Manipulator control equipment for carrying wafer

Abstract

The utility model discloses manipulator control equipment for carrying wafers, which belongs to the field of wafer processing and comprises a base, a mechanical arm fixedly connected above the base, a mounting frame fixedly connected at the end part of the mechanical arm, and a motor fixedly connected below the inside of the mounting frame. Negative pressure generated by the negative pressure pump is accurately transmitted to the suction cup through the guide pipe, the telescopic hose and the connecting pipe, so that the suction cup can firmly suck the wafer, the situation that the wafer is scratched, damaged and the like due to external force in the carrying process can be effectively avoided, the quality and integrity of the wafer are guaranteed, and meanwhile the wafer conveying efficiency is improved. By means of linkage of the arc-shaped grooves, the sliding strips, the sliding blocks and other components, flexible adjustment of the distance between the four suction cups is achieved, the device can adapt to carrying of wafers of different sizes, meanwhile, the telescopic hose correspondingly stretches out and draws back along with changes of the distance between the suction cups, negative pressure stable transmission is guaranteed, it is guaranteed that the wafers of different specifications can be firmly adsorbed and carried, and the working efficiency is improved. And the applicability and the carrying efficiency of the equipment are obviously improved.

Description

Technical Field

[0001] This utility model relates to the field of robotic arms, and more specifically, to a control device for a robotic arm used for handling wafers. Background Technology

[0002] A wafer is a thin sheet of semiconductor, such as crystalline silicon, used to manufacture integrated circuits. During the manufacturing process, wafers need to be handled and transferred.

[0003] Chinese Patent Announcement No. CN220856551U discloses a robotic arm for handling wafers. The solution includes an X-axis drive unit, a Z-axis drive unit disposed on the X-axis drive unit, a Y-axis drive unit disposed on the Z-axis drive unit, and a wafer pick-and-place unit disposed on the Y-axis drive unit. A steering unit is disposed between the Y-axis drive unit and the Z-axis drive unit. The wafer pick-and-place unit includes a wafer fork and a wafer positioning sensor. The angular distance between the wafer fork and the wafer positioning sensor is 180 degrees.

[0004] However, in the aforementioned patent, the wafer fork is used to transport the wafer. The wafer fork is inserted into the gap at the edge of the wafer by the fork structure and uses the lever principle to lift or move the wafer to achieve transport. This method has many drawbacks: First, during the insertion and lifting of the wafer, the wafer fork is very likely to rub and collide with the edge of the wafer, resulting in damage such as wafer edge cracking and surface scratches. The integrity of the wafer edge and surface is crucial to subsequent precision processing steps such as photolithography and etching. Such damage will significantly reduce the wafer yield.

[0005] Therefore, a robotic arm control device for wafer handling is proposed to address the above problems. Utility Model Content

[0006] In view of the problems existing in the prior art, the purpose of this utility model is to provide a robotic arm control device for wafer handling, which can achieve the required functions.

[0007] To solve the above problems, the present invention adopts the following technical solution.

[0008] A robotic arm control device for handling wafers includes a base, a robotic arm fixedly connected to the top of the base, a mounting frame fixedly connected to the end of the robotic arm, a motor fixedly connected to the lower part of the mounting frame, a turntable fixedly connected to the output end of the motor, the turntable being rotatably connected to the lower part of the mounting frame, four arc-shaped grooves being formed on one side of the turntable in an equidistant circular array, and four sliders fixedly connected to the lower part of the mounting frame in an equidistant circular array with the center of the turntable as the center.

[0009] Furthermore, each of the four sliders is slidably connected to a slider below it, and each of the four sliders is fixedly connected to a connecting plate below it.

[0010] Furthermore, each of the four connecting plates is fixedly connected to a protrusion, and the four protrusions are slidably connected inside the four arc-shaped grooves.

[0011] Furthermore, suction cups are fixedly connected to the lower part of each of the four connecting plates, and connecting tubes are fixedly connected to the upper part of each of the four suction cups. Telescopic hoses are fixedly connected to the ends of the four connecting tubes away from the suction cups.

[0012] Furthermore, each of the four telescopic hoses has a conduit fixedly connected to the end furthest from the connecting pipe, and a negative pressure pump is fixedly connected to the upper part of the inside of the mounting bracket. The output end of the negative pressure pump is fixedly connected to the end of the four conduits furthest from the telescopic hoses.

[0013] Furthermore, fixing plates are fixedly connected to both sides of the base, and reinforcing ribs are fixedly connected between the two fixing plates and one side of the base.

[0014] Furthermore, a hydraulic cylinder is fixedly connected above each of the two fixed plates, and the output ends of the two hydraulic cylinders are fixedly connected to a support plate through the fixed plates.

[0015] Furthermore, omnidirectional wheels are fixedly connected to the four corners below the base.

[0016] Compared with existing technologies, the advantages of this utility model are:

[0017] (1) In this solution, the turntable is driven by a motor to rotate, and the linkage of components such as arc groove, slide bar, and slider is used to realize the flexible adjustment of the distance between the four suction cups, which can be adapted to the handling of wafers of different sizes. At the same time, the telescopic hose extends and retracts accordingly with the change of suction cup distance to ensure stable negative pressure transmission, and ensure that wafers of different specifications can be firmly adsorbed and handled, significantly improving the applicability and handling efficiency of the equipment.

[0018] (2) In this scheme, the support plate connected to the output end of the hydraulic cylinder mainly increases the friction between the equipment and the ground. When the equipment is in working condition and the caster wheel is locked, the support plate contacts the ground in a large area, which effectively prevents the equipment from shifting or shaking during operation, further improving the stability of the equipment during operation and ensuring the smooth handling of wafers.

[0019] (3) In this scheme, the negative pressure generated by the negative pressure pump is accurately transmitted to the suction cup through the conduit, telescopic hose and connecting pipe, so that the suction cup can firmly adsorb the wafer. Compared with the traditional mechanical gripping method, this adsorption method causes less damage to the surface of the wafer and can effectively avoid scratches and damage to the wafer due to external force during the handling process, thereby ensuring the quality and integrity of the wafer. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 For the present utility model Figure 1 Schematic diagram of the structure at point A in the middle;

[0022] Figure 3 This is a schematic diagram showing the positional relationship between the mounting bracket, the negative pressure pump, and the motor in this utility model;

[0023] Figure 4 This is a schematic diagram showing the positional relationship between the turntable and the arc-shaped groove in this utility model;

[0024] Figure 5 This is a schematic diagram showing the connection relationship between the connecting plate and the suction cup in this utility model.

[0025] Explanation of the labels in the diagram:

[0026] 1. Base; 11. Fixing plate; 12. Reinforcing rib; 13. Hydraulic cylinder; 14. Support plate; 15. Casters; 16. Robotic arm; 17. Mounting bracket; 18. Motor; 19. Turntable; 2. Arc groove; 21. Sliding bar; 22. Sliding block; 23. Connecting plate; 24. Protrusion; 25. Suction cup; 26. Connecting pipe; 27. Telescopic hose; 28. Conduit; 29. ​​Negative pressure pump. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] In some embodiments, please refer to the accompanying drawings. Figures 1-5 A robotic arm control device for handling wafers includes a base 1, a robotic arm 16 fixedly connected to the top of the base 1, a mounting frame 17 fixedly connected to the end of the robotic arm 16, a motor 18 fixedly connected to the lower part of the mounting frame 17, a turntable 19 fixedly connected to the output end of the motor 18, the turntable 19 being rotatably connected to the lower part of the mounting frame 17, four arc-shaped grooves 2 formed on one side of the turntable 19, the four arc-shaped grooves 2 being arranged in an equidistant circular array, four sliders 21 fixedly connected to the lower part of the mounting frame 17, the four sliders 21 being arranged in an equidistant circular array with the center of the turntable 19 as the center, and sliders 22 slidably connected to the lower part of each of the four sliders 21. A connecting plate 23 is fixedly connected to the bottom of each of the four blocks 22. A protrusion 24 is fixedly connected to the top of each of the four connecting plates 23. The four protrusions 24 are slidably connected to the inside of the four arc-shaped grooves 2. A suction cup 25 is fixedly connected to the bottom of each of the four connecting plates 23. A connecting tube 26 is fixedly connected to the top of each of the four suction cups 25. A telescopic hose 27 is fixedly connected to the end of each of the four connecting tubes 26 away from the suction cups 25. A conduit 28 is fixedly connected to the end of each of the four telescopic hoses 27 away from the connecting tubes 26. A negative pressure pump 29 is fixedly connected to the top inside the mounting bracket 17. The output end of the negative pressure pump 29 is fixedly connected to the end of each of the four conduits 28 away from the telescopic hose 27.

[0031] In this embodiment, the unique mechanical structure design of the wafer handling robot control device involves a motor 18 driving a turntable 19 to rotate. The turntable 19 has equidistant circularly arranged arc-shaped grooves 2, and the mounting bracket 17 has equally equidistant circularly arranged sliding bars 21. These, along with the corresponding sliders 22, connecting plates 23, and protrusions 24, form a clever linkage system. When the motor 18 drives the turntable 19 to rotate, the protrusions 24 slide within the arc-shaped grooves 2, causing the connecting plate 23 and the suction cups 25 below it to move along the sliding bars 21. This changes the spacing between the four suction cups 25. During this process, the telescopic hose 27 connecting the suction cups 25 and the guide tube 28 moves with the spacing of the suction cups 25. The robot arm extends or contracts accordingly, ensuring that the negative pressure generated by the negative pressure pump 29 can be stably transmitted to the suction cup 25, and preventing pipe pulling, damage, or air leakage due to changes in the position of the suction cup 25. In actual wafer handling, whether it is a small or large wafer, the robot arm can precisely change the spacing of the suction cup 25 by adjusting the rotation angle of the turntable 19, and move the suction cup 25 to the appropriate position for adsorption and handling, which greatly improves the flexibility and adaptability of handling. Compared with the traditional fixed-spacing handling method, this design can handle the handling tasks of wafers of various sizes more efficiently, save handling time, and improve production efficiency.

[0032] The combination of negative pressure pump 29, conduit 28, telescopic hose 27, connecting pipe 26, and suction cup 25 provides a stable negative pressure environment for wafer adsorption. The negative pressure generated by negative pressure pump 29 is accurately transmitted to suction cup 25 through conduit 28, telescopic hose 27, and connecting pipe 26, enabling suction cup 25 to firmly adsorb wafers. Compared with traditional mechanical gripping methods, this adsorption method causes less damage to the wafer surface and can effectively avoid scratches and damage to wafers caused by external forces during transportation, thereby ensuring the quality and integrity of wafers.

[0033] In some embodiments, please refer to the accompanying drawings. Figures 1-5 A robotic arm control device for handling wafers includes a base 1 with fixed plates 11 fixedly connected to both sides, a reinforcing rib 12 fixedly connected between the two fixed plates 11 and one side of the base 1, a hydraulic cylinder 13 fixedly connected above the two fixed plates 11, a support plate 14 fixedly connected through the output end of the two hydraulic cylinders 13 through the fixed plates 11, and casters 15 fixedly connected at the four corners below the base 1.

[0034] In this embodiment, the casters 15 installed under the base 1 greatly facilitate the movement of the equipment. In the wafer production workshop, the position of the equipment needs to be adjusted frequently according to changes in the production process and layout. The casters 15 not only allow the robot to move easily in the workshop without the need for additional handling tools or equipment, but their flexible steering function also allows the equipment to move freely in narrow spaces, improving the operability and ease of use of the equipment and saving manpower and time costs. It is worth mentioning that the casters 15 have a self-locking function. When the robot moves to the designated position, the casters 15 can be locked by operation, effectively preventing the equipment from accidentally sliding during operation, ensuring the stability and safety of the equipment during operation, and also ensuring the accuracy of the wafer handling process, avoiding handling errors caused by equipment movement.

[0035] The support plate 14 connected to the output end of the hydraulic cylinder 13 mainly increases the friction between the equipment and the ground. When the equipment is in operation and the caster wheel 15 is locked, the support plate 14 has a large contact area with the ground, which effectively prevents the equipment from shifting or shaking during operation, further improving the stability of the equipment during operation and ensuring the smooth handling of wafers.

[0036] Working principle: When it is necessary to use the equipment to move wafers, first push the equipment, and use the casters 15 at the four corners of the base 1 to move the equipment to the target position. After reaching the designated position, operate the self-locking function of the casters 15 to lock it and prevent the equipment from moving during operation. At the same time, the fixing plates 11 on both sides of the base 1 and the reinforcing ribs 12 work together to enhance the structural strength of the base 1 and provide a foundation for the stable operation of the equipment. In addition, the hydraulic cylinder 13 above the fixing plate 11 extends and drives the support plate 14 to descend and contact the ground, increasing the friction between the equipment and the ground and further improving the stability of the equipment.

[0037] According to the size of the wafer to be transported, the motor 18 is started, and the output of the motor 18 drives the turntable 19 to rotate. Since there are four arc-shaped grooves 2 arranged in an equidistant circular array on one side of the turntable 19, and the four sliders 21 fixedly connected below the mounting bracket 17 are also arranged in an equidistant circular array with the center of the turntable 19 as the center, the slider 22, the connecting plate 23 and the protrusion 24 above the connecting plate 23 are slidably connected below the sliders 21 and cooperate with the arc-shaped grooves 2. When the turntable 19 rotates, the protrusion 24 slides in the arc-shaped grooves 2, which drives the connecting plate 23 and the suction cups 25 below to move along the sliders 21, thereby changing the spacing between the four suction cups 25 to adapt to the wafer size. During this process, the telescopic hose 27 connecting the suction cups 25 and the guide tube 28 extends and retracts accordingly with the change of the spacing between the suction cups 25 to ensure that the negative pressure transmission is not affected.

[0038] After the spacing is adjusted, the negative pressure pump 29 is started. The negative pressure pump 29 delivers negative pressure to the suction cups 25 through the conduit 28, the telescopic hose 27 and the connecting pipe 26, moving the robot arm to a suitable position above the wafer, so that the four suction cups 25 are aligned with the surface of the wafer. Under the action of negative pressure, the suction cups 25 firmly adsorb the wafer, completing the gripping operation.

[0039] After the wafer is picked up, the robotic arm 16 moves under the command of the control system, moving the mounting frame 17, the turntable 19 and the suction cup 25 holding the wafer, transporting the wafer to the target position. After reaching the target position, the negative pressure pump 29 is turned off, the suction cup 25 loses negative pressure, and releases its grip on the wafer, completing the wafer placement.

[0040] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. A robotic arm control device for handling wafers, comprising a base (1), characterized in that: A mechanical arm (16) is fixedly connected above the base (1). A mounting frame (17) is fixedly connected to the end of the mechanical arm (16). A motor (18) is fixedly connected to the lower part inside the mounting frame (17). A turntable (19) is fixedly connected to the output end of the motor (18). The turntable (19) is rotatably connected to the lower part of the mounting frame (17). Four arc-shaped grooves (2) are opened on one side of the turntable (19). The four arc-shaped grooves (2) are arranged in an equidistant circular array. Four sliders (21) are fixedly connected to the lower part of the mounting frame (17). The four sliders (21) are arranged in an equidistant circular array with the center of the turntable (19) as the center.

2. The robotic arm control device for wafer handling according to claim 1, characterized in that: Each of the four sliders (21) is slidably connected to a slider (22), and each of the four sliders (22) is fixedly connected to a connecting plate (23).

3. The robotic arm control device for wafer handling according to claim 2, characterized in that: Each of the four connecting plates (23) is fixedly connected to a protrusion (24), and the four protrusions (24) are slidably connected inside the four arc-shaped grooves (2).

4. The robotic arm control device for wafer handling according to claim 3, characterized in that: Each of the four connecting plates (23) is fixedly connected to a suction cup (25) below, and each of the four suction cups (25) is fixedly connected to a connecting tube (26) above, and each of the four connecting tubes (26) is fixedly connected to a telescopic hose (27) at the end away from the suction cup (25).

5. The robotic arm control device for wafer handling according to claim 4, characterized in that: Each of the four telescopic hoses (27) is fixedly connected to a conduit (28) at the end away from the connecting pipe (26). A negative pressure pump (29) is fixedly connected to the upper part of the mounting bracket (17). The output end of the negative pressure pump (29) is fixedly connected to the end of the four conduits (28) away from the telescopic hoses (27).

6. The robotic arm control device for wafer handling according to claim 1, characterized in that: Both sides of the base (1) are fixedly connected to fixing plates (11), and reinforcing ribs (12) are fixedly connected between the two fixing plates (11) and one side of the base (1).

7. The robotic arm control device for wafer handling according to claim 6, characterized in that: Hydraulic cylinders (13) are fixedly connected above the two fixed plates (11), and the output ends of the two hydraulic cylinders (13) are fixedly connected to support plates (14) through the fixed plates (11).

8. The robotic arm control device for wafer handling according to claim 1, characterized in that: Universal wheels (15) are fixedly connected to the four corners below the base (1).

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