Wafer clamp for micropore processing

Abstract

The utility model belongs to the technical field of wafer production, and particularly relates to a wafer clamp for micro-hole processing, which comprises a fixed seat fixed on a machine table of processing equipment, and further comprises a positioning table fixed on the top surface of the fixed seat, the multiple overturning arms are distributed in the circumferential direction at equal intervals and rotationally installed on the positioning table through a first pivot; the driving mechanism is connected to the overturning arm in a drivable manner and is used for driving the overturning arm to overturn; the pressure plate is mounted on the overturning arm; according to the utility model, the overturning arm is driven to overturn by the driving mechanism, the wafer is compressed by the pressure plate, the overturning arm can overturn in a narrow space and compress the wafer at different positions, the stability is high, the device is suitable for a processing scene with a limited space, and unnecessary interference on laser micropore processing is avoided; and the reliability and the safety of processing are ensured.

Description

Technical Field

[0001] This utility model belongs to the field of wafer manufacturing technology, specifically relating to a wafer fixture for micro-hole processing. Background Technology

[0002] Currently, the main methods for processing micro-holes in 3D packaged chips are dry etching, wet etching, and laser drilling etching. Laser micro-hole processing, which is a non-contact drilling method, has attracted widespread attention due to its high equipment portability.

[0003] Laser micro-hole processing is used in many applications, such as micro-hole processing of PCB boards and laser cutting of holes. In the micro-hole processing of three-dimensional chip packaging, it is often necessary to perform three-dimensional micro-hole processing on the material chip, and the micro-holes are required to have a high aspect ratio, good roundness, almost no recast layer, a very small heat-affected zone, and smooth hole walls without taper.

[0004] When performing laser micro-hole processing on wafers, in order to ensure processing quality, it is usually necessary to use a fixture to hold and fix the wafer to prevent the wafer from shifting and affecting the processing accuracy.

[0005] For example, in the prior art, Chinese utility model patent with authorization announcement number CN210498875U discloses "a wafer jig for micro-hole processing", which includes a placement plate, an electric telescopic rod, a clamping mechanism, a limiting strip, a moving mechanism, a pressing mechanism and a cleaning mechanism; the upper surface of the placement plate is partially distributed with rubber blocks, the upper surface of the placement plate is provided with two symmetrically arranged fixing plates, the upper surface of the placement plate is provided with a gooseneck tube, the end of the gooseneck tube is provided with a locking block, and the lower surface of the placement plate is provided with a mounting block in the middle.

[0006] While existing wafer jigs, including those mentioned above, can meet general usage requirements, the left and right translation of the clamping mechanism requires a large amount of space, making them unsuitable for confined work environments. Furthermore, the pressing mechanism can easily cause unnecessary obstruction to laser micro-hole processing.

[0007] To address the aforementioned problems, this utility model proposes a wafer jig for micro-hole processing. Utility Model Content

[0008] To address the aforementioned problems in the existing technology, this utility model provides a wafer fixture for micro-hole processing, which is convenient to use and has high safety performance.

[0009] To achieve the above objectives, this utility model provides the following technical solution: a wafer jig for micro-hole processing, comprising a fixing base, the fixing base being fixed to the machine base of the processing equipment, and further comprising:

[0010] A positioning platform, which is fixed to the top surface of the fixing base;

[0011] A flipping arm, wherein multiple flipping arms are equally spaced along the circumferential direction and are rotatably mounted on the positioning platform using a pivot number one;

[0012] A drive mechanism is drivably connected to the tilting arm for driving the tilting arm to tilt.

[0013] A pressure plate, which is mounted on the tilting arm.

[0014] As a preferred embodiment of this utility model, the driving mechanism includes:

[0015] A lifting seat, which is located between the fixed seat and the machine base of the processing equipment and has a vertical degree of freedom of movement;

[0016] A vertical cylinder is fixed to the bottom surface of the machine base of the processing equipment, and the piston rod of the vertical cylinder passes through the machine base of the processing equipment and is fixedly connected to the lifting seat.

[0017] The No. 1 threaded post is fixed on the lifting seat;

[0018] U-shaped frame, the U-shaped frame being fixed to the top of the first threaded column;

[0019] The second pivot is fixed on the U-shaped frame, and a second waist hole is provided on the flip arm for the second pivot to pass through.

[0020] As a preferred embodiment of this utility model, the outer wall of the second pivot abuts against the inner wall of the second waist hole.

[0021] As a preferred technical solution of this utility model, it also includes:

[0022] A locking nut is provided, wherein the first threaded post passes through the fixed seat and the lifting seat, and locking nuts are distributed on the first threaded post at both the upper and lower parts of the lifting seat by means of threaded engagement.

[0023] As a preferred technical solution of this utility model, it also includes:

[0024] The second threaded post is fixed to the top surface of the pressure plate, and a first waist hole is provided on the flip arm for the second threaded post to pass through.

[0025] The wing nuts are distributed on both the upper and lower parts of the tilting arm and are installed on the second threaded post by means of threaded engagement.

[0026] As a preferred technical solution of this utility model, it also includes:

[0027] A rubber gasket is bonded and fixed to the bottom surface of the pressure plate.

[0028] As a preferred embodiment of this utility model, it further includes: a positioning mechanism, wherein multiple sets of the positioning mechanisms are fixed at equal intervals along the circumferential direction on the top surface of the positioning platform, wherein the positioning mechanism includes:

[0029] Arc-shaped positioning base plate;

[0030] A fixing block is fixed to the outer wall of the arc-shaped positioning base plate, and a third waist hole is machined on the fixing block;

[0031] A locking bolt, which passes through the third waist hole and is fixedly connected to the positioning platform by thread engagement.

[0032] As a preferred embodiment of this utility model, a debris collection groove is provided at the top of the positioning platform.

[0033] Compared with the prior art, the beneficial effects of this utility model are:

[0034] In this invention, the flipping arm is driven to flip by a drive mechanism, and the wafer is pressed by a pressure plate. The flipping arm can flip in a narrow space and press the wafer at different positions. It has high stability and is suitable for processing scenarios with limited space. It will not cause unnecessary obstacles to laser micro-hole processing, thus ensuring the reliability and safety of processing.

[0035] Other additional advantages and beneficial effects of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this invention. Attached Figure Description

[0036] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0037] Figure 1 This is a schematic diagram of the structure of this utility model;

[0038] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A in the diagram;

[0039] Figure 3 This utility model Figure 1 A magnified schematic diagram of the positioning mechanism in the diagram;

[0040] Figure 4This utility model Figure 1 Enlarged structural diagram at point B in the diagram;

[0041] Figure 5 This utility model Figure 1 A magnified structural diagram at point C in the diagram.

[0042] In the diagram: 1. Fixed seat; 2. Lifting seat; 3. Vertical cylinder; 4. Positioning platform; 41. Collection trough; 5. Tilting arm; 51. No. 1 waist hole; 52. No. 2 waist hole; 6. Pressure plate; 7. No. 1 threaded column; 8. U-shaped frame; 9. Positioning mechanism; 91. Arc-shaped positioning base plate; 92. Fixed block; 921. No. 3 waist hole; 93. Locking bolt; 10. No. 1 pivot; 11. No. 2 pivot; 12. No. 2 threaded column; 13. Wing nut; 14. Rubber gasket; 15. Locking nut. Detailed Implementation

[0043] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0044] Please see Figures 1-5 The present invention provides the following technical solution: a wafer fixture for micro-hole processing, including a fixed base 1, the fixed base 1 being fixed on the machine base of the processing equipment, and further including: a positioning stage 4, a flipping arm 5, a drive mechanism and a pressure plate 6.

[0045] Furthermore, by Figure 1 As shown in this embodiment, the positioning platform 4 is fixed to the top surface of the fixed base 1, and multiple flipping arms 5 are evenly distributed along the circumferential direction and are rotatably mounted on the positioning platform 4 using a pivot 10. The driving mechanism is drivably connected to the flipping arms 5 to drive the flipping arms 5 to flip. The pressure plate 6 is mounted on the flipping arms 5. With the above scheme, when in use, the multiple flipping arms 5 are in a horizontally extended state (or other starting angle), the pressure plate 6 maintains a distance from the positioning platform 4, and the driving mechanism does not apply driving force.

[0046] The wafer to be processed is placed on the positioning stage 4, the drive mechanism is started, and all the flipping arms 5 are driven to flip upward around the first pivot 10 in sync. The flipping arms 5 drive the pressure plate 6 to gradually approach the wafer surface. Finally, the bottom surface of the pressure plate 6 evenly contacts the edge of the wafer or a specific support point, forming a multi-point uniform pressure.

[0047] The spindle of the processing equipment drives micro-hole processing tools (such as laser, EDM or mechanical drill bits) to perform micro-hole processing on the wafer. The rigid structure of the fixture (the integrated design of the fixed base 1 and the positioning stage 4) can reduce processing vibration and improve the accuracy of micro-holes.

[0048] After processing is completed, the drive mechanism moves in the opposite direction, the flipping arm 5 flips down to reset, the pressure plate 6 is removed from the wafer, the processed wafer is taken out, and the above process is repeated.

[0049] This invention uses a drive mechanism to drive the flipping arm 5 to flip, and uses the pressure plate 6 to press the wafer. The flipping arm 5 can flip in a narrow space and press the wafer at different positions. It has high stability and is suitable for processing scenarios with limited space. It will not cause unnecessary obstacles to laser micro-hole processing, thus ensuring the reliability and safety of processing.

[0050] Optionally, by Figure 1 and Figure 4 In this embodiment, the driving mechanism includes: a lifting seat 2, a vertical cylinder 3, a first threaded column 7, a U-shaped frame 8, and a second pivot 11. The lifting seat 2 is located between the fixed seat 1 and the machine table of the processing equipment and has a vertical degree of freedom of movement. The vertical cylinder 3 is fixed to the bottom surface of the machine table of the processing equipment, and the piston rod of the vertical cylinder 3 passes through the machine table of the processing equipment and is fixedly connected to the lifting seat 2. The first threaded column 7 is fixed on the lifting seat 2, the U-shaped frame 8 is fixed to the top of the first threaded column 7, and the second pivot 11 is fixed on the U-shaped frame 8. A second waist hole 52 is provided on the flipping arm 5 for the second pivot 11 to pass through. With the above scheme, in the initial state, the piston rod of the vertical cylinder 3 is in the retracted state, the lifting seat 2 is in the lower position, and the flipping arm 5 is in the unfolded state. At this time, there is a certain distance between the pressure plate 6 and the positioning table 4, which is convenient for placing the wafer to be processed.

[0051] During processing, the vertical cylinder 3 is activated, and its piston rod extends, pushing the lifting seat 2, which is fixedly connected to it, to move upward in the vertical direction. Since the first threaded column 7 is fixed on the lifting seat 2, when the lifting seat 2 moves upward, the first threaded column 7 also moves upward, and at the same time, the U-shaped frame 8 fixed at the top of the first threaded column 7 also rises.

[0052] During the upward movement, the second pivot 11 on the U-shaped frame 8 will slide within the second waist hole 52 of the flipping arm 5. This is because the flipping arm 5 is rotatably mounted on the positioning platform 4 via the first pivot 10. As the second pivot 11 rises, the engagement between the second waist hole 52 and the second pivot 11 will cause the flipping arm 5 to flip upward around the first pivot 10.

[0053] As the flip arm 5 flips upward, the pressure plate 6 mounted on the flip arm 5 gradually approaches the wafer surface. Finally, the pressure plate 6 contacts the wafer surface and applies a certain pressure to firmly fix the wafer on the positioning stage 4.

[0054] After the wafer is firmly fixed by the pressure plate 6, the spindle of the processing equipment drives the micro-hole processing tool (such as laser, EDM or mechanical drill bit, etc.) to perform micro-hole processing on the wafer. Since the fixture can stably fix the wafer, it reduces vibration and displacement during the processing, which helps to improve the accuracy and quality of micro-hole processing.

[0055] After processing, the piston rod of the vertical cylinder 3 retracts, causing the lifting seat 2 to move downwards in the vertical direction. The first threaded column 7 and the U-shaped frame 8 descend together with the lifting seat 2. During the descent, the second pivot 11 slides in the second waist hole 52, causing the flipping arm 5 to flip downwards around the first pivot 10 and return to the initial horizontal unfolded state. At this time, the pressure plate 6 separates from the wafer, and the processed wafer can be taken out from the positioning table 4, completing one processing cycle.

[0056] Preferably, by Figure 1 and Figure 4 In this embodiment, the outer wall of the second pivot 11 abuts against the inner wall of the second waist hole 52. With the above solution, during use, the rigid contact between the second pivot 11 and the inner wall of the second waist hole 52 forms a sliding pair constraint, ensuring that the tilting arm 5 can only rotate around the first pivot 10 when the lifting seat 2 moves, avoiding swaying or displacement caused by redundant degrees of freedom.

[0057] The length direction (usually horizontal) of the second waist hole 52 determines the rotation angle range of the tilting arm 5. For example, when the waist hole length is L, the maximum rotation angle θ of the tilting arm 5 satisfies:

[0058]

[0059] (r is the horizontal distance from pivot 10 to waist hole 52).

[0060] Preferably, by Figure 1 and Figure 5 In this embodiment, the device further includes a locking nut 15. A first threaded post 7 passes through the fixed seat 1 and the lifting seat 2. Locking nuts 15 are distributed on the upper and lower parts of the lifting seat 2 and installed on the first threaded post 7 by thread engagement. With the above solution, when in use, by tightening the locking nuts 15 at both ends of the lifting seat 2, the first threaded post 7 is fixed at the target height of the lifting seat 2, preventing the lifting seat 2 from shifting due to vibration or cylinder pressure fluctuations during processing.

[0061] Meanwhile, by rotating the locking nuts 15 at both ends of the lifting seat 2, the initial installation height of the first threaded column 7 can be adjusted to meet different processing scenarios. For example, when it is necessary to raise the height of the first threaded column 7, first loosen the locking nut 15 on the lower side of the lifting seat 2, and then tighten the locking nut 15 on the upper side of the lifting seat 2.

[0062] Preferably, by Figure 1 and Figure 2 In this embodiment, the device further includes a second threaded post 12 and a wing nut 13. The second threaded post 12 is fixed to the top surface of the pressure plate 6, and a first waist hole 51 is provided on the flip arm 5 for the second threaded post 12 to pass through. Wing nuts 13 are distributed on the upper and lower parts of the flip arm 5 and are installed on the second threaded post 12 by thread engagement. With the above solution, during use, by adjusting the engagement position of the wing nut 13 on the second threaded post 12, the initial height of the pressure plate 6 can be precisely adjusted in the vertical direction to compensate for wafer thickness tolerance (usually ±0.1mm) or processing wear.

[0063] In addition, the first waist hole 51 can be used to adjust the initial horizontal position of the pressure plate 6 to meet the clamping of wafers of different diameters.

[0064] Preferably, by Figure 1 and Figure 2 In this embodiment, the device further includes a rubber pad 14, which is bonded and fixed to the bottom surface of the pressure plate 6. With the above solution, when the pressure plate 6 contacts the wafer during use, the rubber pad 14 first undergoes elastic compression, and then the cylinder thrust is evenly transmitted to the wafer.

[0065] The elastic cushioning of the rubber pad 14 prevents the metal bottom surface of the pressure plate 6 from directly contacting the wafer, thus preventing scratches or breakage.

[0066] Preferably, by Figure 1 and Figure 3 In this embodiment, the system further includes a positioning mechanism 9. Multiple positioning mechanisms 9 are fixed at equal intervals along the circumferential direction on the top surface of the positioning platform 4. The positioning mechanism 9 includes an arc-shaped positioning base plate 91, a fixing block 92, and a locking bolt 93. The fixing block 92 is fixed to the outer wall of the arc-shaped positioning base plate 91, and a third waist hole 921 is machined on the fixing block 92. The locking bolt 93 passes through the third waist hole 921 and is fixedly connected to the positioning platform 4 by threaded engagement. With the above solution, the arc-shaped positioning base plate 91 can initially position the wafer during use, ensuring the accuracy of the wafer loading position and facilitating accurate processing.

[0067] In addition, after loosening the locking bolt 93, the initial position of the arc-shaped positioning substrate 91 can be adjusted, which is suitable for wafer processing of different diameters. After the adjustment is completed, tighten the locking bolt 93 to lock it, ensuring the stability of the arc-shaped positioning substrate 91 after adjustment.

[0068] Preferably, by Figure 1 In this embodiment, a collection groove 41 is provided at the top of the positioning stage 4. With the above solution, when using the laser processing, the particles generated by ablation will fall into the collection groove 41, and the collected impurities can be cleaned by vacuum adsorption later.

[0069] It should be noted that the vertical cylinder 3 is a commercially available standard device with a built-in power switch. Those skilled in the art can make conventional selections according to their needs. Its working principle is common knowledge known to those skilled in the art and has been fully disclosed in the prior art, so it will not be elaborated further in this article.

[0070] The circuit connection involved in this utility model is a common method used by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments. It belongs to the widely used prior art.

[0071] Components not described in detail in this article are existing technologies.

[0072] The working principle and usage process of this utility model: In the initial state, the piston rod of the vertical cylinder 3 of this utility model is in the retracted state, the lifting seat 2 is in the lower position, and the flipping arm 5 is in the extended state. At this time, the pressure plate 6 and the positioning table 4 are a certain distance apart, which is convenient for placing the wafer to be processed.

[0073] During processing, the vertical cylinder 3 is activated, its piston rod extends, and pushes the lifting seat 2, which is fixedly connected to it, to move upward in the vertical direction. Since the first threaded column 7 is fixed on the lifting seat 2, when the lifting seat 2 moves upward, the first threaded column 7 also moves upward. At the same time, the U-shaped frame 8 fixed at the top of the first threaded column 7 also rises.

[0074] During the upward movement, the second pivot 11 on the U-shaped frame 8 will slide in the second waist hole 52 of the flipping arm 5. This is because the flipping arm 5 is rotatably mounted on the positioning platform 4 via the first pivot 10. As the second pivot 11 rises, the cooperation between the second waist hole 52 and the second pivot 11 will cause the flipping arm 5 to flip upward around the first pivot 10.

[0075] As the flip arm 5 flips upward, the pressure plate 6 mounted on the flip arm 5 gradually approaches the wafer surface. Finally, the pressure plate 6 contacts the wafer surface and applies a certain pressure to firmly fix the wafer on the positioning stage 4.

[0076] After the wafer is firmly fixed by the pressure plate 6, the spindle of the processing equipment drives the micro-hole processing tool (such as laser, EDM or mechanical drill bit, etc.) to perform micro-hole processing on the wafer. Since the fixture can stably fix the wafer, it reduces vibration and displacement during the processing, which helps to improve the accuracy and quality of micro-hole processing.

[0077] After processing, the piston rod of the vertical cylinder 3 retracts, causing the lifting seat 2 to move downward in the vertical direction. The first threaded column 7 and the U-shaped frame 8 descend together with the lifting seat 2. During the descent, the second pivot 11 slides in the second waist hole 52, causing the flipping arm 5 to flip downward around the first pivot 10 and return to the initial horizontal unfolded state. At this time, the pressure plate 6 separates from the wafer, and the processed wafer can be taken out from the positioning table 4 to complete one processing cycle. Then the above process is repeated.

[0078] This invention uses a drive mechanism to drive the flipping arm 5 to flip, and uses the pressure plate 6 to press the wafer. The flipping arm 5 can flip in a narrow space and press the wafer at different positions. It has high stability and is suitable for processing scenarios with limited space. It will not cause unnecessary obstacles to laser micro-hole processing, thus ensuring the reliability and safety of processing.

[0079] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer jig for micro-hole processing, comprising a fixing base (1) fixed to the machine table of a processing equipment, characterized in that, Also includes: Positioning platform (4), which is fixed to the top surface of the fixing base (1); A plurality of the flip arms (5) are distributed at equal intervals along the circumferential direction and are rotatably mounted on the positioning platform (4) using a pivot (10); A drive mechanism is drivably connected to the flipping arm (5) for driving the flipping arm (5) to flip. Pressure plate (6), which is mounted on the tilting arm (5).

2. A wafer jig for micro-hole processing according to claim 1, characterized in that: The drive mechanism includes: Lifting seat (2), the lifting seat (2) is located between the fixed seat (1) and the machine base of the processing equipment and has a degree of freedom of movement in the vertical direction; Vertical cylinder (3) is fixed to the bottom surface of the machine base of the processing equipment, and the piston rod of the vertical cylinder (3) passes through the machine base of the processing equipment and is fixedly connected to the lifting seat (2). The No. 1 threaded column (7) is fixed on the lifting seat (2); U-shaped frame (8), the U-shaped frame (8) is fixed to the top of the first threaded column (7); The second pivot (11) is fixed on the U-shaped frame (8) and a second waist hole (52) is provided on the flip arm (5) for the second pivot (11) to pass through.

3. A wafer jig for micro-hole processing according to claim 2, characterized in that: The outer wall of the second pivot (11) abuts against the inner wall of the second waist hole (52).

4. A wafer jig for micro-hole fabrication according to claim 2, characterized in that: Also includes: Locking nut (15), the first threaded post (7) passes through the fixed seat (1) and the lifting seat (2), and locking nuts (15) are distributed on the first threaded post (7) by thread engagement at both the upper and lower parts of the lifting seat (2).

5. A wafer jig for micro-hole fabrication according to claim 1, characterized in that: Also includes: The No. 2 threaded post (12) is fixed to the top surface of the pressure plate (6), and a No. 1 waist hole (51) is provided on the flip arm (5) for the No. 2 threaded post (12) to pass through. The butterfly nuts (13) are distributed on both the upper and lower parts of the flip arm (5) and are installed on the second threaded post (12) by means of thread engagement.

6. A wafer jig for micro-hole fabrication according to claim 1, characterized in that: Also includes: A rubber pad (14) is bonded and fixed to the bottom surface of the pressure plate (6).

7. A wafer jig for micro-hole fabrication according to claim 1, characterized in that: Also includes: Positioning mechanism (9), multiple sets of the positioning mechanism (9) are fixed at equal intervals along the circumferential direction to the top surface of the positioning platform (4), wherein the positioning mechanism (9) includes: Arc-shaped positioning base plate (91); A fixing block (92) is fixed to the outer wall of the arc-shaped positioning base plate (91), and a third waist hole (921) is machined on the fixing block (92); The locking bolt (93) passes through the third waist hole (921) and is fixedly connected to the positioning table (4) by thread engagement.

8. A wafer jig for micro-hole fabrication according to claim 1, characterized in that: A collection groove (41) is provided at the top of the positioning platform (4).

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