Semiconductor chip processing and testing device
By introducing movable columns, buffer springs, suction cups, and adjustment components into the semiconductor chip processing and testing equipment, and combining motor drive and manual operation, the problem of automatic adjustment of chip test points was solved, realizing automated positioning and multi-directional testing, and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING HENGXINTONG TECHNOLOGY CO LTD
- Filing Date
- 2025-05-15
- Publication Date
- 2026-05-12
AI Technical Summary
Existing semiconductor chip processing and testing equipment cannot automatically adjust to the appropriate position according to the chip's test points, requiring manual adjustment, which affects production efficiency.
Using movable columns, buffer springs, suction cups, and adjustment components, the chip is automatically positioned and fixed through motor drive and manual operation, and multi-directional testing is achieved by combining threaded rods and guide columns.
It enables automated chip positioning and multi-directional testing, reducing manual intervention and improving production efficiency.
Smart Images
Figure CN224231913U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor chip equipment technology, and in particular to a semiconductor chip processing and testing device. Background Technology
[0002] Semiconductor chip fabrication and testing equipment is used to perform various tests and verifications during chip manufacturing to ensure that the quality and performance of the final product meet design specifications. These devices cover multiple stages from wafer fabrication to packaging and testing, including but not limited to electrical characteristic testing, physical defect inspection, and reliability testing.
[0003] In the prior art, such as Chinese Patent No. CN217034046U, "A Semiconductor Chip Processing and Testing Device", it includes: a mounting plate and a detector fixedly connected to the mounting plate. The upper end of the detector is fixedly connected to a placement plate. The upper surface of the placement plate has multiple grooves. The detector is used to detect semiconductor chips. The clamping component includes a pressure plate, a squeezing block, and a telescopic cavity. The upper end of the telescopic cavity is fixedly connected to the mounting plate, and the pressure plate is fixedly connected to the lower end of the telescopic cavity. In this invention, the squeezing block pushes the squeezing block upward under the limitation of the chip and compresses the second spring, thereby making the squeezing block squeeze the chip in the groove. This allows the chip to be tightly attached to the upper end of the probe for detection. Since the squeezing block uses the elastic force of the second spring to squeeze the chip, it can avoid excessive squeezing force that could damage the probe or chip.
[0004] In the aforementioned technology, although the extrusion block is used to compress the chip in the groove, which can tightly attach the chip to the upper end of the probe for testing and prevent the chip from being damaged by compression, the testing device cannot be adjusted to the appropriate position according to the chip's test points during chip processing and testing. The operator needs to repeatedly use the test pen to manually click on the chip's test points. After the chip is tested, the operator needs to remove the chip from the fixing device. Repeatedly removing and fixing the chip wastes a lot of processing time and affects production efficiency. Utility Model Content
[0005] The purpose of this invention is to solve the problem in the existing technology that when chips are processed and tested, the testing device cannot be adjusted to the appropriate position according to the chip's test points. The operator needs to repeatedly use a test pen to manually click on the chip's test points. After the chip is tested, the operator needs to remove the chip from the fixing device. This repeated removal and fixing wastes a lot of processing time and affects production efficiency.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor chip processing and testing device, comprising: a testing platform and a fixed plate, characterized in that: a movable column is movably connected to the top of the fixed plate, a connecting plate is fixedly connected to the top of the movable column, two buffer springs are fixedly connected to the top of the connecting plate, a connecting block is fixedly connected to the top of each of the two buffer springs, a support block is fixedly connected to the opposite side of the two connecting blocks, a pull ring is fixedly installed on the top of the support block, two suction cups are fixedly connected to the bottom of the support block, and an adjustment component is provided on one side of the testing platform.
[0007] The technical effect of adopting the above-mentioned further solution is as follows: the staff pulls the ring to lift the support block. At this time, the support block causes the buffer spring to be in a charged state through the connecting block, placing the chip at the bottom of the suction cup. Then, the ring is rotated to make the chip enter the interior of the test stage. The ring is then lowered to cause the buffer spring to rebound and make the suction cup fit and fix with the interior of the test stage.
[0008] In a preferred embodiment, the adjustment assembly includes an L-shaped frame, which is fixedly connected to one outer surface of the test bench. A motor is fixedly mounted on one side of the L-shaped frame, and a rotating shaft is fixedly connected to the output shaft of the motor. A belt is movably fitted onto the outer surface of the rotating shaft, and a movable shaft is movably embedded on the other side of the belt. A threaded rod is fixedly connected to one side of the movable shaft, and a threaded block is movably fitted onto the outer surface of the threaded rod. A guide post is fixedly connected to one side of the threaded block, and a test frame is fixedly connected to the other side of the guide post. Two movable slots are opened on both sides of the test bench, and a guide post is fixedly connected inside one of the movable slots. The test frame is movably fitted onto the outer surface of the guide post, and a handle is fixedly connected to one side of the test frame.
[0009] The technical effect of adopting the above-mentioned further solution is as follows: when the motor is started, the output shaft of the motor drives the rotating shaft to rotate. The rotation of the rotating shaft drives the movable shaft to rotate synchronously through the belt. The rotation of the movable shaft causes the movable shaft to slide on the outer surface of the threaded rod. The movement of the movable shaft drives the test fixture to test the outer surface of the chip back and forth through the first guide post. The handle three drives the test fixture to slide on the outer surface of the third guide post. At this time, the test fixture also tests the front and back of the chip.
[0010] In a preferred embodiment, the adjustment assembly further includes a support column, a lead screw is movably connected inside the support column, a handle is fixedly connected to one side of the lead screw, a threaded column is movably sleeved on the outer surface of the lead screw, a linkage column is fixedly connected to one side of the threaded column, a fixing block is fixedly connected to one side of the linkage column, a connecting column is fixedly connected to one side of the outer surface of the fixing block, the connecting column is fixedly connected to one side of the outer surface of the test frame, two guide columns are fixedly installed on one side of the fixing block, a support frame is fixedly installed on one side of the test platform, the two guide columns are movably embedded inside the support frame, a handle is fixedly connected to one side of the fixing block, an electric push rod is fixedly installed at the bottom of the test frame, and a test plate is fixedly connected to the output end of the electric push rod.
[0011] The technical effect of adopting the above-mentioned further solution is as follows: Rotating handle one causes handle one to drive the lead screw to rotate. The rotation of the lead screw causes the threaded column to move on the outer surface of the lead screw. The movement of the threaded column drives the fixed block to move synchronously through the linkage column. The movement of the fixed block drives the test frame to test the left and right sides of the chip through the connecting column. Holding handle two causes handle two to drive guide column two to slide inside the support frame for guidance, so that the test frame can also test the left and right sides of the chip.
[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0013] 1. In this utility model, the motor is started, and the output shaft of the motor drives the rotating shaft to rotate. The rotation of the rotating shaft drives the movable shaft to rotate synchronously via a belt. The rotation of the movable shaft causes the threaded block to slide on the outer surface of the threaded rod. The movement of the movable shaft drives the test frame to test the outer surface of the chip back and forth via the first guide post. Rotating the first handle causes the first handle to drive the lead screw to rotate. The rotation of the lead screw causes the threaded post to move on the outer surface of the lead screw. The movement of the threaded post drives the fixed block to move synchronously via the linkage post. The movement of the fixed block drives the test frame to test the left and right sides of the chip via the connecting post. When the motor drive fails, the third handle causes the test frame to slide on the outer surface of the third guide post. At this time, the test frame also tests the front and back of the chip. The second handle causes the second handle to drive the second guide post to slide inside the support frame for guidance, causing the test frame to test the left and right sides of the chip. Attached Figure Description
[0014] Figure 1 A three-dimensional structural diagram of a semiconductor chip processing and testing device provided by this utility model;
[0015] Figure 2 A top view of a semiconductor chip processing and testing device provided by this utility model;
[0016] Figure 3This is a front view of a semiconductor chip processing and testing device provided by the present invention.
[0017] Figure 4 This is an enlarged cross-sectional view of the buffer spring in a semiconductor chip processing and testing device provided by this utility model.
[0018] Legend:
[0019] 1. Test stand; 2. Fixing plate; 101. L-shaped frame; 102. Motor; 103. Rotating shaft; 104. Belt; 105. Movable shaft; 106. Threaded rod; 107. Movable groove; 108. Guide column one; 109. Test frame; 110. Support column; 111. Handle one; 112. Lead screw; 113. Threaded column; 114. Linkage column; 115. Fixing block; 116. Connecting column; 117. Handle two; 118. Guide column two; 119. Support frame; 120. Threaded block; 121. Guide column three; 122. Handle three; 123. Electric push rod; 124. Test plate; 201. Movable column; 202. Connecting plate; 203. Buffer spring; 204. Connecting block; 205. Support block; 206. Pull ring; 207. Suction cup. Detailed Implementation
[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.
[0022] Example 1, such as Figure 1-4As shown, the system includes a test platform 1 and a fixed plate 2. The fixed plate 2 has a movable column 201 movably connected to its top, a connecting plate 202 fixedly connected to the top of the movable column 201, two buffer springs 203 fixedly connected to the top of the connecting plate 202, connecting blocks 204 fixedly connected to the top of each of the two buffer springs 203, support blocks 205 fixedly connected to opposite sides of the two connecting blocks 204, pull rings 206 fixedly installed on the top of the support blocks 205, and two suction cups 207 fixedly connected to the bottom of the support blocks 205. An adjustment assembly is provided on one side of the test platform 1, including an L-shaped frame 101 fixedly connected to the outer surface of one side of the test platform 1. A pull ring 206 is fixedly installed on one side of the L-shaped frame 101. Motor 102, the output shaft of motor 102 is fixedly connected to rotating shaft 103, the outer surface of rotating shaft 103 is movably fitted with belt 104, the other side of belt 104 is movably fitted with movable shaft 105, one side of movable shaft 105 is fixedly connected to threaded rod 106, the outer surface of threaded rod 106 is movably fitted with threaded block 120, one side of threaded block 120 is fixedly connected to guide post 108, the other side of guide post 108 is fixedly connected to test frame 109, two movable slots 107 are opened on both sides of test platform 1, one movable slot 107 is fixedly connected to guide post 3 121, test frame 109 is movably fitted on the outer surface of guide post 3 121, one side of test frame 109 is fixedly connected to handle 3 122.
[0023] In this embodiment, the motor 102 is started, and the output shaft of the motor 102 drives the rotating shaft 103 to rotate. The rotation of the rotating shaft 103 drives the movable shaft 105 to rotate synchronously through the belt 104. The rotation of the movable shaft 105 causes the movable shaft 105 to slide on the outer surface of the threaded rod 106. The movement of the movable shaft 105 drives the test frame 109 to test the outer surface of the chip back and forth through the guide post 108. The handle 122 drives the test frame 109 to slide on the outer surface of the guide post 121 and move. At this time, the test frame 109 also tests the front and back of the chip.
[0024] Example 2, as Figure 1-4As shown, the adjustment assembly also includes a support column 110, a lead screw 112 is movably connected inside the support column 110, a handle 111 is fixedly connected to one side of the lead screw 112, a threaded column 113 is movably sleeved on the outer surface of the lead screw 112, a linkage column 114 is fixedly connected to one side of the threaded column 113, a fixing block 115 is fixedly connected to one side of the linkage column 114, a connecting column 116 is fixedly connected to one side of the outer surface of the fixing block 115, the connecting column 116 is fixedly connected to one side of the outer surface of the test frame 109, two guide columns 118 are fixedly installed on one side of the fixing block 115, a support frame 119 is fixedly installed on one side of the test platform 1, the two guide columns 118 are movably embedded inside the support frame 119, a handle 117 is fixedly connected to one side of the fixing block 115, an electric push rod 123 is fixedly installed at the bottom of the test frame 109, and a test plate 124 is fixedly connected to the output end of the electric push rod 123.
[0025] In this embodiment, rotating handle 111 causes the lead screw 112 to rotate. The rotation of the lead screw 112 causes the threaded post 113 to move on the outer surface of the lead screw 112. The movement of the threaded post 113 causes the fixing block 115 to move synchronously through the linkage post 114. The movement of the fixing block 115 causes the test frame 109 to test the left and right sides of the chip through the connecting post 116. Holding handle 117 causes handle 117 to slide guide post 118 inside the support frame 119 for guidance, causing the test frame 109 to also test the left and right sides of the chip.
[0026] Working Principle: This equipment is a semiconductor chip processing and testing device. During use, the operator pulls the pull ring 206 to lift the support block 205. At this time, the support block 205, through the connecting block 204, causes the buffer spring 203 to be in a charged state, placing the chip at the bottom of the suction cup 207. Then, rotating the pull ring 206 causes the chip to enter the testing stage 1. Lowering the pull ring 206 causes the buffer spring 203 to rebound, fixing the suction cup 207 to the inside of the testing stage 1. Then, the motor 102 is started. The output shaft of the motor 102 drives the rotating shaft 103 to rotate. The rotation of the rotating shaft 103 drives the movable shaft 105 to rotate synchronously via the belt 104. The rotation of the movable shaft 105 causes it to slide on the outer surface of the threaded rod 106. The movement of the movable shaft 105 is driven by the guide post 108. The test fixture 109 tests the outer surface of the chip from front to back. Rotating handle 111 causes the screw 112 to rotate. The rotation of the screw 112 causes the threaded post 113 to move on the outer surface of the screw 112. The movement of the threaded post 113 drives the fixed block 115 to move synchronously through the linkage post 114. The movement of the fixed block 115 drives the test fixture 109 to test the left and right sides of the chip through the connecting post 116. When the drive of the motor 102 fails, the handle 3122 causes the test fixture 109 to slide on the outer surface of the guide post 3121. At this time, the test fixture 109 also tests the front and back of the chip. The handle 217 causes the handle 217 to drive the guide post 218 to slide inside the support frame 119 for guidance, causing the test fixture 109 to test the left and right sides of the chip.
[0027] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.
Claims
1. A semiconductor chip processing and testing apparatus, comprising: The test platform (1) and the fixed plate (2) are characterized in that: the top of the fixed plate (2) is movably connected to a movable column (201), the top of the movable column (201) is fixedly connected to a connecting plate (202), the top of the connecting plate (202) is fixedly connected to two buffer springs (203), the top of each of the two buffer springs (203) is fixedly connected to a connecting block (204), the opposite side of the two connecting blocks (204) is fixedly connected to a support block (205), the top of the support block (205) is fixedly installed with a pull ring (206), the bottom of the support block (205) is fixedly connected to two suction cups (207), and an adjustment component is provided on one side of the test platform (1).
2. The semiconductor chip processing and testing apparatus according to claim 1, characterized in that: The adjustment assembly includes: an L-shaped frame (101), which is fixedly connected to the outer surface of one side of the test bench (1). A motor (102) is fixedly installed on one side of the L-shaped frame (101). A rotating shaft (103) is fixedly connected to the output shaft of the motor (102). A belt (104) is movably sleeved on the outer surface of the rotating shaft (103). A movable shaft (105) is movably embedded on the other side of the belt (104).
3. The semiconductor chip processing and testing apparatus according to claim 2, characterized in that: A threaded rod (106) is fixedly connected to one side of the movable shaft (105). A threaded block (120) is movably sleeved on the outer surface of the threaded rod (106). A guide post (108) is fixedly connected to one side of the threaded block (120), and a test frame (109) is fixedly connected to the other side of the guide post (108).
4. The semiconductor chip processing and testing apparatus according to claim 3, characterized in that: The test bench (1) has two movable slots (107) on both sides. One of the movable slots (107) is fixedly connected to a guide post three (121). The test frame (109) is movably fitted on the outer surface of the guide post three (121). A handle three (122) is fixedly connected to one side of the test frame (109).
5. The semiconductor chip processing and testing apparatus according to claim 4, characterized in that: The adjustment assembly also includes a support column (110), a lead screw (112) is movably connected inside the support column (110), a handle (111) is fixedly connected to one side of the lead screw (112), a threaded column (113) is movably sleeved on the outer surface of the lead screw (112), and a linkage column (114) is fixedly connected to one side of the threaded column (113).
6. The semiconductor chip processing and testing apparatus according to claim 5, characterized in that: A fixing block (115) is fixedly connected to one side of the linkage column (114), and a connecting column (116) is fixedly connected to the outer surface of one side of the fixing block (115). The connecting column (116) is fixedly connected to the outer surface of one side of the test frame (109), and two guide columns (118) are fixedly installed on one side of the fixing block (115).
7. The semiconductor chip processing and testing apparatus according to claim 6, characterized in that: A support frame (119) is fixedly installed on one side of the test bench (1), and two guide columns (118) are movably embedded inside the support frame (119). A handle (117) is fixedly connected to one side of the fixing block (115).
8. The semiconductor chip processing and testing apparatus according to claim 7, characterized in that: An electric push rod (123) is fixedly installed at the bottom of the test frame (109), and a test plate (124) is fixedly connected to the output end of the electric push rod (123).