Wafer transfer box processing system
By configuring adhesion detection and attitude detection modules, the problem of positional displacement caused by adhesion between the wafer transfer box cover and the box body was solved, ensuring the smooth progress of subsequent processing and achieving efficient cleaning and drying of the wafer transfer box.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU XINMENG SEMICON EQUIP CO LTD
- Filing Date
- 2025-05-13
- Publication Date
- 2026-05-08
AI Technical Summary
After prolonged use, the cover of the wafer transfer box may stick to the box body, causing the box body to shift and affecting the automation and effectiveness of subsequent cleaning or drying processes.
An adhesion detection module is configured, including at least two first and second detection components, to detect the adhesion between the lid and the box during the opening process, and to promptly remind the operator through an alarm device to ensure that the box is in the correct position. An attitude detection module is set up to detect the status of the box to ensure the smooth operation of the processing station.
Effectively detect and address adhesion issues between the lid and the box, ensuring the box is in the correct position and condition for subsequent processing, guaranteeing a smooth cleaning or drying process, and improving processing results.
Smart Images
Figure CN224218799U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the semiconductor field, and more specifically, to a wafer transfer box processing system. Background Technology
[0002] A front-opening unified pod (FOUP) is a container used in semiconductor manufacturing processes to protect, transport, and store wafers. During the cleaning and drying process of the FOUP, a cover-opening device is typically inserted into a perforation on the cover of the FOUP, clamps and unlocks the cover, and then transfers the cover until it is separated from the pod.
[0003] After prolonged use, the gaskets inside the wafer transfer box are prone to aging. When the opening device clamps and unlocks the box, the gaskets can easily stick to the box, causing the box to shift position under the influence of the cover, or even be moved along with the cover. Because the process is automated, the adhesion between the cover and the box is difficult to detect in time, which adversely affects subsequent processes such as cleaning or drying of the box. Utility Model Content
[0004] The purpose of this invention is to provide a wafer transfer box processing system that can detect whether the box body is stuck to the cover during the opening process of the wafer transfer box, so as to ensure that the subsequent processing of the box body proceeds smoothly.
[0005] The embodiments of this utility model provide a technical solution:
[0006] A wafer transfer box processing system includes a box body, a cover that closes to the box body, and a gasket located on one of the box body and the cover. When the box body and the cover are closed, the gasket abuts against both the cover and the box body. The processing system includes:
[0007] The cover opening device is configured to separate the cover and the box body of the wafer transfer box, which is located at the cover opening station and is in a closed state; the conveying device is configured to convey the separated box body to the processing station.
[0008] An adhesion detection module is used to detect the adhesion between the wafer transfer box and the cover during the process of the opening device separating the box body from the cover.
[0009] In an optional embodiment, the lid opening device is configured to move the lid vertically in a direction away from the box body;
[0010] The adhesion detection module includes at least two first detection elements, which are used to simultaneously detect the distance between the cover and the box within a first preset time.
[0011] In an optional embodiment, at least two of the first detection elements are mounted on the opening device and are arranged opposite each other on both sides of the opening device.
[0012] In an optional embodiment, the adhesion detection module further includes a second detection element, which is disposed on the lid opening station and configured to detect the presence of the box at the lid opening station within a first preset time.
[0013] In an optional embodiment, the processing system further includes an alarm device configured to issue an alarm when the detection difference between the two first detectors within a first preset time is outside a preset range or when the second detector detects that the box is not in place within a first preset time.
[0014] In an optional implementation, the preset range is 0-3mm.
[0015] In an optional embodiment, the processing system further includes an attitude detection module, which includes a third detection element disposed at the processing station for detecting the state of the box at the processing station.
[0016] In an optional implementation, the third detection element is a through-beam sensor.
[0017] In an optional embodiment, the processing station is provided with a limiting structure for limiting the position of the box.
[0018] In an optional embodiment, the processing system further includes a cleaning device and / or a drying device, wherein the processing station is located within the cleaning device and / or drying device.
[0019] Compared to existing technologies, the wafer transfer box processing system provided by this utility model is equipped with an adhesion detection module. This module can detect the adhesion between the box and the cover during the process of separating the cover from the box body by the opening device. This allows the system to respond promptly if adhesion occurs, such as adjusting the box position, to ensure smooth subsequent processing of the box, such as cleaning or drying. Therefore, the beneficial effects of the wafer transfer box processing system provided by this utility model include: detecting whether the box body is stuck to the cover during the opening process of the wafer transfer box, ensuring smooth subsequent processing of the box body. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this utility model and therefore should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without any creative effort.
[0021] Figure 1 A partial structural schematic diagram of the wafer transfer box processing system provided in the embodiments of this utility model in practical application;
[0022] Figure 2 This is a schematic diagram of the structure when the box body and the lid are separated after being glued together.
[0023] Figure 3 This is a structural diagram of the box at the opening station;
[0024] Figure 4 This is a schematic diagram of the processing station after the box arrives;
[0025] Figure 5 This is a schematic diagram of the structure in which the box tilts in the vertical plane at the processing station.
[0026] Icons: 10-Lid; 20-Box; 100-Lid opening device; 200-First inspection piece; 300-Processing station; 310-Limiting structure; 410-First transmitter; 420-First receiver; 510-Second transmitter; 520-Second receiver. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0030] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0031] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0032] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.
[0034] Example
[0035] Please see Figure 1 , Figure 1 The diagram shown is a partial structural schematic of the wafer transfer box processing system provided in this embodiment in practical application.
[0036] The wafer transfer box processing system provided in this embodiment is used to process wafer transfer boxes in a closed state, which can be cleaning or drying processes, etc.
[0037] Specifically, the wafer transfer box processing system includes a cover opening device 100, which is configured to separate the cover 10 and the box body 20 of the wafer transfer box in the closed state at the cover opening station.
[0038] In reality, the wafer transfer box in the closed state is in the open position, that is, the cover 10 and the box body 20 are closed. The wafer transfer box also includes a gasket located on either the box body 20 or the cover 10. When the cover 10 and the box body 20 are closed, the gasket abuts against the cover 10 and the box body 20 respectively. In this state, the opening device 100 applies a force to the cover 10, unlocks the cover 10, and causes the cover 10 to move and separate from the box body 20.
[0039] Considering that the gasket is prone to aging after long-term use, the aged gasket may cause the box 20 to be moved and shifted due to adhesion to the cover 10 during the process of using the cover opening device 100 to transfer the cover 10, or even move with the cover 10, affecting the subsequent processing of the box 20.
[0040] Please refer to the following: Figure 2 , Figure 2 The diagram shows the structure of the box body 20 and the cover body 10 after they are partially bonded together and then separated.
[0041] To address this issue, the wafer transfer box processing system provided in this embodiment further includes an adhesion detection module, used to detect the adhesion between the wafer transfer box body 20 and the cover 10 during the process of the cover opening device 100 separating the box body 20 from the cover 10.
[0042] Understandably, due to the setting of the adhesion detection module, if the adhesion detection module detects that the box 20 and the cover 10 are stuck together during the process of the opening device 100 moving the cover 10 away from the box 20, the opening device 100 can stop immediately, and the wafer transfer box processing system can remind the operator to check and process the wafer transfer box to ensure that the box 20 can be kept in a fixed position at the opening station so that the subsequent processing of the box 20 can proceed smoothly.
[0043] In this embodiment, the lid opening device 100 is configured to move the lid 10 vertically away from the box body 20. The adhesion detection module includes at least two first detection elements 200, which are used to simultaneously detect the distance between the lid 10 and the box body 20 within a first preset time. In this embodiment, the two first detection elements 200 are mounted on the lid opening device 100 and are arranged opposite to each other on both sides of the lid opening device 100.
[0044] Understandably, in practical applications, before the lid opening device 100 moves the lid 10, the two first detection elements 200 detect the same distance between the lid 10 and the box 20. During the opening process, if the box 20 and the lid 10 are partially stuck together, the unstuck sides separate, and the stuck side moves due to the movement of the lid 10. Therefore, the box 20 will undergo a process such as... Figure 2 The sway shown causes the detection data of the two first detection elements 200 to be different. Therefore, the difference in the detection data of the two first detection elements 200 can be used to determine whether the box body 20 is partially stuck to the cover body 10.
[0045] In this embodiment, it is determined that the box body 20 and the cover body 10 are partially adhered when the detection difference between the two first detection elements 200 is outside a preset range within a first preset time. Preferably, the first preset time is 0-2.5s, and the preset range is 0-3mm.
[0046] Understandably, in practice, the separation of the lid 10 from the box 20 caused by the opening device 100 is not instantaneous. Instead, during the early part of the first preset time period, the box 20 and the lid 10 may partially adhere. As the opening device 100 moves the lid 10 away from the box 20, a certain pulling force is generated, resulting in the separation of the box 20 and the lid 10 during the later part of the first preset time period. For example, if the distance difference detected between the two first detection elements 200 is 2mm when the opening device 100 moves the lid 10 for 1 second, and the distance difference detected between the two first detection elements 200 is 0 when the opening device 100 moves the lid 10 for 3 seconds, then the box 20 and the lid 10 are gradually separating. If the distance difference detected between the two first detection elements 200 is 3.5mm when the opening device 100 moves the lid 10 for 3 seconds, then the lid 10 and the box 20 are determined to be partially adhered. Therefore, the purpose of setting the first preset time memory preset range is to allow the box 20 and the cover 10 to separate gradually rather than instantaneously during the separation process.
[0047] The wafer transfer box processing system provided in this embodiment also includes a transport device (not shown in the figure) and a processing station 300. The transport device is used to transport the box 20 at the opening station to the processing station 300 after the opening device 100 drives the cover 10 away from the opening station. Please refer to the following reference. Figure 3 and Figure 4 , Figure 3 The diagram shown is a structural schematic of the box at the opening station. Figure 4 The diagram shows the structure of the processing station 300 after the box 20 arrives.
[0048] Processing station 300 can be a cleaning station for cleaning the box 20, or a drying station for drying the box 20, etc.
[0049] Considering that in practical applications, the box body 20 may also be completely stuck to the cover 10, in which case the detection data of the two first detection elements 200 will always be the same, and the box body 20 will leave the opening station together with the cover 10. Therefore, in order to successfully detect the situation where the box body 20 is completely stuck to the cover 10, in this embodiment, the adhesion detection module also includes a second detection element. The second detection element is set at the opening station and is configured to detect the presence of the box body 20 at the opening station within a first preset time.
[0050] Understandably, if during the process of the lid opening device 100 driving the lid 10 to move, the two first detection elements 200 fail to detect that the box 20 and the lid 10 are partially stuck together, there are two possibilities: one is that the lid 10 and the box 20 are not stuck together, and the box 20 remains at the lid opening position; the other is that the box 20 and the lid 10 are completely stuck together and leave the lid opening position together, that is, the box 20 does not exist at the lid opening position.
[0051] If the two first detection elements 200 do not detect that the box body 20 and the cover body 10 are partially stuck together, and during the time that the cover opening device 100 moves the cover body 10, the second detection element detects the position of the box body 20 at the cover opening station. If the box body 20 is detected to remain at the cover opening station, it is determined that the box body 20 and the cover body 10 are not stuck together; if the box body 20 is detected to leave the cover opening station, it is determined that the box body 20 and the cover body 10 are completely stuck together.
[0052] In this embodiment, the second detection element is a first through-beam sensor, including a first transmitter 410 and a first receiver 420. When the wafer transfer box is in the open position, the first transmitter 410 and the first receiver 420 are respectively disposed on opposite sides of the box body 20.
[0053] In the initial state, the first transmitter 410 and the first receiver 420 are blocked by the housing 20, and the first receiver 420 cannot receive the detection signal emitted by the first transmitter 410. If the housing 20 leaves the opening position along with the cover 10, the housing 20 releases its obstruction of the first transmitter 410 and the first receiver 420, and the detection signal emitted by the first transmitter 410 can reach the first receiver 420. Therefore, whether the first receiver 420 receives the detection signal from the first transmitter 410 within a first preset time is used as the basis for determining whether the housing 20 is completely adhered to the cover 10.
[0054] In another embodiment, the second detection element may be a detection device based on a principle other than a through-beam sensor; for example, the second detection element may also be a distance sensor.
[0055] In fact, the wafer transfer box processing system provided in this embodiment also includes an alarm device. The alarm device is configured to issue an alarm when the detection difference between the two first detection elements 200 within a first preset time is outside a preset range, or when the second detection element detects that the box 20 is not in place within a first preset time, so as to remind the operator to check. In this embodiment, a limiting structure 310 for limiting the box 20 is provided in the receiving cavity of the processing station 300. After the transport device transports the box 20 into the receiving cavity, the limiting structure 310 limits the box 20 in at least one direction to ensure the processing effect of the box 20 by the subsequent processing station 300.
[0056] Considering that the state of the wafer transfer box 20 may change after it is transported to the processing station 300 by the transport device, such as tilting in the vertical plane, the processing effect may still be unsatisfactory. To solve this problem, the wafer transfer box processing system provided in this embodiment also includes an attitude detection module, which is used to detect the state of the wafer transfer box 20 at the processing station 300.
[0057] In this embodiment, the attitude detection module includes a third detection element, which is disposed at the processing station 300 and is used to detect the state of the housing 20 at the processing station 300, specifically to detect whether the housing 20 is tilted in the vertical plane. It is understood that when the third detection element detects that the housing 20 is tilted in the vertical plane, the wafer transfer box processing system suspends subsequent cleaning or drying operations on the housing 20 and can remind the operator to adjust the state of the housing 20. Please refer to [reference needed]. Figure 5 , Figure 5 The diagram shows the structure of the box 20 tilting in the vertical plane at the processing station 300.
[0058] Preferably, the third detection element in this embodiment is a second through-beam sensor, including a second transmitter 510 and a second receiver 520, which are respectively disposed on opposite sides of the cavity wall of the accommodating cavity.
[0059] In practice, the second transmitter 510 and the second receiver 520 are positioned opposite each other at the opening of the accommodating cavity. In actual applications, if the housing 20 is in a normal position within the accommodating cavity, then the housing 20 is below the plane of the opening of the accommodating cavity. Figure 4 As shown, the second receiver 520 can successfully receive the detection signal emitted by the second transmitter 510. If the housing 20 is tilted in a vertical plane, the top of the housing 20 will protrude from the opening of the receiving cavity, as shown. Figure 5 As shown, at this time, due to the obstruction of the box 20, the second receiver 520 cannot receive the detection signal emitted by the second transmitter 510.
[0060] It should be noted that in practical applications, the installation height of the second transmitter 510 and the second receiver 520 can be adjusted according to the specific model and size of the box 20 being tested. It is not limited to the opening of the accommodating cavity. It is only necessary to ensure that the height of the second transmitter 510 and the second receiver 520 is slightly higher than the top of the box 20 when the box 20 is in normal condition.
[0061] In fact, the wafer transfer box processing system provided in this embodiment also includes a cleaning device, with the processing station 300 located within the cleaning device, meaning the box 20 can complete the cleaning process at the processing station 300. In another embodiment, the wafer transfer box processing system may also include a drying device, with the processing station 300 located within the drying device, allowing the box 20 to complete the drying process at the processing station 300. Alternatively, it may include both a cleaning device and a drying device, with processing stations 300 provided within both the cleaning device and the drying device.
[0062] In summary, the wafer transfer box processing system provided in this embodiment can detect whether the box body 20 is stuck to the cover 10 during the process of opening the wafer transfer box, and can also ensure that the box body 20 is processed in the correct state, so as to ensure that the subsequent processing of the box body 20 is carried out smoothly and the ideal processing effect is obtained.
[0063] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A wafer transfer box processing system, characterized in that, The wafer transfer box includes a box body (20) and a cover (10) that closes to the box body (20), and a gasket located on one of the box body (20) and the cover (10). When the box body (20) and the cover (10) are closed, the gasket abuts against the cover (10) and the box body (20), respectively. The processing system includes: The cover opening device (100) is configured to separate the cover (10) and the box body (20) of the wafer transfer box, which are located at the cover opening station and in the closed state; the conveying device is configured to convey the separated box body (20) to the processing station (300). An adhesion detection module is used to detect the adhesion between the wafer transfer box body (20) and the cover body (10) during the process of the opening device (100) separating the box body (20) from the cover body (10).
2. The wafer transfer box processing system according to claim 1, characterized in that, The lid opening device (100) is configured to drive the lid (10) to move vertically away from the box body (20); The adhesion detection module includes at least two first detection elements (200), which are used to simultaneously detect the distance between the cover (10) and the box (20) within a first preset time.
3. The wafer transfer box processing system according to claim 2, characterized in that, At least two of the first detection elements (200) are mounted on the opening device (100) and are arranged opposite each other on both sides of the opening device (100).
4. The wafer transfer box processing system according to claim 2, characterized in that, The adhesion detection module further includes a second detection element, which is disposed on the opening station and is configured to detect the presence of the box (20) on the opening station within a first preset time.
5. The wafer transfer box processing system according to claim 4, characterized in that, The processing system also includes an alarm device configured to issue an alarm when the detection difference between the two first detection elements (200) within a first preset time is outside a preset range or when the second detection element detects that the box is not in place within a first preset time.
6. The wafer transfer box processing system according to claim 5, characterized in that, The preset range is 0-3mm.
7. The wafer transfer box processing system according to claim 1, characterized in that, The processing system also includes an attitude detection module, which includes a third detection element. The third detection element is disposed at the processing station (300) and is used to detect the state of the box (20) at the processing station (300).
8. The wafer transfer box processing system according to claim 7, characterized in that, The third detection component is a through-beam sensor.
9. The wafer transfer box processing system according to claim 1, characterized in that, The processing station (300) is provided with a limiting structure (310) for limiting the box (20).
10. The wafer transfer box processing system according to any one of claims 1-9, characterized in that, The processing system further includes a cleaning device and / or a drying device, and the processing station is located within the cleaning device and / or drying device.