Wafer aging test equipment and test system

Abstract

The utility model relates to wafer aging test equipment and system, and the equipment comprises at least one test unit, each test unit comprises at least one aging test device, and the at least one aging test device is stacked in the vertical direction. Any aging test device comprises a test assembly, an electric control assembly and a test signal acquisition mechanism; the test assembly comprises a probe plate assembly, a heat sink assembly and an alignment mechanism; the alignment mechanism is electrically connected with the electric control assembly so as to realize alignment and cavity closing of the probe plate assembly and the heat sink assembly; and the probe plate assembly and the heat sink assembly are electrically connected with the test signal acquisition mechanism respectively so as to realize the electrical performance test of the corresponding wafer. The wafer aging test equipment has remarkable advantages in the aspects of space utilization, test process optimization, operation convenience, adaptation to special environmental conditions and the like, and can meet the requirements of high precision, high reliability and high efficiency of wafer aging test in a high-temperature and high-pressure environment.

Description

Technical Field

[0001] This application relates to the field of wafer testing technology, specifically to a wafer aging test equipment and testing system. Background Technology

[0002] In the field of modern semiconductor manufacturing, wafer aging test is a key step in ensuring chip quality and reliability. With the continuous advancement of semiconductor technology, the requirements for its efficiency, accuracy and stability are becoming increasingly stringent.

[0003] Existing wafer aging test equipment suffers from several drawbacks. First, it is poorly designed, occupies a large space, and has low testing efficiency, making it difficult to meet the needs of large-scale production. Second, the equipment has poor structural stability and is prone to performance degradation and frequent failures under special testing environments such as high temperature and high pressure, affecting the stability of the test. Utility Model Content

[0004] To address the various issues in existing wafer aging test equipment, such as inefficient space utilization, low productivity, and poor stability in special environments.

[0005] This application provides a wafer aging test equipment, including at least one test unit, each of the test units including at least one aging test device, and the at least one aging test device is stacked in a vertical direction;

[0006] Any of the aforementioned aging test apparatuses includes a test component, an electrical control component, and a test signal acquisition mechanism; the test component includes a probe plate assembly, a heat sink assembly, and an alignment mechanism; the alignment mechanism is electrically connected to the electrical control component to achieve alignment and cavity closing between the probe plate assembly and the heat sink assembly; the probe plate assembly and the heat sink assembly are respectively electrically connected to the test signal acquisition mechanism to achieve electrical performance testing of the corresponding wafer.

[0007] Furthermore, it includes at least two test units, which are arranged in parallel along the same extending direction.

[0008] Furthermore, the test components, the electronic control components, and the test signal acquisition mechanism are arranged in a row in the aging test device.

[0009] Furthermore, the heat sink assembly includes a heat sink outer frame, and a detachable heat sink is disposed inside the heat sink outer frame;

[0010] The bottom of the heat sink outer frame is provided with at least one air inlet, and the bottom surface of the heat sink is provided with a vent corresponding to at least one air inlet; the interior of the heat sink outer frame is provided with an air passage communicating with the air inlet and the vent.

[0011] Furthermore, the aging test apparatus includes a gantry frame, and the heat sink assembly and alignment mechanism are movably disposed within the gantry frame.

[0012] Furthermore, the aging test device includes a visual positioning mechanism, which is connected to the gantry and located between the probe plate assembly and the heat sink assembly;

[0013] The visual positioning mechanism includes a two-way field-of-view camera and a two-way moving component; the two-way field-of-view camera is mounted on the two-way moving component, and the two-way moving component is connected to the gantry frame to drive the two-way field-of-view camera to move along a first direction and a second direction.

[0014] Furthermore, the gantry frame includes a base plate, a top plate, and multiple columns;

[0015] Multiple columns are evenly distributed on both sides of the base plate, and the top plate is located above the columns and fixedly connected to them. The top plate is used to fix the probe plate assembly.

[0016] Furthermore, the alignment mechanism includes a first alignment component, a second alignment component, and a third alignment component;

[0017] The first alignment component is disposed on the bottom support plate along the first direction; the second alignment component is disposed above the first alignment component along the second direction and is slidably connected to the first alignment component; the third alignment component is disposed above the second alignment component, for supporting the heat sink component and driving the heat sink component to move in the third direction.

[0018] Furthermore, the alignment mechanism also includes an angle adjustment component, which is connected to the heat sink outer frame and is used to drive the heat sink outer frame to rotate around its axis.

[0019] This application also provides a wafer aging test system, including wafer loading and unloading equipment, wafer transport equipment, and the wafer aging test equipment;

[0020] Along the extension direction of the wafer transport equipment, the wafer loading and unloading equipment and the wafer aging test equipment are both located on the same side of the wafer transport equipment.

[0021] Implementing the embodiments of this application has the following beneficial effects:

[0022] This application's wafer aging test equipment optimizes the layout of the test units in both the vertical and horizontal directions. It reduces the horizontal footprint of the equipment, allowing more test units to be accommodated within a limited floor space or working area, thus improving overall testing efficiency. The specific arrangement of test components, electrical control components, and test signal acquisition mechanisms within each test rack layer facilitates more convenient and efficient connections and collaborative work, further enhancing overall space utilization and enabling a more efficient testing process within a limited space. The tighter connections between components also result in more stable signal transmission, thereby improving test accuracy and stability.

[0023] This application, through the structural layout of the test unit and the design of the gantry, alignment mechanism and vision positioning mechanism, gives the equipment significant advantages in terms of space utilization, test process optimization, ease of operation and adaptability to special environmental conditions, and can meet the high precision, high reliability and high efficiency requirements of wafer aging test under high temperature and high pressure environment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the test unit in an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of the structure of the test component in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the structure of the first alignment component in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of the structure of the second alignment component in an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the structure of the second alignment component and the support plate in an embodiment of this application;

[0030] Figure 6 This is a schematic diagram of the structure of the third alignment component in an embodiment of this application;

[0031] Figure 7 This is a structural schematic diagram of the pressure-bearing platform and heat sink assembly according to an embodiment of this application;

[0032] Figure 8 This is a schematic diagram of the structure of the heat sink assembly according to an embodiment of this application;

[0033] Figure 9 This is a front view of the heating module to the heat sink in an embodiment of this application;

[0034] Figure 10 This is a schematic diagram of the bottom structure of the heat sink outer frame according to an embodiment of this application;

[0035] Figure 11 This is a schematic diagram of the ventilation structure in the outer frame of the heat sink in an embodiment of this application.

[0036] Figure 12 This is a schematic diagram showing the connection between the visual positioning mechanism and the gantry in an embodiment of this application;

[0037] Figure 13 This is a schematic diagram of the structure of the visual positioning mechanism according to an embodiment of this application;

[0038] Figure 14 This is a schematic diagram of the aging test system according to an embodiment of this application.

[0039] In the figure, the corresponding reference numerals are as follows: 100, test unit; 1, aging test device; 10, test frame; 101, crossbeam; 2, test component; 201, bottom support plate; 21, probe plate assembly; 22, heat sink assembly; 221, heat sink outer frame; 2211, air inlet; 2212, air passage; 222, heat sink; 223, heating module; heat spreader; 224; 225, adapter; 23, alignment mechanism; 231, first alignment component; 2311, first guide component; 2312, first drive component; 232, second alignment component; 2321, moving support. 2322, Second guide assembly; 2323, Second drive assembly; 233, Third alignment assembly; 2331, Support plate; 2332, Linear drive assembly; 234, Angle adjustment assembly; 235, Pressure bearing platform; 3, Electrical control assembly; 4, Test signal acquisition mechanism; 5, Gantry; 51, Base plate; 52, Top plate; 53, Column; 6, Visual positioning mechanism; 61, Two-way field of view camera; 62, Two-way movement assembly; 621, First direction movement assembly; 622, Second direction movement assembly; 200, Wafer loading and unloading equipment; 300, Wafer transport equipment. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0041] In the description of this application, it should be understood that the terms "upper," "lower," "inner," "outer," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or regarding the vertical, perpendicular, or gravitational direction of the component itself. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0042] The following combination Figures 1-13 This application provides a wafer-level aging test equipment, including at least one test unit 100, each test unit 100 including at least one aging test device 1, and the at least one aging test device 1 is stacked in a vertical direction.

[0043] like Figure 1 As shown, any aging test device 1 includes a test component 2, an electrical control component 3, and a test signal acquisition mechanism 4; the test component 2 includes a probe plate assembly 21, a heat sink assembly 22, and an alignment mechanism 23; the alignment mechanism 23 is electrically connected to the electrical control component 3 to realize the alignment and cavity closing of the probe plate assembly 21 and the heat sink assembly 22; the probe plate assembly 21 and the heat sink assembly 22 are respectively electrically connected to the test signal acquisition mechanism 4 to realize the electrical performance test of the corresponding wafer.

[0044] It should be noted that the specific number of test units 100 in this embodiment of the wafer aging test equipment can be determined according to actual production needs. At least two test units 100 can be arranged in parallel along the same extension direction. Each test unit 100 can interface with the wafer transport equipment 300 to smoothly complete wafer loading, unloading, handling, and aging tests. Specifically, each test unit 100 can complete the aging test tasks of a corresponding number of wafers based on its own layer number. For example, a test unit 100 with three aging test devices 1 stacked vertically can ideally complete the aging test of up to three wafers at a time. In large-scale production scenarios, multiple test units 100 can be set up to work in parallel to improve overall testing efficiency.

[0045] At least one aging test device 1 is stacked vertically to form a multi-layer structure. This stacking arrangement effectively utilizes space and reduces the equipment footprint. Within each aging test device 1, the test component 2, the electrical control component 3, and the test signal acquisition mechanism 4 are arranged in a row. This compact and orderly arrangement greatly optimizes the horizontal space utilization of the aging test device 1, and also makes the connection and collaborative work between components more convenient and efficient, avoiding space waste caused by scattered layout of units, and significantly improving the overall space utilization rate. After the test component 2 completes the placement and alignment of the wafer, the electrical control component 3 can apply corresponding electrical signals to the wafer to perform aging tests according to the test requirements, while the test signal acquisition mechanism 4 is responsible for collecting various data in real time during the test process. The tighter connection between the components also makes the signal transmission more stable, thereby improving the test accuracy and stability.

[0046] It should be noted that the wafer aging test apparatus 1 of this application includes a first direction, a second direction, and a vertical direction that are perpendicular to each other. The first direction is the horizontal arrangement direction of the components within the test unit 100, that is, the arrangement direction of the test components 2, the electronic control components 3, and the test signal acquisition mechanism 4 in each layer of the test rack. The second direction is a horizontal direction perpendicular to the first direction, and is the same as the conveying direction of the wafer transport equipment 300. The vertical direction is the stacking direction of the test unit 100, that is, the arrangement direction of the multi-layer aging test apparatus 1 stacked together.

[0047] The layout of the wafer aging test apparatus 1 in this application optimizes the space utilization of the test unit 100 in both the vertical and horizontal directions. This reduces the equipment's footprint on the horizontal plane, allowing more test units 100 to be accommodated within a limited floor space or working area, thus improving overall testing efficiency. The specific arrangement of the test components 2, electrical control components 3, and test signal acquisition mechanisms 4 within each layer of the aging test apparatus 1 makes their connection and collaborative operation more convenient and efficient, further enhancing overall space utilization and enabling the equipment to achieve a more efficient testing process within a limited space.

[0048] In one possible implementation, each test unit 100 includes at least three aging test devices 1 stacked vertically. In another possible implementation, three test units 100 are provided, arranged parallel to each other, and each test unit 100 includes three aging test devices 1. During testing, each layer of aging test devices 1 in each test unit 100 can complete the aging test of one wafer, and the three test units 100 can simultaneously complete the aging test of up to nine wafers.

[0049] In one possible implementation, at least two test units 100 are arranged on the same side of the wafer transport equipment 300 along the transport direction of the wafer transport equipment 300, and the test units 100 are arranged perpendicular to the transport direction of the wafer transport equipment 300.

[0050] It should be noted that the conveying channel of the wafer transport equipment 300 extends along the second direction, and the testing unit 100 is set perpendicular to the conveying direction of the wafer transport equipment 300. This makes the transmission path of the wafer from the wafer transport equipment 300 to the testing unit 100 clearer and more direct, reducing turns and detours during transmission and lowering the risk of damage such as collisions and scratches to the wafers during transmission. This layout effectively utilizes space, reducing the horizontal footprint of the equipment. In large-scale production environments, this layout allows for the placement of more testing units 100 within limited workshop space, increasing production capacity per unit area and reducing production costs.

[0051] Furthermore, such as Figure 2 As shown, the aging test device 1 includes a gantry frame 5, a heat sink assembly 22, and an alignment mechanism 23 movably disposed within the gantry frame 5. The gantry frame 5 includes a base plate 51, a top plate 52, and multiple columns 53. The multiple columns 53 are evenly distributed on both sides of the base plate 51, and the top plate 52 is located above the columns 53 and is fixedly connected to the columns 53. The top plate 52 is used to fix the probe plate assembly 21.

[0052] In practical applications, the base plate 51, top plate 52, and columns 53 are connected by bolts, welding, or other methods to form a stable frame structure. The frame structure of the gantry 5 provides excellent stability and rigidity, effectively protecting the internal test assembly 2 and probe plate assembly 21, reducing vibration and deformation during operation, and ensuring the accuracy and reliability of test results. Placing the test assembly 2 within the gantry 5 makes the entire testing process more compact and orderly. Operators can conveniently perform loading and unloading operations within the gantry 5, reducing wasted space and time and improving production efficiency.

[0053] The probe plate assembly 21 is disposed inside the gantry 5 and its back side is connected to the top plate 52 of the gantry 5. The probes on the front side of the probe plate assembly 21 are used to make electrical connections with the wafer and collect test data. In one possible implementation, positioning pins and mounting holes can be provided on the top plate 52. The probe plate assembly 21 is initially positioned by the positioning pins and then fixed to the top plate using bolts or other fasteners. Furthermore, a shock-absorbing pad or other buffer device can be provided between the probe plate assembly 21 and the top plate 52 to reduce the impact of vibrations generated during testing on the probe plate assembly 21.

[0054] The aging test apparatus 1 includes a test frame 10, which comprises multiple crossbeams 101 for layering the crossbeams, spaced apart vertically. The base plate 51 is connected to the corresponding crossbeams 101 on both sides. Optionally, the base plate 51 can be connected to the crossbeams 101 by overlapping, snap-fitting, bolting, welding, riveting, etc., which allows for a more even distribution of stress on both sides of the crossbeams 101. This connection method avoids stress concentration in a specific area of ​​the crossbeams 101, improving the load-bearing capacity and service life of the crossbeams 101, while also reducing the risk of equipment failure and damage due to stress concentration.

[0055] In some possible implementations, a positioning column structure is provided above the top plate 52, and mounting components are provided on the bottom plate 51. The mounting components on the bottom plate 51 of the upper-layer gantry 5 are fixedly connected to the corresponding positioning column structure on the top plate 52 of the lower-layer gantry 5. Through the fixed connection of the positioning column structure and the mounting components, adjacent layers of gantry 5 can be tightly connected together to form a stable integral structure. This connection method can effectively transmit and distribute the various forces borne by the gantry 5 during operation, enhance the overall strength and rigidity of the gantry 5, and improve the reliability and service life of the equipment.

[0056] Furthermore, the test assembly 2 includes a bottom support plate 201, which is located inside the gantry 5 and positioned above the base plate 51. The bottom support plate 201 protrudes from the base plate 51 in a first direction to dock with the wafer transport equipment 300.

[0057] The gantry 5 provides a stable support structure for the test assembly 2. One end of the bottom support plate 201 protrudes from the base plate 51, allowing for accurate docking between the bottom support plate 201 and the wafer transport equipment 300, ensuring a smooth transition of the wafer during transport. In one possible implementation, the protruding portion of the bottom support plate 201 extends into the transport channel of the wafer transport equipment 300. Preferably, the edge or a specific position on the bottom of the bottom support plate 201 is provided with a positioning structure or connecting device that matches the wafer transport equipment 300, ensuring precise alignment between the bottom support plate 201 and the wafer transport equipment 300. Furthermore, slots, snap-fit ​​connections, or other connection methods can be used to further enhance the stability and reliability of the connection between the two.

[0058] The gantry frame 5 installed within each layer of the aging test device 1 in this application provides a stable support structure for the test assembly 2 and the probe plate assembly 21. The frame structure of the gantry frame 5 exhibits excellent stability and rigidity. During equipment operation, especially under special environments such as high temperature and high pressure, the gantry frame 5 can effectively resist various forces, reducing equipment vibration and deformation, thereby ensuring the accuracy and reliability of test results. For example, under working conditions of nitrogen atmosphere with a pressure of approximately 0.3 MPa, a temperature of 200 degrees Celsius, and a high voltage of 4000V, the stable structure of the test frame 1 and the gantry frame 5 can prevent loosening or displacement of equipment components caused by various factors, ensuring the stability of the testing process.

[0059] Furthermore, such as Figure 2 As shown, the alignment mechanism 23 is located below the heat sink assembly 22. The alignment mechanism 23 includes a pressure-bearing platform 235, and the heat sink assembly 22 is located on the pressure-bearing platform 235 for supporting the wafer.

[0060] The alignment mechanism 23 includes a first alignment component 231, a second alignment component 232, and a third alignment component 233. The first alignment component 231 is disposed on the bottom support plate 201 along a first direction. The second alignment component 232 is disposed above the first alignment component 231 along a second direction and is slidably connected to the first alignment component 231. The third alignment component 233 is disposed above the second alignment component 232 and is used to support the heat sink component 22 and drive the heat sink component 22 to move in a third direction.

[0061] like Figure 7 As shown, the alignment mechanism 23 also includes an angle adjustment component 234, which is mounted on the pressure platform 235 and connected to the heat sink outer frame 221. The angle adjustment component 234 drives the heat sink outer frame 221 to rotate around its central axis perpendicular to it, thereby adjusting the wafer angle. It should be noted that the angle adjustment component 234 can be powered by a motor, pneumatic motor, or other drive device, and drives the heat sink assembly 22 to rotate around its central axis via a crank-slider mechanism, eccentric wheel mechanism, or gear and rack mechanism. The control device, electrically connected to the angle adjustment component 234, can precisely control the rotation angle and speed, thereby achieving precise adjustment of the wafer angle and ensuring accurate alignment of the wafer with the pads of the probe board assembly 21, thus improving the accuracy and reliability of the test.

[0062] The alignment mechanism 23 of this application enables high-precision alignment of the test component 2 in three-dimensional space, meeting the high-precision requirements for wafer alignment and testing. Through the coordinated work of the first alignment component 231, the second alignment component, the third alignment component, and the angle adjustment component, the wafer can be precisely positioned in the first, second, third, and circumferential directions. This high-precision alignment capability ensures that the wafer can achieve accurate electrical connection and alignment with components such as the probe board assembly 21 during testing, improving the accuracy and repeatability of test data. For example, under high temperature and high pressure environments, the wafer may experience slight displacement due to thermal expansion and other factors; the high-precision positioning capability of the alignment mechanism 23 can effectively compensate for these displacements, ensuring the accuracy of the test.

[0063] Furthermore, such as Figure 3 As shown, the first alignment component 231 includes a first guide component 2311 and a first drive component 2312; the first guide component 2311 is connected to the second alignment component 232, and the first drive component 2312 is used to drive the second alignment component 232 to move along a first direction.

[0064] In this embodiment, the first guide component 2311 can be two parallel guide rail slider assemblies. The slider of the first guide component 2311 is located at the bottom of the second alignment component 232, thereby connecting the second alignment component 232 to the first guide component 2311. The first drive component 2312 can be a lead screw motor structure, which is mounted on the base plate 51 and located in the middle of the two first guide components 2311 to ensure uniform distribution of driving force. The nut assembly of the first drive component 2312 is connected to the slider of the first guide component 2311 through the movable support plate 2321. When the first drive component 2312 starts and rotates, its output shaft drives the lead screw nut to move, thereby driving the slider of the first guide component 2311 to move along the corresponding guide rail, thereby driving the second alignment component 232 to move in the first direction. The coordinated operation of the first drive component 2312 and the first guide component 2311 enables high-precision motion control of the second alignment component 232, ensuring its stability during movement, reducing the impact of mechanical vibration on motion accuracy, and significantly improving the position adjustment accuracy of the alignment mechanism 23 in the first direction.

[0065] In other possible implementations, the first drive assembly 2312 may also adopt a linear drive structure such as a linear motor structure, a pneumatic drive, or an electric actuator.

[0066] like Figure 4 and 5As shown, the second alignment component 232 includes a movable tray 2321, a second guide component 2322 and a second drive component 2323 disposed on the movable tray 2321. The second drive component 2323 is used to drive the third alignment component 233 to move along a second direction.

[0067] In this embodiment, the second guide component 2322 can be two parallel guide rail slider assemblies. The slider of the second guide component 2322 is disposed at the bottom of the third alignment component 233, thereby connecting the third alignment component 233 and the second guide component 2322. The second drive component 2323 can be a lead screw motor structure, which is mounted on the moving support plate 2321 and located in the middle of the two second guide components 2322 to ensure uniform distribution of driving force. The nut assembly of the second drive component 2323 is connected to the slider of the second guide component 2322 through the support plate 2331. When the second drive component 2323 starts and rotates, its output shaft drives the lead screw nut to move, thereby driving the slider of the second guide component 2322 to move along the corresponding guide rail, thereby driving the third alignment component 233 to move in the second direction. The coordinated operation of the second drive component 2323 and the second guide component 2322 enables high-precision motion control of the third alignment component 233, ensuring its stability during movement, reducing the impact of mechanical vibration on motion accuracy, and significantly improving the position adjustment accuracy of the alignment mechanism 23 in the second direction.

[0068] In other possible implementations, the second drive assembly 2323 may also adopt a linear drive structure such as a linear motor structure, a pneumatic drive, or an electric actuator.

[0069] like Figure 6 As shown, the third alignment component 233 includes a support plate 2331 and a linear drive component 2332. The support plate 2331 is connected to the slider of the second guide component 2322; the linear drive component 2332 is disposed between the support plate 2331 and the pressure platform 235, and is used to drive the pressure platform 235 to move in a third direction.

[0070] This application, through the structural layout of the wafer testing unit 100 and the design of the gantry 5 and the alignment mechanism 23, gives the equipment significant advantages in terms of space utilization, test process optimization, ease of operation, and adaptability to special environmental conditions, and can meet the high precision, high reliability, and high efficiency requirements of wafer aging tests under high temperature and high pressure environments.

[0071] Examples of embodiments in this application, such as Figure 8 and 9As shown, the heat sink assembly includes a heat sink frame 221, a heat sink 222, a heating module 223, and a heat spreader 224. The heating module 223 is disposed within the heat sink frame 221 to heat the wafer placed above it. The heat spreader 224 is disposed above the heating module 223 and is used to receive external test signals. The heat sink 222 is detachably disposed within the heat sink frame 221, specifically above the heat spreader 224, and is used to support the wafer. At least one adapter 225 is disposed on the heat sink frame 221. Any adapter 225 is connected to the heating module or the heat spreader via a lead passing through the heat sink frame 221. Any adapter 225 is connected to one of a heating signal source or a test signal source.

[0072] Heating module 223 and heat spreader 224 are used to generate a high-pressure, high-temperature environment. Heating module 223 and heat spreader 224 are stacked. Heating module 223 and heat spreader 224 are respectively connected to at least one adapter 225 via leads. One adapter 225 is connected to at most one component. Adapter 225 is used to transmit signals, which can be power signals, sensor signals, or other signals.

[0073] In one possible implementation, the heating module 223 is used to connect to a heating signal source to generate a high-temperature environment. The heating signal source can be an AC signal source, and the adapter 225 connected to the heating module 223 is configured as an AC power adapter.

[0074] In one specific embodiment, a heat spreader 224 is disposed above the heating module 223. The heat spreader 224 is used to connect a test signal source to generate a test environment. The test signal source can be a high-voltage test signal source, and the test environment is a high-voltage test environment. That is, the heat spreader 224 is used to connect a high-voltage power supply signal to generate a high-voltage environment, and the adapter 225 connected to the heat spreader 224 is a high-voltage test signal source adapter.

[0075] In this embodiment, the adapter 225 is arranged circumferentially along the heat sink frame 221, and the adapter 225 passes through the heat sink frame 221 to connect with the heating module 223 or the heat spreader 224 inside the heat sink frame 221. Based on the above solution, the number of openings in the heat sink frame can be reduced, the airtightness of the heat sink frame can be improved, thereby improving the accuracy of wafer aging test results.

[0076] Furthermore, such as Figure 10 and 11As shown, the bottom of the heat sink outer frame 221 is provided with at least one air inlet 2211, which penetrates the bottom of the heat sink outer frame 221. The at least one air inlet 2211 is used to connect to an air pump, which blows or draws air into the interior of the heat sink outer frame 221 through the air inlet 2211. The bottom surface of the heat sink 222 is provided with a vent corresponding to the at least one air inlet 2211; the interior of the heat sink outer frame 221 is provided with an air passage 2212 communicating with the air inlet 2211 and the vent.

[0077] In this embodiment, the heat sink 222 has multiple vent holes on its lower surface, and its upper surface has micropores for adsorbing the wafer. The heat sink 222 also has an internal chamber for gas flow. After the wafer is placed on the heat sink 222, an air pump draws air, creating a negative pressure in the internal chamber of the heat sink 222, thus firmly adsorbing the wafer. After the aging test is completed, the air pump blows air to detach the wafer from the heat sink 222.

[0078] The embodiments of this application do not limit the specific structure of the heat sink 222. The heat sink 222 can be configured as a metal plate, or it can be configured as a microporous ceramic, or it can be configured as a combination of microporous ceramic and metal plate.

[0079] In one possible implementation, the heat sink 222 includes a microporous ceramic layer (e.g., a microporous ceramic sheet) disposed on the side facing the wafer. Microporous ceramic refers to a ceramic body containing a large number of open or closed micropores inside or on its surface. It is a functional structural ceramic with pore sizes typically in the micrometer or submicrometer range. Microporous ceramics possess adsorption properties, permeability, corrosion resistance, environmental compatibility, and biocompatibility. The heat sink 222 containing the microporous ceramic layer has small pore sizes and uniform pore distribution for adsorbing the wafer, which can solve the technical problem of wafer backside discoloration after aging tests in related technologies. Specifically, in related technologies, the adsorption pores of heat sinks used to adsorb the wafer have large pore sizes, and the part of the wafer backside in contact with the adsorption pores will discolor after aging tests, resulting in uneven color on the wafer backside. A heat sink based on microporous ceramic can prevent discoloration of the wafer backside, maintaining a consistent color.

[0080] Based on the above embodiments, in a further embodiment, in order to ensure that the color of the back side of the wafer is consistent after the aging test, a conductive pad can also be provided on the top of the heat sink 222 as a top cover plate. The conductive pad is used to place the wafer and isolate the wafer from the heat sink 222.

[0081] In this embodiment, the air passage 2212 is a tubular channel that penetrates the heating module 223 and the heat spreader 224. Specifically, the heating module 223 and the heat spreader 224 each have a first through hole. The air passage 2212 passes through the first through holes of the heating module 223 and the heat spreader 224 and communicates with the vent hole of the heat sink 222. Besides conveying gas, the air passage 2212 also has a limiting function, effectively restricting the heating module 223 and the heat spreader 224 to prevent horizontal displacement or rotation.

[0082] Furthermore, such as Figure 12 and 13 As shown, the aging test device 1 also includes a visual positioning mechanism 6, which is connected to the gantry 5 and located between the probe plate assembly 21 and the heat sink assembly 22.

[0083] The visual positioning mechanism 6 includes a two-way field-of-view camera 61 and a two-way moving component 62; the two-way field-of-view camera 61 is mounted on the two-way moving component 62, and the two-way moving component 62 is connected to the gantry 5 to drive the two-way field-of-view camera 61 to move along the first direction and the second direction.

[0084] In this embodiment, the bidirectional movement assembly 62 includes two first-direction movement assemblies 621 and one second-direction movement assembly 622, used to achieve synchronous movement of the bidirectional field-of-view camera 61 in the first and second directions. The two first-direction movement assemblies 621 are respectively fixed to the two side columns 53 of the gantry 5. Preferably, the first-direction movement assembly 621 can be a lead screw motor assembly, which consists of a servo motor, a lead screw, a nut, a guide rail, and other key components. The servo motor, as a power source, provides stable and precise power output for the movement in the first direction. The lead screw is precisely connected to the motor shaft of the servo motor via a coupling; when the motor rotates, the lead screw rotates accordingly. The rotation of the lead screw drives the nut to perform linear motion. The nut is connected to the second-direction movement assembly 622 via a mounting structure. The guide rail provides support and guidance, ensuring that the second-direction movement assembly 622 does not wobble during movement and always moves along a predetermined linear trajectory.

[0085] The second-direction movement component 622 is a lead screw motor assembly perpendicularly arranged to the first-direction movement component 621. The second-direction movement component 622 is connected to the first-direction movement component 621 via a mounting structure, ensuring that the movement in both directions can be effectively integrated and transmitted to the bidirectional field-of-view camera 61. The bidirectional field-of-view camera 61 is connected to the output end of the second-direction movement component 622. Specifically, the lead screw of the second-direction movement component 622 is connected to the bidirectional field-of-view camera 61. When the lead screw of the second-direction movement component 622 rotates under the drive of the corresponding servo motor, the lead screw directly or indirectly drives the bidirectional field-of-view camera 61 to move in the second direction, either directly or indirectly through the connecting structure. This vertically arranged structural design makes full use of space, resulting in a compact structure and a clear and defined motion trajectory for the entire bidirectional movement component 62, which helps to achieve flexible and precise positioning of the bidirectional field-of-view camera 61 in a two-dimensional plane.

[0086] The visual positioning mechanism 6 of this application, through the design of the aforementioned bidirectional moving component 62, especially the coordinated work of the two first-direction moving components 621 and the second-direction moving component 622, enables the bidirectional field-of-view camera 61 to move quickly and accurately to the shooting position of different areas on the probe plate assembly 21, greatly improving the efficiency and accuracy of visual inspection.

[0087] The bidirectional field-of-view camera 61 includes at least two independently controlled light sources, one for illuminating the probe plate assembly 21 and the other for illuminating the heat sink assembly 22. It can acquire image information from one side of the probe plate assembly 21 and the other side of the heat sink assembly 22 from the same location. In a single shooting process, images from both sides can be acquired without adjusting the camera position or using multiple cameras, greatly saving inspection time and equipment operation steps, and significantly improving the efficiency of the entire testing process.

[0088] This application also provides a wafer aging test system, such as... Figure 14 As shown, it includes wafer loading and unloading equipment 200, wafer transport equipment 300, and wafer aging test equipment.

[0089] Along the extension direction of the wafer transport equipment, the wafer loading / unloading equipment 200 and the wafer aging test equipment are both located on the same side of the wafer transport equipment 300. The wafer loading / unloading equipment 200 is used to remove the wafer from the cassette, perform edge-finding and positioning, and load it onto the heat sink 222. After loading, the heat sink 222 containing the wafer is moved to the loading section. The wafer transport equipment 300 is used to move the heat sink 222 to realize its placement and removal on the aging test equipment.

[0090] The wafer aging test system integrates wafer loading / unloading equipment 200, wafer transport equipment 300, and wafer aging test equipment into one unit. Both the wafer loading / unloading equipment 200 and the wafer aging test equipment are located on the same side of the wafer transport equipment 300. This more compact and rational spatial arrangement reduces the transport distance and time for wafers between different devices, significantly improving the efficiency of the entire testing process. The wafer loading / unloading equipment 200 automatically completes a series of operations, including removing wafers from the cassette, edge positioning, loading onto the heat sink 222, and moving the heat sink 222 to the loading / unloading section. The wafer transport equipment 300 automatically handles the transport of heat sinks containing wafers to be tested and heat sinks containing completed wafers between the loading / unloading section and the aging test equipment. This fully automated process avoids errors and delays that may occur with manual operation, improves operational accuracy and stability, and accelerates wafer loading / unloading and transport speeds, providing a strong guarantee for the efficient operation of the entire aging test process.

[0091] Obviously, the embodiments described above are merely some, not all, of the embodiments in this specification. Based on the embodiments in this specification, those skilled in the art can make other variations or modifications without creative effort, and all such variations should fall within the scope of protection of the embodiments in this specification. The specification and embodiments are considered exemplary only, and the true scope and spirit of the embodiments in this specification are indicated by the appended claims.

Claims

1. A wafer aging test device, characterized in that, It includes at least one test unit, each of the test units includes at least one aging test device, and at least one of the aging test devices is stacked in a vertical direction; Any of the aforementioned aging test devices includes a test component, an electronic control component, and a test signal acquisition mechanism; The testing assembly includes a probe plate assembly, a heat sink assembly, and an alignment mechanism; the alignment mechanism is electrically connected to the electrical control assembly to achieve alignment and cavity closing between the probe plate assembly and the heat sink assembly; the probe plate assembly and the heat sink assembly are respectively electrically connected to the test signal acquisition mechanism to achieve electrical performance testing of the corresponding wafer.

2. The wafer aging test equipment according to claim 1, characterized in that, It includes at least two test units, which are arranged in parallel along the same extension direction.

3. The wafer aging test equipment according to claim 1, characterized in that, The test components, the electronic control components, and the test signal acquisition mechanism are arranged in a row in the aging test device.

4. The wafer aging test equipment according to claim 1, characterized in that, The heat sink assembly includes a heat sink outer frame, and a detachable heat sink is provided inside the heat sink outer frame; The bottom of the heat sink outer frame is provided with at least one air inlet, and the bottom surface of the heat sink is provided with a vent corresponding to at least one air inlet; the interior of the heat sink outer frame is provided with an air passage communicating with the air inlet and the vent.

5. The wafer aging test equipment according to claim 1, characterized in that, The aging test apparatus includes a gantry frame, and the heat sink assembly and alignment mechanism are movably disposed within the gantry frame.

6. The wafer aging test equipment according to claim 5, characterized in that, The aging test device includes a visual positioning mechanism, which is connected to the gantry and located between the probe plate assembly and the heat sink assembly.

7. The wafer aging test equipment according to claim 6, characterized in that, The visual positioning mechanism includes a two-way field-of-view camera and a two-way motion component; The bidirectional field-of-view camera is mounted on the bidirectional moving assembly, which is connected to the gantry and is used to drive the bidirectional field-of-view camera to move along a first direction and a second direction.

8. The wafer aging test equipment according to claim 4, characterized in that, The alignment mechanism includes a first alignment component, a second alignment component, and a third alignment component; The first alignment component is disposed on the bottom support plate along the first direction; the second alignment component is disposed above the first alignment component along the second direction and is slidably connected to the first alignment component; the third alignment component is disposed above the second alignment component, for supporting the heat sink component and driving the heat sink component to move in the third direction.

9. The wafer aging test equipment according to claim 8, characterized in that, The alignment mechanism further includes an angle adjustment component, which is connected to the heat sink outer frame and is used to drive the heat sink outer frame to rotate around its axis.

10. A wafer aging test system, characterized in that, Includes wafer loading and unloading equipment, wafer transport equipment, and wafer aging test equipment as described in any one of claims 1-9; Along the extension direction of the wafer transport equipment, the wafer loading and unloading equipment and the wafer aging test equipment are both located on the same side of the wafer transport equipment.

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