Wafer cutting device

Abstract

The utility model discloses a wafer cutting device. The wafer cutting device comprises a machining table, a cutting tool and a lens assembly. The machining table is provided with a bearing part used for bearing a to-be-cut piece and a moving part arranged above the bearing part. The cutting tool is arranged on the moving part and is driven by the moving part to move so as to be at least used for cutting a to-be-cut piece; the lens assembly is installed on the moving part and located on the side edge of the cutting tool, the lens assembly comprises at least two lenses arranged side by side, and the magnification factor of one of the at least two lenses is larger than the magnification factor of the other lens. The wafer cutting device at least can solve the problems that in the prior art, a lens in a wafer cutting device cannot normally recognize a machined object, and consequently the cutting precision and the cutting efficiency of a wafer are low.

Description

Technical Field

[0001] This application relates to the field of ultra-precision machining technology, and more specifically, to a wafer dicing apparatus. Background Technology

[0002] Wafer dicing machines are typically equipped with lens modules, which are used for precise positioning of the workpiece and for quality inspection during the dicing process. During dicing, the processing area often generates a significant amount of water mist and dust, which can easily contaminate the lens on the lens module. This can prevent the lens module from properly recognizing the workpiece, ultimately affecting the dicing accuracy.

[0003] Furthermore, some existing wafer dicing apparatuses are equipped with only low-magnification or only high-magnification lenses for observation. However, in actual operation, observation with only a low-magnification lens has significant limitations in terms of accuracy, while observation with only a high-magnification lens results in a very narrow field of view, making it difficult to locate the target dicing area, thus reducing the accuracy and efficiency of dicing. Utility Model Content

[0004] The main objective of this application is to provide a wafer dicing apparatus to at least solve the problem of low wafer dicing accuracy and efficiency caused by the lens in the existing wafer dicing apparatus being unable to properly identify the workpiece.

[0005] According to one aspect of this application, a wafer dicing apparatus is provided, comprising:

[0006] A processing table, wherein the processing table is provided with a support component for carrying the workpiece to be cut and a moving component disposed above the support component;

[0007] A cutting tool, which is disposed on the moving component and moves under the drive of the moving component to at least cut the workpiece to be cut;

[0008] A lens assembly, which is mounted on the moving part and located on the side of the cutting tool, the lens assembly comprising at least two lenses arranged side by side, wherein the magnification of one of the at least two lenses is greater than that of the other.

[0009] Furthermore, the lens assembly includes a first lens, a second lens, a first connector, a second connector, a first air supply structure, and a second air supply structure. The first connector has a first through hole, and the second connector has a second through hole. The first lens is mounted in the first through hole, and the second lens is mounted in the second through hole. The first air supply structure is disposed on the first connector away from the second lens, and the second air supply structure is disposed on the second connector away from the first lens.

[0010] Further, the first air supply structure includes a first air supply pipe and a second air supply pipe, the first air supply pipe being disposed in the first connector and extending into the first through hole, and the second air supply pipe being disposed in the first connector and extending to the bottom of the first lens; and / or,

[0011] The second air supply structure includes a third air supply pipe and a fourth air supply pipe. The third air supply pipe is disposed in the second connector and extends into the second through hole, and the fourth air supply pipe is disposed in the second connector and extends to the bottom of the second lens.

[0012] Furthermore, the lens assembly also includes a first ring light source and a second ring light source, wherein the first ring light source is disposed at the bottom of the first connector and coaxially arranged with the first connector, and the center line of the port of the first air supply pipe near the first through hole is tangent to the outer peripheral sidewall of the first lens; and / or,

[0013] The second ring light source is disposed at the bottom of the second connector and is coaxially arranged with the second ring light source. The center line of the port of the third air supply line near the second through hole is tangent to the outer peripheral sidewall of the second lens.

[0014] Furthermore, the first ring light source has a first conical hole inside, which communicates with the first through hole, and the cross-sectional area of ​​the first conical hole gradually increases in the direction away from the first lens. The second air supply pipe includes a first connecting section, a second connecting section, and a third connecting section. The first connecting section extends along the height direction of the first connector to the bottom of the first ring light source. The second connecting section is perpendicularly connected to the first connecting section and extends to the outer edge of the bottom of the first conical hole. The third connecting section is connected to the second connecting section and extends in the direction away from the first lens, and the third connecting section is inclined in the direction close to the axis of the first conical hole; and / or,

[0015] The second ring light source has a second conical hole inside, which communicates with the second through hole. The cross-sectional area of ​​the second conical hole gradually increases in the direction away from the second lens. The fourth air supply pipe includes a fourth connecting section, a fifth connecting section, and a sixth connecting section. The fourth connecting section extends along the height direction of the second connector to the bottom of the second ring light source. The fifth connecting section is perpendicularly connected to the fourth connecting section and extends to the outer edge of the bottom of the second conical hole. The sixth connecting section is connected to the fifth connecting section and extends in the direction away from the second lens. The sixth connecting section is inclined in the direction close to the axis of the second conical hole.

[0016] Furthermore, the wafer dicing apparatus further includes a first guide rail component extending along a first direction, and the processing table is disposed on the first guide rail component and is movable along the first direction;

[0017] The moving component includes a mounting bracket, a first positioning part, a second positioning part, a first driving component, and a second driving component. At least two lenses are mounted on the first positioning part and arranged sequentially along the first direction. The first driving component is mounted on the second positioning part and drivenly connected to the first positioning part to drive the first positioning part to move along the height direction of the wafer dicing device. The second driving component is mounted on the mounting bracket and drivenly connected to the second positioning part to drive the second positioning part to move along a second direction perpendicular to the first direction. The first direction, the second direction, and the height direction are all perpendicular to each other.

[0018] Further, the first driving component includes:

[0019] A first driving component is mounted on the second positioning part;

[0020] A first transmission mechanism is connected to the first driving member and extends along the height direction. A first positioning part is installed on the first transmission mechanism and moves along the length direction of the first transmission mechanism under the drive of the first driving member.

[0021] Furthermore, the first driving component includes a first driving motor or a first driving cylinder, and the first transmission mechanism includes a first lead screw mechanism or a first slider mechanism.

[0022] Furthermore, the second drive component includes:

[0023] A second driving component is mounted on the mounting bracket;

[0024] The second transmission mechanism is connected to the second driving member and extends along the second direction. The second positioning part is installed on the second transmission mechanism and moves along the length direction of the second transmission mechanism under the drive of the second driving member.

[0025] Furthermore, the second driving component includes a second driving motor or a second driving cylinder, and the second transmission mechanism includes a second lead screw mechanism or a second slider mechanism. In this invention, a supporting component and a moving component are provided on the processing table. The supporting component stably supports the workpiece to be cut, providing a stable foundation for the wafer dicing operation, ensuring cutting accuracy and smooth operation. The cutting tool is mounted on the moving component, which is positioned above the supporting component. The moving component moves, causing the cutting tool and lens assembly to move synchronously, facilitating accurate cutting of the workpiece. The lens assembly is mounted on the moving component and located beside the cutting tool, facilitating observation during the cutting process and preventing interference between the lens and the cutting tool. Specifically, the lens assembly includes at least two lenses arranged side-by-side, with one lens having a magnification greater than the other. This arrangement simultaneously meets the macroscopic positioning and microscopic monitoring requirements of the cutting process. Lenses with low magnification provide a wide field of view for quick positioning of the cutting area, while lenses with high magnification can accurately determine the cutting path and observe the microscopic quality of the cutting edge (such as chipping, cracks, etc.) in real time. This setup can improve the cutting accuracy and efficiency of the wafer. Attached Figure Description

[0026] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0027] Figure 1 This is a schematic diagram of the overall structure of the wafer dicing apparatus disclosed in this application;

[0028] Figure 2 This is a rear view of the wafer dicing apparatus disclosed in this application;

[0029] Figure 3 This is a schematic diagram of the lens assembly of the wafer dicing apparatus disclosed in this application;

[0030] Figure 4 This is a cross-sectional view (a) of the lens assembly of the wafer dicing apparatus disclosed in this application;

[0031] Figure 5 This is a cross-sectional view (II) of the lens assembly of the wafer dicing apparatus disclosed in this application;

[0032] Figure 6 This is a schematic diagram of the lens assembly of the wafer dicing apparatus disclosed in this application from a first-view perspective.

[0033] Figure 7 This is a bottom view of the lens assembly of the wafer dicing apparatus disclosed in this application.

[0034] The above figures include the following reference numerals:

[0035] 51. Processing table; 511. Bearing component; 512. Moving component; 5121. Mounting bracket; 5122. First positioning part; 5123. Second positioning part; 5124. First driving component; 5124a. First driving member; 5124b. First transmission mechanism; 5125. Second driving component; 5125a. Second driving member; 5125b. Second transmission mechanism; 52. Cutting tool; 53. Lens assembly; 531. First lens; 532. Second lens; 533. First connector; 5331. First through hole; 534. Second connector; 5341. Second through hole; 535. First Gas supply structure; 5351, First gas supply pipeline; 5352, Second gas supply pipeline; 5352a, First connecting section; 5352b, Second connecting section; 5352c, Third connecting section; 536, Second gas supply structure; 5361, Third gas supply pipeline; 5362, Fourth gas supply pipeline; 5362a, Fourth connecting section; 5362b, Fifth connecting section; 5362c, Sixth connecting section; 537, First annular light source; 5371, First conical hole; 538, Second annular light source; 5381, Second conical hole; 54, First guide rail component; x, First direction; y, Second direction; z, Height direction. Detailed Implementation

[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0037] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0038] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0039] As mentioned in the background section, some existing wafer dicing apparatuses are equipped with only low-magnification lenses or only high-magnification lenses for observation. However, in actual operation, observation with only a low-magnification lens has significant limitations in accuracy, while observation with only a high-magnification lens results in a very narrow field of view, making it difficult to locate the target dicing area, thus reducing dicing accuracy and efficiency. Therefore, this application provides a wafer dicing apparatus that solves the problem of low dicing accuracy and efficiency caused by the lens's inability to properly identify the workpiece in existing wafer dicing apparatuses. A detailed description is provided below with reference to the accompanying drawings.

[0040] See Figures 1 to 7 As shown, according to an embodiment of this application, a wafer dicing apparatus is provided, which includes a processing table 51, a dicing tool 52, and a lens assembly 53.

[0041] Specifically, the processing table 51 is provided with a support member 511 for supporting the workpiece to be cut (not shown in the figure) and a moving member 512 disposed above the support member 511; the cutting tool 52 is disposed on the moving member 512 and moves under the drive of the moving member 512 to at least cut the workpiece to be cut; the lens assembly 53 is mounted on the moving member 512 and located on the side of the cutting tool 52, and the lens assembly 53 includes at least two lenses arranged side by side, and the magnification of one of the at least two lenses is greater than the magnification of the other.

[0042] like Figure 1 and Figure 2As shown, the processing table 51 is equipped with a support component 511 and a moving component 512. The support component 511 stably supports the workpiece to be cut (i.e., the wafer hereinafter referred to as wafer), providing a stable foundation for the wafer dicing operation and ensuring cutting accuracy and smooth operation. The cutting tool 52 is mounted on the moving component 512, which is positioned above the support component 511. The movement of the moving component 512 drives the cutting tool 52 and the lens assembly 53 to move synchronously, facilitating accurate cutting of the workpiece. The lens assembly 53 is mounted on the moving component 512 and located beside the cutting tool 52, facilitating observation during the cutting process and preventing interference between the lens and the cutting tool 52. Specifically, the lens assembly 53 includes at least two lenses arranged side-by-side, with one lens having a magnification greater than the other. This arrangement simultaneously meets the needs of macroscopic positioning and microscopic monitoring during the cutting process. The lens with a small magnification (i.e., the second lens 532 below) provides a large field of view to facilitate quick positioning of the cutting area, while the lens with a large magnification (i.e., the first lens 531 below) can accurately determine the cutting path and observe the microscopic quality of the cutting edge (such as chipping, cracks, etc.) in real time. This setting can improve the cutting accuracy and efficiency of the wafer.

[0043] See Figures 1 to 7 As shown, the lens assembly 53 includes a first lens 531, a second lens 532, a first connector 533, a second connector 534, a first air supply structure 535, and a second air supply structure 536. The first connector 533 has a first through-hole 5331, and the second connector 534 has a second through-hole 5341. The first lens 531 is mounted in the first through-hole 5331, and the second lens 532 is mounted in the second through-hole 5341. The first connector 533 and the second connector 534 provide stable support structures for the first lens 531 and the second lens 532, respectively, ensuring that the lenses maintain a relatively stable state during the operation of the wafer dicing apparatus, providing a stable viewing angle and image quality. The first through-hole 5331 and the second through-hole 5341 facilitate better positioning of the first lens 531 and the second lens 532, ensuring that the lenses can accurately and clearly present the image of the observed object during observation. The first air supply structure 535 is disposed on the first connector 533, facing away from the second lens 532, and the second air supply structure 536 is disposed on the second connector 534, facing away from the first lens 531. The first and second air supply structures 535 and 536 can promptly blow away impurities near each lens during wafer dicing, keeping the lens surfaces clean, ensuring normal lens use and observation accuracy, and also helping to extend the lens lifespan. Furthermore, the independent air supply structure for each lens improves the reliability of the lens assembly 53 to a certain extent.

[0044] like Figure 3As shown, the first air supply structure 535 includes a first air supply pipe 5351 and a second air supply pipe 5352. The first air supply pipe 5351 is disposed in the first connector 533 and extends into the first through hole 5331. When the wafer dicing device is started, the first air supply structure 535 is activated accordingly. The first air supply pipe 5351, disposed in the first connector 533 and extending into the first through hole 5331, allows airflow into the first through hole 5331, making it difficult for water mist and dust to enter the first through hole 5331, thereby preventing water mist and dust from contaminating the first lens 531. In addition, the airflow in the first air supply pipe 5351 can also cool the first lens 531, preventing the first lens 531 from overheating and causing thermal deformation after long-term operation. The second air supply line 5352 is disposed on the first connector 533 and extends to the bottom of the first lens 531. The second air supply line 5352 continuously blows to prevent debris on the wafer surface from obscuring the first lens 531 and to ensure accurate monitoring during dicing.

[0045] Furthermore, the second air supply structure 536 includes a third air supply pipe 5361 and a fourth air supply pipe 5362. The third air supply pipe 5361 is disposed in the second connector 534 and extends into the second through hole 5341. When the wafer dicing device is started, the second air supply structure 536 is activated accordingly. The third air supply pipe 5361, disposed in the second connector 534 and extending into the second through hole 5341, allows airflow into the second through hole 5341, making it difficult for water mist and dust to enter the second through hole 5341, thereby preventing water mist and dust from contaminating the second lens 532. In addition, the airflow in the third air supply pipe 5361 can also cool the second lens 532, preventing the second lens 532 from overheating and causing thermal deformation after long-term operation. The fourth air supply line 5362 is disposed on the second connector 534 and extends to the bottom of the second lens 532. The fourth air supply line 5362 continuously blows to prevent debris on the wafer surface from obscuring the second lens 532 and to ensure accurate monitoring during dicing.

[0046] like Figures 3 to 5As shown, the lens assembly 53 also includes a first ring light source 537 and a second ring light source 538. The first ring light source 537 is disposed at the bottom of the first connector 533 and coaxially arranged with the first connector 533. The coaxial arrangement allows light to be uniformly irradiated onto the target area to be observed. During the wafer dicing process, when observed through the first lens 531, the light emitted by the first ring light source 537 can illuminate the workpiece to be diced and the dicing area from all directions from the bottom, avoiding blind spots and providing a uniform and bright field of view. This helps to observe the details of the dicing more clearly and comprehensively, such as the flatness of the diced surface and the contact state between the blade and the material. The centerline of the port of the first air supply pipe 5351 near the first through hole 5331 is tangent to the outer peripheral sidewall of the first lens 531. The airflow spirals down the end of the first lens 531 and then passes through the first through hole 5331 and enters the first ring light source 537. This allows the airflow to clean the entire outer peripheral side of the first lens 531 and prevent water mist or dust from covering the outer peripheral sidewall of the first lens 531.

[0047] Furthermore, the second ring light source 538 is disposed at the bottom of the second connector 534 and coaxially arranged with the second ring light source 538. The center line of the port of the third air supply pipe 5361 near the second through hole 5341 is tangential to the outer peripheral sidewall of the second lens 532. The gas blown out from the port of the third air supply pipe 5361 can flow along the tangential direction of the outer peripheral sidewall of the second lens 532. On the one hand, this tangential airflow can form a "curtain" effect on the outer periphery of the second lens 532, more effectively blocking external impurities from approaching the lens. Compared with the airflow blowing vertically towards the lens surface, the tangential airflow has a wider coverage area and better protection effect. On the other hand, when the airflow flows along the sidewall, it can also better sweep away the tiny impurities already attached to the outer peripheral sidewall of the lens, promptly removing them from the lens surface, keeping the lens sidewall clean, and ensuring that the lens's light transmission and image quality are not affected by impurities. The third gas supply line 5361 can both clean and protect the gas without interfering with normal observation operations, thus ensuring the smooth progress of the observation work and the reliability of the observation results.

[0048] like Figure 6As shown, the first ring light source 537 has a first conical hole 5371 inside, which communicates with the first through hole 5331. The cross-sectional area of ​​the first conical hole 5371 gradually increases along the direction away from the first lens 531. This arrangement allows the light emitted by the first ring light source 537 within the first conical hole 5371 to have a wider range. Furthermore, the second gas supply pipe 5352 includes a first connecting section 5352a, a second connecting section 5352b, and a third connecting section 5352c. The first connecting section 5352a extends along the height direction of the first connector 533 to the bottom of the first ring light source 537, thus fulfilling the basic function of stably delivering gas from the gas source to the area where the ring light source is located. The second connecting section 5352b is perpendicularly connected to the first connecting section 5352a and extends to the outer edge of the bottom of the first conical hole 5371. This arrangement allows gas to be precisely delivered to the critical position at the bottom of the first conical hole 5371, facilitating air blowing cleaning of the conical hole and its surrounding area and preventing dust, debris, and other impurities from accumulating in this area and affecting light propagation and lens observation. The third connecting section 5352c is connected to the second connecting section 5352b and extends in a direction away from the first lens 531. The third connecting section 5352c is inclined towards the axis of the first conical hole 5371. This arrangement can clean impurities on the wafer surface, which is beneficial for lens observation, and also avoids direct airflow interfering with cutting accuracy.

[0049] like Figure 6 As shown, the second ring light source 538 has a second conical hole 5381 inside, which communicates with the second through hole 5341, and the cross-sectional area of ​​the second conical hole 5381 gradually increases along the direction away from the second lens 532. The conical structure can guide light to scatter at a wider angle, reduce the central dark area, make the illumination of the cut area more uniform, and avoid observation errors caused by shadows. The fourth air supply pipe 5362 includes a fourth connecting section 5362a, a fifth connecting section 5362b, and a sixth connecting section 5362c. The fourth connecting section 5362a extends along the height of the second connector 534 to the bottom of the second annular light source 538. The fifth connecting section 5362b is perpendicularly connected to the fourth connecting section 5362a and extends to the outer edge of the bottom of the second conical hole 5381. The sixth connecting section 5362c is connected to the fifth connecting section 5362b and extends in a direction away from the second lens 532, and the sixth connecting section 5362c is inclined towards the axis of the second conical hole 5381. The segmented design of the fourth air supply pipe 5362 (vertical → horizontal → inclined) gradually adjusts the airflow direction, avoids pressure loss caused by sharp turns, and ensures the stability of airflow and velocity.

[0050] like Figure 1 As shown, the wafer dicing apparatus also includes a first direction (i.e., Figure 1The first guide rail component 54 extends in the first direction (x-direction), and the processing table 51 is disposed on the first guide rail component 54 and can extend along the first direction (i.e., x-direction). Figure 1 The cutting table 51 moves in the x-direction. The first guide rail component 54 improves cutting accuracy and stability. The machining table 51 and the first guide rail component 54 are designed separately, which facilitates maintenance or replacement of the first guide rail component 54.

[0051] Further, the moving component 512 includes a mounting bracket 5121, a first positioning part 5122, a second positioning part 5123, a first driving component 5124, and a second driving component 5125. At least two lenses are mounted on the first positioning part 5122 and arranged sequentially along a first direction. The first driving component 5124 is mounted on the second positioning part 5123 and is drivenly connected to the first positioning part 5122 to drive the first positioning part 5122 along the height direction of the wafer dicing apparatus (i.e., Figure 1 The movement (in the z-direction) facilitates the adjustment of the lens assembly 53's position in the height direction. The second drive component 5125 is mounted on the mounting bracket 5121 and is drivenly connected to the second positioning part 5123 to drive the second positioning part 5123 along a second direction perpendicular to the first direction (i.e., the z-direction), which is beneficial for adjusting the position of the lens assembly 53 in the height direction. Figure 1 The lens assembly 53 moves in the y-direction, and the first direction, the second direction, and the height direction are all perpendicular to each other. The lens assembly 53 can be flexibly changed in position within the two-dimensional plane. The operator can easily move the lens assembly 53 above the position that needs to be observed, depending on the actual cutting area, so as to achieve accurate observation of the cutting situation at different positions of the wafer.

[0052] Furthermore, by using three mutually perpendicular directions to set up the driving and positioning structure, the three-dimensional space is fully utilized, avoiding mutual conflicts and unreasonable occupation of space among the components. This makes the entire moving component 512 more efficient in space utilization, better adaptable to the overall architecture of the wafer dicing device, and able to cooperate with other components (such as the processing table 51, dicing tool 52, etc.) to jointly complete the wafer dicing and observation tasks.

[0053] Furthermore, during the cutting process of the cutting tool 52, the position of the cutting tool 52 will continuously change according to the cutting path, etc. The lens assembly 53 can be driven by the first driving component 5124 and the second driving component 5125, allowing it to move flexibly in the height and lateral directions. This ensures that it is always adapted to the position of the cutting tool 52, so that while cutting, the lens assembly 53 can be aimed at the cutting area for real-time observation. Based on the observation, such as the flatness of the cut and whether there are any chipped edges, the operator can adjust the cutting parameters (such as the feed speed of the cutting tool 52, the cutting depth, etc.) in a timely manner, achieving efficient coordination between cutting and observation and improving the cutting quality.

[0054] like Figure 1 and Figure 2 As shown, the first driving component 5124 includes a first driving member 5124a and a first transmission mechanism 5124b. The first driving member 5124a is mounted on the second positioning part 5123. The first transmission mechanism 5124b is connected to the first driving member 5124a and extends along the height direction, making full use of the vertical space of the wafer dicing apparatus and reducing the equipment's footprint. The first positioning part 5122 is mounted on the first transmission mechanism 5124b and moves along the length direction of the first transmission mechanism 5124b under the drive of the first driving member 5124a. The first transmission mechanism 5124b, extending along the height direction, can serve as a rigid support in the vertical direction, enhancing system stability. The first driving member 5124a is mounted on the second positioning part 5123, which provides a relatively stable support for the first driving member 5124a. The first transmission mechanism 5124b is connected to the first driving member 5124a and extends along the height direction. Through the guiding effect of the first transmission mechanism 5124b, the first positioning part 5122 can achieve high-precision vertical movement. The first transmission mechanism 5124b smoothly transmits the power generated by the first driving member 5124a, driving the cutting tool 52 and the lens assembly 53 to move up and down.

[0055] Furthermore, the first driving component 5124a includes a first driving motor or a first driving cylinder, and the first transmission mechanism 5124b includes a first lead screw mechanism or a first slider mechanism. In this application, the first driving component 5124a is preferably a first driving motor, and the first transmission mechanism 5124b is preferably a first lead screw mechanism. Using a driving motor and a lead screw in conjunction provides high-precision control, good motion stability, efficient power transmission, and good integration. The first driving motor is a servo motor, which can precisely control the speed, angle, and output torque; the first lead screw mechanism is a ball screw, which has very high transmission accuracy.

[0056] like Figure 1 and Figure 2 As shown, the second drive component 5125 includes a second drive member 5125a and a second transmission mechanism 5125b. The second drive member 5125a is mounted on the mounting bracket 5121; the second transmission mechanism 5125b is connected to the second drive member 5125a and operates along a second direction (i.e., Figure 1 Extending in the y-direction, the second positioning part 5123 is mounted on the second transmission mechanism 5125b and moves along the length direction of the second transmission mechanism 5125b under the drive of the second driving member 5125a. Driven by the second driving member 5125a and guided by the second transmission mechanism 5125b, the movement of the second positioning part 5123 causes the cutting tool 52 and lens assembly 53 to move along the length direction of the second transmission mechanism 5125b, facilitating the observation and cutting of the wafer on the processing table 51.

[0057] Furthermore, the second driving component 5125a includes a second driving motor or a second driving cylinder, and the second transmission mechanism 5125b includes a second lead screw mechanism or a second slider mechanism. In this application, the second driving component 5125a is preferably a second driving motor, and the second transmission mechanism 5125b is preferably a second lead screw mechanism. Using a driving motor and a lead screw in conjunction provides high-precision control, good motion stability, efficient power transmission, and good integration. The second driving motor is a servo motor, which can precisely control the speed, angle, and output torque, and the second lead screw mechanism is a ball screw, which has very high transmission accuracy.

[0058] Based on the above embodiments, it can be seen that the wafer dicing apparatus of this application has at least the following technical effects:

[0059] (1) This application sets up at least two lenses, one of which has a magnification greater than the other. The lens with the smaller magnification is used to locate the cutting area, while the lens with the larger magnification is used to accurately determine the cutting path and observe the microscopic quality of the wafer cutting edge in real time. This setup can improve the cutting accuracy and efficiency of the wafer.

[0060] (2) This application sets each lens in the through hole of the corresponding connector and sets two air supply lines for each lens. The first air supply line is set inside the connector to avoid water mist and dust contamination of the lens. The second air supply line is set at the bottom of each lens to blow away debris on the surface of each wafer to ensure that the lens performs accurate monitoring.

[0061] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0062] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0063] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer dicing apparatus, characterized in that, include: A processing table (51) is provided with a support component (511) for carrying the workpiece to be cut and a moving component (512) provided above the support component (511); A cutting tool (52) is disposed on the moving part (512) and moves under the drive of the moving part (512) to at least cut the workpiece to be cut; A lens assembly (53) is mounted on the moving part (512) and located on the side of the cutting tool (52). The lens assembly (53) includes at least two lenses arranged side by side, one of which has a magnification greater than that of the other.

2. The wafer dicing apparatus according to claim 1, characterized in that, The lens assembly (53) includes a first lens (531), a second lens (532), a first connector (533), a second connector (534), a first air supply structure (535), and a second air supply structure (536). The first connector (533) is provided with a first through hole (5331), and the second connector (534) is provided with a second through hole (5341). The first lens (531) is installed in the first through hole (5331), and the second lens (532) is installed in the second through hole (5341). The first air supply structure (535) is disposed on the first connector (533) away from the second lens (532), and the second air supply structure (536) is disposed on the second connector (534) away from the first lens (531).

3. The wafer dicing apparatus according to claim 2, characterized in that, The first air supply structure (535) includes a first air supply pipe (5351) and a second air supply pipe (5352). The first air supply pipe (5351) is disposed in the first connector (533) and extends into the first through hole (5331). The second air supply pipe (5352) is disposed in the first connector (533) and extends to the bottom of the first lens (531); and / or, The second air supply structure (536) includes a third air supply pipe (5361) and a fourth air supply pipe (5362). The third air supply pipe (5361) is disposed in the second connector (534) and extends into the second through hole (5341). The fourth air supply pipe (5362) is disposed in the second connector (534) and extends to the bottom of the second lens (532).

4. The wafer dicing apparatus according to claim 3, characterized in that, The lens assembly (53) further includes a first ring light source (537) and a second ring light source (538), wherein the first ring light source (537) is disposed at the bottom of the first connector (533) and coaxially arranged with the first connector (533), and the center line of the port of the first air supply pipe (5351) near the first through hole (5331) is tangent to the outer peripheral sidewall of the first lens (531); and / or, The second ring light source (538) is disposed at the bottom of the second connector (534) and is coaxially disposed with the second ring light source (538). The center line of the third air supply pipe (5361) near the port of the second through hole (5341) is tangent to the outer peripheral sidewall of the second lens (532).

5. The wafer dicing apparatus according to claim 4, characterized in that, The first ring light source (537) has a first conical hole (5371) inside, which communicates with the first through hole (5331). The cross-sectional area of ​​the first conical hole (5371) gradually increases in the direction away from the first lens (531). The second air supply pipe (5352) includes a first connecting section (5352a), a second connecting section (5352b), and a third connecting section (5352c). The first connecting section (5352a) extends along the first connecting member (533). The height direction of the first ring light source (537) extends to the bottom of the first ring light source (537), the second connecting segment (5352b) is perpendicularly connected to the first connecting segment (5352a) and extends to the outer edge of the bottom of the first conical hole (5371), the third connecting segment (5352c) is connected to the second connecting segment (5352b) and extends in a direction away from the first lens (531), and the third connecting segment (5352c) is inclined in a direction close to the axis of the first conical hole (5371); and / or, The second ring light source (538) has a second conical hole (5381) inside, which communicates with the second through hole (5341). The cross-sectional area of ​​the second conical hole (5381) gradually increases in the direction away from the second lens (532). The fourth air supply pipe (5362) includes a fourth connecting section (5362a), a fifth connecting section (5362b), and a sixth connecting section (5362c). The fourth connecting section (5362a) is along the second connector (5341). 34) extends in the height direction to the bottom of the second ring light source (538), the fifth connecting segment (5362b) is perpendicularly connected to the fourth connecting segment (5362a) and extends to the outer edge of the bottom of the second conical hole (5381), the sixth connecting segment (5362c) is connected to the fifth connecting segment (5362b) and extends in a direction away from the second lens (532), and the sixth connecting segment (5362c) is inclined in a direction close to the axis of the second conical hole (5381).

6. The wafer dicing apparatus according to claim 1, characterized in that, The wafer dicing apparatus further includes a first guide rail component (54) extending along a first direction, and the processing table (51) is disposed on the first guide rail component (54) and can move along the first direction; The moving component (512) includes a mounting bracket (5121), a first positioning part (5122), a second positioning part (5123), a first driving component (5124), and a second driving component (5125). At least two lenses are mounted on the first positioning part (5122) and arranged sequentially along the first direction. The first driving component (5124) is mounted on the second positioning part (5123) and drivenly connected to the first positioning part (5122) to drive the first positioning part (5122) to move along the height direction of the wafer dicing device. The second driving component (5125) is mounted on the mounting bracket (5121) and drivenly connected to the second positioning part (5123) to drive the second positioning part (5123) to move along a second direction perpendicular to the first direction. The first direction, the second direction, and the height direction are all perpendicular to each other.

7. The wafer dicing apparatus according to claim 6, characterized in that, The first drive component (5124) includes: A first driving member (5124a) is mounted on the second positioning part (5123); A first transmission mechanism (5124b) is connected to the first driving member (5124a) and extends along the height direction. A first positioning part (5122) is mounted on the first transmission mechanism (5124b) and moves along the length direction of the first transmission mechanism (5124b) under the drive of the first driving member (5124a).

8. The wafer dicing apparatus according to claim 7, characterized in that, The first driving component (5124a) includes a first driving motor or a first driving cylinder, and the first transmission mechanism (5124b) includes a first lead screw mechanism or a first slider mechanism.

9. The wafer dicing apparatus according to claim 6, characterized in that, The second drive component (5125) includes: The second drive member (5125a) is mounted on the mounting bracket (5121); The second transmission mechanism (5125b) is connected to the second driving member (5125a) and extends along the second direction. The second positioning part (5123) is mounted on the second transmission mechanism (5125b) and moves along the length direction of the second transmission mechanism (5125b) under the drive of the second driving member (5125a).

10. The wafer dicing apparatus according to claim 9, characterized in that, The second driving member (5125a) includes a second driving motor or a second driving cylinder, and the second transmission mechanism (5125b) includes a second lead screw mechanism or a second slider mechanism.

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