Semiconductor wafer slice multi-defect detection device
By combining droplet development with color CMOS vision for collaborative inspection, along with multiple light sources and automated processes, the problem of low efficiency and high cost in semiconductor wafer slicing inspection in existing technologies has been solved, achieving efficient and low-cost automated identification of multiple defects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI YIXIN SEMICON CO LTD
- Filing Date
- 2025-04-14
- Publication Date
- 2026-05-12
AI Technical Summary
Existing technologies for semiconductor wafer slicing inspection suffer from low efficiency, high cost, and poor adaptability, and cannot simultaneously and accurately identify defects such as contaminants in the dicing path, surface cracks, metal contamination, and organic residues.
By employing droplet development and color CMOS vision-based collaborative detection, combined with multiple light sources and automated processes, the system achieves automated identification of contaminants, surface cracks, metal contamination, and organic residues in the cutting path.
It achieves efficient and low-cost multi-defect detection, reduces equipment costs, improves detection efficiency and adaptability, and supports the detection of wafer slices made of various materials.
Smart Images
Figure CN224231656U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a multi-defect detection device for semiconductor wafer slicing. Background Technology
[0002] In the semiconductor manufacturing industry, defects such as the quality of the dicing channels, surface damage, metal contamination, and organic residues after wafer slicing directly affect chip yield and packaging reliability. Currently, the industry mainly relies on the following testing methods:
[0003] ① Manual visual inspection: Operators observe defects in the slices using an optical microscope, which is inefficient and easily affected by subjective factors, and cannot achieve accurate quantification of defects (such as crack length and contaminant particle size statistics).
[0004] ② High-precision optical equipment: such as laser confocal microscope (CLSM) or scanning electron microscope (SEM), although they can provide high-resolution images, are expensive (over one million RMB per unit), slow in detection speed, and require a professional operating environment (such as vacuum), making them difficult to adapt to the rapid detection needs of production lines.
[0005] ③ Single-function automated equipment: Some manufacturers use automated optical inspection (AOI) equipment, but it can only identify surface scratches or particulate contamination and cannot be compatible with chemical development detection (such as metal ion residues and organic contaminants). In addition, the complex multi-axis motion system results in large equipment size and high maintenance costs.
[0006] To address the aforementioned issues, this application proposes a multi-defect detection device for semiconductor wafer slicing. Utility Model Content
[0007] The purpose of this invention is to provide a semiconductor wafer slicing multi-defect detection device to solve the problems mentioned in the background art.
[0008] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor wafer slicing multi-defect detection device, comprising an electrical cabinet, an external industrial control computer on top of the electrical cabinet, a display screen on the side wall of the external industrial control computer, operation buttons on the front of the electrical cabinet, the front of the electrical cabinet being open, an industrial camera on the inner top surface of the electrical cabinet, a wafer fixing tray inside the electrical cabinet below the industrial camera, and a drip collection bracket above the wafer fixing tray.
[0009] Preferably, the industrial camera is provided with an x-axis slide rail above it, and one end of the x-axis slide rail is provided with a telescopic drive component, which drives the industrial camera along the x-axis slide rail.
[0010] Preferably, the bottom of the wafer fixing tray is provided with a cylinder, and the bottom surface of the wafer fixing tray is symmetrically and slidably connected with a wafer holding area guide rail.
[0011] Preferably, the inner top surface of the electrical cabinet is provided with a light source.
[0012] Preferably, the bottom of the electrical cabinet is provided with a shock-absorbing bracket.
[0013] This utility model has at least the following beneficial effects:
[0014] This invention provides a multi-defect detection device for semiconductor wafer slicing, which adopts droplet development + color CMOS vision collaborative detection to realize integrated automatic identification of contaminants, surface cracks, metal contamination and organic residues in the dicing channel, thereby achieving efficient and low-cost automated quality assessment. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the electrical cabinet structure of this utility model;
[0017] Figure 3 This is a schematic diagram of the bottom structure of the wafer fixing tray of this utility model;
[0018] Figure 4 This is a schematic diagram showing the position of the light source in this utility model;
[0019] Figure 5 This is a schematic diagram of the modules of this utility model.
[0020] In the attached diagram, the following are the reference numerals: 1. Display screen; 2. External industrial computer; 3. Electrical cabinet; 4. Operation button; 5. Anti-vibration bracket; 6. X-axis slide rail; 7. Industrial camera; 8. Droplet holder; 9. Wafer fixing tray; 10. Wafer placement area guide rail; 11. Light source; 12. Cylinder. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.
[0022] Example
[0023] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 This utility model provides a technical solution: a semiconductor wafer slicing multi-defect detection device, including an electrical cabinet 3, an external industrial control computer 2 on the top of the electrical cabinet 3, specifically, the electrical cabinet 3 is fixedly connected to the external industrial control computer 2, a display screen 1 on the side wall of the external industrial control computer 2, specifically, the display screen 1 is fixedly connected to the external industrial control computer 2, an operation button 4 on the front of the electrical cabinet 3, the front of the electrical cabinet 3 is open, an industrial camera 7 is provided on the inner top surface of the electrical cabinet 3, a wafer fixing tray 9 is provided inside the electrical cabinet 3 below the industrial camera 7, and a drip collection bracket 8 is provided above the wafer fixing tray 9, specifically, the drip collection bracket 8 is fixedly connected to the inner wall of the electrical cabinet 3.
[0024] Furthermore, an x-axis slide rail 6 is provided above the industrial camera 7. Specifically, the x-axis slide rail 6 is fixedly connected to the electrical cabinet 3, and the top mounting base of the industrial camera 7 is slidably connected to the x-axis slide rail 6. One end of the x-axis slide rail 6 is provided with a telescopic drive component, which drives the industrial camera 7 along the x-axis slide rail 6.
[0025] Furthermore, a cylinder 12 is provided at the bottom of the wafer fixing tray 9. Specifically, the two ends of the cylinder 12 are fixedly connected to the bottom of the wafer fixing tray 9 and the inner wall of the electrical cabinet 3, respectively, and drive the wafer fixing tray 9 to move closer or further away from the dripping support 8. A wafer holding area guide rail 10 is symmetrically slidably connected to the bottom surface of the wafer fixing tray 9. Specifically, the bottom surface of the wafer holding area guide rail 10 is fixedly connected to the electrical cabinet 3.
[0026] Furthermore, a light source 11 is provided on the inner top surface of the electrical cabinet 3.
[0027] Furthermore, the bottom of the electrical cabinet 3 is provided with a shock-absorbing bracket 5, which is specifically fixedly connected to the electrical cabinet 3.
[0028] Working principle and usage process of this utility model:
[0029] Step 1. Manual Operation Stage:
[0030] Place the wafer on a vacuum adsorption platform and add the detection solution (e.g., 10 μL of Secco etching solution) using a quantitative pipette.
[0031] Step 2. Automatic Detection Phase:
[0032] The industrial control computer receives the dripping completion signal, starts the detection program, and automatically executes the following process:
[0033] a. Light source switching (based on preset detection type): The camera switches the light source according to the detection type. Dark field ring light → cutting channel pollutants, coaxial light → surface cracks, UV light → organic residual fluorescence.
[0034] b. Autofocus shooting (5-point viewfinder);
[0035] Image analysis (parallel execution of multiple algorithms): Contaminant detection, binarization + contour counting (OpenCV); Crack detection, Canny edge extraction + Hough transform; Metal contamination, HSV color space segmentation;
[0036] d Generate an inspection report (including a defect distribution map).
[0037] Step 3. Results displayed:
[0038] The test results are displayed on the screen in real time and the data is automatically saved to the industrial computer's hard drive.
[0039] Specifications of each component in this application:
[0040] X-axis slide rail: X-axis precision slide (repeat positioning accuracy ±5μm), equipped with an industrial camera and light source module.
[0041] Wafer placement area guide rail: prevents platform displacement and can be used for multi-angle shooting.
[0042] Wafer slicing tray: Vacuum adsorption tray: Surface covered with anti-static silicone pad, adsorption force ≥50N;
[0043] Industrial camera: 5-megapixel color CMOS (global shutter, 30fps frame rate), supports USB 3.0 transmission.
[0044] Light source system: Modular design, including white ring lamp (dark field), coaxial lamp (bright field), and UV-LED (365nm).
[0045] Industrial PC: Intel i5 processor, pre-installed with Windows + Python + OpenCV environment.
[0046] Compared with the prior art, this application has the following technical advantages:
[0047] ①. Multifunctional integration: One device is compatible with four types of defect detection, and can switch between different droplet types and light source modes;
[0048] ②. Low-cost solution: Using ordinary industrial cameras and self-made light sources, the cost is less than 10% of that of professional equipment;
[0049] ③. Automated process: The industrial control computer controls the entire process of shooting and analysis, reducing human error;
[0050] ④. High adaptability: It can detect wafer slices of various materials such as silicon, silicon carbide, and GaN.
[0051] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this utility model, and no reference numerals in the claims should be construed as limiting the scope of the claims.
[0052] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A multi-defect detection device for semiconductor wafer slicing, characterized in that, The device includes an electrical cabinet (3), an external industrial control computer (2) on top of the electrical cabinet (3), a display screen (1) on the side wall of the external industrial control computer (2), an operation button (4) on the front of the electrical cabinet (3), an open front of the electrical cabinet (3), an industrial camera (7) on the inner top surface of the electrical cabinet (3), a wafer fixing tray (9) below the industrial camera (7) inside the electrical cabinet (3), and a drip container bracket (8) above the wafer fixing tray (9).
2. The semiconductor wafer slicing multi-defect detection device according to claim 1, characterized in that: The industrial camera (7) is provided with an x-axis slide rail (6) above it. One end of the x-axis slide rail (6) is provided with a telescopic drive component, which drives the industrial camera (7) along the x-axis slide rail (6).
3. The semiconductor wafer slicing multi-defect detection device according to claim 1, characterized in that: The bottom of the wafer fixing tray (9) is provided with a cylinder (12), and the bottom surface of the wafer fixing tray (9) is symmetrically and slidably connected with a wafer holding area guide rail (10).
4. The semiconductor wafer slicing multi-defect detection device according to claim 1, characterized in that: The electrical cabinet (3) is equipped with a light source (11) on its inner top surface.
5. The semiconductor wafer slicing multi-defect detection device according to claim 1, characterized in that: The bottom of the electrical cabinet (3) is provided with a shockproof bracket (5).