Test signal acquisition mechanism and wafer aging test device comprising same

Abstract

The utility model relates to the technical field of wafer performance detection, and discloses a test signal acquisition mechanism and a wafer aging test device comprising the same, and the test signal acquisition mechanism comprises a mounting frame which is provided with a mounting channel, the mounting frame comprises a mounting plate, and the mounting plate is arranged at the end of the mounting channel; the acquisition line assembly comprises an acquisition line and an acquisition line connector, the acquisition line connector is arranged on the mounting plate, one end of the acquisition line connector faces the mounting channel, and the other end of the acquisition line connector is used for being connected with the acquisition line; and the acquisition board assembly comprises an acquisition board and an acquisition board connector, the acquisition board connector is arranged at the end of the acquisition board, and the acquisition board assembly can move in the mounting channel, so that the acquisition board connector and the acquisition line connector are plugged in each other. Based on the combined action of the technical characteristics, on the premise of realizing the high-efficiency, accurate and stable-data acquisition performance of the test signal acquisition mechanism, the disassembly and assembly efficiency of part maintenance after the test is improved, and the wafer aging performance test is ensured to be smoothly carried out.

Description

Technical Field

[0001] This application relates to the field of wafer performance testing technology, and in particular to a test signal acquisition mechanism and a wafer aging test device including the same. Background Technology

[0002] In order to monitor and record various performance indicators of the wafer in real time during the wafer aging performance test, a large number of acquisition lines must be deployed to collect test data, so that each acquisition line is responsible for transmitting specific data of the wafer during the test process, which leads to the problem of a huge number of acquisition lines.

[0003] Currently, in wafer aging performance testing acquisition devices, whenever maintenance is required on the acquisition board, it must be pulled out of the aging test equipment for inspection or replacement. This necessitates manual removal of all acquisition lines from the acquisition board. After maintenance, reinstalling the acquisition board requires manually reconnecting these acquisition lines. This disassembly and reassembly process is repeated every time the acquisition board is maintained. The aging test equipment includes three acquisition modules, each containing over 200 acquisition lines and more than 10 acquisition boards. This means that at least 20 acquisition lines are installed on each acquisition board. Even if only one acquisition board is removed during maintenance, the disassembly and reassembly of its acquisition lines must be repeated more than 40 times. This undoubtedly increases the workload for operators, making the disassembly and reassembly work extremely tedious.

[0004] At the same time, due to the limited internal space of the aging test equipment, the dense layout of the acquisition lines, and the chaotic interweaving between the acquisition lines, the disassembly and assembly process is not only time-consuming but also extremely inconvenient, increasing the complexity and difficulty of the work. Summary of the Invention

[0005] In view of the above-mentioned problems in the prior art, the purpose of this application is to solve the defects in wafer aging performance testing, which is that the number of acquisition lines is large and the disassembly and assembly are cumbersome. In addition, the internal space of the aging test equipment is limited, resulting in the complexity and inefficiency of the acquisition board maintenance operation.

[0006] To address the aforementioned problems, this application provides a test signal acquisition mechanism and a wafer aging test apparatus including the same, comprising:

[0007] The mounting frame has a mounting channel, and the mounting frame includes a mounting plate disposed at the end of the mounting channel;

[0008] A data acquisition line assembly includes a data acquisition line and a data acquisition line connector. The data acquisition line connector is disposed on the mounting plate, with one end of the data acquisition line connector facing the mounting channel and the other end used to connect to the data acquisition line.

[0009] The acquisition board assembly includes an acquisition board and an acquisition board connector, the acquisition board connector being disposed at an end of the acquisition board, and the acquisition board assembly being movable within the mounting channel, such that the acquisition board connector and the acquisition line connector are mated together.

[0010] Preferably, the acquisition board is provided with guide pins, which are located near the acquisition board connector and extend toward the side away from the acquisition board;

[0011] The mounting plate is provided with guide holes corresponding to the guide pins. The guide pins can be embedded in the guide holes to provide positioning for the mating of the acquisition board connector and the acquisition line connector.

[0012] Preferably, the acquisition plate is provided with a connecting block, and the guide pin is disposed on the connecting block. Along the extension direction of the installation channel, the guide pin and the acquisition plate are misaligned.

[0013] Preferably, the acquisition board is provided with a guide seat, the guide seat is located near the acquisition board connector, the guide seat is provided with a positioning groove, and the opening of the positioning groove is located on the side opposite to the acquisition board;

[0014] The mounting plate is provided with guide posts corresponding to the positioning slots. The guide posts extend toward one side of the mounting channel and can be embedded in the positioning slots to provide positioning for the mating of the acquisition board connector and the acquisition line connector.

[0015] Preferably, the mounting frame includes two enclosure panels and two guide plates, the enclosure panels and the guide plates are arranged adjacent to each other, the two enclosure panels and the two guide plates surround each other to form the mounting channel, and the two ends of the mounting plate are connected to the two guide plates.

[0016] Preferably, at least one of the guide plates is provided with a guide groove, the guide groove is disposed on the side of the guide plate facing the mounting channel, the guide groove is disposed along the extension direction of the mounting channel, the acquisition plate can be embedded in the guide groove, and the guide groove is used to provide guidance for the movement of the acquisition plate.

[0017] Preferably, along the extension direction of the mounting channel, the cross-sectional dimension of the guide groove is not less than the radial dimension of the acquisition plate.

[0018] Preferably, there are multiple guide grooves, which are arranged sequentially at intervals along an extension direction perpendicular to the mounting channel.

[0019] Preferably, the mounting plate is provided with a slot and a fixing member, the insertion end of the acquisition line connector for the acquisition board connector to be inserted is embedded in the slot, and the fixing member is provided at least on one side of the acquisition line connector to fix the acquisition line connector on the mounting plate.

[0020] A wafer aging test apparatus, comprising:

[0021] Probe plate assembly;

[0022] A heat sink assembly is used to support the wafer and, together with the probe plate assembly, forms a test cavity for testing the wafer;

[0023] The alignment mechanism is used to align the heat sink assembly with the probe plate assembly to form the test cavity;

[0024] An electronic control component, electrically connected to the alignment mechanism, is used to control the movement of the alignment mechanism;

[0025] At least one test signal acquisition mechanism as described in any of the preceding claims, wherein each of the test signal acquisition mechanisms is electrically connected to the probe plate assembly and the heat sink assembly respectively via the acquisition line assembly, for acquiring wafer electrical performance data within the test cavity.

[0026] Based on the above technical solution, the test signal acquisition mechanism and wafer aging test device including the same described in this application have the following beneficial effects:

[0027] First, the design of the mounting frame provides a stable support structure for the installation of the acquisition board assembly. The design of the mounting channel allows the acquisition board assembly to move within it. Furthermore, the mounting plate can serve not only as a fixing point for the acquisition board assembly but also as a fixing point for the acquisition line assembly. This ensures the structural stability of either the acquisition board assembly or the acquisition line assembly after it is installed on the mounting plate, preventing it from shaking due to external factors. It also reduces interference from other components to the test signal acquisition mechanism. This not only improves the accuracy of wafer aging test data acquisition and ensures stable transmission of the acquired signal but also guarantees the stability and reliability of the entire test signal acquisition mechanism.

[0028] Secondly, the acquisition lines are mounted on the mounting plate via acquisition line connectors. This eliminates the need to reconnect the acquisition lines and acquisition board before each wafer aging test. Simply plugging in the acquisition board connector and the acquisition line connector before starting the test allows for quick wafer aging detection. Furthermore, after the wafer aging test is completed, there is no need to disconnect the acquisition lines and acquisition board separately. Simply unplugging the acquisition board connector relative to the acquisition line connector disconnects the acquisition lines and acquisition board.

[0029] Furthermore, placing the acquisition cable connector at the end of the acquisition board allows for quick mating with the acquisition board connector, reducing connection time before testing and improving the efficiency of pre-test preparation. Additionally, the mobility of the acquisition board assembly allows for precise alignment with the acquisition cable connector within the installation channel. Moving the acquisition board assembly ensures correct mating between the acquisition board connector and the acquisition cable connector, reducing signal loss or errors caused by inaccurate alignment and minimizing errors from manual operation.

[0030] In summary, based on the combined effect of the above-mentioned technical features, while achieving efficient, accurate, and stable data acquisition performance of the test signal acquisition mechanism, the disassembly and assembly efficiency of post-test component repair is improved, ensuring the smooth progress of wafer aging performance testing. Attached Figure Description

[0031] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0032] Figure 1 This is a schematic diagram of the test signal acquisition mechanism provided in Embodiment 1 of this application.

[0033] Figure 2 This is a schematic diagram of the acquisition line assembly and mounting frame provided in Embodiment 1 of this application.

[0034] Figure 3 yes Figure 2 A magnified view of section A in the image.

[0035] Figure 4 This is a schematic diagram of the acquisition line assembly and mounting plate provided in Embodiment 1 of this application from a first-view perspective.

[0036] Figure 5 This is a schematic diagram of the acquisition line assembly and mounting plate provided in Embodiment 1 of this application from a second-view perspective.

[0037] Figure 6 This is a schematic diagram of the acquisition board assembly provided in Embodiment 1 of this application from a first-view perspective.

[0038] Figure 7 This is a schematic diagram of the acquisition board assembly provided in Embodiment 1 of this application from a second-view perspective.

[0039] Figure 8 yes Figure 7 A magnified view of section B in the image.

[0040] Figure 9 yes Figure 7 A magnified view of section C in the image.

[0041] Figure 10 This is a schematic diagram of the wafer aging test device provided in Embodiment 2 of this application.

[0042] Figure 11 This is an internal front view of the wafer aging test apparatus provided in Embodiment 2 of this application.

[0043] Figure 12 This is a schematic diagram of the heat sink assembly, the heat sink assembly and the connection mechanism provided in Embodiment 2 of this application.

[0044] The reference numerals in the attached drawings are as follows: Test signal acquisition mechanism 100; mounting frame 11, mounting plate 111, mounting channel 112, surrounding plate 113, guide plate 114, guide groove 1141; acquisition line assembly 12, acquisition line connector 121; acquisition plate assembly 13, acquisition plate 131, acquisition plate connector 132; guide pin 141, guide hole 142, guide seat 143, positioning groove 1431, guide post 144; connecting block 15; slot 161, fastener 162; extension direction H of the mounting channel.

[0045] Wafer aging test apparatus 200; probe plate assembly 21, heat sink assembly 22, alignment mechanism 23, electrical control assembly 24, frame 25, test module 26. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0047] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0048]

Example 1

[0049] like Figures 1-9 As shown in Embodiment 1 of this application, a test signal acquisition mechanism 100 is disclosed, which is applied to wafer aging performance testing. It is responsible for summarizing the various acquisition components that collect various performance data in wafer aging testing, so as to ensure the normal progress of the test and improve the disassembly and assembly efficiency of component repair after the test.

[0050] Specifically, the test signal acquisition mechanism 100 includes:

[0051] The mounting frame 11 has a mounting channel 112, and the mounting frame 11 includes a mounting plate 111, which is disposed at the end of the mounting channel 112.

[0052] The acquisition line assembly 12 includes an acquisition line (not shown in the figure) and an acquisition line connector 121. The acquisition line connector 121 is disposed on the mounting plate 111. One end of the acquisition line connector 121 faces the mounting channel 112, and the other end is used to connect to the acquisition line.

[0053] The acquisition board assembly 13 includes an acquisition board 131 and an acquisition board connector 132. The acquisition board connector 132 is disposed at the end of the acquisition board 131. The acquisition board assembly 13 is movable within the mounting channel 112, so that the acquisition board connector 132 and the acquisition line connector 121 are mated together.

[0054] Understandably, the mounting channel 112 in the mounting frame 11 can accommodate and guide the movement of the acquisition board assembly 13, so as to guide the acquisition board connector 132 at the end of the acquisition board 131 to move to the end of the mounting channel 112, that is, to the corresponding position of the acquisition line connector 121 on the mounting board 111, so as to realize the mating of the acquisition board connector 132 and the acquisition line connector 121, thereby realizing the acquisition of various performance data in the wafer aging performance test.

[0055] In this embodiment, the acquisition board connector 132 and the acquisition board 131 are integrally formed. Since there are no additional connectors, this design reduces the number of connection points between the acquisition board 131 and the acquisition board connector 132, thereby reducing structural weaknesses caused by poor connections and improving the overall stability and durability of the acquisition board assembly 13. Furthermore, reducing connection points in the signal transmission path reduces interference and loss during signal transmission, improving the integrity and reliability of signal transmission. Simultaneously, considering the space limitations of wafer aging performance testing, the integrally formed acquisition board assembly 13 allows for a more compact overall structure of the test signal acquisition mechanism 100, improving space utilization efficiency. In addition, the integrally formed structure simplifies the composition of the acquisition board assembly 13, making maintenance and repair more convenient. This facilitates fault detection and replacement, reducing repair time and costs.

[0056] Therefore, the technical effect that can be derived based on the above structural form is as follows:

[0057] First, the design of the mounting frame 11 provides a stable support structure for the installation of the acquisition board assembly 13. The design of the mounting channel 112 allows the acquisition board assembly 13 to move within it. Furthermore, the mounting plate 111 can serve not only as a fixing point for the acquisition board assembly 13 but also as a fixing point for the acquisition line assembly 12. This ensures the structural stability of either the acquisition board assembly 13 or the acquisition line assembly 12 after it is installed on the mounting plate 111, preventing it from shaking due to external factors. This reduces interference from other components to the test signal acquisition mechanism 100. This not only improves the accuracy of wafer aging test data acquisition and ensures stable transmission of the acquired signal but also guarantees the stability and reliability of the entire test signal acquisition mechanism 100.

[0058] Secondly, the acquisition line is mounted on the mounting plate 111 via the acquisition line connector 121. This eliminates the need to reconnect the acquisition line and the acquisition board 131 before each wafer aging test. Simply plugging in the acquisition board connector 132 and the acquisition line connector 121 before starting the test allows for quick start of the wafer aging test. Furthermore, after the wafer aging test is completed, there is no need to disconnect the acquisition line and the acquisition board 131 separately. Simply unplugging the acquisition board connector 132 relative to the acquisition line connector 121 disconnects the acquisition line and the acquisition board 131.

[0059] Furthermore, by placing the acquisition line connector 121 at the end of the acquisition board 131, it can be quickly plugged into the acquisition board connector 132, reducing the connection time before testing and improving the efficiency of pre-test preparation. In addition, the mobility of the acquisition board assembly 13 allows it to be precisely aligned with the acquisition line connector 121 within the installation channel 112. The correct docking between the acquisition board connector 132 and the acquisition line connector 121 can be ensured by moving the acquisition board assembly 13, reducing signal loss or errors caused by inaccurate alignment and reducing errors caused by manual operation.

[0060] In summary, based on the combined effect of the above-mentioned technical features, while achieving efficient, accurate, and stable data acquisition performance of the test signal acquisition mechanism 100, the disassembly and assembly efficiency of post-test component repair is improved, ensuring the smooth progress of wafer aging performance testing.

[0061] like Figure 7 and Figure 9 As shown, the acquisition plate 131 is provided with a guide pin 141. The guide pin 141 is located near the acquisition plate connector 132, that is, the guide pin 141 is located at one end of the acquisition plate 131 near the acquisition plate connector 132 and extends toward the side away from the acquisition plate 131.

[0062] The mounting plate 111 is provided with guide holes 142 corresponding to the guide pins 141. That is, the mounting plate 111 is provided with guide holes 142 at the positions corresponding to the guide pins 141. The guide pins 141 and guide holes 142 are adapted to each other, so that the guide pins 141 can be embedded in the guide holes 142 to provide positioning for the mating of the acquisition board connector 132 and the acquisition line connector 121.

[0063] Understandably, the matching design of the guide pin 141 and the guide hole 142 provides a precise positioning function for the mating of the acquisition board connector 132 and the acquisition line connector 121.

[0064] Therefore, the technical effects derived from the above structural form are as follows: Through the cooperation of the guide pin 141 and the guide hole 142, the operator only needs to move the acquisition board 131 along the mounting channel 112 to smoothly insert the guide pin 141 into the guide hole 142 by aligning the guide pin 141 and the guide hole 142. This ensures accurate alignment of the acquisition board connector 132 and the acquisition line connector 121 during the mating process without the need for precise adjustment of the acquisition board 131's position. This not only reduces connection failures or signal transmission problems caused by inaccurate alignment but also speeds up the mating speed between the acquisition board connector 132 and the acquisition line connector 121. Furthermore, the guide pin 141 embedded in the guide hole 142 also, to a certain extent, fixes the acquisition board assembly 13 to the mounting plate 111, making the mating of the acquisition board connector 132 and the acquisition line connector 121 more stable and improving the reliability of the connection.

[0065] In a preferred embodiment, the acquisition plate 131 is provided with a connecting block 15, and the guide pin 141 is disposed on the connecting block 15, that is, the guide pin 141 is disposed on the acquisition plate 131 through the connecting block 15;

[0066] Along the extension direction H of the installation channel 112, the guide pin 141 and the acquisition plate 131 are misaligned.

[0067] It is understandable that the width of the connecting block 15 is greater than the thickness of the acquisition plate 131. Thus, when the guide pin 141 is set at either end of the connecting block 15, the guide pin 141 can be located on the side of the acquisition plate 131, thereby achieving the misalignment of the guide pin 141 and the acquisition plate 131.

[0068] Therefore, the technical effect derived from the above structural form is as follows: Since the width of the connecting block 15 is greater than the thickness of the acquisition board 131, the guide pin 141 can be set at either end of the connecting block 15. In this way, when the thickness of the acquisition board 131 changes, and the structural size of the acquisition board connector 132 changes accordingly, the position of the acquisition line connector 121 will not change. Therefore, as long as the size of the connecting block 15 remains unchanged, the position of the guide pin 141 can remain unchanged. Thus, regardless of the structural size of the acquisition board 131 or the acquisition board connector 132, the guide pin 141 and the guide hole 142 can be positioned through the connecting block 15. This provides a unified positioning method for acquisition board assemblies 13 of different sizes, ensuring smooth mating of the acquisition board connector 132 and the acquisition line connector 121, thereby improving the applicability of the test signal acquisition mechanism 100.

[0069] like Figures 7-8As shown, the acquisition plate 131 is provided with a guide seat 143, which is located near the acquisition plate connector 132. That is, the guide seat 143 is located at one end of the acquisition plate 131 near the acquisition plate connector 132. The guide seat 143 is provided with a positioning groove 1431, and the opening of the positioning groove 1431 is located on the side away from the acquisition plate 131, that is, the opening of the positioning groove 1431 faces the mounting plate 111.

[0070] The mounting plate 111 is provided with guide posts 144 corresponding to the positioning groove 1431. That is, the mounting plate 111 is provided with guide posts 144 at the position corresponding to the positioning groove 1431. The guide posts 144 extend toward one side of the mounting channel 112, that is, the extended end of the guide posts 144 faces the mounting channel 112. The guide pins 141 and guide holes 142 are adapted to each other, so that the guide posts 144 can be embedded in the positioning groove 1431 to provide positioning for the mating of the acquisition board connector 132 and the acquisition line connector 121.

[0071] In this embodiment of the application, the guide post 144 is a nail structure.

[0072] In this embodiment, there are multiple acquisition board connectors 132, which are arranged sequentially and at intervals at one end of the acquisition board 131 facing the mounting plate 111. Correspondingly, the mounting plate 111 also has a corresponding number of acquisition line connectors 121 in corresponding areas.

[0073] In this embodiment, guide pins 141 and guide seats 143 are provided on the acquisition plate 131, and the number of each can be set as needed. Preferably, the guide seats 143 are located at the end of the acquisition plate 131, and the guide pins 141 are located in the middle part of the acquisition plate 131; further, there are multiple guide pins 141, each of which is clamped between two adjacent acquisition plate connectors 132, and there are two guide seats 143, which are located at the edge of the acquisition plate connector 132, that is, one side of the acquisition plate connector 132 is a guide pin 141, and the other side is a guide seat 143.

[0074] Therefore, based on the above structural form, the technical effect can be deduced as follows: when the acquisition board 131 moves the acquisition board connector 132 to the mounting plate 111, the guide post 144 on the mounting plate 111 can accurately insert into the positioning groove 1431 of the guide seat 143, thereby providing precise positioning and guidance for the mating of the acquisition board connector 132 and the acquisition line connector 121. This ensures that during the movement of the acquisition board 131, it can be guided to mate in the correct direction and position, avoiding connection problems caused by inaccurate alignment. At the same time, through the cooperation of the guide post 144 and the positioning groove 1431, the operator can more easily and correctly mate the acquisition board connector 132 onto the acquisition line connector 121 without complicated alignment operations, thereby reducing the number of adjustments required by the operator and improving mating efficiency. In addition, the cooperation between the positioning groove 1431 and the guide post 144 is equivalent to a locking mechanism. After the guide post 144 is inserted into the positioning groove 1431, it can ensure that the connection between the acquisition board connector 132 and the acquisition line connector 121 is stable and reliable, reduce the shaking of the acquisition board 131 during the connection process, and improve the stability of signal transmission.

[0075] In other embodiments, positioning components with positioning functions in other structural forms can be provided on the acquisition board assembly 13 and the acquisition line assembly 12, and no specific limitations are imposed.

[0076] like Figure 2 As shown, the mounting frame 11 includes two enclosure plates 113 and two guide plates 114. The enclosure plates 113 and the guide plates 114 are arranged adjacent to each other, that is, the two guide plates 114 are arranged opposite to each other, and the two operating plates are arranged opposite to each other.

[0077] The two enclosure plates 113 and the two guide plates 114 are arranged to form the installation channel 112, and the two ends of the installation plate 111 are connected to the two guide plates 114.

[0078] It is understood that the enclosure plate 113 and the guide plate 114 are alternately arranged to form the mounting frame 11, and the mounting channel 112 is formed at its center, allowing the acquisition plate assembly 13 to enter the mounting channel 112. At the same time, both ends of the mounting plate 111 overlap with the two guide plates 114 respectively, ensuring the stability of the mounting plate 111 fixed on the mounting frame 11.

[0079] Therefore, based on the above structural form, the technical effect can be deduced as follows: the guide plate 114 serves as a support structure. By connecting the two ends of the mounting plate 111 to two oppositely arranged guide plates 114, it not only enhances the stability of the mounting plate 111 connected to the guide plate 114, but also ensures that the entire mounting frame 11 can effectively resist external forces and vibrations caused by the movement of the acquisition plate assembly 13 within the mounting channel 112, thus guaranteeing the structural stability of the entire mounting frame 11.

[0080] like Figure 3 As shown, at least one of the guide plates 114 is provided with a guide groove 1141, which is disposed on the side of the guide plate 114 facing the mounting channel 112, that is, located on the inner wall surface of the mounting channel 112.

[0081] The guide groove 1141 is provided along the extension direction H of the mounting channel 112, and the acquisition plate 131 can be embedded in the guide groove 1141. The guide groove 1141 is used to provide guidance for the movement of the acquisition plate 131.

[0082] In this embodiment of the application, both guide plates 114 are provided with guide grooves 1141, and the guide grooves 1141 on both sides are correspondingly provided to provide symmetrical support. In this way, when the acquisition plate 131 is located in the guide groove 1141 on one side, the guide groove 1141 on the other side will not cause the acquisition plate 131 to tilt, ensuring that the acquisition plate 131 is always in a position parallel to the surrounding plate 113 in the installation channel 112.

[0083] In this embodiment, the guide groove 1141 is provided through the extension direction H of the mounting channel 112, that is, there are no blocking elements at both ends of the mounting channel 112 to restrict the movement of the acquisition board 131. This arrangement not only facilitates the acquisition board 131 to be embedded in the guide groove 1141, but also facilitates the flexible adjustment of the acquisition board 131 in the guide groove 1141 without restricting its specific movement position, so that the acquisition board connector 132 and the acquisition line connector 121 can be correctly inserted.

[0084] In this embodiment of the application, the guide groove 1141 extends from one end to the mounting plate 111 at the other end, so that the mounting plate 111 is located at the end of the guide groove 1141, so that the acquisition plate 131 can move directly to the mounting plate 111 along the setting direction of the guide groove 1141.

[0085] In other embodiments, the structure of the guide groove 1141 can be set as needed based on the structure of the acquisition board assembly 13. For example, along the extension direction H of the mounting channel 112, since the length of the acquisition board connector 132 occupies three-quarters of the overall length of the acquisition board assembly 13, the guide groove 1141 can be set to extend only to three-quarters of the length of the mounting channel 112. In this way, when the acquisition board 131 moves in the guide groove 1141, after moving to the end of the travel of the guide groove 1141, the movement of the acquisition board 131 is restricted, avoiding excessive movement of the acquisition board 131 that could cause the acquisition board connector 132 to collide or break relative to the acquisition line connector 121.

[0086] Therefore, the technical effects derived from the above structural form are as follows: Since the guide groove 1141 is located on the inner wall of the installation channel 112, the acquisition plate 131 can be embedded in the guide groove 1141 when moving. The guide groove 1141 provides a clear path for the movement of the acquisition plate 131, ensuring that the acquisition plate 131 can move accurately along the predetermined direction during installation, thereby limiting the movement direction of the acquisition plate 131, improving the alignment accuracy between the acquisition plate connector 132 and the acquisition line connector 121, and avoiding misalignment. Furthermore, the setting of the guide groove 1141 simplifies the installation and replacement process of the acquisition plate 131, providing an intuitive guiding path. The operator does not need to precisely control the direction of the acquisition plate 131, but only needs to move it along the guide groove 1141, reducing the difficulty of operation and improving work efficiency.

[0087] In a preferred embodiment, the cross-sectional dimension of the guide groove 1141 along the extension direction H of the mounting channel 112 is not less than the radial dimension of the acquisition plate 131.

[0088] This design, when the cross-sectional dimensions of the guide groove 1141 are sufficient to meet the size requirements of the acquisition plate 131, provides a more stable guiding effect. This is because the movement of the acquisition plate 131 within the guide groove 1141 is more comprehensively restricted, reducing lateral swaying. Furthermore, the larger cross-sectional dimensions allow the guide groove 1141 to accommodate more installation errors. Even if the acquisition plate 131 deviates slightly from its initial position, it can still smoothly enter the guide groove 1141. If the radial dimension of the guide groove 1141 is small, the acquisition plate 131 must be aligned very precisely for insertion. The larger cross-sectional dimensions provide more docking space, making operation more forgiving.

[0089] Based on the above, it is understandable that during wafer aging performance testing, a large number of acquisition lines must be deployed to collect test data in order to monitor and record various performance indicators of the wafer in real time. Each acquisition line is responsible for transmitting specific data of the wafer during the testing process, resulting in a very large number of acquisition lines. Consequently, the number of acquisition boards 131 also increases accordingly. Therefore, in order to place multiple acquisition boards 131 into the mounting frame 11, multiple guide slots 1141 are also needed to provide specific accommodating areas for the assembly of each acquisition board assembly 13, ensuring that there is no interference between adjacent acquisition boards 131.

[0090] Therefore, as Figure 3 As shown, there are multiple guide grooves 1141, and the multiple guide grooves 1141 are arranged at intervals along the extension direction H perpendicular to the mounting channel 112.

[0091] This configuration provides multiple guide slots 1141 with an independent accommodating area for each acquisition board assembly 13, ensuring that each acquisition board 131 has its own fixed position. This guarantees that each acquisition board 131 can be accurately placed and positioned without interfering with other acquisition boards 131, maintaining the order and stability within the entire mounting frame 11. It also allows for independent assembly and disassembly of each acquisition board assembly 13 without affecting others. Furthermore, by rationally designing the spacing of the guide slots 1141, the internal space of the mounting frame 11 can be effectively utilized, accommodating more acquisition board assemblies 13 within a limited space, thus improving space utilization.

[0092] like Figures 4-5 As shown, the mounting plate 111 is provided with a slot 161 and a fixing member 162. The insertion end of the acquisition line connector 121 is embedded in the slot 161. The fixing member 162 is provided at least on one side of the acquisition line connector 121 to fix the acquisition line connector 121 on the mounting plate 111.

[0093] It is understood that the acquisition line connector 121 can pass through the mounting plate 111, and the acquisition line connector 121 and the mounting plate 111 are fixedly connected by the fastener 162.

[0094] In this embodiment, the fixing member 162 is a C-shaped structure, surrounding the three sides of the acquisition line connector 121, preferably located at both ends of the length of the acquisition line connector 121 and around one of its circumferences. In other embodiments, the fixing member 162 can also be configured as multiple L-shaped structures, with the multiple L-shaped structures surrounding the four corners of the acquisition line connector 121, so as to limit the acquisition line connector 121 from all directions.

[0095] In this embodiment, the fastener 162 connects the acquisition line connector 121 and the mounting plate 111 using screws.

[0096] Therefore, the technical effect that can be derived from the above structural form is: by setting the fixing part 162, the acquisition line connector 121 can be firmly fixed on the mounting plate 111, ensuring that the acquisition board connector 132 will not be displaced during insertion and removal or under the action of other external forces, thus ensuring the stability of the overall structure.

[0097] Based on the above structural form, the operation process of the test signal acquisition mechanism 100 in this application during use will be described in detail below:

[0098] In the preparation stage of wafer aging test, each acquisition line is first connected to the acquisition line connector 121 on the mounting plate 111. Then, one end of the acquisition board connector 132 is inserted into the mounting channel 112, ensuring that both ends of the acquisition board 131 are precisely embedded in the guide groove 1141, thereby pushing the acquisition board 131 to move smoothly along the preset direction of the guide groove 1141. Next, using the positioning function of the guide seat 143 and the guide post 144, and the precise positioning of the guide pin 141 and the guide hole 142, the acquisition board connector 132 and the acquisition line connector 121 are accurately mated, completing the assembly of the test signal acquisition mechanism 100. After the test, if the acquisition board 131 needs maintenance, simply pull out the insertion part of the acquisition board connector 132 and the acquisition line connector 121, and then pull out the acquisition board assembly 13 along the direction of the guide groove 1141 to remove it from the mounting frame 11 for maintenance or replacement.

[0099]

Example 2

[0100] like Figures 10-12 As shown in Embodiment 2 of this application, a wafer aging test apparatus 200 is disclosed, which is used to perform aging tests on wafers to test the aging performance of wafers in order to ensure the quality and reliability of wafers.

[0101] The wafer aging test apparatus 200 includes:

[0102] Probe plate assembly 2;

[0103] The heat sink assembly 22 is used to support the wafer and to form a test cavity for testing the wafer by molding with the probe plate assembly;

[0104] Alignment mechanism 23 is used to drive the heat sink assembly 22 to align with the probe plate assembly 21 to form the test cavity;

[0105] The electronic control component 24 is electrically connected to the alignment mechanism 23 and is used to control the movement of the alignment mechanism 23.

[0106] At least one test signal acquisition mechanism 100 as described in Embodiment 1, each of the test signal acquisition mechanisms 100 is electrically connected to the probe plate assembly 21 and the heat sink assembly 22 respectively through the acquisition line assembly 12, so as to acquire wafer electrical performance data in the test cavity.

[0107] like Figure 12 As shown, the wafer is disposed on the upper surface of the heat sink assembly 22, the heat sink assembly 22 is disposed on the alignment mechanism 23, and the probe plate assembly 21 is disposed on the frame 25, with the probes on the probe plate assembly 21 facing downwards. Specifically, the alignment mechanism 211 is used to move the wafer and the heat sink assembly 22 in the XYZR direction, moving them to the corresponding area below the probe plate assembly 21 for wafer data acquisition. Specifically, the wafer and the heat sink assembly 22 are moved to the area below the probe plate in the probe plate assembly 21, and the probes on the probe plate contact the wafer to detect the electrical parameters of each chip on the wafer. The electrical parameters include at least voltage data and current data. The specific detection principle and detection process are existing technologies and will not be described in detail here.

[0108] Wherein, the X direction mentioned above refers to a first direction on the horizontal plane, the Y direction refers to a second direction on the horizontal plane perpendicular to the first direction, the Z direction refers to the vertical direction, and the R direction refers to the direction of circumferential rotation along the wafer's own axis. See details... Figure 12 The labels shown are as follows.

[0109] Understandably, one end of the acquisition line is connected to the probe plate assembly 21 and the heat sink assembly 22, and the other end is connected to the acquisition line connector 121 to realize data transmission.

[0110] In the embodiments of this application, such as Figure 11 As shown, the wafer aging test device 200 includes three test modules. Each test module includes a probe plate assembly 21, a heat sink assembly 22, an alignment mechanism 23, an electrical control assembly 24, and a test signal acquisition mechanism 100.

[0111] In other embodiments, a test module 22 may also be configured to include multiple test signal acquisition mechanisms 100, which can be configured as needed based on the test requirements of the wafer aging test device 200.

[0112] Therefore, based on the above structural form, the technical effects that can be derived are as follows: The test signal acquisition mechanism 100 is electrically connected to the probe board assembly 21 and the heat sink assembly 22 through the acquisition line assembly 12. This not only enables efficient acquisition of electrical parameter data of the wafer during the aging test, ensuring the real-time nature and accuracy of the data, but also simplifies the test process and improves the efficiency of data processing. Simultaneously, the design of the test signal acquisition mechanism 100 enhances its maintainability, allowing for rapid maintenance operations in case of malfunctions or when maintenance is required, thus improving the convenience and efficiency of maintenance.

[0113] The foregoing description has fully disclosed the specific embodiments of this application. It should be noted that any modifications made by those skilled in the art to the specific embodiments of this application do not depart from the scope of the claims. Accordingly, the scope of the claims of this application is not limited to the foregoing specific embodiments.

Claims

1. A test signal acquisition mechanism, characterized in that, It includes: The mounting frame has a mounting channel, and the mounting frame includes a mounting plate disposed at the end of the mounting channel; A data acquisition line assembly includes a data acquisition line and a data acquisition line connector. The data acquisition line connector is disposed on the mounting plate, with one end of the data acquisition line connector facing the mounting channel and the other end used to connect to the data acquisition line. The acquisition board assembly includes an acquisition board and an acquisition board connector, the acquisition board connector being disposed at an end of the acquisition board, and the acquisition board assembly being movable within the mounting channel, such that the acquisition board connector and the acquisition line connector are mated together.

2. The test signal acquisition mechanism according to claim 1, characterized in that, The acquisition board is provided with guide pins, which are located near the acquisition board connector and extend toward the side away from the acquisition board. The mounting plate is provided with guide holes corresponding to the guide pins. The guide pins can be embedded in the guide holes to provide positioning for the mating of the acquisition board connector and the acquisition line connector.

3. The test signal acquisition mechanism according to claim 2, characterized in that, The acquisition board is provided with a connecting block, and the guide pin is disposed on the connecting block. Along the extension direction of the installation channel, the guide pin and the acquisition board are misaligned.

4. The test signal acquisition mechanism according to claim 1 or 2, characterized in that, The acquisition board is provided with a guide seat, which is located near the acquisition board connector. The guide seat is provided with a positioning groove, and the opening of the positioning groove is located on the side away from the acquisition board. The mounting plate is provided with guide posts corresponding to the positioning slots. The guide posts extend toward one side of the mounting channel and can be embedded in the positioning slots to provide positioning for the mating of the acquisition board connector and the acquisition line connector.

5. The test signal acquisition mechanism according to claim 1, characterized in that, The mounting frame includes two enclosure panels and two guide plates, which are arranged adjacent to each other to form the mounting channel. Both ends of the mounting plate are connected to the two guide plates.

6. The test signal acquisition mechanism according to claim 5, characterized in that, At least one of the guide plates is provided with a guide groove, the guide groove is disposed on the side of the guide plate facing the mounting channel, the guide groove is disposed along the extension direction of the mounting channel, the acquisition plate can be embedded in the guide groove, and the guide groove is used to provide guidance for the movement of the acquisition plate.

7. The test signal acquisition mechanism according to claim 6, characterized in that, Along the extension direction of the installation channel, the cross-sectional dimension of the guide groove is not less than the radial dimension of the acquisition plate.

8. The test signal acquisition mechanism according to claim 6, characterized in that, The number of guide grooves is multiple, and the multiple guide grooves are arranged sequentially at intervals along the extension direction perpendicular to the installation channel.

9. The test signal acquisition mechanism according to claim 1, characterized in that, The mounting plate is provided with a slot and a fixing member. The acquisition line connector is used for the insertion end of the acquisition board connector to be inserted into the slot. The fixing member is provided at least on one side of the acquisition line connector to fix the acquisition line connector on the mounting plate.

10. A wafer aging test apparatus, characterized in that, It includes: Probe plate assembly; A heat sink assembly is used to support the wafer and, together with the probe plate assembly, forms a test cavity for testing the wafer; The alignment mechanism is used to align the heat sink assembly with the probe plate assembly to form the test cavity; An electronic control component, electrically connected to the alignment mechanism, is used to control the movement of the alignment mechanism; At least one test signal acquisition mechanism as described in any one of claims 1-9, wherein each of the test signal acquisition mechanisms is electrically connected to the probe plate assembly and the heat sink assembly respectively through the acquisition line assembly, for acquiring wafer electrical performance data within the test cavity.

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