Product surface temperature monitoring module

Abstract

The utility model aims to provide the product surface temperature monitoring module which is low in cost, small in occupied space and convenient to integrate on a test production line. The temperature measuring device comprises a processor, a switch unit and a plurality of temperature measuring probes, the temperature measuring probes are communicated with the processor through the switch unit, the processor is communicated with an external computer, and each temperature measuring probe comprises an installation block, a flexible circuit board and a digital temperature sensor. The digital temperature sensor is electrically connected to the flexible circuit board, the flexible circuit board is arranged on the mounting block in a limiting mode, and a heat conduction block wrapping the digital temperature sensor is arranged at the end of the mounting block. The temperature testing device is applied to the technical field of temperature testing.

Description

Technical Field

[0001] This invention relates to the technical field of temperature testing, and in particular to a product surface temperature monitoring module. Background Technology

[0002] In the field of temperature testing, standard instruments are typically used to ensure testing results, such as the Keysight DAQ970A data acquisition instrument, which uses thermocouples for temperature measurement. However, this method is costly and bulky. For monitoring the surface temperature of products such as mobile phones, tablets, and watches during charging, and subsequently testing product performance, standard instruments are difficult to integrate into the testing production line. Furthermore, thermocouple measurements are prone to error, and traditional contact structures cannot guarantee the stability of testing accuracy in batch testing.

[0003] If a product surface temperature monitoring module that occupies little space and is easy to integrate into the testing production line can be provided. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a product surface temperature monitoring module that is low in cost, occupies little space, and is easy to integrate into the testing production line.

[0005] The technical solution adopted by this utility model is as follows: This utility model includes a processor, a switching unit, and several temperature probes. The several temperature probes communicate with the processor through the switching unit. The processor communicates with an external computer. Each temperature probe includes a mounting block, a flexible circuit board, and a digital temperature sensor. The digital temperature sensor is electrically connected to the flexible circuit board. The flexible circuit board is positioned on the mounting block. A heat-conducting block covering the digital temperature sensor is provided at the end of the mounting block.

[0006] As can be seen from the above scheme, the processor is used to feed back the signal collected by the temperature probe to the host computer, and the switching unit is used to select one of the signals from the multi-channel temperature probe to conduct to the processor, thereby realizing batch data acquisition through the processor. This achieves low cost and small footprint, and can be better applied to temperature testing of batch products during charging on a test production line. Specifically, a digital temperature sensor is used to improve the accuracy of temperature detection, and the mounting block is used to fix the flexible circuit board. By setting the heat-conducting block, the digital temperature sensor is protected while ensuring effective temperature transfer from the product under test when in contact with it, thus ensuring the accuracy and stability of temperature acquisition.

[0007] A preferred embodiment is that a heat insulation layer is provided between the flexible circuit board and the mounting block.

[0008] A further preferred embodiment is that the insulation layer is a foam insulation layer.

[0009] In a preferred embodiment, the switching unit includes a plurality of switching chips, all of which communicate with the processor, and the switching ports of the switching chips are correspondingly connected to a plurality of the temperature probes.

[0010] In a preferred embodiment, the present invention further includes a power supply module and a communication module, wherein the power supply module is connected to an external power input, and the processor communicates with an external computer through the communication module. Attached Figure Description

[0011] Figure 1 This is a system block diagram of this utility model;

[0012] Figure 2 This is a circuit schematic diagram of the processor, the power module, and the communication module;

[0013] Figure 3 This is the circuit schematic diagram of the switching unit;

[0014] Figure 4 This is the circuit diagram of the temperature probe. Detailed Implementation

[0015] like Figures 1 to 4 As shown, in this embodiment, the present invention includes a processor 1, a switching unit 2, and several temperature probes 3. The temperature probes 3 communicate with the processor 1 through the switching unit 2. The processor 1 communicates with an external computer. Each temperature probe 3 includes a mounting block, a flexible circuit board, and a digital temperature sensor 31. The digital temperature sensor 31 is electrically connected to the flexible circuit board, which is positioned on the mounting block. A heat-conducting block covering the digital temperature sensor 31 is provided at the end of the mounting block. The processor 1 is an STM32F103 series processing chip. The processing chip reads the signal from the digital temperature sensor 31 and transmits the data to the host computer. By using a flexible circuit board, the digital temperature sensor 31 can be adapted to product installation. The mounting block is designed according to the product's shape and installation space. The digital temperature sensor 31 is then positioned on the mounting block at the location where it mates with the product under test via the flexible circuit board. Temperature is conducted through the heat-conducting block, thereby enabling the acquisition of the surface temperature of the product under test during charging without damaging the digital temperature sensor 31. The digital temperature sensor 31 is a TMP117.

[0016] In this embodiment, a heat insulation layer is provided between the flexible circuit board and the mounting block. The heat insulation layer is a foam insulation layer. By providing the heat insulation layer, the temperature of the mounting block is prevented from being transferred to the flexible circuit board, thereby avoiding affecting the acquisition accuracy of the digital temperature sensor 31.

[0017] like Figure 3 As shown in this embodiment, the switching unit 2 includes several PCA9546ADWR switching chips 21. The SDA and SCL ports of the switching chips 21 communicate with the processor 1 via an I2C bus. The four pairs of SD and SC ports of the switching chips 21 are respectively connected to four sets of temperature probes 3 via I2C. During testing, when it is necessary to obtain temperature data of a corresponding part of the product, the switching unit 2 turns on the corresponding temperature probe 3 to the processor 1, thereby realizing the reading of temperature data.

[0018] like Figure 2 As shown, in this embodiment, it also includes a power module 4 and a communication module 5. The power module 4 includes a first power chip and a second power chip, both of which are 5V-3.3V voltage regulator chips. These chips convert the 5V voltage input to the input terminal into a 3.3V voltage to power the processor 1, the switching unit 2, and the digital temperature sensor 31. The communication module includes an RJ45 network interface (model DGKYD511Q030AC1A8D057), through which the processor 1 communicates with the host computer.

[0019] Although the embodiments of this utility model are described with reference to actual solutions, they do not constitute a limitation on the meaning of this utility model. For those skilled in the art, modifications to the implementation schemes and combinations with other schemes based on this specification are obvious.

Claims

1. A product surface temperature monitoring module, characterized in that: It includes a processor (1), a switching unit (2) and several temperature probes (3). The several temperature probes (3) communicate with the processor (1) through the switching unit (2). The processor (1) communicates with an external computer. The temperature probe (3) includes a mounting block, a flexible circuit board and a digital temperature sensor (31). The digital temperature sensor (31) is electrically connected to the flexible circuit board. The flexible circuit board is positioned on the mounting block. The end of the mounting block is provided with a heat-conducting block covering the digital temperature sensor (31).

2. The product surface temperature monitoring module according to claim 1, characterized in that: A heat insulation layer is provided between the flexible circuit board and the mounting block.

3. The product surface temperature monitoring module according to claim 2, characterized in that: The insulation layer is a foam insulation layer.

4. The product surface temperature monitoring module according to claim 1, characterized in that: The switching unit (2) includes several switching chips (21), all of which communicate with the processor (1). The switching ports of the switching chips (21) are connected to several temperature probes (3).

5. A product surface temperature monitoring module according to claim 1, characterized in that: It also includes a power module (4) and a communication module (5), the power module (4) being connected to an external power input, and the processor (1) communicating with an external computer through the communication module (5).

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