Weather-resistant ultrathin metal nameplate electronic tag
By designing a weather-resistant ultra-thin metal nameplate electronic tag, the corrosion problem of metal nameplates in harsh environments has been solved, achieving both thinness and good identification performance, and supporting long-distance temperature measurement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 张丹彤
- Filing Date
- 2025-06-10
- Publication Date
- 2026-05-12
AI Technical Summary
Existing metal nameplate tags are prone to corrosion in harsh natural and indoor environments, have short identification distances and require external light sources, and non-metallic RFID tags are prone to aging and cannot meet thickness requirements.
Design an ultra-thin metal nameplate electronic tag consisting of upper and lower metal plates, a filling layer, an RFID anti-metal electronic tag, and reinforcing structural components. It uses weather-resistant materials and flexible circuit boards, combined with electromagnetic sheets and chips, to achieve radio frequency identification and built-in temperature measurement function.
It achieves corrosion resistance and metal resistance of labels in harsh environments, maintains a thin thickness, and has good identification performance and industrial aesthetics, while supporting long-distance temperature measurement.
Smart Images
Figure CN224232195U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a weather-resistant ultra-thin metal nameplate electronic tag, belonging to the field of radio frequency identification. Background Technology
[0002] Metal nameplates are a very common type of object identification. Through a series of processing steps, visible information such as equipment name, manufacturer, production date, model specifications, and barcodes are created on the surface of the metal nameplate to identify the object being labeled. Due to the aging effects of the natural environment or harsh indoor usage environments, the surface information typically corrodes and becomes illegible after 3-5 years. Furthermore, these labels have drawbacks such as short reading distance and the need for an external light source. By embedding RFID functionality, these problems can be effectively solved by preserving the surface information while simultaneously writing it into an electronic chip.
[0003] Currently, these RFID-enabled nameplates are mainly implemented in the following way: a non-metallic shell is used to make a nameplate to encapsulate an RFID electronic tag to achieve radio frequency identification. However, plastic shells are prone to aging and do not have the same industrial aesthetics as metal nameplates. Furthermore, when the surface of the object on which the nameplate is installed is metal, the encapsulated electronic tag needs to have anti-metal capability, and the anti-metal tag itself needs to have a certain thickness, so the entire nameplate will be very thick.
[0004] Therefore, it is necessary to design a weather-resistant ultra-thin metal nameplate electronic tag that can withstand the effects of natural environments such as corrosion, ultraviolet rays, and rain, as well as the harsh indoor application scenarios such as high temperature and oil stains, and also has RFID radio frequency identification function. Utility Model Content
[0005] The purpose of this invention is to address the shortcomings of existing technologies and provide a weather-resistant, ultra-thin metal nameplate electronic tag.
[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a weather-resistant ultra-thin metal nameplate electronic tag, comprising, from top to bottom, an upper metal plate, an upper filling layer, an RFID anti-metal electronic tag, a lower filling layer, and a lower metal plate. The RFID anti-metal electronic tag has a reinforcing structural component on its outer periphery. The RFID anti-metal electronic tag includes an FPC flexible circuit board, a chip, and an electromagnetic sheet. The FPC flexible circuit board is divided into two parts. One part of the FPC flexible circuit board has a feed line and is connected to the chip through the feed line. The lower surface of the electromagnetic sheet is attached to one part of the FPC flexible circuit board. The electromagnetic sheet has a through hole for placing the chip. The other part of the FPC flexible circuit board is bent and disposed on the upper surface of the electromagnetic sheet. The chip has a temperature measuring module.
[0007] Preferably, the thickness of the upper metal plate is 0.5 mm, the thickness of the upper filling layer is 0.15 mm, the thickness of the reinforcing structural member is 1.9 mm, the thickness of the lower filling layer is 0.15 mm, and the thickness of the lower metal plate is 0.3 mm.
[0008] Preferably, both the upper and lower metal plates are made of metal, including but not limited to aluminum and stainless steel; the surface of the upper metal plate is provided with a baked enamel coating, and the nameplate information can be UV-printed or heat-transferred onto the paint surface, or the nameplate information can be directly laser-engraved on the paint surface.
[0009] Preferably, the upper and lower filler layers are made of rubber or thermosetting adhesive; including but not limited to rubber and thermosetting adhesive, which have excellent heat resistance, cold resistance, odor resistance, atmospheric aging resistance, corrosion resistance and other excellent properties.
[0010] Preferably, the reinforcing structural component is made of a non-metallic material, including but not limited to FR4, PC, and nylon, used for overall structural reinforcement (the mounting holes around the nameplate require screws or rivets to fix it to the mounting object during installation; the reinforcing structural component ensures a firm and effective fixation and prevents the metal nameplate body from deforming or denting) and tag positioning (an RFID anti-metal electronic tag is placed inside the reinforcing structural component to ensure that the tag is effectively protected and its position is fixed and does not move); the non-metallic design of the reinforcing structural component also serves an important purpose: the metal nameplate electronic tag, with its upper and lower metal plate structure, would shield electromagnetic signals; the RFID anti-metal electronic tag in the nameplate needs to receive and feed back electromagnetic signals through the non-metallic design of the reinforcing structural component, thereby achieving radio frequency and identification.
[0011] Preferably, the reinforcing structural member is a ring structure, and an RFID anti-metal electronic tag is placed inside the ring structure.
[0012] Preferably, the FPC flexible circuit board uses high-temperature resistant PI as the substrate, which has high flexibility and bendability. In this design, its bending design is used to achieve the label's anti-metal capability.
[0013] Preferably, the electromagnetic sheet is a high-transmittance composite material with low dielectric constant and low electromagnetic loss, and its thickness is 1.0 mm. As the substrate of the bent electronic tag, the electromagnetic sheet can achieve good impedance matching of the tag, thereby improving the performance of the tag. It also has good temperature resistance. The electromagnetic sheet has through holes for placing the electronic tag chip, which can effectively protect the chip while reducing the overall thickness of the electronic tag.
[0014] Preferably, the chip is soldered to the feeder using high-temperature resistant solder paste, and the chip is encapsulated and protected with high-temperature resistant epoxy resin.
[0015] Preferably, the upper metal plate, the upper filling layer, the reinforcing structural member, the lower filling layer, and the lower metal plate are all provided with mounting holes around their perimeter for label production positioning and subsequent label installation and fixing.
[0016] The present invention has the following advantages: ordinary PCB anti-metal tags need to be at least 3.0mm thick to achieve reliable anti-metal performance, but the electronic tag provided by the present invention has an overall thickness of only 3.0mm after being embedded in a metal plate, which is an ultra-thin design.
[0017] The metal nameplate electronic tag is designed with both front and back metal surfaces, giving the tag strong mechanical strength, load-bearing capacity, good weather resistance, and industrial aesthetics. In addition, metal has thermal conductivity, and by using a temperature sensor built into the chip, it can transmit the current environment or the surface temperature of the object being installed via radio frequency identification, which can effectively solve some application problems of long-distance temperature measurement. Attached Figure Description
[0018] Figure 1 This is an exploded view of the present invention.
[0019] Figure 2 This is a structural schematic diagram of the reinforcing structural component in this utility model.
[0020] Figure 3 This is a schematic diagram of the structure of the RFID anti-metal electronic tag in this utility model.
[0021] Figure 4 This is a schematic diagram of the structure of the FPC flexible circuit board in this utility model.
[0022] Figure 5 This is a schematic diagram of the structure of the electromagnetic sheet in this utility model.
[0023] In the diagram: 1 Upper metal plate, 2 Upper filler layer, 3 Reinforcing structural component, 4 Lower filler layer, 5 Lower metal plate, 6 FPC flexible circuit board, 7 Electromagnetic sheet, 8 Chip, 9 RFID anti-metal electronic tag, 10 Feeder line, 11 Through hole. Detailed Implementation
[0024] Embodiments of various aspects are further illustrated and described below. It should be understood that the description herein is not intended to limit the claims to the specific aspects described. Rather, it is intended to cover substitutions, modifications, and equivalents that may be included within the spirit and scope of this disclosure as defined by the appended claims.
[0025] A weather-resistant ultra-thin metal nameplate electronic tag includes an upper metal plate 1, an upper filling layer 2, an RFID anti-metal electronic tag 9, a lower filling layer 4, and a lower metal plate 5 arranged sequentially from top to bottom. The RFID anti-metal electronic tag 9 is provided with a reinforcing structural member 3 on its outer periphery.
[0026] The thickness of the upper metal plate 1 is 0.5mm, the material is metal, and the surface has a baked enamel coating;
[0027] The thickness of the upper filler layer 2 is 0.15mm, and it is made of a material with excellent heat resistance, cold resistance, ozone resistance, atmospheric aging resistance, and corrosion resistance.
[0028] The thickness of the reinforcing structural component 3 is 1.9mm, and the material is non-metallic.
[0029] The thickness of the lower filler layer 4 is 0.15mm, and it is made of a material with excellent heat resistance, cold resistance, ozone resistance, atmospheric aging resistance, and corrosion resistance.
[0030] The thickness of the upper metal plate 5 is 0.5mm, and the material is metal;
[0031] FPC flexible circuit board 6 uses high-temperature resistant PI as the substrate;
[0032] Chip 8 uses a DFN package, offering high stability. It conforms to the ISO / IEC 18000-6C EPC Class 1 GEN2 protocol or optionally the GB / T 29768 protocol. The chip includes a temperature measurement module and supports SM7 national cryptographic encryption. Its operating frequency covers 920~925MHz and is adaptable to 902~928MHz.
[0033] Chip 8 and FPC flexible circuit board 6 are combined using SMT surface mount technology to form RFID anti-metal electronic tag 9.
[0034] The RFID anti-metal electronic tag 9 includes an FPC flexible circuit board 6, a chip 8, and an electromagnetic sheet 7. The FPC flexible circuit board 6 consists of two parts. The pins on both sides of the chip 8 are connected to one part of the FPC flexible circuit board 6 through a feed line 10. When the chip 8 is attached to the feed line 10, high-temperature resistant solder paste is used for soldering, and high-temperature resistant epoxy resin is used to encapsulate and protect the chip 8.
[0035] The electromagnetic sheet 7 has a through hole 11 for placing the chip 8, which can effectively include the chip 8 while greatly reducing the overall thickness of the RFID anti-metal electronic tag 9. Placing the chip 8 in the through hole 11 can buffer external forces to a certain extent and reduce damage to the tag due to collisions or external pressure. The lower surface of the electromagnetic sheet 7 is attached to a portion of the FPC flexible circuit board, another portion of the FPC flexible circuit board is bent and attached to the upper surface of the electromagnetic sheet 7, and another portion of the FPC flexible circuit board is hollowed out, with the hollowed-out position corresponding to the chip 8. The FPC flexible circuit board 6 is bent and attached to the electromagnetic sheet. This design can change the current distribution of the antenna, optimize the radiation performance of the antenna, enable the radio frequency signal to be transmitted more effectively, and form a good electromagnetic coupling. Using the electromagnetic sheet 7 as the substrate of the RFID anti-metal electronic tag 9 can effectively match the impedance of the tag, thereby improving the performance of the tag.
[0036] The reinforcing structure 3 is a ring structure. The RFID anti-metal electronic tag 9 is placed in the reinforcing structure 3. The reinforcing structure 3 can effectively protect the RFID anti-metal electronic tag 9 while also improving the overall structural strength. Moreover, the non-metallic design of the reinforcing structure 3 can penetrate electromagnetic wave signals, allowing the tag to work normally without being affected by the electromagnetic signals shielded by the upper metal plate 1 and the lower metal plate 5. It cleverly combines metal shielding and radio frequency identification.
[0037] The upper metal plate 1, upper filling layer 2, RFID anti-metal electronic tag 9, lower filling layer 4, and lower metal plate 5 are placed in a mold and integrally heated and cured or vulcanized. Due to the characteristics of its integral molding process, the tag structure is stable and the firmness is reliable.
[0038] The metal nameplate electronic tag is designed with metal surfaces on both sides, which gives the tag strong mechanical strength, load-bearing capacity, good weather resistance and industrial aesthetics (especially the stainless steel wire drawing process, which further enhances its luster). In addition, metal has thermal conductivity, and by using a temperature sensor built into the chip, the current environment or the surface temperature of the object being installed can be transmitted through radio frequency identification, which can effectively solve some application problems of long-distance temperature measurement.
[0039] The upper metal plate 1, upper filler layer 2, reinforcing structural component 3, lower filler layer 4, and lower metal plate 5 all have mounting holes on all four sides, allowing for various label installation methods. Labels can be installed by threading cable ties through the mounting holes, using screws or rivets, or applying adhesive backing. This makes it flexible and convenient to use.
[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. However, the above description is only a specific embodiment of this utility model, and the technical features of this utility model are not limited thereto. Any other embodiments derived by those skilled in the art without departing from the technical solution of this utility model should be covered within the patent scope of this utility model.
Claims
1. A weather-resistant ultra-thin metal nameplate electronic tag, characterized in that, The device includes, from top to bottom, an upper metal plate (1), an upper filling layer (2), an RFID anti-metal electronic tag (9), a lower filling layer (4), and a lower metal plate (5). The RFID anti-metal electronic tag (9) has a reinforcing structural component (3) on its outer periphery. The reinforcing structural component (3) is made of non-metallic material. The RFID anti-metal electronic tag (9) includes an FPC flexible circuit board (6), a chip (8), and an electromagnetic sheet (7). The FPC flexible circuit board (6) is divided into two parts. One part of the FPC flexible circuit board has a feed line (10) and is connected to the chip (8) through the feed line (10). The lower surface of the electromagnetic sheet (7) is attached to one part of the FPC flexible circuit board. The electromagnetic sheet (7) has a through hole (11) for placing the chip (8). The other part of the FPC flexible circuit board is bent and attached to the upper surface of the electromagnetic sheet (7).
2. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, The thickness of the upper metal plate (1) is 0.5 mm, the thickness of the upper filling layer (2) is 0.15 mm, the thickness of the reinforcing structural member (3) is 1.9 mm, the thickness of the lower filling layer (4) is 0.15 mm, and the thickness of the lower metal plate (5) is 0.3 mm.
3. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, Both the upper metal plate (1) and the lower metal plate (5) are made of metal, and the surface of the upper metal plate (1) is coated with a baked paint.
4. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, The upper filling layer (2) and the lower filling layer (4) are made of rubber or thermosetting adhesive.
5. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, The chip (8) has a temperature measurement module.
6. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, The reinforcing structural component (3) is a ring structure, and an RFID anti-metal electronic tag (9) is placed inside the ring structure.
7. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, The FPC flexible circuit board (6) uses high-temperature resistant PI as the substrate.
8. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, The electromagnetic sheet (7) is a high-transmittance composite material with low dielectric constant and low electromagnetic loss.
9. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, When the chip (8) is attached to the feed line (10), high-temperature resistant solder paste is used for soldering, and high-temperature resistant epoxy resin is used to encapsulate and protect the chip (8).
10. The weather-resistant ultra-thin metal nameplate electronic tag according to claim 1, characterized in that, Mounting holes are provided around the upper metal plate (1), upper filling layer (2), reinforcing structural member (3), lower filling layer (4), and lower metal plate (5).