Anodic oxidation hanger for chip cooling fin

Abstract

The utility model provides an anodizing hanger for a chip radiating fin, which comprises an anode beam rod, a radiating bottom plate is arranged on one side of the anode beam rod, a plurality of radiating fins are uniformly mounted on one side, deviating from the anode beam rod, of the radiating bottom plate, and conductive arm plates are mounted at two ends of the anode beam rod. A cylindrical head is installed at the end, away from the anode beam rod, of the conductive arm plate, a rod head obliquely arranged upwards is installed on the face, away from the conductive arm plate, of the cylindrical head, lug plates are installed at the four corners of the heat dissipation bottom plate, and fixing holes are formed in the ends, away from the heat dissipation bottom plate, of the lug plates. The two cylindrical heads are respectively inserted into corresponding fixing holes in the two lug plates, and a plurality of conductive sheets which are in contact with each other are arranged between the two conductive arm plates. The oxidation device has the following beneficial effects that a conductive contact area is adjusted as required, the uniformity of film thickness is improved, and the oxidation time is shortened.

Description

Technical Field

[0001] This utility model is an anodizing fixture for chip heat sinks, belonging to the field of chip heat sink processing. Background Technology

[0002] Chip heat sinks are critical components used to reduce chip operating temperature and ensure stable performance. They dissipate heat generated by the chip to the surrounding environment through heat conduction, convection, and radiation. Their design and performance directly affect the chip's lifespan, processing speed, and reliability. Anodizing fixtures are specialized tooling used to fix heat sinks and ensure uniform conductivity and stable suspension during the anodizing process. The dimensions of the anodizing fixture are fixed, and the contact area between the fixture and the chip heat sink is limited. During the anodizing process, if the conductive contact area is small, it will significantly affect the oxide film quality, production efficiency, and equipment wear and tear. According to I=J×S (where I is current, J is current density, and S is contact area), when the contact area S decreases, the current density J increases inversely. When J exceeds the process threshold (e.g., the conventional current density for sulfuric acid anodizing is 1-2 A / dm²), it will lead to uneven film thickness: the current density near the contact point can be many times that of the normal area, resulting in an excessively thick oxide film, while the non-contact area has an insufficient current, resulting in a thin film and a large film thickness deviation. To compensate for the insufficient film thickness in the non-contact area, the oxidation time needs to be extended, leading to a decrease in production capacity and an increase in energy consumption. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an anodizing fixture for chip heat sinks to solve the problems mentioned in the background art. This utility model allows the conductive contact area to be adjusted as needed, improves the uniformity of film thickness, and shortens the oxidation time.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an anodizing fixture for a chip heat sink, comprising an anode beam, a heat sink base plate on one side of the anode beam, a plurality of heat sink fins evenly mounted on the side of the heat sink base plate facing away from the anode beam, conductive arm plates mounted at both ends of the anode beam, a cylindrical head mounted at the end of the conductive arm plate away from the anode beam, and an upwardly inclined rod head mounted on the side of the cylindrical head facing away from the conductive arm plate, ear plates mounted at the four corners of the heat sink base plate, a fixing hole provided at the end of the ear plate away from the heat sink base plate, two cylindrical heads respectively inserted into corresponding fixing holes on the two ear plates, a plurality of conductive sheets in contact between the two conductive arm plates, the conductive sheets having a "U" shaped structure, both ends of the conductive sheets contacting the two conductive arm plates respectively, the conductive sheets contacting the heat sink base plate, and the conductive sheets being connected to the anode beam via connectors.

[0005] Furthermore, an insert plate is installed at the middle position of the upper surface of the anode beam rod, and there is a gap between the insert plate and the heat dissipation base plate. A protrusion is installed at the middle position of the conductive sheet, and a slot is opened on one side of the protrusion, through which the insert plate passes.

[0006] Furthermore, the upper surface of the protrusion is provided with a weight-reducing opening that penetrates the protrusion, and the weight-reducing opening is located on the side of the slot near the heat dissipation base plate.

[0007] Furthermore, the insert plate has a rectangular cross-section, and the slot has a rectangular cross-section.

[0008] Furthermore, both ends of the anode beam are equipped with connecting arms that are offset from the conductive arm plate. The end of the connecting arm away from the anode beam is equipped with a connecting seat, and one side of the connecting seat has a through hole for inserting screws.

[0009] Furthermore, the connecting seat is provided with a limiting plate on the side near the anode beam rod to limit the position of the screw head. There is a gap between the limiting plate and the connecting seat. One end of the limiting plate is connected and fixed to the connecting arm. One side of the limiting plate is provided with a round hole that is aligned with the through hole.

[0010] Furthermore, a snap-fit ​​bracket is provided on the side of the heat dissipation fins away from the heat dissipation base plate. The snap-fit ​​bracket has a U-shaped structure and is connected to the heat dissipation fins by screws. A connecting plate for installing a cooling fan is installed in the middle of one side of the snap-fit ​​bracket.

[0011] The beneficial effects of this utility model are:

[0012] 1. Multiple "U"-shaped conductive sheets are in contact with the conductive arm plate at both ends and attached to the heat dissipation base plate in the middle, forming a surface contact. The number of conductive sheets can be increased or decreased as needed. That is, the insertion plate of the anode beam passes through the slot of the protrusion. By increasing or decreasing the number of conductive sheets, the contact area can be adjusted to adapt to heat dissipation base plates of different sizes, ensuring that the contact area matches the workpiece and avoiding local current concentration. As a result, the current density on the heat dissipation base plate and heat dissipation fins is reduced during the anodizing process, the oxide film thickness deviation is reduced, and the uniform current distribution solves the problem of insufficient film thickness in non-contact areas, shortens the oxidation time, and reduces energy consumption.

[0013] 2. When installing the anode beam rod onto the anode using screws, one end of the screw should pass through the limiting plate and the connecting seat in sequence. Under the restriction of the limiting plate, there is a gap between the screw head and the connecting seat. When the screw is difficult to disassemble due to oxidation, the screw can be cut off using the gap between the limiting plate and the connecting seat, which facilitates the smooth removal of the anode beam rod. Attached Figure Description

[0014] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0015] Figure 1 This is a schematic diagram of the structure of an anodizing fixture for a chip heat sink according to the present invention;

[0016] Figure 2 This is another perspective view of an anodized mounting bracket for a chip heat sink according to the present invention;

[0017] Figure 3 This is an assembly diagram of the heat dissipation base plate, heat dissipation fins and ear plate in an anodized mounting bracket for chip heat sinks according to the present invention.

[0018] Figure 4 This is an assembly diagram of the conductive sheet, conductive arm plate and anode beam rod in an anodizing fixture for chip heat sinks according to the present invention.

[0019] Figure 5 This is a schematic diagram of the assembly of bumps and conductive sheets in an anodized mounting bracket for a chip heat sink according to the present invention.

[0020] In the diagram: 1-Anode beam, 2-Limiting plate, 3-Through hole, 4-Connecting seat, 5-Connecting arm, 6-Conductive arm plate, 7-Ear plate, 8-Rod head, 9-Heat dissipation base plate, 10-Conductive sheet, 11-Insert plate, 12-Protrusion, 13-Heat dissipation fins, 14-Connecting plate, 15-Snap-fit ​​bracket, 16-Round hole, 17-Fixing hole, 18-Cylindrical head, 19-Slot, 20-Weight reduction port. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] Please see Figures 1-3This utility model provides a technical solution: an anodizing fixture for a chip heat sink, comprising an anode beam 1, a heat sink base plate 9 on one side of the anode beam 1, a plurality of heat sink fins 13 evenly mounted on the side of the heat sink base plate 9 opposite to the anode beam 1, ear plates 7 installed at the four corners of the heat sink base plate 9, and fixing holes 17 opened at the ends of the ear plates 7 away from the heat sink base plate 9. Two cylindrical heads 18 are respectively inserted into the corresponding fixing holes 17 on the two ear plates 7, so that the heat sink base plate 9 is in contact with one side of the chip, and then screws are passed through the fixing holes 17 to install the chip. The structure formed by the heat sink base plate 9 and the heat sink fins 13 increases the heat dissipation area of ​​the chip. A mounting bracket 15 is provided on the side of the heat sink fins 13 away from the heat sink base plate 9. The mounting bracket 15 has a U-shaped structure and is connected to the heat sink fins 13 by screws. A connecting plate 14 for mounting a cooling fan is installed in the middle of one side of the mounting bracket 15. The cooling fan is mounted on the structure formed by the connecting plate 14 and the mounting bracket 15, so that the relative position of the cooling fan and the heat sink fins 13 remains unchanged. The cooling fan increases the airflow when it is working.

[0023] See Figures 1-5 Both ends of the anode beam 1 are equipped with conductive arm plates 6. A cylindrical head 18 is installed at the end of the conductive arm plate 6 away from the anode beam 1. An upwardly inclined rod head 8 is installed on the side of the cylindrical head 18 away from the conductive arm plate 6. The rod head 8 and the cylindrical head 18 cooperate with each other to prevent the ear plate 7 from separating from the conductive arm plate 6. Multiple conductive plates 10 are provided between the two conductive arm plates 6. The conductive plates 10 have a "U"-shaped structure. The two ends of the conductive plates 10 are in contact with the two conductive arm plates 6 respectively. The conductive plates 10 are in contact with the heat dissipation base plate 9. A rectangular cross-section insert plate 11 is installed at the middle position of the upper surface of the anode beam 1. There is a gap between the insert plate 11 and the heat dissipation base plate 9. A protrusion 12 is installed at the middle position of the conductive plate 10. A rectangular cross-section slot 19 is opened on one side of the protrusion 12. The insert plate 11 passes through... The slot 19 and the upper surface of the protrusion 12 are provided with a weight-reducing opening 20 that passes through the protrusion 12. The weight-reducing opening 20 is located on the side of the slot 19 near the heat dissipation base plate 9. Multiple "U"-shaped conductive sheets 10 have their ends in contact with the conductive arm plate 6 and their middle parts in contact with the heat dissipation base plate 9, forming a surface contact. At the same time, the number of conductive sheets 10 can be increased or decreased as needed. That is, the insertion plate 11 of the anode beam rod 1 passes through the slot 19 of the protrusion 12. By increasing or decreasing the conductive sheets 10, the contact area can be adjusted to adapt to heat dissipation base plates 9 of different sizes, ensuring that the contact area matches the workpiece, avoiding local current concentration, and thus reducing the current density on the heat dissipation base plate 9 and heat dissipation fins 13 during the anodizing process, reducing the oxide film thickness deviation, and solving the problem of insufficient film thickness in non-contact areas by uniform current distribution, shortening the oxidation time and reducing energy consumption.

[0024] See Figure 1 , Figure 2 and Figure 4 Both ends of the anode beam rod 1 are equipped with connecting arms 5 that are staggered from the conductive arm plate 6. A connecting seat 4 is installed at the end of the connecting arm 5 away from the anode beam rod 1. One side of the connecting seat 4 has a through hole 3 for inserting a screw. The side of the connecting seat 4 near the anode beam rod 1 has a limiting plate 2 for limiting the position of the screw head. There is a gap between the limiting plate 2 and the connecting seat 4. One end of the limiting plate 2 is connected and fixed to the connecting arm 5. One side of the limiting plate 2 has a round hole 16 that is aligned with the through hole 3. When the anode beam rod 1 is installed on the anode with a screw, one end of the screw passes through the limiting plate 2 and the connecting seat 4 in sequence. Under the restriction of the limiting plate 2, there is a gap between the screw head and the connecting seat 4. When the screw is difficult to disassemble due to oxidation, the screw can be cut off by using the gap between the limiting plate 2 and the connecting seat 4, which facilitates the smooth removal of the anode beam rod 1.

[0025] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An anodizing fixture for a chip heat sink, comprising an anode beam (1), characterized in that: A heat dissipation base plate (9) is provided on one side of the anode beam (1). Multiple heat dissipation fins (13) are evenly installed on the side of the heat dissipation base plate (9) away from the anode beam (1). Conductive arm plates (6) are installed at both ends of the anode beam (1). A cylindrical head (18) is installed at the end of the conductive arm plate (6) away from the anode beam (1). An upwardly inclined rod head (8) is installed on the side of the cylindrical head (18) away from the conductive arm plate (6). Ear plates (7) are installed at the four corners of the heat dissipation base plate (9). A fixing hole (17) is provided at one end away from the heat dissipation base plate (9). The two cylindrical heads (18) are respectively inserted into the corresponding fixing holes (17) on the two ear plates (7). A plurality of conductive plates (10) are provided between the two conductive arm plates (6). The conductive plates (10) are U-shaped. The two ends of the conductive plates (10) are in contact with the two conductive arm plates (6) respectively. The conductive plates (10) are in contact with the heat dissipation base plate (9). The conductive plates (10) are connected to the anode beam rod (1) through a plug-in.

2. The anodizing fixture for a chip heat sink according to claim 1, characterized in that: A plug plate (11) is installed at the middle position of the upper surface of the anode beam (1). There is a gap between the plug plate (11) and the heat dissipation base plate (9). A protrusion (12) is installed at the middle position of the conductive sheet (10). A slot (19) is opened on one side of the protrusion (12). The plug plate (11) passes through the slot (19).

3. The anodizing fixture for a chip heat sink according to claim 2, characterized in that: The upper surface of the protrusion (12) is provided with a weight reduction port (20) that penetrates the protrusion (12), and the weight reduction port (20) is located on the side of the slot (19) near the heat dissipation base plate (9).

4. The anodizing fixture for a chip heat sink according to claim 2, characterized in that: The insert plate (11) has a rectangular cross-section, and the slot (19) has a rectangular cross-section.

5. The anodizing fixture for a chip heat sink according to claim 1, characterized in that: Both ends of the anode beam (1) are equipped with connecting arms (5) that are offset from the conductive arm plate (6). A connecting seat (4) is installed at the end of the connecting arm (5) away from the anode beam (1). A through hole (3) for inserting screws is provided on one side of the connecting seat (4).

6. An anodizing fixture for a chip heat sink according to claim 5, characterized in that: The connecting seat (4) is provided with a limiting plate (2) for limiting the position of the screw head on the side near the anode beam rod (1). There is a gap between the limiting plate (2) and the connecting seat (4). One end of the limiting plate (2) is connected and fixed to the connecting arm (5). One side of the limiting plate (2) is provided with a round hole (16) that is aligned with the through hole (3).

7. An anodizing fixture for a chip heat sink according to claim 1, characterized in that: The heat dissipation fins (13) are provided with a snap-fit ​​bracket (15) on the side away from the heat dissipation base plate (9). The snap-fit ​​bracket (15) has a U-shaped structure and is connected to the heat dissipation fins (13) by screws. A connecting plate (14) for installing a cooling fan is installed in the middle of one side of the snap-fit ​​bracket (15).

Images