Assembly of multiple optical modules

Abstract

This disclosure relates to an assembly of multiple optical modules. An assembly of multiple optical modules is provided, the assembly comprising: a base layer including a circuit board laminate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a corresponding optical module of the plurality of optical modules; a cover layer substantially parallel to the base layer and including a circuit board laminate having a plurality of holes defined therein, each of the plurality of holes corresponding to and aligned with a corresponding optical module of the plurality of optical components; and a wall layer coupled to the base layer and coupled to the cover layer, forming a plurality of outer walls for each of the plurality of optical modules; wherein the base layer, the cover layer, and the wall layer collectively define a plurality of chambers, each of the plurality of chambers corresponding to a corresponding optical module of the plurality of optical modules.

Description

Technical Field

[0001] The exemplary embodiments of this disclosure generally relate to optical modules, and more particularly to methods of constructing optical modules. Background Technology

[0002] An optical sensor is a module that includes and uses one or more light sources and / or light receivers to detect light reflected from a target object. The received light is used to extract useful information such as distance, motion, surface characteristics, etc. The optical module may include a housing formed by attaching a plastic housing to a circuit board or other substrate using adhesive, for encapsulating one or more light sources and / or one or more light receivers. Lenses or other structures may be coupled to and / or integrated with the plastic housing.

[0003] The applicant has identified numerous technical challenges and difficulties associated with optical modules and their manufacturing. For example, such optical modules are typically manufactured as individual modules. This piece-by-piece assembly of each individual module is inefficient and costly. Furthermore, maintaining dimensional and quality consistency throughout the assembly of a large number of modules is difficult.

[0004] Through effort, innovation and originality, the applicant has solved problems related to such optical modules by developing the solutions implemented in this disclosure, which will be described in detail below. Summary of the Invention

[0005] The various embodiments described herein relate to optical module assemblies and methods for constructing multiple optical modules as assemblies.

[0006] According to various embodiments of the present disclosure, an assembly of multiple optical modules is provided. In some embodiments, the assembly includes a base layer, a cover layer, and a wall layer. The base layer includes a circuit board laminate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a corresponding optical module among the plurality of optical modules. The cover layer is substantially parallel to the base layer and includes a circuit board laminate having a plurality of holes defined therein. Each of the plurality of holes corresponds to a corresponding optical module among the plurality of optical modules and is aligned with the corresponding optical component among the plurality of optical components. The wall layer is coupled to the base layer and coupled to the cover layer, and forms a plurality of outer walls for each of the plurality of optical modules. The base layer, cover layer, and wall layer together define a plurality of chambers, each of the plurality of chambers corresponding to a corresponding optical module among the plurality of optical modules.

[0007] In some embodiments, the wall layer includes at least one circuit board laminate substrate.

[0008] In some embodiments, the wall layer includes a plurality of sublayers, each of which includes a circuit board laminate substrate.

[0009] In some embodiments, one or more of the multiple sublayers form one or more inner walls for each of the multiple optical modules to divide each chamber of the multiple optical modules into two or more sub-chambers.

[0010] In some embodiments, at least one inner wall of one or more inner walls of each of the plurality of optical modules does not extend from the base layer to the cover layer.

[0011] In some embodiments, at least one inner wall and / or wall layer of one or more inner walls of each of the plurality of optical modules forms one or more mounting surfaces for lenses and / or filters in each of the plurality of optical modules.

[0012] In some embodiments, a plurality of conductive vias are formed in the wall layer to electrically connect the base layer and the cover layer.

[0013] In some embodiments, at least one of the plurality of conductive vias forms part of a circuit for detecting the displacement of a lens and / or the displacement of a cover layer in each of the plurality of optical modules.

[0014] In some embodiments, the wall layer includes a unitary wall layer formed on or fixed to the base layer and / or the cover layer.

[0015] In some embodiments, the component further includes a plurality of lenses fixed to the underside of the cover layer. Each of the plurality of lenses is aligned with a corresponding hole among the plurality of holes. At least a portion of the innermost sublayer of the cover layer is removed to define an airvent from each chamber of each of the plurality of optical modules to a corresponding hole among the plurality of holes.

[0016] According to various embodiments of this disclosure, a method for constructing a plurality of optical modules is provided. In some embodiments, the method includes constructing an assembly of a plurality of optical modules by coupling a base layer and a cover layer to a wall layer, and slicing the assembly into individual optical modules. The base layer includes a circuit board laminate having a plurality of optical components mounted thereon. Each of the plurality of optical components corresponds to a corresponding optical module among the plurality of optical modules. The cover layer is substantially parallel to the base layer and includes a circuit board laminate having a plurality of holes defined therein. Each of the plurality of holes corresponds to a corresponding optical module among the plurality of optical modules and is aligned with the corresponding optical component among the plurality of optical components. The wall layer forms a plurality of outer walls for each of the plurality of optical modules. The base layer, cover layer, and wall layer together define a plurality of chambers, each of the plurality of chambers corresponding to a corresponding optical module among the plurality of optical modules.

[0017] According to one aspect of this disclosure, an assembly of a plurality of optical modules is provided, the assembly comprising: a base layer including a circuit board laminate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a corresponding optical module of the plurality of optical modules; a cover layer substantially parallel to the base layer and including a circuit board laminate having a plurality of holes defined therein, each of the plurality of holes corresponding to a corresponding optical module of the plurality of optical modules and aligned with the corresponding optical component of the plurality of optical components; and a wall layer coupled to the base layer and coupled to the cover layer, and forming a plurality of outer walls for each of the plurality of optical modules; wherein the base layer, the cover layer and the wall layer together define a plurality of chambers, each of the plurality of chambers corresponding to a corresponding optical module of the plurality of optical modules.

[0018] According to one embodiment of the present disclosure, the wall layer includes at least one circuit board laminate substrate.

[0019] According to one embodiment of the present disclosure, the wall layer includes a plurality of sublayers, each of the plurality of sublayers including a circuit board laminate substrate.

[0020] According to one embodiment of the present disclosure, one or more of the plurality of sublayers form one or more inner walls for each of the plurality of optical modules to divide each chamber of the plurality of optical modules into two or more sub-chambers.

[0021] According to one embodiment of this disclosure, at least one inner wall of one or more inner walls of each of the plurality of optical modules does not extend from the base layer to the cover layer.

[0022] According to one embodiment of the present disclosure, at least one inner wall and / or wall layer of the one or more inner walls of each of the plurality of optical modules forms one or more mounting surfaces for lenses and / or filters in each of the plurality of optical modules.

[0023] According to one embodiment of this disclosure, a plurality of conductive vias are formed in the wall layer to electrically connect the base layer and the cover layer.

[0024] According to one embodiment of this disclosure, at least one of the plurality of conductive vias forms part of a circuit for detecting the displacement of a lens in each of the plurality of optical modules and / or the displacement of the cover layer.

[0025] According to one embodiment of the present disclosure, the wall layer comprises a single wall layer formed on or fixed to the base layer and / or the cover layer.

[0026] According to one embodiment of the present disclosure, the component further includes a plurality of lenses fixed to the underside of the cover layer; wherein each of the plurality of lenses is aligned with a corresponding hole among the plurality of holes; and wherein at least a portion of the innermost sublayer of the cover layer is removed to define an air vent from each chamber of each of the plurality of optical modules to a corresponding hole among the plurality of holes.

[0027] According to another aspect of this disclosure, a method for constructing a plurality of optical modules is provided, the method comprising: constructing an assembly of a plurality of optical modules by coupling a base layer and a cover layer to a wall layer; and slicing the assembly into individual optical modules; wherein the base layer includes a circuit board laminate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a corresponding optical module among the plurality of optical modules; wherein the cover layer is substantially parallel to the base layer and includes a circuit board laminate having a plurality of holes defined therein, each of the plurality of holes corresponding to and aligned with a corresponding optical module among the plurality of optical components; wherein the wall layer forms a plurality of outer walls for each of the plurality of optical modules; and wherein the base layer, the cover layer, and the wall layer together define a plurality of chambers, each of the plurality of chambers corresponding to a corresponding optical module among the plurality of optical modules.

[0028] According to one embodiment of the present disclosure, the wall layer includes at least one circuit board laminate substrate.

[0029] According to one embodiment of the present disclosure, the wall layer includes a plurality of sublayers, each of the plurality of sublayers including a circuit board laminate substrate.

[0030] According to one embodiment of the present disclosure, one or more of the plurality of sublayers form one or more inner walls for each of the plurality of optical modules to divide each chamber of the plurality of optical modules into two or more sub-chambers.

[0031] According to one embodiment of this disclosure, at least one inner wall of one or more inner walls of each of the plurality of optical modules does not extend from the base layer to the cover layer.

[0032] According to one embodiment of the present disclosure, at least one inner wall and / or wall layer of the one or more inner walls of each of the plurality of optical modules forms one or more mounting surfaces for lenses and / or filters in each of the plurality of optical modules.

[0033] According to one embodiment of this disclosure, a plurality of conductive vias are formed in the wall layer to electrically connect the base layer and the cover layer.

[0034] According to one embodiment of this disclosure, at least one of the plurality of conductive vias forms part of a circuit for detecting the displacement of the lens and / or the displacement of the cover layer in each of the plurality of optical modules.

[0035] According to one embodiment of this disclosure, the method further includes forming the wall layer as a single structure directly located on the base layer or the cover layer.

[0036] According to one embodiment of the present disclosure, the method further includes: fixing each of a plurality of lenses to the underside of the cover layer such that each of the plurality of lenses is aligned with a corresponding hole of the plurality of holes; and removing at least a portion of the innermost sublayer of the cover layer to define an air vent from each chamber of each of the plurality of optical modules to a corresponding hole of the plurality of holes.

[0037] The foregoing description of the invention is provided merely to outline some exemplary embodiments for the purpose of providing a basic understanding of some aspects of this disclosure. Therefore, it will be appreciated that the above embodiments are merely illustrative and should not be construed as limiting the scope or spirit of this disclosure in any way. It will also be appreciated that the scope of this disclosure covers many potential embodiments in addition to those outlined herein, some of which will be further described below. Attached Figure Description

[0038] The description of the illustrative embodiments can be read in conjunction with the accompanying drawings. It will be appreciated that, for the sake of simplicity and clarity of illustration, the elements shown in the figures are not necessarily drawn to scale unless otherwise described. For example, the dimensions of some elements may be exaggerated relative to others unless otherwise described. Embodiments incorporating the teachings of this disclosure are shown and described with reference to the accompanying drawings, in which:

[0039] Figure 1 This is a top perspective view of an example base layer of an example component of four optical modules according to some embodiments of the present disclosure;

[0040] Figure 2 It is an example of an added first wall sublayer according to some embodiments of this disclosure. Figure 1 A top perspective view of a sample portion of the optical module components;

[0041] Figure 3 It is an example of an added second wall sublayer according to some embodiments of this disclosure. Figure 2 A top perspective view of a sample portion of the optical module components;

[0042] Figure 4 It is according to some embodiments of this disclosure that has to be added Figure 3 Example of a partial optical module component: bottom perspective view of the third wall sublayer;

[0043] Figure 5 It is based on some embodiments of this disclosure with added features Figure 4 Example of the third wall sublayer Figure 3 A top perspective view of a sample portion of the optical module components;

[0044] Figure 6 It is to be added according to some embodiments of this disclosure Figure 5 A bottom perspective view of an example overlay layer for a sample portion of the optical module components;

[0045] Figure 7 Examples of optical lenses and / or filters have been added according to some embodiments of this disclosure. Figure 6 Example bottom perspective view of the overlay;

[0046] Figure 8 This is a top perspective view of an example complete optical module assembly according to some embodiments of this disclosure;

[0047] Figure 9 According to some embodiments of this disclosure, it is divided into four separate optical modules. Figure 8 A top perspective view of an example optical module assembly; and

[0048] Figure 10This is a bottom perspective view of an example cover layer for an example component of four optical modules coupled to a single wall layer, according to some alternative embodiments of the present disclosure. Detailed Implementation

[0049] Some embodiments of this disclosure will now be described more fully below with reference to the accompanying drawings, which illustrate some, but not all, of these embodiments. In fact, these disclosures may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Similar reference numerals refer to similar elements throughout.

[0050] As used herein, terms such as “front,” “rear,” and “top” are used for explanatory purposes in the examples provided below to describe the relative positions of certain parts or portions of parts. Furthermore, as will be clear to those skilled in the art, the terms “substantially” and “approximately” indicate that the referenced element or associated description is accurate within applicable engineering tolerances, according to this disclosure.

[0051] As used herein, the term “comprising” means including but not limited to and should be interpreted in the manner commonly used in the patent context. The use of broader terms such as including, comprising, and having should be understood to support narrower terms such as consisting of, substantially consisting of, and substantially consisting of.

[0052] The phrases “in one embodiment”, “according to one embodiment”, etc., generally mean that the specific feature, structure or characteristic following the phrase can be included in at least one embodiment of this disclosure, and can be included in more than one embodiment of this disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0053] The terms “example” or “exemplary” are used herein to mean “served as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations.

[0054] If the specification states that a component or feature "may," "can," "possibly," "should," "will," "preferably," "possibly," "usually," "optionally," "for example," "often," or "maybe" (or other such language) be included or have a certain characteristic, then it is not required that the specific component or feature be included or have that characteristic. Such a component or feature may be optionally included in some embodiments or may be excluded.

[0055] Various embodiments of this disclosure overcome the aforementioned technical challenges and difficulties, and are based on, but not limited to, constructing multiple optical modules together as a component, and then cutting that component into individual optical modules to provide a variety of technical improvements and advantages. In this regard, it is easy to maintain consistency in the size and quality of individual optical modules, which facilitates the handling and installation of the modules. In many embodiments, a large number (e.g., hundreds) of optical modules are constructed as a single component and then cut into individual optical modules.

[0056] In various embodiments of this disclosure, an assembly of multiple optical modules is constructed in layers. In some example embodiments, the assembly of multiple optical modules includes three layers: a base (i.e., bottom) layer, a cover (i.e., top) layer, and a wall layer located therebetween. In other example embodiments, the wall layer includes two or more sublayers, such that the assembly of multiple optical modules includes four or more layers (i.e., a base layer, a cover layer, and two or more wall sublayers). Once slicing, the base layer, cover layer, and wall layers or sublayers form the housing of each individual optical module.

[0057] In many embodiments, multiple layers are stacked and adhered to each other using any suitable adhesive. In some embodiments, the adhesive may include a conductive adhesive. In many embodiments, components may be pre-attached to the relevant layers before the layers are stacked and adhered to each other. Such components include, but are not limited to, light sources, light receivers, lenses, filters, etc.

[0058] In various embodiments of this disclosure, one or more layers of this assembly of multiple optical modules each include a standard circuit board substrate laminate. In some embodiments, one or more layers include a copper clad laminate (CCL). The CCL includes copper foil layers laminated to two main faces of an insulating (core) layer. The core layer may include resin, glass fabric, etc.

[0059] In some embodiments, all layers (base layer, cover layer, wall layer, or sublayer) are constructed from a standard circuit board substrate laminate. In other embodiments, one or more of the layers may be constructed from any other suitable material. For example, if conductivity is not required for the wall layer(s) (discussed below), the wall layer may be a single structure constructed from any suitable material, such as any suitable plastic. In some such embodiments, the wall layer may be formed directly onto the base layer or onto the cover layer using a forming or additive process, such as, but not limited to, transfer molding, screen printing, 3D printing, and / or similar processes. In other such embodiments, the wall layer may be formed separately from the base layer or cover layer using a forming or additive process or any other suitable process (e.g., injection molding), and then the wall layer may be attached to the base layer or cover layer.

[0060] In various embodiments, each layer or sublayer constructed from a circuit board substrate laminate is constructed from a single circuit board substrate laminate, which forms that layer or sublayer of all optical modules of the assembly. Forming each layer from a single substrate ensures consistency among all optical modules of the assembly.

[0061] In various embodiments, one or more openings may be created (e.g., drilled or routed) in one or more of the layers prior to the stacking. For example, large openings are typically routed into wall layers or sublayers such that the wall layers or sublayers define chambers for the electronics of each optical module. As another example, openings are typically drilled or routed into cover layers to define one or more holes for light to be emitted from or received in each optical module. In various embodiments, one or more of the holes include plated through-holes.

[0062] While embodiments of this disclosure are described herein as being constructed from standard circuit board substrate laminates such as CCL, other embodiments may use other forms of substrates, such as ceramic substrates, polymer-based laser direct structuring (LDS) substrates, etc.

[0063] Once assembled, the optical module components of various embodiments can be cut into individual optical modules using any suitable cutting process (such as sawing).

[0064] In various embodiments, multiple conductive vias are formed in the wall layer or sublayer to electrically connect the base layer and the cover layer. In this regard, the base, wall, and cover of each optical module together form a Faraday cage that prevents or limits electromagnetic interference (EMI) from entering and / or leaving each optical module. In various embodiments, one or more conductive vias are formed in the wall layer or sublayer to form part of a circuit for detecting displacement of the lens and / or the cover layer in each of the multiple optical modules. In various embodiments, the one or more conductive vias forming part of the circuit for detecting displacement of the cover layer and / or the lens are separate from the multiple conductive vias formed in the wall layer or sublayer for electrically connecting the base layer and the cover layer.

[0065] In various embodiments, a wall layer or one or more wall sublayers form one or more inner walls for each optical module, thereby defining two or more sub-chambers within each optical module. In some embodiments, the inner wall extends from the base layer to the cover layer. In some other embodiments, the inner wall does not extend from the base layer to the cover layer, such that an opening is provided between two sub-chambers to allow, for example, electronic components to cross between the two sub-chambers.

[0066] Now refer to the figures, Figures 1-8 The figures illustrate various steps in constructing an example assembly of four modules according to some embodiments of the present disclosure. Although the figures illustrate optical components for constructing four optical modules for simplicity, embodiments of the present disclosure may involve constructing any suitable number of optical components (e.g., hundreds or more).

[0067] Figure 1 This is a top perspective view of an example base layer 102 of an example assembly of four optical modules. The example base layer 102 is created using a single substrate made of a circuit board material such as CCL, which is created using conventional circuit board construction methods. Figure 1 As can be seen, the substrate of the circuit board material includes a composite core 104, a copper layer 106 on top of the core 104 (a copper layer may also be present on the bottom of the core (not shown)), and a solder mask 108 on top of the copper layer 106. The base layer 102 includes multiple electronic components for each of the four modules being constructed, such as a light emitter 110 (which may include, for example, a vertical-cavity surface-emitting laser (VCSEL)) and an integrated circuit 112 (which can be used as a light receiver), these electronic components being connected to the copper layer 106 via wire bonding. Since the construction of the components of the four optical modules is illustrated, the base layer 102 includes four separate components and circuit systems required for each individual optical module.

[0068] Figure 2 It has the ability to Figure 1 The image shows a top perspective view of an example portion of an optical module assembly, specifically a first wall sublayer 120 added to the top of the base layer 102. Like the base layer 102, the first wall sublayer 120 is created using a single substrate of a circuit board material such as CCL, which is created using conventional circuit board construction methods. Figure 2 As can be seen, the substrate of the circuit board material used to create the first wall sublayer 120 includes a composite core 122, a top copper layer 124a on top of the core 122, a bottom copper layer 124b on bottom of the core 122, and a solder mask 126 on top of the top copper layer 124a.

[0069] like Figure 2 As can be seen, the four openings are confined in the first wall sublayer 120, such that the first wall sublayer 120 forms a frame, which begins to form the portion of the outer wall 128a-d of the four optical modules when it is cut, and the frame begins to form the cavity 132 of the optical module.

[0070] In various embodiments, the first wall sublayer 120 is adhered to the base layer using adhesive 134 around all edges. Any suitable adhesive can be used, such as a conductive adhesive if the sidewalls are conductive between the base layer and the cover layer (i.e., if the sidewalls have conductive vias).

[0071] One or more conductive vias 130 may be formed in the first wall sublayer 120 for each of the optical modules, such as part of a circuit for detecting the displacement of the lens and / or the displacement of the cover layer in each of the multiple optical modules, as further described below.

[0072] The first wall sublayer 120 may include multiple conductive vias (in...) Figure 9 As can be seen after the cut, the multiple conductive vias are formed around all areas of the outer walls 128a-d that will become the four optical modules, for conductive connection of the base layer 102 and the cover layer (described below) to form a Faraday cage.

[0073] Figure 3 It has an example of a second wall layer 140 added on top of the first wall layer 120. Figure 2 The example section shows a top perspective view of the optical module assembly. Similar to the base layer 102 and the first wall sublayer 120, the second wall sublayer 140 is created using a single substrate made of a circuit board material such as CCL, which is created using conventional circuit board construction methods. Figure 3As can be seen, the substrate of the circuit board used to create the second wall sublayer 140 material includes a composite core 142, a top copper layer 144a on top of the core 142, a bottom copper layer 144b on bottom of the core 142, and a solder mask 146 on top of the top copper layer 144a.

[0074] Similar to the first wall layer 120, four openings are defined in the second wall layer 140, such that the second wall layer 140 also forms a frame that continues to form the portion that, when cut, will become the outer walls 128a-d of the four optical modules, and that the frame continues to form the chambers 132 of the optical modules. In various embodiments, the second wall layer 140 is adhered to the first wall layer 120 using an adhesive 134 around all edges.

[0075] Similar to the first wall sublayer 120, one or more conductive vias 130 may be formed in the second wall sublayer 140 for each of the optical modules, such as part of a circuit for continuing to form a circuit for detecting displacement of the cover layer and / or lens.

[0076] Similar to the first wall sublayer 120, the second wall sublayer 140 may include a plurality of conductive vias (in Figure 9 As can be seen after the single-layer cutting is exposed), the multiple conductive vias are formed around all areas that will become the outer walls of the four optical modules, for conductive connection of the base layer 102 and the cover layer (described below) to form a Faraday cage.

[0077] In the illustrated embodiment, the second wall sublayer 140 begins to form an inner wall 148 for each optical module, thereby dividing the cavity 132 of each optical module into two sub-cavities 152, 154. In the illustrated embodiment, the inner wall 148 does not contact the base layer, such that an opening or gap 150 is provided under each inner wall 148 and between the two sub-cavities 152, 154 of each optical module to allow the integrated circuit 112 to span the two sub-cavities 152, 154. Such an inner wall can reduce crosstalk between the light emitter and the light receiver. Such an inner wall can, for example, provide mounting surfaces for components such as lenses and / or filters, and provide strength and rigidity to the housing of each module.

[0078] Figure 4 This is a bottom perspective view of an example third wall layer 160 to be added on top of the second wall layer 140. Figure 5 It is added on top of the second wall sublayer 140. Figure 4 Example of the third wall sublayer Figure 3The example section shows a top perspective view of the optical module assembly. Similar to the base layer 102, the first wall sublayer 120, and the second wall layer 140, the third wall sublayer 160 is created using a single substrate made of a circuit board material such as CCL, which is created using conventional circuit board construction methods. Figure 4 and Figure 5 As can be seen, the substrate of the circuit board material used to create the third wall sublayer 160 includes a composite core 162, a top copper layer 164a on top of the core 162, a bottom copper layer 164b on the bottom surface of the core 162, a top solder mask 166a on top of the top copper layer 164a, and a bottom solder mask 166b on the bottom copper layer 164b.

[0079] Similar to the first and second wall sublayers 120 and 140, four openings are defined in the third wall sublayer 160, such that the third wall sublayer 160 also forms a frame that continues to form the portion that, when cut, will become the outer walls 128a-d of the four optical modules, and that the frame continues to form the chambers 132 of the optical modules. In various embodiments, the third wall sublayer 160 is adhered to the second wall sublayer 140 using adhesive 134 around all edges.

[0080] Similar to the first and second wall sublayers 120 and 140, one or more conductive vias 130 may be formed in the third wall sublayer 160 for each optical module, such as for continuing to form part of circuitry used to detect displacement of the cover layer and / or lens. These conductive vias 130 allow electrical connections between the circuitry in the filter, lens, and / or cover layer and, for example, an integrated circuit 112, such that displacement of the filter, lens, or cover layer disconnects the circuitry. The integrated circuit 112 can detect this disconnection in the circuitry, which can then stop the operation of the optical module.

[0081] Similar to the first and second wall layers 120 and 140, the third wall layer 160 may include a plurality of conductive vias (in... Figure 9 As can be seen after the single-layer cutting is exposed), the multiple conductive vias are formed around all areas that will become the outer walls of the four optical modules, for conductive connection of the base layer 102 and the cover layer (described below) to form a Faraday cage.

[0082] In the illustrated embodiment, the third wall sublayer 160 continues to form an inner wall 148 for each optical module.

[0083] In the illustrated embodiment, a first filter 168 and a second filter 170 are mounted below a third wall sublayer 160 such that the first filter 168 filters emitted light from the light emitter 110, and the second filter 170 filters light to be received by the integrated circuit 112. The third wall sublayer 160 includes a plurality of mounting surfaces 172 for such filters. In various embodiments, any suitable number and type of filters can be used, and any suitable mounting arrangement can be used.

[0084] Figure 6 This is the bottom perspective of the example overlay 180 to be added on top of the third wall sublayer 160. Figure 7 This is a bottom perspective view of an example cover layer 180 with an example optical lens (described further below) fixed thereto. The cover layer 180 is created using a single substrate of a circuit board material such as CCL, which is created using conventional circuit board construction methods. Figure 6 and Figure 7 As can be seen, the substrate of the circuit board used to create the cover layer 180 material includes a composite core 182, a top copper layer 184a on top of the core 142, a bottom copper layer 184b on the bottom surface of the core 182, a top solder mask 186a on the top copper layer 184a, and a bottom solder mask 186b on the bottom copper layer 184a.

[0085] Multiple openings are defined within the cover layer 180. In the illustrated embodiment, a first aperture 188 is defined for each optical module, allowing light from the light emitter to exit and a second aperture 190 to allow light to enter and reach the light receiver. In the illustrated embodiment, each aperture in the first aperture 188 is typically square and created by milling the opening, while each aperture in the second aperture 190 is typically circular and created by drilling the opening. However, such apertures can be of any suitable shape and can be created using any suitable technique. Furthermore, any suitable number of apertures and their placement can be used. In various embodiments, one or both of the first and second apertures can be plated through-holes created by copper plating the cover layer after milling / drilling the apertures.

[0086] In various embodiments, one or more optical lenses for each optical module may be adhered to the underside of the cover layer. For example, such lenses can help prevent foreign objects from entering the optical module through the apertures. Figure 7 As can be seen, a first optical lens 196 is fixed to the cover layer 180 and is positioned to span the first aperture 188, and a second optical lens 198 is fixed to the cover layer 180 and is positioned to span the second aperture 190.

[0087] In various embodiments, some of the bottom weld mask 186b is removed from multiple areas beneath the cover layer 180 to create shallow gaps for vents and glue traps. In the illustrated embodiment, some of the bottom weld mask 186b adjacent to the second hole 190 is removed to create vent 192 (creating a similar vent (unlabeled) adjacent to the first hole 188). Figure 7 As can be seen, when the second optical lens 198 adheres to the cover layer 180, the vent 192 creates a gap between the second optical lens 198 and the cover layer 180 to allow air and / or moisture inside the optical module to escape to the outside. The air inside the optical module expands when the optical module is heated. Without such a vent, the expanded air cannot escape and may damage the module. The vent in embodiments of the present invention is shallow enough to allow air to escape but shallow enough to prevent foreign objects from entering the module.

[0088] In the illustrated embodiment, some of the bottom welding mask 186b on the opposite side of the second hole 190 is removed to create glue pits 194. The shallow gaps in the glue pits 194 receive adhesive for securing the second optical lens 198 to the cover layer 180, thereby allowing the second optical lens 198 to be close to the cover layer 180.

[0089] Figure 8 yes Figure 6 and Figure 7 The example overlay has been added on top of the third wall sublayer 160. This is a top perspective view of the example complete optical module assembly. Figure 8 The complete optical module assembly 100 includes four complete optical modules that have not yet been cut into individual units. In various embodiments, any suitable cutting mechanism or method is used to cut into individual units. Figure 8 The complete optical module assembly 100 is cut into individual pieces.

[0090] Figure 9 yes Figure 8 The image shows a top perspective view of an example optical module assembly 100, cut into four individual complete optical modules 200a-d. The four individual complete optical modules 200a-d are identical, having a consistent shape and size to enable efficient module handling and installation into devices such as mobile phones. Figure 9As can be seen, the single-cut process has removed the outermost surface of the wall, thereby exposing conductive vias 130 positioned along all four sides of the optical module. The conductive vias 130, bonded to a conductive adhesive layer 134, provide electrical connection between the top copper layer 106 of the base layer 102 and the bottom copper layer 184b of the cover layer 180. The conductive vias 130, the copper layer 106 of the base layer 102, and the bottom copper layer 184b of the cover layer 180 thus form a Faraday cage that prevents or limits electromagnetic interference (EMI) from entering and / or leaving each optical module.

[0091] As described above, in alternative embodiments, the wall layer can be a single structure, such as a single structure constructed using a forming process, an additive process, or any other suitable process (e.g., injection molding). This single wall structure can be formed directly onto the base layer or the cover layer, or it can be constructed separately and adhered to the base layer or the cover layer. Figure 10 This alternative embodiment is illustrated, wherein a single wall layer 220 is formed on or adhered to the example cover layer 280. As shown Figure 10 As can be seen, a single wall layer 220 forms an inner wall 248 and defines a cavity, such as sub-cavities 252 and 254.

[0092] in conclusion

[0093] Many modifications and other embodiments of this disclosure will occur to those skilled in the art upon benefiting from the teachings presented in the foregoing description and associated drawings. While the figures illustrate only certain components of the apparatus and systems described herein, it should be understood that a variety of other components may be used in conjunction with the system. Therefore, it should be understood that this disclosure is not limited to the specific embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. Furthermore, the steps in the described methods do not necessarily occur in the order shown in the drawings, and in some cases, one or more of the illustrated steps may occur substantially simultaneously, or additional steps may be involved. Although specific terminology is used herein, it is used only in a general and descriptive sense and is not intended to be limiting.

[0094] While various embodiments based on the principles disclosed herein have been shown and described above, modifications can be made to them by those skilled in the art without departing from the spirit and teachings of this disclosure. The embodiments described herein are merely representative and not intended to be limiting. Many variations, combinations, and modifications are possible and are within the scope of this disclosure. The disclosed embodiments primarily relate to segmented broadband tympanometer techniques for true wireless stereo; however, those skilled in the art will recognize that these principles can be applied to any audio device. Alternative embodiments resulting from combining, integrating, and / or omitting features of one or more of the embodiments are also within the scope of this disclosure. Therefore, the scope of protection is not limited by the above description.

[0095] Furthermore, the section headings used herein are provided for consistency with the recommendations of 37 CFR 1.77, or to provide organizational clues in any other way. These headings should not limit or characterize the disclosure (one or more) that may be set forth in any of the claims issued herein.

[0096] While this detailed description has illustrated some embodiments of the present disclosure, the appended claims cover other embodiments of the present disclosure that differ from the described embodiments based on various modifications and improvements. For example, the appended claims may cover any form of optical module, such as proximity sensors, time-of-flight sensors, ambient light sensors, cameras, infrared sensors, and transmitting modules. The appended claims may also cover other forms of microelectromechanical systems (MEMS) devices and sensors in which such a construction is advantageous, such as MEMS microphones, pressure sensors, and temperature sensors.

[0097] Within the appended claims, unless the specific terms “means for…” or “steps for…” are used within the given claims, they are not intended to be interpreted in accordance with paragraph 6 of 35 USC 112.

Claims

1. A component comprising multiple optical modules, characterized in that, The components include: The substrate includes a circuit board laminate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a corresponding optical module among the plurality of optical modules; A cover layer, substantially parallel to the base layer, and comprising a circuit board laminate having a plurality of holes defined therein, each of the plurality of holes corresponding to and aligned with a corresponding optical module of the plurality of optical modules; and A wall layer coupled to the base layer and the cover layer, and forming multiple outer walls for each of the plurality of optical modules; The base layer, the cover layer, and the wall layer together define a plurality of chambers, each of the plurality of chambers corresponding to a specific optical module among the plurality of optical modules.

2. The assembly of the plurality of optical modules as described in claim 1, characterized in that, The wall layer includes at least one circuit board laminate substrate.

3. The assembly of the plurality of optical modules as described in claim 2, characterized in that, The wall layer comprises a plurality of sublayers, each of which comprises a circuit board laminate substrate.

4. The assembly of the plurality of optical modules as described in claim 3, characterized in that, One or more of the plurality of sublayers form one or more inner walls for each of the plurality of optical modules to divide each chamber of the plurality of optical modules into two or more sub-chambers.

5. The assembly of the plurality of optical modules as described in claim 4, characterized in that, In the case of the plurality of optical modules, at least one of the one or more inner walls of each optical module does not extend from the base layer to the cover layer.

6. The assembly of the plurality of optical modules as described in claim 4, characterized in that, In the plurality of optical modules, at least one inner wall and / or wall layer of the one or more inner walls of each optical module forms one or more mounting surfaces for the lenses and / or filters in each optical module.

7. The assembly of a plurality of optical modules as described in claim 2, characterized in that, Multiple conductive vias are formed in the wall layer to electrically connect the base layer and the cover layer.

8. The assembly of the plurality of optical modules as described in claim 7, characterized in that, At least one of the plurality of conductive vias forms part of a circuit for detecting the displacement of the lens in each of the plurality of optical modules and / or the displacement of the cover layer.

9. The assembly of the plurality of optical modules as claimed in claim 1, characterized in that, The wall layer comprises a single wall layer formed on or fixed to the base layer and / or the cover layer.

10. The assembly of a plurality of optical modules as claimed in claim 1, characterized in that, It also includes a plurality of lenses fixed to the underside of the cover layer; Each of the plurality of lenses is aligned with a corresponding hole of the plurality of holes; and At least a portion of the innermost sublayer of the cover layer is removed to define an air vent from each chamber of each of the plurality of optical modules to a corresponding hole of the plurality of holes.

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