Semiconductor wafer thinning device convenient for replacing grinding wheel

Abstract

The semiconductor wafer thinning device comprises a flange plate body, the lower end of the flange plate body is connected with a transmission shaft, the upper end of the flange plate body is provided with a metal ceramic gradient composite filling layer, a plurality of positive pole magnetic blocks are embedded in the metal ceramic gradient composite filling layer, and a plurality of negative pole magnetic blocks are embedded in the metal ceramic gradient composite filling layer. A grinding wheel body is arranged at the upper end of the flange plate body, a positioning mechanism is arranged at the lower end of the grinding wheel body, the positioning mechanism is clamped on the flange plate body, and a modified epoxy resin composite filling layer is arranged on the grinding wheel body. According to the utility model, not only can quick mounting and dismounting be realized, but also the stability and firmness of mounting can be ensured, in addition, the uniformity of magnetic force distribution can be improved, the uniform distribution of mounting locking force and balance between the flange plate and the grinding wheel body can be ensured, and meanwhile, high-temperature-resistant and high-speed-resistant working conditions can be realized; and the service life of the grinding wheel is greatly prolonged.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer thinning machine technology, and in particular to a semiconductor wafer thinning device that facilitates the replacement of grinding wheels. Background Technology

[0002] The operation of wafer thinning machines relies on multi-stage grinding parameter control and precision mechanical design. Through layered processing of coarse grinding (efficient material removal), fine grinding (reducing damage), and polishing (improving surface quality), the wafer thickness can be reduced from the initial 775μm to less than 50μm, while ensuring structural integrity and packaging compatibility. Its core technologies lie in the matching of grinding wheel grit size, optimization of cooling system, and automated control, which directly affect the yield and reliability of semiconductor devices.

[0003] Currently, in rough grinding, traditional bolts and mechanical locking structures are used to install the grinding wheel and flange on the spindle. To ensure installation stability, lock nuts are usually used to fix the grinding wheel and flange connection through left-hand threads. However, this method is extremely inconvenient when periodically replacing the grinding wheel for maintenance and repair. The grinding wheel is easily damaged by wrench impacts, and the disassembly efficiency is low, increasing labor costs. To address these issues, we propose a semiconductor wafer thinning device that facilitates grinding wheel replacement. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor wafer thinning device that facilitates the replacement of grinding wheels.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor wafer thinning device with easy-to-change grinding wheel includes a flange body, a drive shaft connected to the lower end of the flange body, a metal-ceramic gradient composite filler layer at the upper end of the flange body, a plurality of positive magnetic blocks embedded in the metal-ceramic gradient composite filler layer, a grinding wheel body at the upper end of the flange body, a positioning mechanism at the lower end of the grinding wheel body, the positioning mechanism being engaged with the flange body, a modified epoxy resin composite filler layer on the grinding wheel body, a plurality of magnetic adsorption structures evenly spaced within the modified epoxy resin composite filler layer, and the magnetic adsorption structures corresponding to the positive magnetic blocks.

[0007] Preferably, the positioning mechanism includes a positioning post fixed to the lower end of the grinding wheel body, four clamping plates are fixed at equal intervals around the positioning post, the upper end of the flange body is provided with a positioning groove, four clamping slots are provided at equal intervals around the positioning groove, the positioning post is clamped in the positioning groove, and one clamping plate on the same side is clamped in one clamping slot on the same side.

[0008] Preferably, the lower end of the positioning post is provided with a quantum dot fluorescent marker.

[0009] Preferably, the magnetic adsorption structure includes 8-12 negative magnetic blocks evenly spaced within the modified epoxy resin composite filler layer, the negative magnetic blocks and positive magnetic blocks adsorbing each other, and a second mounting groove is provided at the lower end of the grinding wheel body, the modified epoxy resin composite filler layer being disposed within the second mounting groove.

[0010] Preferably, the flange body is provided with a first mounting groove, and the metal-ceramic gradient composite filling layer is disposed in the first mounting groove.

[0011] Preferably, the modified epoxy resin composite filler layer is formed by combining a two-component high-temperature resistant epoxy resin, boron nitride nanosheets, and chopped carbon fiber filaments.

[0012] Preferably, the metal-ceramic gradient composite filler layer consists of a contact layer, a transition layer, and an outer layer. The contact layer is sintered from copper powder and silver paste, the transition layer is a composite of alumina ceramic particles and epoxy resin, and the outer layer is a silicon nitride coating.

[0013] Preferably, 5-8 small magnetic blocks are evenly spaced on the flange body.

[0014] In this invention, the modified epoxy resin composite filler layer is composed of a matrix material and reinforcing fillers. The matrix material is a two-component high-temperature resistant epoxy resin with a temperature resistance of 280℃. The reinforcing filler is boron nitride nanosheets (15-20wt%), which improves the thermal conductivity to 6.8 W / m·K and reduces interfacial thermal stress. Short carbon fiber filaments (5-8wt%) increase the shear strength to 45MPa and inhibit crack propagation. By setting it up, it can achieve the dual functions of mechanical support and thermal management between magnets, and is suitable for high-speed rotation conditions.

[0015] In this invention, the metal-ceramic gradient composite filling layer structure is layered, wherein: the contact layer is formed by sintering copper powder and silver paste (particle size 5μm) to form a conductive network, the transition layer is composed of alumina ceramic particles (30 vol%) and epoxy resin, and the outer layer is a silicon nitride coating (thickness 50 μm) for corrosion protection. The dense structure with porosity <0.5% is achieved by 3D printing layer by layer deposition.

[0016] In this utility model, during installation, step 1: pre-positioning, the robotic arm grasps the grinding wheel module to 2mm above the flange, and the laser interferometer initially calibrates the coaxiality (error <5μm); step 2: magnetic locking, the negative and positive magnetic blocks attract each other, the gap between the grinding wheel and the flange is <0.01mm, and the magnetic uniformity reaches 98%; step 3: dynamic balance test, the vibration value is detected by idling at 3000rpm. Through magnetic attraction, the integration of smart materials and quantum sensing technology, under the premise of strictly following the flange clamping specifications (diameter ≥ 1 / 3 of the grinding wheel, vibration value <0.1mm / s), a breakthrough innovation in grinding wheel installation efficiency and accuracy has been achieved.

[0017] This utility model has the following advantages:

[0018] 1. The magnetic locking mechanism greatly improves the stability and firmness of the installation. In addition, the circular array can improve the uniformity of magnetic force distribution, ensuring a uniform distribution of locking force and balance between the flange and the grinding wheel body.

[0019] 2. By using a layered structure of modified epoxy resin composite filler layer and metal-ceramic gradient composite filler layer, it is possible not only to achieve high temperature and high speed resistance, but also to greatly improve the stability of the connection.

[0020] In summary, this utility model not only enables rapid installation and disassembly, but also ensures the stability and firmness of the installation. In addition, it can improve the uniformity of magnetic force distribution, ensure the uniform distribution of installation locking force and balance between the flange and the grinding wheel body, and achieve high temperature and high speed resistance, while also greatly improving the service life of the grinding wheel. Attached Figure Description

[0021] Figure 1 This is a structural diagram of the present invention;

[0022] Figure 2 A structural diagram showing the first and second mounting ports of this utility model;

[0023] Figure 3 This is a diagram of the internal structure of the present invention;

[0024] Figure 4 This is a side view of the present invention;

[0025] Figure 5 This is a diagram of the internal structure of this utility model.

[0026] In the figure: 1 Grinding wheel body, 2 Negative magnetic block, 3 Modified epoxy resin composite filler layer, 4 Positioning post, 5 Quantum dot fluorescent marker, 6 Card plate, 7 Metal-ceramic gradient composite filler layer, 8 Positive magnetic block, 9 Flange body, 10 Drive shaft, 11 Positioning groove, 12 Card slot, 13 First mounting groove, 14 Small magnetic block. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Example

[0028] Reference Figure 1-4 A semiconductor wafer thinning device that facilitates the replacement of grinding wheels includes a flange body 9, a drive shaft 10 connected to the lower end of the flange body 9, and a metal-ceramic gradient composite filling layer 7 at the upper end of the flange body 9. The metal-ceramic gradient composite filling layer 7 is composed of a contact layer, a transition layer and an outer layer. The contact layer is sintered with copper powder and silver paste, the transition layer is composite of alumina ceramic particles and epoxy resin, and the outer layer is a silicon nitride coating. The device is deposited layer by layer by 3D printing to achieve a dense structure with a porosity of <0.5%.

[0029] Multiple positive magnetic blocks 8 are embedded in the metal-ceramic gradient composite filling layer 7. A grinding wheel body 1 is provided at the upper end of the flange body 9, and a positioning mechanism is provided at the lower end of the grinding wheel body 1. The positioning mechanism includes a positioning post 4 fixed at the lower end of the grinding wheel body 1. Four clamping plates 6 are fixed at equal intervals around the positioning post 4. A positioning groove 11 is provided at the upper end of the flange body 9. Four clamping slots 12 are provided at equal intervals around the positioning groove 11. The positioning post 4 is clamped in the positioning groove 11, and one clamping plate 6 on the same side is clamped in one clamping slot 12 on the same side. This allows for quick and accurate installation and further improves the stability of the installation.

[0030] The positioning mechanism is snapped onto the flange body 9. The grinding wheel body 1 is provided with a modified epoxy resin composite filler layer 3. The modified epoxy resin composite filler layer 3 is formed by a combination of two-component high-temperature resistant epoxy resin, boron nitride nanosheets and carbon fiber short filaments. By setting it, it can realize the dual functions of mechanical support and thermal management between magnets, and is suitable for high-speed rotation conditions.

[0031] Multiple magnetic adsorption structures are evenly spaced within the modified epoxy resin composite filler layer 3. Each magnetic adsorption structure includes 8-12 negative magnetic blocks 2 evenly spaced within the modified epoxy resin composite filler layer 3. The negative magnetic blocks 2 and positive magnetic blocks 8 attract each other. A second mounting groove is provided at the lower end of the grinding wheel body 1, and the modified epoxy resin composite filler layer 3 is placed in the second mounting groove. The magnetic locking mechanism greatly improves the stability and firmness of the installation. In addition, the circular array can improve the uniformity of magnetic force distribution and ensure the uniform distribution of locking force and balance between the flange and the grinding wheel body.

[0032] The lower end of the positioning post 4 is equipped with a quantum dot fluorescent marker 5, a quantum dot coding positioning system. The non-working surface of the grinding wheel is sprayed with a quantum dot fluorescent marker (50μm in diameter). The grinding wheel model, installation angle and wear condition are identified by ultraviolet excitation, with an accuracy of ±0.1μm, replacing the traditional mechanical positioning pin. Example

[0033] Reference Figure 5 The difference between this embodiment 2 and embodiment 1 is that 5-8 small magnetic blocks 14 are evenly spaced on the flange body 9. The addition of small magnetic blocks 14 can further improve the adsorption firmness and adapt to high-speed rotation. In addition, a bushing is installed between the flange and the grinding wheel body during installation to further improve the connection tightness and enhance the firmness.

[0034] In this invention, the modified epoxy resin composite filler layer is composed of a matrix material and reinforcing fillers. The matrix material is a two-component high-temperature resistant epoxy resin with a temperature resistance of 280℃. The reinforcing filler is boron nitride nanosheets (15-20wt%), which improves the thermal conductivity to 6.8 W / m·K and reduces interfacial thermal stress. Short carbon fiber filaments (5-8wt%) increase the shear strength to 45MPa and inhibit crack propagation. By setting it up, it can achieve the dual functions of mechanical support and thermal management between magnets, and is suitable for high-speed rotation conditions.

[0035] In this invention, the metal-ceramic gradient composite filling layer structure is layered, wherein: the contact layer is formed by sintering copper powder and silver paste (particle size 5μm) to form a conductive network, the transition layer is composed of alumina ceramic particles (30 vol%) and epoxy resin, and the outer layer is a silicon nitride coating (thickness 50 μm) for corrosion protection. The dense structure with porosity <0.5% is achieved by 3D printing layer by layer deposition.

[0036] In this utility model, during installation, step 1: pre-positioning, the robotic arm grasps the grinding wheel module to 2mm above the flange, and the laser interferometer initially calibrates the coaxiality (error <5μm); step 2: magnetic locking, the negative and positive magnetic blocks attract each other, the gap between the grinding wheel and the flange is <0.01mm, and the magnetic uniformity reaches 98%; step 3: dynamic balance test, the vibration value is detected by idling at 3000rpm. Through magnetic attraction, the integration of smart materials and quantum sensing technology, under the premise of strictly following the flange clamping specifications (diameter ≥ 1 / 3 of the grinding wheel, vibration value <0.1mm / s), a breakthrough innovation in grinding wheel installation efficiency and accuracy has been achieved.

[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor wafer thinning device that facilitates grinding wheel replacement, comprising a flange body (9), characterized in that, The lower end of the flange body (9) is connected to a drive shaft (10). The upper end of the flange body (9) is provided with a metal-ceramic gradient composite filling layer (7). Multiple positive magnetic blocks (8) are embedded in the metal-ceramic gradient composite filling layer (7). The upper end of the flange body (9) is provided with a grinding wheel body (1). The lower end of the grinding wheel body (1) is provided with a positioning mechanism. The positioning mechanism is engaged with the flange body (9). The grinding wheel body (1) is provided with a modified epoxy resin composite filling layer (3). Multiple magnetic adsorption structures are provided at equal intervals in the modified epoxy resin composite filling layer (3), and the magnetic adsorption structures correspond to the positive magnetic blocks (8).

2. The semiconductor wafer thinning device with easy-to-change grinding wheel according to claim 1, characterized in that: The positioning mechanism includes a positioning post (4) fixed at the lower end of the grinding wheel body (1). Four clamping plates (6) are fixed at equal intervals around the positioning post (4). The upper end of the flange body (9) is provided with a positioning groove (11). Four clamping slots (12) are provided at equal intervals around the positioning groove (11). The positioning post (4) is clamped in the positioning groove (11), and one clamping plate (6) on the same side is clamped in one clamping slot (12) on the same side.

3. The semiconductor wafer thinning device with easy-to-change grinding wheel according to claim 2, characterized in that: The lower end of the positioning post (4) is provided with a quantum dot fluorescent marker (5).

4. The semiconductor wafer thinning device with easy-to-change grinding wheel according to claim 1, characterized in that: The magnetic adsorption structure includes 8-12 negative magnetic blocks (2) evenly spaced within the modified epoxy resin composite filler layer (3). The negative magnetic blocks (2) and positive magnetic blocks (8) adsorb to each other. The lower end of the grinding wheel body (1) is provided with a second mounting groove, and the modified epoxy resin composite filler layer (3) is disposed within the second mounting groove.

5. A semiconductor wafer thinning device with an easily replaceable grinding wheel according to claim 1, characterized in that: The flange body (9) is provided with a first mounting groove (13), and the metal-ceramic gradient composite filling layer (7) is disposed in the first mounting groove (13).

6. A semiconductor wafer thinning device with an easily replaceable grinding wheel according to claim 1, characterized in that: The flange body (9) is provided with 5-8 small magnetic blocks (14) at equal intervals.

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