Wafer transportation equipment and wafer aging test system
By setting up a leveling component in the wafer transport equipment to align the moving mechanism of adjacent boxes, the problem of insufficient connection accuracy in long-distance transportation is solved, and high-precision and stable wafer transport is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- STELIGHT INSTR CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-05-12
AI Technical Summary
In the semiconductor wafer testing process, the insufficient accuracy and stability of the connection between multiple transport devices during long-distance wafer transportation can lead to unstable transportation.
By setting leveling components between the moving mechanisms of adjacent wafer transport boxes, high-precision splicing is achieved, ensuring that the moving mechanisms of each transport box are aligned, thereby improving connection accuracy and stability.
It improves the accuracy and stability of long-distance wafer transportation, avoids jams and sluggish movement during transportation, and ensures smooth transportation of wafers between multiple transport devices.
Smart Images
Figure CN224226173U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer testing technology, and in particular to a wafer transport device and a wafer aging test system. Background Technology
[0002] In the semiconductor wafer testing process, wafer transport is typically performed using transport equipment to achieve automated testing. For long-distance wafer transport, multiple transport devices need to be connected. To ensure stable long-distance transport of wafers across these interconnected devices, the accuracy and stability of the connections between them are crucial. Utility Model Content
[0003] To address the aforementioned problems in the prior art, this utility model discloses a wafer transport device and a wafer aging test system, which can achieve high-precision splicing between the moving mechanisms of two adjacent wafer transport boxes, improving the accuracy and stability of long-distance wafer transport. The technical solution disclosed in this utility model is as follows:
[0004] This utility model provides a wafer transport device, the wafer transport device comprising:
[0005] At least two wafer transport boxes are connected in sequence. Each wafer transport box includes a first fixing member and a moving mechanism. The moving mechanism is disposed on the first fixing member and extends in a horizontal direction. The moving mechanisms of two adjacent wafer transport boxes are connected to each other.
[0006] A wafer transport device is slidably connected to the moving mechanism and is used to slide on each of the moving mechanisms to realize the wafer transport;
[0007] A leveling component is provided on each of the first fixing members, the leveling component being used to level the corresponding first fixing member so that the moving mechanisms of two adjacent wafer transport boxes are aligned.
[0008] Optionally, the leveling assembly includes a first horizontal leveling assembly, a second horizontal leveling assembly, and a vertical leveling assembly. The moving mechanism is disposed on one side of the first fixing member, the first horizontal leveling assembly and the second horizontal leveling assembly are disposed on the other side of the first fixing member, and the vertical leveling assembly is disposed at the bottom of the first fixing member.
[0009] The first horizontal leveling component is used to level the first fixing member along the extension direction of the moving mechanism so as to align the moving mechanisms of two adjacent wafer transport boxes.
[0010] The second horizontal leveling component is used to level the first fixing member in a direction perpendicular to the side of the first fixing member, so as to align the moving mechanisms of the two adjacent wafer transport boxes.
[0011] The vertical leveling component is used to level the first fixing member in a direction parallel to the side of the first fixing member, so as to align the moving mechanisms of the two adjacent wafer transport boxes.
[0012] Optionally, the first leveling component includes a first leveling member and a second leveling member, and a second fixing member is provided parallel to the other side of the first fixing member, the second fixing member being smaller in size than the first fixing member;
[0013] The second leveling component is disposed on the second fixing component, and the first leveling component is disposed on the first fixing component, with the first leveling component and the second leveling component being disposed opposite to each other.
[0014] Optionally, a third fixing member is provided parallel to the other side of the first fixing member. The third fixing member is smaller than the first fixing member. The second horizontal leveling component is disposed on the third fixing member. The second horizontal leveling component includes at least four leveling screws.
[0015] Optionally, the wafer transport device further includes a first connecting structure that spans across the first fixing members of two adjacent wafer transport boxes to connect them.
[0016] Optionally, the wafer transport equipment further includes a second connecting structure, and each wafer transport box further includes a housing. The first fixing member, the moving mechanism and the wafer transport device are all disposed in the housing, and the housings of two adjacent wafer transport boxes are connected by the second connecting structure.
[0017] Optionally, the second connection structure includes a first sub-connection structure and a second sub-connection structure, wherein the first sub-connection structure and the second sub-connection structure are respectively disposed on the housings of two adjacent wafer transport boxes;
[0018] The first sub-connection structure and the second sub-connection structure are plugged into each other to connect the housings of two adjacent wafer transport boxes.
[0019] Optionally, the wafer transport equipment further includes a leveling detection device, which is used to detect whether the moving mechanisms of two adjacent wafer transport boxes are leveled and aligned.
[0020] Optionally, the moving mechanism includes a first guide and a first driving mechanism. The first guide extends horizontally, and the first guides of two adjacent wafer transport boxes are connected. The first driving mechanism is driven to the wafer transport device, and the wafer transport device is slidably connected to the first guide. The first driving mechanism is used to drive the wafer transport device to move horizontally along the first guide.
[0021] Optionally, the wafer transport device includes a wafer pick-and-place device and a lifting mechanism, wherein the lifting mechanism and the moving mechanism are slidably connected, and the wafer pick-and-place device and the lifting mechanism are slidably connected.
[0022] The lifting mechanism is used to move the wafer loading and unloading device vertically, and the moving mechanism is used to move the lifting mechanism horizontally within the at least two wafer transport boxes to realize the wafer transport. The wafer loading and unloading device is used to perform the wafer loading and unloading operations.
[0023] This utility model also provides a wafer aging test system, including the wafer transport equipment described in any of the above claims.
[0024] The technical solutions provided by the embodiments disclosed in this utility model have at least the following beneficial effects:
[0025] This invention provides a wafer transport device and a wafer aging test system. The wafer transport device includes: at least two wafer transport boxes connected in sequence, each wafer transport box including a first fixing member and a moving mechanism. The moving mechanism is disposed on the first fixing member and extends horizontally. The moving mechanisms of two adjacent wafer transport boxes are connected to each other. A wafer transport device is slidably connected to the moving mechanism and is used to slide on each moving mechanism to realize wafer transport. A leveling component is disposed on each first fixing member and is used to level the corresponding first fixing member to align the moving mechanisms of two adjacent wafer transport boxes. This achieves high-precision splicing between the moving mechanisms of two adjacent wafer transport boxes, enabling the wafer transport device to move smoothly among multiple sequentially connected wafer transport boxes based on the spliced and aligned moving mechanisms, thereby improving the accuracy and stability of long-distance wafer transport.
[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the disclosure of this utility model and, together with the description, serve to explain the principles disclosed herein, but do not constitute an undue limitation on the disclosure of this utility model.
[0028] Figure 1 This is a schematic diagram of a wafer transport device provided in an embodiment of the present invention;
[0029] Figure 2 This is a schematic diagram of a second connection structure provided in an embodiment of the present utility model;
[0030] Figure 3 This is a schematic diagram of a first guide member and a second guide member provided in an embodiment of this utility model;
[0031] Figure 4 This is a schematic diagram of a leveling component provided in an embodiment of the present utility model;
[0032] Figure 5 This is an enlarged schematic diagram of a leveling component provided in an embodiment of this utility model;
[0033] Figure 6 This is a schematic diagram of a wafer transport device provided in an embodiment of the present invention moving horizontally between two adjacent wafer transport boxes;
[0034] Figure 7 This is a schematic diagram of the vertical movement of a wafer loading and unloading device provided in an embodiment of this utility model;
[0035] Figure 8 This is a schematic diagram of a wafer aging test system provided in an embodiment of the present invention;
[0036] In the figure, the corresponding reference numerals are: 1-Wafer transport equipment; 10-Wafer transport box; 11-First fixing component; 12-Second fixing component; 13-Third fixing component; 14-Moving mechanism; 141-First guide component; 15-Wafer transport device; 151-Wafer loading and unloading device; 152-Lifting mechanism; 153-Second guide component; 16-Leveling component; 161-First horizontal leveling component; 162-Second horizontal leveling component; 163-Vertical leveling component; 164-First leveling component; 165-Second leveling component; 17-First connecting structure; 18-Second connecting structure; 181-First sub-connecting structure; 182-Second sub-connecting structure; 2-Wafer loading and unloading equipment; 3-Wafer aging test equipment. Detailed Implementation
[0037] To enable those skilled in the art to better understand the technical solutions disclosed in this utility model, the technical solutions in the disclosed embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0038] It should be noted that the term "an embodiment" or "embodiment" in the specification of the embodiments of this application refers to a specific feature, structure, or characteristic that can be included in at least one implementation of this application. It should be understood that in the specification, claims, and accompanying drawings of the embodiments of this application, the terms "upper," "lower," "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, in the description of this embodiment, unless otherwise stated, "a plurality of" means two or more. Additionally, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, or product that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.
[0039] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.
[0040] In semiconductor wafer testing processes, wafer transport is typically achieved through transport equipment to enable automated testing. For example, during wafer aging testing, wafers need to be transferred from wafer loading / unloading equipment to aging testing equipment, and then transferred from aging testing equipment back to wafer loading / unloading equipment. Therefore, transport equipment is required for wafer transport. In long-distance wafer transport, multiple transport devices need to be connected. To ensure stable long-distance transport of wafers across these connected devices, the accuracy and stability of the connections between them are crucial. Based on this, this application provides a wafer transport device and a wafer aging testing system. In the wafer transport device, multiple wafer transport boxes are connected sequentially. A leveling component levels the first fixing member of each wafer transport box, aligning the moving mechanisms of adjacent wafer transport boxes. This achieves high-precision splicing between the moving mechanisms, allowing the wafer transport device to move smoothly among the sequentially connected wafer transport boxes based on the aligned moving mechanisms, thus improving the accuracy and stability of long-distance wafer transport.
[0041] The technical solutions in the embodiments of this utility model are described below with reference to the accompanying drawings.
[0042] Please see Figure 1 This utility model provides a wafer transport device 1, which includes at least two wafer transport boxes 10 connected in sequence. Each wafer transport box 10 includes a first fixing member 11 and a moving mechanism 14. The moving mechanism 14 is disposed on the first fixing member 11 and extends horizontally. The moving mechanisms 14 of two adjacent wafer transport boxes 10 are connected to each other. A wafer transport device 15 is slidably connected to the moving mechanism 14 and is used to slide on each moving mechanism 14 to realize wafer transport. A leveling component 16 is disposed on each first fixing member 11 and is used to level the corresponding first fixing member 11 so that the moving mechanisms 14 of two adjacent wafer transport boxes 10 are aligned.
[0043] In one specific embodiment, the wafer transport box 10 is used to transport and transfer wafers between the wafer loading / unloading equipment 2 and the wafer aging test equipment 3. The wafer loading / unloading equipment 2 provides wafers to be tested and retrieves wafers that have completed testing. The wafer aging test equipment 3 is used to test the wafers to be tested, obtaining wafers that have completed testing. Specifically, the wafer aging test equipment 3 can be a device used to perform aging tests on wafers. In practical applications, in order to expand the simultaneous testing of multiple wafer aging test equipment 3, multiple wafer transport boxes 10 can be connected sequentially, and the tracks of each wafer transport box 10 can be connected to achieve long-distance wafer transportation. Figure 1The dashed lines indicate the connection points between two adjacent wafer transport boxes 10.
[0044] In one specific embodiment, the wafer transport equipment further includes a second connection structure 18, and each wafer transport box 10 also includes a housing. The first fixing member 11, the moving mechanism 14 and the wafer transport device 15 are all disposed in the housing, and the housings of two adjacent wafer transport boxes 10 are connected by the second connection structure 18.
[0045] Specifically, the second connecting structure 18 can connect two adjacent wafer transport boxes 10 as a whole. The specific setting of the second connecting structure 18 can be determined according to actual application requirements. For example, the second connecting structure 18 can be set inside or outside the housing at the connection point of the wafer transport boxes 10, or further, it can be set on the bottom or side of the housing at the connection point. Specifically, the first fixing member 11 is installed on the inner side of the back housing of the wafer transport box 10.
[0046] Optional, such as Figure 2 As shown, the second connection structure includes a first sub-connection structure 181 and a second sub-connection structure 182. The first sub-connection structure 181 and the second sub-connection structure 182 are respectively disposed on the housings of two adjacent wafer transport boxes 10. The first sub-connection structure 181 and the second sub-connection structure 182 are inserted into each other to connect the housings of the two adjacent wafer transport boxes 10.
[0047] Specifically, one of the first sub-connection structure 181 and the second sub-connection structure 182 can be a convex structure and the other can be a corresponding concave structure. The connection between the housings is achieved by inserting the convex structure and the corresponding concave structure at the joint of the housings of two adjacent wafer transport boxes 10. On this basis, the first fixing members 11 of the adjacent wafer transport boxes 10 are in contact with each other, and the moving mechanisms 14 are in contact with each other.
[0048] In one specific embodiment, the wafer transport device further includes a first connection structure 17, which spans the first fasteners 11 of two adjacent wafer transport boxes 10 to connect them.
[0049] Specifically, in two adjacent wafer transport boxes 10, one end of the first connecting structure 17 is fixed to the first fixing member 11 of one wafer transport box 10, and the other end is fixed to the first fixing member 11 of the other wafer transport box 10, so that the first fixing members 11 of the two adjacent wafer transport boxes 10 are connected, thereby connecting the tracks of the two moving mechanisms 14 installed on the corresponding first fixing members 11 in the two adjacent wafer transport boxes 10. In practical applications, the specific structure of the first connecting structure 17 can be set according to application requirements, for example, it can be strip-shaped.
[0050] In one specific embodiment, such as Figure 3 As shown, the moving mechanism 14 includes a first guide member 141 and a first drive mechanism (not shown). The first guide member 141 extends horizontally, and the first guide members 141 of two adjacent wafer transport boxes 10 are connected. The first drive mechanism is drivenly connected to the wafer transport device 15, and the wafer transport device 15 is slidably connected to the first guide member 141. The first drive mechanism is used to drive the wafer transport device 15 to move horizontally along the first guide member 141. Specifically, the first guide member 141 can be a track, and the first drive mechanism can be a linear motor.
[0051] In the embodiments of this specification, multiple wafer transport boxes 10 can correspond to one wafer transport device 15. The wafer transport device 15 can slide on the track of the moving mechanism 14 corresponding to the multiple wafer transport boxes 10, thereby realizing long-distance wafer transport. Specifically, a limiting member is provided on the first guide member 141. In the multiple wafer transport boxes 10 connected in sequence, the limiting member is provided at both ends of the connected first guide member 141 to limit the maximum movable distance of the wafer transport device 15 in the extending direction (horizontal direction) of the moving mechanism 14.
[0052] In one specific embodiment, based on the connection between the housings of two adjacent wafer transport boxes 10 and the connection between the moving mechanisms 14 of two adjacent wafer transport boxes 10, the leveling component 16 can fine-tune the corresponding first fixing member 11 to align the moving mechanisms 14, thereby improving the connection accuracy. The leveling component 16 can level the corresponding first fixing member 11 in the x-axis, y-axis, and z-axis directions to align the moving mechanisms 14 disposed on the corresponding first fixing member 11, wherein the y-axis direction is the extending direction of the moving mechanism 14. Optionally, the first fixing members 11 of the multiple wafer transport boxes 10 can all be non-fixed on the corresponding wafer transport box 10, and aligned and leveled by adjusting their respective leveling components 16. Alternatively, one of the first fixing members 11 can be fixedly installed on the corresponding wafer transport box 10, while the other first fixing members 11 are non-fixed on the corresponding wafer transport box 10. Using the fixedly installed first fixing member 11 as a reference, the other first fixing members 11 can be adjusted to align and level with the fixedly installed first fixing member 11, thereby aligning the moving mechanism 14 on the first fixing member 11 (i.e., track alignment), achieving high-precision splicing. As a result, the wafer transport box 10 can move smoothly and stably within the multiple wafer transport boxes 10, avoiding obstruction or jamming at the connection points of adjacent wafer transport boxes 10, and improving the accuracy and stability of long-distance wafer transport.
[0053] Optional, such as Figure 4 As shown, the leveling assembly 16 includes a first horizontal leveling assembly 161, a second horizontal leveling assembly 162, and a vertical leveling assembly 163. The moving mechanism 14 is disposed on one side of the first fixing member 11, the first horizontal leveling assembly 161 and the second horizontal leveling assembly 162 are disposed on the other side of the first fixing member 11, and the vertical leveling assembly 163 is disposed at the bottom of the first fixing member 11. Specifically, the first horizontal leveling assembly 161 is used to level the first fixing member 11 along the extending direction of the moving mechanism 14, so that the moving mechanisms 14 of two adjacent wafer transport boxes 10 are aligned; the second horizontal leveling assembly 162 is used to level the first fixing member 11 in a direction perpendicular to the side of the first fixing member 11, so that the moving mechanisms 14 of two adjacent wafer transport boxes 10 are aligned; and the vertical leveling assembly 163 is used to level the first fixing member 11 in a direction parallel to the side of the first fixing member 11, so that the moving mechanisms 14 of two adjacent wafer transport boxes 10 are aligned.
[0054] Specifically, the first horizontal leveling component 161 is used to level the first fixing member 11 in the y-axis direction, the second horizontal leveling component 162 is used to level the first fixing member 11 in the x-axis direction, and the vertical leveling component 163 is used to level the first fixing member 11 in the z-axis direction. In this embodiment of the specification, based on the front view of the wafer transport box 10, the moving mechanism 14 is disposed on the front of the first fixing member 11, and the first horizontal leveling component 161 and the second horizontal leveling component 162 are disposed on the back of the first fixing member 11.
[0055] In the above embodiments, Figure 4 The structure of the leveling assembly 16 is shown using one wafer transport box 10 as an example; other wafer transport boxes 10 have the same configuration.
[0056] In one specific embodiment, such as Figure 5 As shown, the first leveling component 161 includes a first leveling component 164 and a second leveling component 165. A second fixing component 12 is arranged parallel to the other side of the first fixing component 11. The size of the second fixing component 12 is smaller than that of the first fixing component 11. The second leveling component 165 is disposed on the second fixing component 12, and the first leveling component 164 is disposed on the first fixing component 11. The first leveling component 164 and the second leveling component 165 are disposed opposite to each other.
[0057] Specifically, the first leveling component 164 and the second leveling component 165 are arranged opposite each other and have a preset distance. The first leveling component 164 and the second leveling component 165 can have a block structure. The first fixing component is leveled and aligned in the y-axis direction by fitting the opposite surfaces of the first leveling component 164 and the second leveling component 165 together. In practical applications, multiple first leveling components 164 and corresponding second leveling components 165 can be set to adjust different positions of the first fixing component 11 to ensure precise leveling. Specifically, the preset distance is relatively small and can be set according to actual application requirements.
[0058] Specifically, a third fixing member 13 is arranged parallel to the other side of the first fixing member 11. The third fixing member 13 is smaller than the first fixing member 11, and a second horizontal leveling assembly 162 is disposed on the third fixing member 13. The second horizontal leveling assembly 162 includes at least four leveling screws. Specifically, the four leveling screws can be considered as a group, and multiple groups of leveling screws can be spaced apart on the other side of the first fixing member 11 to adjust different positions of the first fixing member 11. Optionally, such as Figure 4 and Figure 5 As shown in the rightmost setting, the second leveling component 165 and the leveling screw can be set on the same fixing component.
[0059] In the embodiments described in this specification, the first fixing member 11, the second fixing member 12, and the third fixing member 13 can be fixing plates. Based on the front view of the wafer transport box 10, the second fixing member 12 and the third fixing member 13 are both located on the back of the first fixing member 11.
[0060] Specifically, the vertical leveling component 163 can be used to support the first fixing member 11. The vertical leveling component 163 includes multiple vertical leveling components, which are spaced apart at the bottom of the first fixing member 11 to adjust different positions of the first fixing member 11.
[0061] Optionally, the wafer transport equipment 1 also includes a leveling detection device (not shown), which is used to detect whether the moving mechanisms 14 of two adjacent wafer transport boxes 10 are leveled and aligned. Specifically, the leveling detection device can indicate whether the moving mechanisms 14 are leveled and aligned using pointers or the like.
[0062] In one specific embodiment, such as Figure 1 and Figure 6-7As shown, the wafer transport device 15 includes a wafer loading and unloading device 151 and a lifting mechanism 152. The lifting mechanism 152 and the moving mechanism 14 are slidably connected. The wafer loading and unloading device 151 and the lifting mechanism 152 are slidably connected. The lifting mechanism 152 is used to move the wafer loading and unloading device 151 vertically, and the moving mechanism 14 is used to move the lifting mechanism 152 horizontally in at least two wafer transport boxes 10 to realize wafer transport. The wafer loading and unloading device 151 is used to perform wafer loading and unloading operations.
[0063] Specifically, such as Figure 3 As shown, the lifting mechanism 152 includes a second guide member 153 and a second drive mechanism (not shown). The second drive mechanism is drivenly connected to the wafer pick-and-place device 151, and the wafer pick-and-place device 151 is slidably connected to the second guide member 153. Under the drive of the second drive mechanism, the wafer pick-and-place device 151 slides and lifts along the second guide member 153. The second guide member 153 can be a track, and the second drive mechanism can be a drive motor. Specifically, limit members are provided at both ends of the second guide member 153 to limit the maximum movable distance of the wafer pick-and-place device 151 in the vertical direction, such as... Figure 6 and Figure 7 As shown, Figure 6 The maximum horizontal movement distance of the wafer transport device 15 is shown. Figure 7 The maximum movable distance of the wafer pick-and-place device 151 in the vertical direction is shown. It can realize the pick-and-place and transportation of wafers in multiple wafer aging test equipment 3 and multiple test points in each wafer aging test equipment 3. The dotted line in the figure indicates the connection between the first fixing member 11 and the moving mechanism 14 corresponding to each of the two adjacent wafer transport boxes 10.
[0064] In the above embodiments, the installation and connection methods not explicitly specified may include detachable and non-detachable methods, such as fastener connection, integral connection, etc.
[0065] By implementing the above embodiments of this utility model, the wafer transport equipment includes at least two wafer transport boxes connected in sequence. Each wafer transport box includes a first fixing member and a moving mechanism. The moving mechanism is disposed on the first fixing member and extends horizontally. The moving mechanisms of two adjacent wafer transport boxes are connected to each other. A wafer transport device is slidably connected to the moving mechanism and is used to slide on each moving mechanism to realize wafer transport. A leveling component is disposed on each first fixing member and is used to level the corresponding first fixing member to align the moving mechanisms of two adjacent wafer transport boxes. This achieves high-precision splicing between the moving mechanisms of two adjacent wafer transport boxes, enabling the wafer transport device to move smoothly among multiple sequentially connected wafer transport boxes based on the spliced and aligned moving mechanisms, thereby improving the accuracy and stability of long-distance wafer transport.
[0066] This utility model embodiment also provides a wafer aging test system, including the wafer transport equipment 1 described above.
[0067] Optional, such as Figure 8 As shown, the aforementioned wafer aging test system also includes a wafer loading / unloading device 2 and at least two wafer aging test devices 3. The dotted lines in the figure indicate the connection points between two adjacent wafer transport boxes 10. In practical applications, for one wafer loading / unloading device 2, multiple wafer aging test devices 3 can be expanded to perform tests simultaneously. Each wafer aging test device 3 includes at least one wafer aging test unit, and each wafer aging test unit is used to provide a test position for aging testing one wafer. Specifically, multiple wafer aging test devices can be stacked to form multiple test positions in multiple layers. By connecting multiple wafer transport boxes 10 in sequence, wafer loading and unloading at multiple test positions of multiple wafer aging test devices 3 can be realized, improving test capacity efficiency.
[0068] The specific structural configuration of the aforementioned wafer transport equipment has been described in detail in the above embodiments and will not be elaborated further here.
[0069] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations disclosed herein that follow the general principles disclosed herein and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.
[0070] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.
Claims
1. A wafer transport device, characterized in that, The wafer transport equipment includes: At least two wafer transport boxes are connected in sequence. Each wafer transport box includes a first fixing member and a moving mechanism. The moving mechanism is disposed on the first fixing member and extends in a horizontal direction. The moving mechanisms of two adjacent wafer transport boxes are connected to each other. A wafer transport device is slidably connected to the moving mechanism and is used to slide on each of the moving mechanisms to realize the wafer transport; A leveling component is provided on each of the first fixing members, the leveling component being used to level the corresponding first fixing member so that the moving mechanisms of two adjacent wafer transport boxes are aligned.
2. The wafer transport equipment according to claim 1, characterized in that, The leveling assembly includes a first horizontal leveling assembly, a second horizontal leveling assembly, and a vertical leveling assembly. The moving mechanism is disposed on one side of the first fixing member, the first horizontal leveling assembly and the second horizontal leveling assembly are disposed on the other side of the first fixing member, and the vertical leveling assembly is disposed at the bottom of the first fixing member. The first horizontal leveling component is used to level the first fixing member along the extension direction of the moving mechanism so as to align the moving mechanisms of two adjacent wafer transport boxes. The second horizontal leveling component is used to level the first fixing member in a direction perpendicular to the side of the first fixing member, so as to align the moving mechanisms of the two adjacent wafer transport boxes. The vertical leveling component is used to level the first fixing member in a direction parallel to the side of the first fixing member, so as to align the moving mechanisms of the two adjacent wafer transport boxes.
3. The wafer transport equipment according to claim 2, characterized in that, The first leveling component includes a first leveling component and a second leveling component. A second fixing component is arranged parallel to the other side of the first fixing component, and the size of the second fixing component is smaller than that of the first fixing component. The second leveling component is disposed on the second fixing component, and the first leveling component is disposed on the first fixing component, with the first leveling component and the second leveling component being disposed opposite to each other.
4. The wafer transport equipment according to claim 2, characterized in that, A third fixing member is arranged parallel to the other side of the first fixing member. The third fixing member is smaller than the first fixing member. The second horizontal leveling component is disposed on the third fixing member. The second horizontal leveling component includes at least four leveling screws.
5. The wafer transport equipment according to claim 1, characterized in that, The wafer transport equipment further includes a first connecting structure, which spans across the first fixing members of two adjacent wafer transport boxes to connect them.
6. The wafer transport equipment according to claim 1, characterized in that, The wafer transport equipment further includes a second connection structure. Each wafer transport box also includes a housing. The first fixing member, the moving mechanism, and the wafer transport device are all disposed within the housing. The housings of two adjacent wafer transport boxes are connected by the second connection structure.
7. The wafer transport equipment according to claim 6, characterized in that, The second connection structure includes a first sub-connection structure and a second sub-connection structure, which are respectively disposed on the shells of two adjacent wafer transport boxes; The first sub-connection structure and the second sub-connection structure are plugged into each other to connect the housings of two adjacent wafer transport boxes.
8. The wafer transport device according to any one of claims 1 to 7, characterized in that, The wafer transport equipment also includes a leveling detection device, which is used to detect whether the moving mechanisms of two adjacent wafer transport boxes are leveled and aligned.
9. The wafer transport equipment according to any one of claims 1 to 7, characterized in that, The moving mechanism includes a first guide and a first driving mechanism. The first guide extends horizontally, and the first guides of two adjacent wafer transport boxes are connected. The first driving mechanism is driven to the wafer transport device, and the wafer transport device is slidably connected to the first guide. The first driving mechanism is used to drive the wafer transport device to move horizontally along the first guide.
10. The wafer transport device according to any one of claims 1 to 7, characterized in that, The wafer transport device includes a wafer loading and unloading device and a lifting mechanism, wherein the lifting mechanism and the moving mechanism are slidably connected, and the wafer loading and unloading device and the lifting mechanism are slidably connected. The lifting mechanism is used to move the wafer loading and unloading device vertically, and the moving mechanism is used to move the lifting mechanism horizontally within the at least two wafer transport boxes to realize the wafer transport. The wafer loading and unloading device is used to perform the wafer loading and unloading operations.
11. A wafer aging test system, characterized in that, Includes the wafer transport equipment as described in any one of claims 1 to 10.