Semiconductor process equipment

Abstract

The utility model provides semiconductor process equipment, which comprises a process box body and a loading and unloading box body positioned below the process box body, and further comprises a first box body for accommodating a controller, a second box body for accommodating an exhaust device and a third box body for accommodating an air inlet device, the second box body, the third box body and the loading and unloading box body are sequentially arranged in the first horizontal direction. The orthographic projections of the second box body and the first box body on the horizontal plane are arranged in the second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a semiconductor process apparatus. Background Technology

[0002] In the field of integrated circuit manufacturing, semiconductor vertical furnaces, especially low-pressure chemical vapor deposition (LPCVD) vertical furnaces, are key equipment in the front-end processes of wafer fabrication. These furnaces are primarily used for critical process steps such as silicon oxide, polysilicon, and silicon nitride (SiN), and are crucial for forming the key structures and functional layers in integrated circuits. As device linewidths continue to shrink and semiconductor process technology continues to innovate, higher demands are being placed on equipment performance for indicators such as wafer film thickness uniformity and particle level.

[0003] Existing vertical furnace equipment mainly includes a process box housing the process chamber, a loading / unloading box (LA) located below the process box, and an exhaust box, an inlet box, and a controller box arranged sequentially along a horizontal direction away from the loading / unloading box. The controller box houses the controller, which includes storage components and control components such as temperature control and vacuum control for machine operation. The inlet box houses the inlet device, whose piping connects to the process chamber to meet process gas supply requirements. The exhaust box houses the exhaust device, whose piping extends from the top of the exhaust box into the process box and connects to the exhaust port of the process chamber for rapid discharge of residual gas from the process chamber.

[0004] However, the existing vertical furnace equipment has an unreasonable layout of the exhaust box, air inlet box and controller box, which not only increases the overall length of the machine and occupies a lot of space, thus limiting the space utilization efficiency of the equipment; but may also lead to high internal air resistance in the air inlet pipe and pose a risk of leakage. Utility Model Content

[0005] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor process equipment that can solve the problems of increased machine length, large space occupation, and leakage risk of the air intake device pipeline in the prior art.

[0006] To achieve the purpose of this application, a semiconductor process apparatus is provided, including a process enclosure and a loading / unloading enclosure located below the process enclosure, further including a first enclosure for housing a controller, a second enclosure for housing an exhaust device, and a third enclosure for housing an intake device, wherein:

[0007] The second box, the third box, and the loading / unloading box are arranged sequentially along the first horizontal direction;

[0008] The second box and the first box are arranged along a second horizontal direction on the horizontal plane, and the second horizontal direction is perpendicular to the first horizontal direction.

[0009] In some embodiments, the semiconductor process equipment further includes a transition enclosure; the transition enclosure is located above the second enclosure and the third enclosure, and the transition enclosure and the process enclosure are arranged along the first horizontal direction; the transition enclosure and the first enclosure are arranged along the second horizontal direction;

[0010] The pipes in the exhaust device and the pipes in the intake device both pass through the transition box and connect to the process chamber in the process box.

[0011] In some embodiments, the transition housing has a first sidewall adjacent to the process housing, the first sidewall having a first opening, and a pipe in the air intake device extending through the first opening to the outside of the transition housing and connecting to the process chamber in the process housing.

[0012] The transition box also has a second side wall adjacent to the first box, and a second opening is provided on the second side wall. The pipe in the exhaust device extends through the second opening to the outside of the transition box and is connected to the process chamber in the process box.

[0013] In some embodiments, the pipes in the exhaust device and the pipes in the intake device are arranged side by side in the second horizontal direction.

[0014] In some embodiments, the semiconductor process equipment further includes a fourth housing for a accommodating valve control device, the fourth housing being located below the first housing, and the fourth housing and the second housing being arranged along the second horizontal direction.

[0015] In some embodiments, the first housing is located above the second housing.

[0016] In some embodiments, there are two process boxes, two first boxes, and two transition boxes.

[0017] The semiconductor process equipment further includes a first maintenance space, with two process enclosures located side-by-side on one side of the first maintenance space in the first horizontal direction; two first enclosures located side-by-side on the other side of the first maintenance space in the first horizontal direction; and two transition enclosures symmetrically located on both sides of the first maintenance space in the second horizontal direction.

[0018] In some embodiments, there are two loading / unloading boxes, two second boxes, three third boxes, and two fourth boxes.

[0019] The semiconductor process equipment further includes a second maintenance space located below the first maintenance space and interconnected with it; two loading and unloading boxes are arranged side by side and located below the two process boxes respectively, and located on one side of the second maintenance space in the first horizontal direction; two fourth boxes are arranged side by side on the other side of the second maintenance space in the first horizontal direction; two third boxes are symmetrically located on both sides of the second maintenance space in the second horizontal direction; and two fourth boxes are symmetrically located on both sides of the second maintenance space in the second horizontal direction.

[0020] In some embodiments, the two first housings are interconnected.

[0021] In some embodiments, the semiconductor process equipment further includes a wafer transport box and a wafer storage box, wherein the wafer transport box is located on the side of the loading / unloading box away from the third box; and the wafer storage box is located on the side of the wafer transport box away from the loading / unloading box.

[0022] The wafer transfer box is equipped with a robotic arm, which is used to transfer wafers between the wafer storage box and the loading / unloading box.

[0023] This application has the following beneficial effects:

[0024] The semiconductor process equipment provided in this application, based on the sequential arrangement of a second housing for accommodating the exhaust device, a third housing for accommodating the intake device, and a loading / unloading housing along a first horizontal direction, can shorten the overall length of the machine, improve the rationality of the machine layout, and reduce the space occupied by arranging the orthographic projections of the second housing and the first housing for accommodating the controller along a second horizontal direction. Furthermore, by placing the third housing closer to the process housing than the second housing, the pipe length and number of interfaces of the intake device can be further reduced, thereby reducing internal air resistance and further lowering the risk of leakage. Attached Figure Description

[0025] Figure 1 A top-view layout diagram of the semiconductor process equipment provided in an embodiment of this application;

[0026] Figure 2 A layout diagram of a semiconductor process apparatus provided in an embodiment of this application in the first horizontal direction;

[0027] Figure 3A partial cross-sectional view of a semiconductor process apparatus provided in an embodiment of this application, viewed from above.

[0028] Figure 4 A partial perspective view of the semiconductor process equipment provided in the embodiments of this application on the maintenance space side;

[0029] Figure 5 A layout diagram of a semiconductor process apparatus provided in an embodiment of this application in the second horizontal direction;

[0030] Figure 6 A partial perspective view of the semiconductor process equipment provided in the embodiments of this application, excluding the first housing;

[0031] Figure 7 A partial perspective view of the semiconductor process apparatus provided in the embodiments of this application, excluding the first housing and the transition housing on one side. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solutions of this application, the semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings.

[0033] Related technology provides a vertical furnace device, which mainly includes a process box containing a process chamber, a loading and unloading box located below the process box, and an exhaust box, an inlet box, and a controller box arranged sequentially in a horizontal direction away from the loading and unloading box. The controller box contains a controller, which includes storage components and control components such as temperature control and vacuum control for controlling the machine operation. The inlet box contains an inlet device whose pipeline is connected to the process chamber to meet the process gas supply requirements. The exhaust box contains an exhaust device whose pipeline extends from the top of the exhaust box into the process box and connects to the exhaust port of the process chamber for quickly discharging residual gas from the process chamber.

[0034] Because the exhaust box, intake box, and controller box of the related technology are arranged sequentially along a horizontal direction away from the loading and unloading box, the overall length of the machine increases, occupying a large space and thus limiting the space utilization efficiency of the equipment. Furthermore, the intake device's piping is far from the process chamber, resulting in high internal air resistance and a risk of leakage. Additionally, the exhaust and intake device piping are prone to mutual interference during maintenance, leading to poor maintainability.

[0035] To resolve at least one of the aforementioned technical issues, please refer to the following: Figures 1 to 7This application provides a semiconductor process equipment 100, which is applied, for example, to a semiconductor vertical furnace, especially a low-pressure chemical vapor deposition (LPCVD) vertical furnace.

[0036] Semiconductor process equipment 100 includes a process enclosure 1 and a load area (LA) 2. The process enclosure 1 houses a process chamber 11, such as the space defined by the furnace tubes of a vertical furnace, providing process space. The load area 2, located below the process enclosure 1, houses a boat lifting mechanism 21. This mechanism allows the wafer carrier 22 to be raised to the process position within the process chamber 11 or lowered to the loading position within the load area 2. The wafer carrier 22 is used for loading and transporting wafers. When the wafer carrier 22 is in the process position, the wafer is processed within the process chamber 11; when the wafer carrier 22 is in the loading position, wafers can be loaded and unloaded within the load area 2. The load area 2 provides a well-sealed, oxygen-controlled, and highly clean environment, ensuring no particulate contamination or byproducts on the wafer surface before and after processing.

[0037] Based on this, the semiconductor process equipment 100 also includes a first housing 3 for housing the controller 31, a second housing 4 for housing the exhaust device 41, and a third housing 5 for housing the intake device 51. The controller 31 includes, but is not limited to, storage components and control components, for implementing the control operations of the machine and meeting the motion control requirements of the machine during operation. The control components include, for example, a temperature control module 311 for controlling the temperature of the process chamber 11, a vacuum module 312 for controlling the vacuum level of the process chamber 11, and a main control box 313, etc. However, the embodiments of this application are not limited to this; in practical applications, corresponding functional modules can be added or removed according to specific needs.

[0038] In some embodiments, the exhaust device 41 includes, but is not limited to, an exhaust pipe 411 and a flow control valve (not shown) disposed on the exhaust pipe 411. One end of the exhaust pipe 411 extends to the outside of the second housing 4 and into the interior of the process housing 1, and is sealed to the exhaust port of the process chamber 11. In some embodiments, the exhaust port of the process chamber 11 is, for example, disposed at... Figure 2 and Figure 4The chamber sidewall shown is illustrated in this case, where the exhaust pipe 411 is connected to its exhaust port on one side of the chamber sidewall of the process chamber 11. Of course, this embodiment is not limited to this; in practical applications, the exhaust port can also be located at the top of the process chamber 11, or exhaust ports can be located at both the top and the sidewall of the process chamber 11. The other end of the exhaust pipe 411 is used to connect to a plant exhaust system (not shown) for quickly discharging residual gas from the process chamber 11. A flow control valve installed on the exhaust pipe 411 is used to control the pressure in the process chamber 11.

[0039] In some embodiments, the air intake device 51 includes, for example, at least one air intake pipe 511 and a flow controller (e.g., MFC), on / off switch, etc., disposed on each air intake pipe 511. One end of each air intake pipe 511 extends to the outside of the third housing 5 and into the interior of the process housing 1, and is sealed to the air inlet of the process chamber 11. In some embodiments, the air inlet of the process chamber 11 is disposed, for example, at a location such as... Figure 2 and Figure 4 The chamber sidewall shown is illustrated in this case, where the exhaust pipe 411 is connected to its exhaust port on one side of the chamber sidewall of the process chamber 11. Of course, this embodiment is not limited to this; in practical applications, the aforementioned air inlet can also be located at the top of the process chamber 11, or air inlets can be located at both the top and the sidewall of the process chamber 11. Furthermore, one of the exhaust port and the air inlet can be located at the top of the process chamber 11 and the other at the bottom, or both can be located at the top or bottom of the process chamber 11. The other end of each air inlet pipe 511 is used to connect to the plant gas supply system, and a flow controller is used to control the flow rate of the corresponding air inlet pipe 511 to meet the process gas requirements.

[0040] The second housing 4, the third housing 5, and the loading / unloading housing 2 are arranged sequentially along the first horizontal direction X1, that is, the third housing 5 is located between the second housing 4 and the loading / unloading housing 2. The second housing 4, the third housing 5, and the loading / unloading housing 2 can be fixedly connected together by fasteners (e.g., screws).

[0041] The second housing 4 and the first housing 3 are arranged along a second horizontal direction X2 on the horizontal plane, which is perpendicular to the first horizontal direction X1. In other words, the arrangement direction of the orthographic projections of the first housing 3 and the second housing 4 on the horizontal plane is perpendicular to the arrangement direction of the orthographic projections of the second housing 4, the third housing 5, and the loading / unloading housing 2 on the horizontal plane. This allows the first housing 3 to not occupy space on the machine tool in the first horizontal direction X1, thus not increasing the machine tool length. Compared to existing technologies, this shortens the overall length of the machine tool, improves the rationality of the machine tool layout, and further reduces the space occupied.

[0042] It should be noted that the first box 3 and the second box 4 can be located at different heights in the vertical direction, for example, as Figure 1 As shown, the orthographic projection of the first box 3 on the horizontal plane is arranged side by side with the second box 4, and as... Figure 3 As shown, the first box 3 and the second box 4 are also arranged side by side in their orthographic projections on the vertical plane. Specifically, the first box 3 is located above the second box 4.

[0043] Furthermore, in existing technologies, intake pipes typically require a long path to connect to the process chamber, necessitating more interfaces to complete complex piping connections. To address this, this embodiment of the application significantly shortens the length of the intake pipe 511 by positioning the third housing 5 between the second housing 4 and the loading / unloading housing 2; that is, the third housing 5 is closer to the process housing 1 than the second housing 4. The shorter pipe path not only reduces internal air resistance but also facilitates the use of more direct connection methods to reduce the required number of interfaces. Reducing the number of interfaces simplifies pipe layout, further reducing the risk of leakage. This is because interfaces are the most vulnerable points for leakage in a piping system; a reduced number of interfaces means fewer leakage points, thereby improving system reliability and safety.

[0044] Based on this, since the exhaust process requires handling a large volume of gas and quickly expelling residual gas from the chamber, the exhaust device 41's piping is larger in diameter and heavier than the intake device 51. This necessitates more space and greater ease of operation for maintenance of the exhaust device 41's piping. Furthermore, the intake device 51 typically requires high sealing and precise flow control, resulting in a relatively compact and complex layout. If the exhaust pipe 411 and intake pipe 511 are too close, maintenance of the exhaust pipe 411 may accidentally bump or damage the intake pipe 511, affecting the normal operation of the intake device 51. To avoid this, in this embodiment, the second housing 4 for accommodating the exhaust device 41 is positioned on the side of the third housing 5 furthest from the loading / unloading housing 2. This not only effectively prevents interference with the intake device 51 during exhaust device 41 maintenance, thus improving maintenance performance, but also allows for efficient use of the machine space, enhancing the overall space utilization efficiency of the equipment.

[0045] In some embodiments, the semiconductor process equipment provided in this application further includes a transition enclosure 6, which is located at least above the third enclosure 5 and adjacent to the process enclosure 1. In some examples, such as Figure 2 As shown, the transition box 6 is located above the second box 4 and the third box 5, and the transition box 6 and the process box 1 are arranged along the first horizontal direction X1; as Figure 1As shown, the transition box 6 and the first box 3 are arranged along the second horizontal direction X2. In some examples, such as... Figure 4 As shown, a portion of the second housing 4 is higher than the third housing 5. In this case, the transition housing 6 is located above the second housing 4 and the third housing 5, and the bottom wall of the transition housing 6 is stepped so as to be supported by the top walls of the second housing 4 and the third housing 5 respectively.

[0046] Furthermore, the pipes in the exhaust device 41 (i.e., exhaust pipe 411) and the pipes in the intake device 51 (i.e., intake pipe 511) both pass through the transition housing 6 and connect to the process chamber 11 in the process housing 1. Specifically, in some examples, such as Figure 4 As shown, the pipe in the exhaust device 41 (e.g., exhaust pipe 411) can extend from the top of the second housing 4 and into the interior of the transition housing 6 from the bottom. Similarly, the pipe in the intake device 51 (i.e., intake pipe 511) can extend from the top of the third housing 5 and into the interior of the transition housing 6 from the bottom.

[0047] By adding a transition box 6 above the second box 4 and the third box 5, and ensuring that the pipes in the exhaust device 41 and the intake device 51 both pass through the transition box 6 to connect with the process box 1, the pipeline layout is centralized and standardized. The transition box 6 not only provides a stable installation foundation for the pipelines, ensuring their stability during operation, but also, through a reasonable internal structural design, further reduces the number of bends and joints in the pipelines, thereby reducing wind resistance and leakage risks. Furthermore, the transition box 6 facilitates centralized maintenance and inspection of the pipelines, improving maintenance efficiency and equipment reliability.

[0048] In some embodiments, such as Figure 4 , Figure 6 and Figure 7As shown, the transition housing 6 has a first sidewall 61 adjacent to the process housing 1, and a second sidewall (not shown) adjacent to the first housing 3. A first opening 611 is provided on the first sidewall 61, through which the pipe of the air intake device 51 extends to the outside of the transition housing 6 and connects to the process chamber 11 in the process housing 1. A second opening is provided on the second sidewall, through which the pipe of the exhaust device 41 extends to the outside of the transition housing 6 and connects to the process chamber 11 in the process housing 1. This allows the transition housing 6 to effectively connect the pipes of the air intake device 51 and the exhaust device 41 to the process chamber 11 in the process housing 1, while also providing great convenience for maintenance operations. Specifically, the first opening 611 is provided on the first sidewall 61 of the transition housing 6, through which the pipe of the air intake device 51 extends to the outside of the transition housing 6 and connects to the process chamber 11 in the process housing 1. This design ensures the shortest and most direct path for the intake pipe 511, reducing wind resistance and leakage risks during gas transmission. Since the exhaust pipe 411 is typically large in diameter and heavy, the design of the open side of the transition housing 6 adjacent to the first housing 3 fully considers the physical characteristics of the exhaust pipe 411, providing sufficient space and ease of operation, facilitating inspection and maintenance by maintenance personnel. Therefore, the transition housing 6 not only achieves a reasonable route for the intake and exhaust pipes 411, but also further optimizes space utilization and maintenance convenience by leading the intake and exhaust pipes out from different side walls. Furthermore, in a specific embodiment, the aforementioned second side wall is a protective plate detachably connected to the transition housing 6. This protective plate can be an irregularly shaped plate, used not only to cover the portion of the exhaust pipe 411 located within the transition housing 6, but also to cover the portion of the exhaust pipe 411 that passes through the first side wall 617 and extends outside the transition housing 6, thereby protecting the entire exhaust pipe 411. Additionally, the protective plate can be removed when maintenance is required on the piping of the intake device 51 and the exhaust device 41.

[0049] In some embodiments, such as Figure 4 As shown, the pipes in the exhaust device 41 (i.e., exhaust pipe 411) and the pipes in the intake device 51 (i.e., intake pipe 511) are arranged side by side in the second horizontal direction X2. This side-by-side arrangement allows for a more compact pipe layout, reducing the overall size of the equipment. Furthermore, the side-by-side arrangement makes the paths of the intake pipe 511 and exhaust pipe 411 more direct, reducing unnecessary bends and branches, thereby significantly shortening the pipe length.

[0050] In some embodiments, such as Figure 5As shown, the semiconductor process equipment 100 also includes a fourth housing 8 for accommodating valve control devices. The fourth housing 8 is located below the first housing 3, and the fourth housing 8 and the second housing 4 are arranged along a second horizontal direction X2. The valve control device includes, for example, a valve island control module, which is an integrated unit composed of multiple pneumatic control valves. It is mainly used to centrally manage the dispersed pneumatic control valves and realize coordinated control of the entire pneumatic system.

[0051] In traditional equipment layouts, valve control devices are typically housed in the same enclosure as the controller. While this centralized layout facilitates centralized management, it can result in a larger overall machine size, particularly in the vertical direction, increasing the equipment's footprint and space requirements. Furthermore, a centralized layout can make maintenance less convenient, as maintenance personnel need to operate multiple functional modules within a relatively compact space. To address this, this application places the valve control device separately in a fourth enclosure 8, positioned below the first enclosure 3, and arranged with the second enclosure 4 along a second horizontal direction X2, achieving a distributed distribution of the control modules. This layout not only optimizes space utilization but also further reduces the overall size of the machine, making the equipment more compact and reducing its footprint. Simultaneously, the separation of the valve control device from the controller enclosure 31 allows maintenance personnel to operate the control modules and valve control device separately, significantly improving maintenance convenience and efficiency. This layered arrangement facilitates quick location and troubleshooting for maintenance personnel, further enhancing the equipment's maintainability.

[0052] Furthermore, in some embodiments, such as Figure 5 As shown, the first housing 3 is located above the second housing 4. This increases the vertical distance between the first housing 3 and the fourth housing 8, creating an entrance / exit between them for accessing the maintenance space (i.e., the first maintenance space 7a and the second maintenance space 7b described later), thus facilitating maintenance operations. Preferably, as... Figure 6 As shown, the bottom of the fourth box 8 is aligned with the bottom of the second box 4, which further increases the vertical distance between the first box 3 and the fourth box 8.

[0053] In some embodiments, the semiconductor process equipment 100 provided in this application adopts a dual-chamber layout structure. Specifically, there are two process housings 1, first housing 3, and transition housing 6, all arranged in pairs to meet the requirements of dual-chamber processes. In this case, for ease of layout, such as Figures 5 to 7As shown, the semiconductor process equipment also includes a first maintenance space 7a, with two process enclosures 1 arranged side-by-side on one side of the first maintenance space 7a in a first horizontal direction X1; two first enclosures 3 arranged side-by-side on the other side of the first maintenance space 7a in the first horizontal direction X1; and two transition enclosures 6 symmetrically located on both sides of the first maintenance space 7a in a second horizontal direction X2. In a specific embodiment, the two process enclosures (1A, 1B) are symmetrically arranged with respect to the first maintenance space 7a and parallel to the central axis of the first horizontal direction X1. The two process chambers 11 can perform independent process operations simultaneously, significantly improving the production efficiency of the equipment.

[0054] By arranging the two first enclosures (3A, 3B) side-by-side along the second horizontal direction X2, the space along the second horizontal direction X2 of the equipment can be fully utilized. This compact layout reduces the overall size of the equipment, especially in the first horizontal direction X1, making the equipment more compact and reducing the floor space required. Furthermore, maintenance personnel can directly operate and maintain the controllers 31 within the two first enclosures 3 from within the first maintenance space 7a, facilitating quick access to relevant components for troubleshooting and repair, further improving the maintainability of the equipment. Additionally, arranging the two first enclosures (3A, 3B) side-by-side along the second horizontal direction X2 also reduces cabling length, allowing for shorter connections of control lines to other enclosures and components. Shorter cabling not only reduces signal transmission delay and interference but also improves the operating efficiency and stability of the equipment. Shorter cabling paths also reduce signal attenuation and noise interference during transmission, improving signal integrity and reliability.

[0055] Furthermore, in some embodiments, the two first enclosures 3 are interconnected. This allows for optimization of the electrical wiring and signal transmission paths between the two first enclosures 3, thereby greatly simplifying the wiring layout and helping to reduce the length and number of cables. In addition, the interconnection design between the two first enclosures 3 provides a basis for redundancy design and fault switching. Similarly, in some embodiments, the two fourth enclosures 4 can also be interconnected.

[0056] Furthermore, in some embodiments, there are two loading / unloading boxes 2, 4, 5, and 8. In this case, for ease of layout, such as... Figures 5 to 7As shown, the semiconductor process equipment also includes a second maintenance space 7b, which is located below the first maintenance space 7a and is interconnected; two loading and unloading boxes 2 are arranged side by side and located below the two process boxes 1 respectively, and are located on one side of the second maintenance space 7b in the first horizontal direction X1; two fourth boxes (8A, 8B) are arranged side by side on the other side of the second maintenance space 7b in the first horizontal direction X1; two third boxes (5A, 5B) are symmetrically located on both sides of the second maintenance space 7b in the second horizontal direction X2; and two fourth boxes 8 are symmetrically located on both sides of the second maintenance space 7b in the second horizontal direction X2.

[0057] In one specific embodiment, two loading / unloading boxes 2 are respectively located below two process boxes (1A, 1B), symmetrically arranged with respect to the second maintenance space 7b and parallel to the central axis of the first horizontal direction X1, and for example, arranged side by side in the second horizontal direction X2. The boat lifting mechanism 21 in each loading / unloading box 2 raises the two wafer boats 22 to the corresponding process position in the process chamber 11, or lowers them to the loading position in the loading / unloading box 2. Two second boxes (4A, 4B) are arranged on both sides of the second maintenance space 7b, and symmetrically arranged with respect to the second maintenance space 7b and parallel to the central axis of the first horizontal direction X1; the exhaust device 41 in the two second boxes (4A, 4B) is used to quickly exhaust the residual gas in the process chamber 11 of the two process boxes (1A, 1B). Two third housings (5A, 5B) are disposed on both sides of the second maintenance space 7b and are symmetrically arranged with respect to the second maintenance space 7b and parallel to the central axis of the first horizontal direction X1. The air intake devices 51 in the two third housings (5A, 5B) are used to supply process gas to the process chambers 11 in the two process housings (1A, 1B), respectively. Two transition housings (6A, 6B) are disposed on both sides of the second maintenance space 7b and are symmetrically arranged with respect to the second maintenance space 7b and parallel to the central axis of the first horizontal direction X1. The pipes in the exhaust device 41 and the air intake devices 51 both pass through the transition housing 6 on the same side and connect to the process housing 1.

[0058] The aforementioned layout allows each enclosure to surround the first maintenance space 7a and the second maintenance space 7b, optimizing space utilization and significantly improving maintenance convenience. Maintenance personnel can efficiently perform centralized maintenance and inspection of components within each enclosure within the first and second maintenance spaces 7a and 7b, eliminating the need for frequent movement between different areas of the equipment and thus significantly improving maintenance efficiency. Simultaneously, this layout reduces potential interference with equipment operation caused by maintenance, further enhancing the equipment's reliability and stability. Furthermore, this layout facilitates rapid location and repair of pipelines and components during maintenance, ensuring quick resumption of operation and reducing downtime. This, in turn, improves overall equipment performance and provides strong support for long-term stable operation.

[0059] In some embodiments, the semiconductor process equipment 100 further includes a wafer transfer box 9 and a wafer storage box 10. The wafer transfer box 9 is located on the side of the loading and unloading box 2 away from the third box 5, that is, the wafer transfer box 9 and the third box 5 are located on opposite sides of the loading and unloading box 2 in the first horizontal direction X1. The wafer storage box 10 is located on the side of the wafer transfer box 9 away from the loading and unloading box 2. A robot arm 91 is provided in the wafer transfer box 9, and the robot arm 91 is used to transfer wafers between the wafer storage box 10 and the loading and unloading box 2. In some embodiments, the wafer storage box 10 is provided with a shelf 101 for storing wafers (placed in wafer cassettes 103) and a loading stage 102 for loading and unloading wafers. A wafer transfer port and a wafer transfer door 104 for closing the wafer transfer port are provided between the wafer storage box 10 and the wafer transfer box 9. When the wafer transfer door 104 is open, the robot arm 91 can transfer wafers between the wafer cassette 103 located on the loading stage 102 and the wafer carrier boat 22 located in the loading and unloading box 2 via the wafer transfer port. The wafer cassette 103 is, for example, a front-opening unified pod (FOUP).

[0060] In some embodiments, a maintenance door 71 is provided on the side wall of the loading box 2 facing the first maintenance space 7a and the second maintenance space 7b. The maintenance door 71 is used by maintenance personnel to open it to maintain the moving parts inside the loading box 2.

[0061] In summary, the semiconductor process equipment 100 provided in this application embodiment, based on the sequential arrangement of the second housing 4 for accommodating the exhaust device 41, the third housing 5 for accommodating the intake device 51, and the loading / unloading housing 2 along the first horizontal direction X1, can shorten the overall length of the machine, improve the rationality of the machine layout, and reduce the space occupied by using the orthographic projection of the first housing 3 and the second housing 4 on the horizontal plane arranged along the second horizontal direction X2. Moreover, by making the third housing 5 closer to the process housing 1 than the second housing 4, the pipe length and number of interfaces of the intake device 51 can be further reduced, thereby reducing the risk of leakage while reducing the internal air resistance of the pipe.

[0062] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. A semiconductor process apparatus, comprising a process enclosure and a loading / unloading enclosure located below the process enclosure, characterized in that, It also includes a first housing for housing the controller, a second housing for housing the exhaust device, and a third housing for housing the intake device, wherein: The second box, the third box, and the loading / unloading box are arranged sequentially along the first horizontal direction; The second box and the first box are arranged along a second horizontal direction on the horizontal plane, and the second horizontal direction is perpendicular to the first horizontal direction.

2. The semiconductor process equipment according to claim 1, characterized in that, The semiconductor process equipment further includes a transition box; the transition box is located above the second box and the third box, and the transition box and the process box are arranged along the first horizontal direction; the transition box and the first box are arranged along the second horizontal direction; The pipes in the exhaust device and the pipes in the intake device both pass through the transition box and connect to the process chamber in the process box.

3. The semiconductor process equipment according to claim 2, characterized in that, The transition box has a first sidewall adjacent to the process box, and a first opening is provided on the first sidewall. The pipe in the air intake device extends through the first opening to the outside of the transition box and is connected to the process chamber in the process box. The transition box also has a second side wall adjacent to the first box, and a second opening is provided on the second side wall. The pipe in the exhaust device extends through the second opening to the outside of the transition box and is connected to the process chamber in the process box.

4. The semiconductor process equipment according to any one of claims 1-3, characterized in that, The pipes in the exhaust device and the pipes in the intake device are arranged side by side in the second horizontal direction.

5. The semiconductor process equipment according to claim 2, characterized in that, The semiconductor process equipment also includes a fourth housing for a accommodating valve control device, the fourth housing being located below the first housing, and the fourth housing and the second housing being arranged along the second horizontal direction.

6. The semiconductor process equipment according to claim 5, characterized in that, The first box is located above the second box.

7. The semiconductor process equipment according to claim 5, characterized in that, There are two of each of the following: the process box, the first box, and the transition box; The semiconductor process equipment further includes a first maintenance space, with two process enclosures located side-by-side on one side of the first maintenance space in the first horizontal direction; two first enclosures located side-by-side on the other side of the first maintenance space in the first horizontal direction; and two transition enclosures symmetrically located on both sides of the first maintenance space in the second horizontal direction.

8. The semiconductor process equipment according to claim 7, characterized in that, There are two loading / unloading boxes, two second boxes, three third boxes, and four fourth boxes; The semiconductor process equipment further includes a second maintenance space located below the first maintenance space and interconnected with it; two loading and unloading boxes are arranged side by side and located below the two process boxes respectively, and located on one side of the second maintenance space in the first horizontal direction; two fourth boxes are arranged side by side on the other side of the second maintenance space in the first horizontal direction; two third boxes are symmetrically located on both sides of the second maintenance space in the second horizontal direction; and two fourth boxes are symmetrically located on both sides of the second maintenance space in the second horizontal direction.

9. The semiconductor process equipment according to claim 7, characterized in that, The two first boxes are interconnected.

10. The semiconductor process equipment according to claim 1, characterized in that, The semiconductor process equipment further includes a wafer transport box and a wafer storage box, wherein the wafer transport box is located on the side of the loading and unloading box away from the third box; and the wafer storage box is located on the side of the wafer transport box away from the loading and unloading box. The wafer transfer box is equipped with a robotic arm, which is used to transfer wafers between the wafer storage box and the loading / unloading box.

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