitting layer 160 away from the flexible substrate 110, and the main body layer 134 is disposed on the side of the transparent conductive layer 133 away from the second light-transmitting layer 160.

[0138] The preparation process in this embodiment is as follows:

[0139] A 30-nanometer-thick layer of alumina was prepared on a 0.0125-cm-thick PET film using atomic deposition, resulting in a water vapor permeability as low as 5×10-4 g / m2 / day. The film was then cut to a size of 15cm*20cm to obtain a flexible substrate 110.

[0140] A 1-micron-thick layer of PMMA was prepared on a transparent water-resistant film using a slit coating method, serving as the second light-transmitting layer 160.

[0141] A 120nm thick ITO layer is magnetron sputtered on the second transparent layer 160 as a transparent conductive layer 133. Based on the transparent conductive layer 133, a main layer 134 is prepared. The edges are cleaned using a laser, so that the size of the perovskite component 130 (including the transparent conductive layer 133 and the main layer 134) is 14cm*19cm, and the distance between the edge of the perovskite component 130 and the edge of the flexible substrate 110 is 0.5cm.

[0142] Two conductive tapes are attached to the perovskite module 130 to serve as the positive and negative electrodes, respectively, leading out the positive electrode 170 and the negative electrode.

[0143] A 15cm*20cm aluminum-plastic film is cut to serve as a flexible cover plate 120. A 0.02cm thick PDMS is prepared on the flexible cover plate 120 using screen printing as an encapsulating adhesive 140.

[0144] The flexible cover plate 120 and the perovskite component 130 are bonded together using encapsulating adhesive 140. After degassing using a roller press, the components are placed in an oven at 90°C for 1 hour to cure, thus obtaining the encapsulation structure 100 of this embodiment.

[0145] Comparative Example 1

[0146] Figure 6 This is a schematic diagram of a package structure provided on a scale according to this application. (Reference) Figure 6 As shown, the encapsulation structure 100 includes a flexible substrate 110, a flexible cover plate 120, a perovskite component 130, and an encapsulating adhesive 140. The perovskite component 130 is disposed between the flexible substrate 110 and the flexible cover plate 120. The flexible substrate 110, the perovskite component 130, and the flexible cover plate 120 are stacked along a first direction.

[0147] In this comparative example, the perovskite component 130 is along the first direction (reference). Figure 6 The edge of the perovskite assembly 130 along the X-axis direction is flush with the edge of the flexible substrate 110 along the first direction, and the edge of the perovskite assembly 130 along the first direction is flush with the edge of the flexible cover plate 120 along the first direction.

[0148] In this comparative example, the perovskite component 130 has a first surface 131 facing the flexible cover plate 120. The first surface 131 includes a first central portion 1311 and a first edge portion 1312. The first edge portion 1312 is disposed around the first central portion 1311. The perovskite component 130 has a second surface 132 facing the flexible substrate 110. The second surface 132 includes a second central portion 1321 and a second edge portion 1322. The second edge portion 1322 surrounds the second central portion 1321.

[0149] In this comparative example, the encapsulation structure 100 includes a first light-transmitting layer 150 and a second light-transmitting layer 160. The first light-transmitting layer 150 is sandwiched between the flexible cover plate 120 and the first central portion 1311, and the space between the first edge portion 1312 and the flexible cover plate 120 is filled with encapsulating adhesive 140. The second light-transmitting layer 160 is sandwiched between the second central portion 1321 and the flexible substrate 110, and the space between the second edge portion 1322 and the flexible substrate 110 is filled with encapsulating adhesive 140.

[0150] The preparation process of this comparative example is as follows:

[0151] Flexible perovskite solar cells with dimensions of 0.01 cm * 15 cm * 20 cm were fabricated based on PET / I TO substrates as perovskite module 130.

[0152] A transparent barrier film with a size of 15cm*20cm is cut out as a flexible substrate 110, and an aluminum-plastic film with the same size as the flexible substrate 110 is cut out as a flexible cover plate 120.

[0153] A POE with a size of 14cm*19cm is cut out as the second light-transmitting layer 160. A 0.5cm wide butyl rubber is used as the encapsulating adhesive 140 between the second edge portion 1322 and the flexible substrate 110. The encapsulating adhesive 140 between the second edge portion 1322 and the flexible substrate 110 and the second light-transmitting layer 160 are placed on top of the flexible substrate 110.

[0154] The aforementioned perovskite component 130 is placed above the encapsulating adhesive 140 and the second light-transmitting layer 160 between the second edge portion 1322 and the flexible substrate 110, and two conductive tapes are applied as positive and negative electrodes to lead out the positive electrode 170 and the negative electrode, respectively.

[0155] A 14cm*19cm piece of POE is cut as the first light-transmitting layer 150. A 0.5cm wide piece of butyl rubber is used as the encapsulating adhesive 140 between the first edge portion 1312 and the flexible cover plate 120. The encapsulating adhesive 140 between the first edge portion 1312 and the flexible cover plate 120 and the first light-transmitting layer 150 are placed above the perovskite component 130, the positive electrode 170 and the negative electrode.

[0156] The aforementioned flexible cover plate 120 is applied over the encapsulating adhesive 140 between the first edge portion 1312 and the flexible cover plate 120 and the first light-transmitting layer 150.

[0157] Vacuum thermal lamination was performed to obtain the packaging structure 100 in this comparative example.

[0158] Test results:

[0159] The results are shown in Table 1.

[0160] Table 1

[0161] Experiment number Initial efficiency (%) DH48 efficiency (%) Efficiency decay Appearance after aging Example 1 15.6 9.62 38％ No change Example 2 15.6 10.2 35％ No change Example 3 17.3 14.9 14％ No change Example 4 17.2 15.7 9％ No change Example 5 18.4 16.7 9％ No change Comparative Example 1 15.4 4.30 72％ Laser marking turns yellow

[0162] like Figures 1 to 6 As shown in Table 1, regarding efficiency degradation, Examples 1-5 (efficiency degradation rate 9%-38%) were significantly better than Comparative Example 1 (72%). Among them, Examples 3-5 exhibited excellent stability (degradation rate ≤14%). This indicates that the package structure with optimized sealing performance can effectively suppress the efficiency degradation of the package structure.

[0163] Regarding appearance stability: The appearance of Examples 1-5 after aging was normal, while the comparative example showed yellowing due to laser scribing, indicating that the packaging structure optimized for sealing performance in Examples 1-5 can effectively avoid interface degradation caused by aging.

[0164] In summary, the high efficiency degradation and yellowing issues of Comparative Example 1 highlight the defects in the packaging structure of the related technology. In contrast, Examples 1-5 significantly improve the ability of the packaging structure to suppress efficiency degradation and resist aging by optimizing the packaging structure and improving its sealing performance.

[0165] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0166] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0167] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0168] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0169] The above description has been given for illustrative and descriptive purposes. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A packaging structure, characterized in that, include: Flexible substrate; Flexible cover plate; A perovskite module is disposed between the flexible substrate and the flexible cover plate. The flexible substrate, the perovskite module, and the flexible cover plate are stacked along a first direction. The perovskite module is used to convert light energy into electrical energy. The projection of the perovskite module onto the flexible substrate along the first direction is completely within the outer contour of the flexible substrate, and the projection of the perovskite module onto the flexible cover plate along the first direction is completely within the outer contour of the flexible cover plate. An encapsulating adhesive is filled between the flexible substrate and the flexible cover plate. The perovskite module has a first surface facing the flexible cover plate. The first surface includes a first central portion and a first edge portion surrounding the first central portion. A first portion of the encapsulating adhesive covers the first edge portion. A second portion of the encapsulating adhesive surrounds the periphery of the perovskite module. Wherein, the minimum width of the second part of the encapsulating adhesive that extends continuously along the second direction is A, and A satisfies: A≥3mm.

2. The packaging structure according to claim 1, characterized in that, The condition A satisfies: A≤50mm.

3. The packaging structure according to claim 1, characterized in that, The encapsulation structure further includes a first light-transmitting layer, which is sandwiched between the flexible cover plate and the first central portion, and the encapsulating adhesive is surrounding the periphery of the first light-transmitting layer.

4. The packaging structure according to claim 3, characterized in that, The packaging structure further includes: The second light-transmitting layer is sandwiched between the perovskite component and the flexible substrate, and the encapsulating adhesive is surrounding the periphery of the second light-transmitting layer.

5. The packaging structure according to claim 4, characterized in that, The two opposing surfaces of the second light-transmitting layer and the perovskite component have the same area, and the two opposing surfaces of the second light-transmitting layer and the perovskite component are arranged to overlap.

6. The packaging structure according to claim 4, characterized in that, The perovskite component has a second surface facing the flexible substrate, the second surface including a second central portion and a second edge portion surrounding the second central portion, the second light-transmitting layer being sandwiched between the second central portion and the flexible substrate, and the encapsulating adhesive being filled between the second edge portion and the flexible substrate.

7. The packaging structure according to claim 4, characterized in that, The encapsulating adhesive includes one of butyl rubber, epoxy resin, and polysiloxane; and / or, The first and / or second light-transmitting layer comprises one of the following: polyolefin elastomer, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyvinyl butyral, polyoxyethylene, polyurethane, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, fluorinated polyacrylate, polyacrylic acid, polyimide, polycarbonate, polystyrene, parylene, polylactic acid, polyethylene, polypropylene, fluorinated polymer, silicon oxide, tin oxide, aluminum oxide, zirconium oxide, nickel oxide, zinc oxide, titanium oxide, silicon nitride, and titanium nitride.

8. The packaging structure according to claim 1, characterized in that, The encapsulating adhesive is filled between the first central portion and the flexible cover plate.

9. The packaging structure according to claim 8, characterized in that, The encapsulating adhesive completely encapsulates the perovskite component.

10. The packaging structure according to claim 8, characterized in that, The packaging structure further includes: The second light-transmitting layer is sandwiched between the perovskite component and the flexible substrate, and the encapsulating adhesive is surrounding the periphery of the second light-transmitting layer. The second light-transmitting layer is formed by slit-coating a layer of polymethyl methacrylate on the flexible substrate.

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