Wafer film deposition jig

Abstract

The utility model discloses a wafer film deposition jig, which belongs to the technical field of wafer film deposition and is characterized by comprising a connecting component, a placing component, a deposition box and a sealing door, the connecting component is arranged on the rear side of the deposition box, the placing component is arranged in the deposition box, and the sealing door is arranged in the deposition box. The sealing door is movably connected to the front side of the deposition box, through the arrangement of the connecting assembly, the effect of injecting reaction gas into the deposition box can be achieved through the connecting assembly, the effect of monitoring the temperature in the deposition box in real time can also be achieved, and through the arrangement of the placing assembly, the temperature in the deposition box can be monitored in real time. The placing assembly can achieve the effect of conveniently replacing a placing seat matched with a wafer in size, so that the adaptability of the device is improved, and the problems that most of existing traditional wafer thin film deposition jigs are of a disc-shaped structure, the size of grooves in the jigs is single, the jigs can only be matched with wafers of one size, replacement is difficult, and the like are solved. Therefore, the problem of low use adaptability is solved.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer thin film deposition, and in particular to a wafer thin film deposition fixture. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer. Domestic wafer production lines are mainly 8-inch and 12-inch.

[0003] Existing traditional wafer thin film deposition fixtures are mostly disk-shaped structures with uniform groove sizes, which can only be matched with wafers of one size and are difficult to replace, resulting in low adaptability.

[0004] To address this, a wafer thin film deposition fixture is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a wafer thin film deposition fixture that can solve the problem that most existing traditional wafer thin film deposition fixtures are disk-shaped structures with uniform groove sizes, which can only match wafers of one size and are difficult to replace, resulting in low adaptability.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer thin film deposition fixture, comprising a connecting assembly, a placement assembly, a deposition chamber, and a sealing door, wherein the connecting assembly is disposed on the rear side of the deposition chamber, the placement assembly is disposed inside the deposition chamber, and the sealing door is movably connected to the front side of the deposition chamber;

[0007] The connection assembly includes a connector, a valve body, a connecting pipe, and a temperature sensor. The connector is fixedly connected to the rear side of the valve body, the valve body is fixedly connected to the rear side of the connecting pipe, the connecting pipe is fixedly connected to the rear side of the deposition tank, and the temperature sensor is fixedly connected to the left side of the deposition tank.

[0008] Preferably, the placement assembly includes a placement box, which is movably connected to the interior of the deposition tank. Sliding strips are fixedly connected to both sides of the placement box, a fixing plate is fixedly connected to the interior of the placement box, and a heating plate is fixedly connected to the top of the fixing plate.

[0009] Preferably, a connecting seat is fixedly connected to the inner wall of the placement box, a retaining ring is snapped into the top of the connecting seat, and a lifting block is fixedly connected to the top of the retaining ring.

[0010] Preferably, a support rod is fixedly connected to the inner wall of the retaining ring, and a placement seat is fixedly connected to the inner side of the support rod.

[0011] Preferably, the top of the connector has a slot, and the inner wall of the slot engages with the surface of the retaining ring.

[0012] Preferably, the sedimentation tank has grooves on both sides inside, and the inner wall of the grooves is slidably connected to the surface of the slide bar.

[0013] Preferably, a fixing hole is provided on the left side of the deposition box, and the inner wall of the fixing hole is fixedly connected to the surface of the temperature sensor.

[0014] Preferably, a connection hole is provided on the rear side of the sedimentation tank, and the inner wall of the connection hole is fixedly connected to the surface of the connecting pipe.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. In this application, by setting up the connecting component, the connecting component can achieve the effect of injecting reactive gas into the deposition box, and can also achieve the effect of real-time monitoring of the temperature inside the deposition box;

[0017] 2. In this application, by setting up the placement components, the placement components can be easily replaced with placement bases that are compatible with wafer sizes, thereby increasing the adaptability of the device. Attached Figure Description

[0018] Figure 1 This is an overall structural diagram of the wafer thin film deposition fixture of this utility model;

[0019] Figure 2 This is a three-dimensional schematic diagram of the connecting component and the placement component of this utility model;

[0020] Figure 3 This is a three-dimensional schematic diagram of the connecting component of this utility model;

[0021] Figure 4 This is a schematic diagram showing the connection of the components of this utility model;

[0022] Figure 5 This is a three-dimensional schematic diagram of the slide, fixing hole and connecting hole of this utility model.

[0023] In the diagram, 1. Connecting assembly; 101. Connector; 102. Valve body; 103. Connecting pipe; 104. Temperature sensor; 2. Placement assembly; 201. Placement box; 202. Sliding bar; 203. Fixing plate; 204. Heating plate; 205. Connecting seat; 206. Snap ring; 207. Lifting block; 208. Support rod; 209. Placement seat; 3. Sedimentation tank; 4. Sealing door; 5. Slot; 6. Slide groove; 7. Fixing hole; 8. Connecting hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-5 The present invention provides the following technical solution:

[0026] A wafer thin film deposition fixture includes a connecting component 1, a placement component 2, a deposition chamber 3, and a sealing door 4. The connecting component 1 is disposed on the rear side of the deposition chamber 3, the placement component 2 is disposed inside the deposition chamber 3, and the sealing door 4 is movably connected to the front side of the deposition chamber 3.

[0027] The connection assembly 1 includes a connector 101, a valve body 102, a connecting pipe 103, and a temperature sensor 104. The connector 101 is fixedly connected to the rear side of the valve body 102, the valve body 102 is fixedly connected to the rear side of the connecting pipe 103, the connecting pipe 103 is fixedly connected to the rear side of the deposition tank 3, and the temperature sensor 104 is fixedly connected to the left side of the deposition tank 3.

[0028] In this embodiment: the connection component 1 enables the injection of reactive gas into the deposition chamber 3 and also allows for real-time monitoring of the temperature inside the deposition chamber 3. The placement component 2 facilitates the replacement of the wafer-sized placement holder 209, thereby increasing the adaptability of the device. The connector 101 enables the connection to external pipelines. The valve body 102 controls the opening and closing of the connecting pipe 103. The connecting pipe 103 also enables the injection of reactive gas into the deposition chamber 3. The temperature sensor 104, an existing device, enables real-time monitoring of the temperature inside the deposition chamber 3.

[0029] Specifically, such as Figure 4 As shown, the placement component 2 includes a placement box 201, which is movably connected inside the deposition tank 3. Sliding strips 202 are fixedly connected to both sides of the placement box 201, and a fixing plate 203 is fixedly connected inside the placement box 201. A heating plate 204 is fixedly connected to the top of the fixing plate 203.

[0030] Specifically, such as Figure 4As shown, a connecting seat 205 is fixedly connected to the inner wall of the placement box 201, a retaining ring 206 is snapped into the top of the connecting seat 205, and a lifting block 207 is fixedly connected to the top of the retaining ring 206.

[0031] Specifically, such as Figure 4 As shown, a support rod 208 is fixedly connected to the inner wall of the retaining ring 206, and a placement seat 209 is fixedly connected to the inner side of the support rod 208.

[0032] In this embodiment: The placement box 201 connects to the fixing plate 203, and its surface is made of a sealing material, thus separating the interior of the deposition tank 3 upon contact. The slide bar 202 supports the placement box 201. The fixing plate 203 connects to the heating plate 204. The heating plate 204 is a conventional electric heating device. The connecting seat 205 can engage the retaining ring 206, connect the support rod 208, and support the placement seat 209. The lifting block 207 facilitates the removal of the retaining ring 206 from the connecting seat 205. The placement seat 209 provides the necessary conditions for placing the wafer.

[0033] Specifically, such as Figure 4 As shown, the top of the connector 205 has a slot 5, and the inner wall of the slot 5 engages with the surface of the retaining ring 206.

[0034] Specifically, such as Figure 5 As shown, grooves 6 are provided on both sides inside the sedimentation box 3, and the inner wall of the grooves 6 is slidably connected to the surface of the slide bar 202.

[0035] In this embodiment: the slot 5 can achieve the effect of engaging the retaining ring 206, and the slide groove 6 can achieve the effect of sliding the slide bar 202.

[0036] Specifically, such as Figure 5 As shown, a fixing hole 7 is provided on the left side of the deposition box 3, and the inner wall of the fixing hole 7 is fixedly connected to the surface of the temperature sensor 104.

[0037] Specifically, such as Figure 5 As shown, a connection hole 8 is provided on the rear side of the sedimentation box 3, and the inner wall of the connection hole 8 is fixedly connected to the surface of the connection pipe 103.

[0038] In this embodiment: the fixing hole 7 can be used to connect the temperature sensor 104, and the connecting hole 8 can be used to connect the connecting pipe 103.

[0039] Working principle: First, select a suitable placement base 209 according to the wafer, and then place the wafer inside the placement base 209. Then, the retaining ring 206 can be engaged in the slot 5 on the connecting base 205. Then, the placement box 201 can be inserted into the sliding groove 6 through the sliding strip 202. Then, the sealing door 4 can be closed. Then, the heating plate 204 can be turned on, so that the heating plate 204 heats the internal space of the deposition chamber 3. Then, the temperature sensor 104 is turned on, so that the temperature inside the deposition chamber 3 can be monitored in real time. After the temperature inside the deposition chamber 3 reaches the required temperature, an external pipe is connected to the rear side of the connector 101. Then, the valve body 102 is opened, and the reaction gas is delivered into the inside of the deposition chamber 3 through the external pipe and the connecting pipe 103, so that the reaction gas reacts with the wafer and deposits, thereby forming a thin film on the wafer surface, thus completing the deposition process.

[0040] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer thin film deposition fixture, comprising a connection assembly (1), a placement assembly (2), a deposition chamber (3), and a sealing door (4), characterized in that: The connecting component (1) is located on the rear side of the sedimentation tank (3), the placement component (2) is located inside the sedimentation tank (3), and the sealing door (4) is movably connected to the front side of the sedimentation tank (3); The connection assembly (1) includes a connector (101), a valve body (102), a connecting pipe (103), and a temperature sensor (104). The connector (101) is fixedly connected to the rear side of the valve body (102), the valve body (102) is fixedly connected to the rear side of the connecting pipe (103), the connecting pipe (103) is fixedly connected to the rear side of the deposition tank (3), and the temperature sensor (104) is fixedly connected to the left side of the deposition tank (3).

2. The wafer thin film deposition fixture according to claim 1, characterized in that: The placement assembly (2) includes a placement box (201), which is movably connected to the inside of the deposition tank (3). Sliding strips (202) are fixedly connected to both sides of the placement box (201), and a fixing plate (203) is fixedly connected to the inside of the placement box (201). A heating plate (204) is fixedly connected to the top of the fixing plate (203).

3. The wafer thin film deposition fixture according to claim 2, characterized in that: The inner wall of the placement box (201) is fixedly connected to a connecting seat (205), and a retaining ring (206) is snapped into the top of the connecting seat (205). A lifting block (207) is fixedly connected to the top of the retaining ring (206).

4. A wafer thin film deposition fixture according to claim 3, characterized in that: The inner wall of the retaining ring (206) is fixedly connected to a support rod (208), and the inner side of the support rod (208) is fixedly connected to a placement seat (209).

5. A wafer thin film deposition fixture according to claim 3, characterized in that: The top of the connector (205) is provided with a slot (5), and the inner wall of the slot (5) is engaged with the surface of the retaining ring (206).

6. A wafer thin film deposition fixture according to claim 2, characterized in that: The sedimentation tank (3) has grooves (6) on both sides inside, and the inner wall of the grooves (6) is slidably connected to the surface of the slide bar (202).

7. A wafer thin film deposition fixture according to claim 1, characterized in that: A fixing hole (7) is provided on the left side of the deposition box (3), and the inner wall of the fixing hole (7) is fixedly connected to the surface of the temperature sensor (104).

8. A wafer thin film deposition fixture according to claim 1, characterized in that: The sedimentation tank (3) has a connection hole (8) on its rear side, and the inner wall of the connection hole (8) is fixedly connected to the surface of the connecting pipe (103).

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