Display module and display device

By creating through holes on the flexible circuit board and optimizing the position of the driver chip, the problem of water vapor condensation corrosion was solved, achieving high reliability and stability of the display module, making it suitable for smart devices.

CN224232297UActive Publication Date: 2026-05-12TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
Filing Date
2025-05-20
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

In display devices, when the ambient temperature changes, water vapor condenses inside the display panel, causing corrosion of electrodes, wires, or chips in the COF structure, leading to display abnormalities and affecting product stability and user experience.

Method used

Through holes are made in the flexible circuit board to allow moisture to escape, preventing moisture from accumulating and corroding circuit components. The location of the driver chip is designed to avoid low-lying areas of the circuit board, and a protective layer and insulating film are set to enhance moisture resistance.

Benefits of technology

It effectively prevents water vapor corrosion, improves the reliability and durability of the display module, reduces the risk of display abnormalities, and enhances the stability of the product in high humidity or temperature difference environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a display module and a display device, the display module comprises a display panel and a flexible circuit board, the first end of the flexible circuit board is connected to the first surface of the display panel, and the second end of the flexible circuit board is bent to the side, away from the first surface, of the display panel; according to the display panel, the plurality of first open holes are formed in the flexible circuit board, and the first open holes penetrate through the flexible circuit board, so that water vapor is discharged out of the circuit assembly through the open holes, the water vapor is prevented from corroding the circuit assembly, and the problem of poor display of the display panel is further avoided.
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Description

Technical Field

[0001] This utility model relates to the field of battery technology, specifically to a display module and display device. Background Technology

[0002] With the continuous development of optical and semiconductor technologies, display devices are evolving towards thinner, smaller, and more integrated designs. This trend has driven the widespread application of new materials and packaging technologies. Chip-on-film (COF) technology, as a key packaging method, enables the direct mounting of integrated circuit chips onto flexible circuit boards and achieves electrical connection with the display panel through a bonding process. This meets the requirements for efficient and reliable signal transmission and is widely used in various high-resolution display products.

[0003] During actual use of display devices, when the ambient temperature changes drastically, water vapor in the air inside the display device can easily condense on the low-temperature surfaces of the metal or glass inside the display panel. Due to the height difference between the driver chip and the flexible substrate in the COF structure, condensed water droplets tend to accumulate and remain in this recessed area. During condensation, these droplets may carry corrosive ions such as dissolved potassium and sodium from the air. Prolonged retention can cause corrosion damage to the electrodes, wires, or chips in the COF structure, leading to driver failure and resulting in abnormal phenomena such as screen flickering, stripe interference, or even black screens. This severely impacts product stability and user experience. Utility Model Content

[0004] This utility model provides a display module and display device to improve the problem of poor image display caused by water droplets accumulating and corroding the flip-chip film.

[0005] To achieve the above objectives, according to a first aspect of the present invention, a display module is provided, comprising:

[0006] Display panel;

[0007] A flexible circuit board, wherein a first end of the flexible circuit board is connected to a first surface of the display panel, and a second end of the flexible circuit board is bent to the side of the display panel away from the first surface;

[0008] The flexible circuit board has multiple first openings, and the first openings penetrate the flexible circuit board.

[0009] Optionally, in one embodiment, the display module further includes:

[0010] A driver chip is bonded to the flexible circuit board, and the driver chip is located between the flexible circuit board and the display panel;

[0011] The first opening is located between the driver chip and the second end of the flexible circuit board.

[0012] Optionally, in one embodiment, the flexible circuit board includes a first connecting portion, a second connecting portion, and a bent portion connecting the first connecting portion and the second connecting portion;

[0013] The driving chip is bonded to the bending portion, and the driving chip is located on the side of the bending portion closer to the first connecting portion.

[0014] Optionally, in one embodiment, in a direction perpendicular to the first surface of the display panel, the distance between the side of the driving chip closest to the display panel and the first surface is smaller than the distance between the center line of the bent portion and the first surface.

[0015] Optionally, in one embodiment, the flexible circuit board includes a wiring area and a non-wiring area, the first opening is located in the non-wiring area, and the distance between the first opening and the wiring area is greater than a preset distance.

[0016] Optionally, in one embodiment, the flexible circuit board includes at least one aperture group, the aperture group including a plurality of first apertures spaced apart along the length direction of the driving chip.

[0017] Optionally, in one embodiment, the length of the aperture group along the length direction of the driver chip is greater than or equal to the length of the driver chip.

[0018] Optionally, in one embodiment, the display module further includes a protective layer disposed on the side of the flexible circuit board away from the display panel, the protective layer covering at least a portion of the flexible circuit board;

[0019] The protective layer has multiple second openings that penetrate the protective layer, and each second opening corresponds to and is connected to a first opening.

[0020] Optionally, in one embodiment, the display module further includes an insulating film disposed on the inner wall of the first opening.

[0021] According to a second aspect of the present invention, a display device is provided, comprising a display module as described in any of the above embodiments.

[0022] The beneficial effects of this utility model embodiment are as follows: This utility model embodiment provides a display module and a display device. The display module includes a display panel and a flexible circuit board. The first end of the flexible circuit board is connected to the first surface of the display panel, and the second end of the flexible circuit board is bent to the side of the display panel away from the first surface. By providing a plurality of first openings on the flexible circuit board, and the first openings penetrating the flexible circuit board, moisture is discharged through the openings to the circuit components, avoiding corrosion of the circuit components by moisture, and thus avoiding the problem of display failure of the display panel. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0024] To gain a more complete understanding of this utility model and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0025] Figure 1 This is a schematic diagram of the structure of the display module provided in an embodiment of the present utility model;

[0026] Figure 2 Provided for the embodiments of this utility model Figure 1 A schematic diagram of a local cross-section corresponding to AA' in the middle;

[0027] Figure 3 This is a schematic diagram of the planar structure of the circuit board assembly provided in an embodiment of the present utility model;

[0028] Figure 4 This is a schematic diagram of the structure of the display device provided in an embodiment of the present utility model;

[0029] Figure 5 Provided for the embodiments of this utility model Figure 4 A schematic diagram of the cross section corresponding to BB'.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1-Display module; 11-Display panel; 12-Functional film layer; 13-Circuit board assembly; 14-Encapsulation structure; 15-Optical transparent adhesive; 16-Protective layer; 17-Insulating film;

[0032] 11A - First surface; 121 - First polarizer; 122 - Second polarizer; 1321 - Second surface; 1322 - Third surface; 111 - First substrate; 112 - Second substrate; 113 - Liquid crystal layer; 1111 - Bonding end; 131 - Flexible circuit board; 132 - Printed circuit board; 133 - Driver chip; 131A - First opening; 131B - First connection part; 131C - Second connection part; 131D - Bending part; 1310 - Opening group; 1311 - Wiring area; 1312 - Non-wiring area; 16A - Second opening;

[0033] 2-Display device; 21-Backlight module; 22-Middle frame. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of the present utility model and are not intended to limit the present utility model. In the present utility model, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower in the actual use or working mode of the device, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only, and features specified as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections or connections that allow for communication; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] The following disclosure provides many different embodiments for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, examples of various specific processes and materials are provided, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0038] Please combine Figure 1 and Figure 2 ;in, Figure 1 This is a schematic diagram of the structure of the display module provided in an embodiment of the present utility model; Figure 2 Provided for the embodiments of this utility model Figure 1 A schematic diagram of a local cross-section corresponding to AA'.

[0039] This embodiment provides a display module 1, which includes a display panel 11, a functional film layer 12, a circuit board assembly 13, and a packaging structure 14; wherein, one end of the circuit board assembly 13 is electrically connected to the display panel 11, and the other end of the circuit board assembly 13 is bent to the back of the display panel 11.

[0040] The display panel 11 includes, but is not limited to, any one of an organic light-emitting diode (OLED) display panel and a liquid crystal display (LCD) panel. The specific type can be selected according to different application requirements. In this embodiment, a liquid crystal display panel is used as an example for illustration, but the present invention is not limited to this and is also applicable to other types of display panel structures.

[0041] The display panel 11 includes a first substrate 111 and a second substrate 112 disposed opposite to each other, and a liquid crystal layer 113 located between the first substrate 111 and the second substrate 112; wherein the first substrate 111 and the second substrate 112 are sealed to form a liquid crystal cell to accommodate the liquid crystal layer 113, and the liquid crystal layer 113 includes a plurality of liquid crystal molecules.

[0042] Specifically, the first substrate 111 can be an array substrate, and the first substrate 111 includes a first electrode; the second substrate 112 can be a color filter substrate, and the second substrate 112 includes a second electrode; wherein, the first electrode and the second electrode are respectively located on the upper and lower sides of the liquid crystal layer 113, and are used to apply an electric field to the liquid crystal layer 113 during operation.

[0043] During image display, the first electrode and the second electrode apply a voltage to the liquid crystal layer 113, forming an electric field perpendicular to the liquid crystal layer 113, thereby driving the liquid crystal molecules to undergo orderly twisting or rearrangement, changing their refractive index or polarization direction for incident light; wherein, when the light emitted from the backlight passes through the liquid crystal layer 113, its polarization state will change according to the arrangement of the liquid crystal molecules, thereby controlling the transmittance of the light after passing through the liquid crystal cell, and realizing the display effect of different brightness grayscale or color images.

[0044] The first substrate 111 includes a bonding end 1111 not covered by the second substrate 112. The second substrate 112 and the first substrate 111 form a step area on the side near the circuit board assembly 13. The bonding end 1111 is located in the step area and is electrically connected to the circuit board assembly 13 in the step area.

[0045] The functional film layer 12 includes a first polarizer 121 and a second polarizer 122, both of which are attached to the surface of the display panel 11. Specifically, the first polarizer 121 is disposed on the light-emitting side of the display panel 11, and the second polarizer 122 is disposed on the backlight side of the display panel 11. The polarization directions of the first polarizer 121 and the second polarizer 122 are perpendicular to each other to achieve polarization control.

[0046] The circuit board assembly 13 includes a flexible printed circuit (FPC) 131. A first end of the flexible printed circuit 131 is connected to a first surface 11A of the display panel 11, and a second end of the flexible printed circuit 131 is bent to the side of the display panel 11 away from the first surface 11A. The flexible printed circuit 131 has a plurality of first openings 131A, and the first openings 131A penetrate the flexible printed circuit 131, thereby allowing water vapor accumulated inside or on the surface of the circuit board assembly 13 to be discharged to the external environment through the first openings 131A, reducing the residue and retention of water vapor on the surface of the circuit board assembly 13, and thus reducing the risk of circuit failure caused by water vapor condensation or corrosion.

[0047] Specifically, the first opening 131A penetrates the circuit board assembly 13 along the thickness direction of the flexible circuit board 131. The shape of the first opening 131A can be circular, elliptical, or other regular geometric shapes. The first opening 131A can be distributed in an array and disposed in the non-functional area or non-soldering area of ​​the flexible circuit board 131 to avoid the first opening 131A affecting the electrical performance of the circuit board assembly 13. The size of the first opening 131A can be designed according to actual needs, and this embodiment does not impose specific limitations on it.

[0048] The shape of the encapsulation structure 14 matches the shape of the functional film layer 12. The encapsulation structure 14 can be bonded to the side of the functional film layer 12 away from the display panel 11 using optically clear adhesive 15 (OCA) to ensure high light transmittance and excellent adhesion performance. Specifically, the encapsulation structure 14 includes, but is not limited to, a cover glass (CG) to provide protection against the external environment, preventing moisture and oxygen from penetrating the functional film layer 12, thereby improving the reliability and service life of the display panel 11.

[0049] Please combine Figure 1 , Figure 2 and Figure 3 ;in, Figure 3 This is a schematic diagram of the planar structure of the circuit board assembly provided in an embodiment of the present utility model.

[0050] In one embodiment, the circuit board assembly 13 includes a flexible printed circuit board 131 (FPC), a printed circuit board 132 (PCB), and a driver chip 133 (DriverIC). The PCB 132 is disposed on the backlight side of the display panel 11. A first end of the flexible printed circuit board 131 is connected to a first surface 11A of the display panel 11. A second end of the flexible printed circuit board 131 is bent to the side of the display panel 11 away from the first surface 11A and electrically connected to the PCB 132. The driver chip 133 is bonded to the flexible printed circuit board 131 and is located between the flexible printed circuit board 131 and the display panel 11.

[0051] Specifically, the display panel 11 includes a first surface 11A bonded to the flexible circuit board 131. The first surface 11A is located on the first substrate 111. In a direction perpendicular to the first surface 11A of the display panel 11, the printed circuit board 132 includes a second surface 1321 and a third surface 1322 disposed opposite to each other. The second surface 1321 and the third surface 1322 are both parallel to the first surface 11A, and the second surface 1321 is disposed close to the first surface 11A. The direction perpendicular to the first surface 11A of the display panel 11 can be... Figure 2 The Z direction in the equation.

[0052] The driver chip 133 is located between the flexible circuit board 131 and the display panel 11. The driver chip 133 can be integrated onto the flexible circuit board 131 using chip-on-film (COF) technology and fixed onto the flexible circuit board 131 by flip-chip bonding, thereby achieving high-density interconnection, simplifying the structure of the display module 1, and improving the integration and electrical performance stability of the display module 1.

[0053] Furthermore, the flexible circuit board 131 has a plurality of first openings 131A, and the first openings 131A are located between the driver chip 133 and the second end of the flexible circuit board 131. This allows moisture that may accumulate inside or on the surface of the flexible circuit board 131 to be discharged to the external environment through the first openings 131A, thereby reducing the risk of moisture condensing and lingering in the welding part or electrical connection area, avoiding moisture from corroding the driver chip 133, electrical connection solder joints and other structures, and thus improving the reliability and durability of the display module 1 in high humidity or temperature difference environments.

[0054] Furthermore, the first opening 131A is not overlapped with the driving chip 133, and there is a gap between the first opening 131A and the connection between the driving chip 133 and the flexible circuit board 131, thereby avoiding the first opening 131A from affecting the connection between the driving chip 133 and the flexible circuit board 131. Specifically, the first opening 131A is spaced apart from the driving chip 133, thereby avoiding problems such as pad peeling, solder joint failure or electrical failure caused by the presence of moisture channels during the processing or long-term use of the flexible circuit board 131, thus improving the overall reliability of the display module 1.

[0055] Please continue to combine Figure 1 , Figure 2 and Figure 3In one embodiment, the flexible circuit board 131 includes a wiring area 1311 and a non-wiring area 1312, the first opening 131A is located in the non-wiring area 1312, and the distance between the first opening 131A and the wiring area 1311 is greater than a preset distance.

[0056] In one embodiment, the flexible circuit board 131 includes a wiring area 1311 and a non-wiring area 1312. The first opening 131A is located in the non-wiring area 1312, and the distance between the first opening 131A and the wiring area 1311 is greater than a preset distance, thereby avoiding the first opening 131A from causing adverse effects on the signal transmission or electrical performance of the flexible circuit board 131.

[0057] Specifically, by limiting the first opening 131A to an area without signal traces or circuit structures (i.e., non-wiring area 1312), and setting the distance between the first opening 131A and the wiring area 1311 to be greater than a preset distance, the risk of electrical corrosion or short circuits to the wires, solder joints, or electrical connections in the wiring area 1311 can be avoided due to condensation or liquid accumulation that may occur during the discharge of moisture and water vapor through the first opening 131A. This improves the environmental stability and electrical reliability of the flexible circuit board 131, thereby enhancing the working stability of the display module 1 in humid or complex environments.

[0058] It is understood that the preset spacing can be determined based on the wiring density, voltage level and product reliability level of the flexible circuit board 131 to ensure a balance between process feasibility and electrical safety.

[0059] Please continue to combine Figure 1 , Figure 2 and Figure 3 In one embodiment, the flexible circuit board includes at least one aperture group 1310, the aperture group 1310 including a plurality of first apertures 131A spaced apart along the length direction of the driving chip 133, thereby forming a directional drainage channel to guide water vapor or condensate to easily drain along a preset path; wherein, the length direction of the driving chip 133 can be Figure 3 The X direction in the equation.

[0060] Specifically, along the length of the driving chip 133, the length of the opening group 1310 is greater than or equal to the length of the driving chip 133, so that water vapor or condensate that condenses at any location around the driving chip 133 can be quickly discharged through the nearest first opening 131A, thereby improving the electrical connection characteristics between the driving chip and the flexible circuit board.

[0061] Please continue to combine Figure 1 , Figure 2 and Figure 3 In one embodiment, the flexible circuit board 131 includes a first connecting portion 131B, a second connecting portion 131C, and a bending portion 131D connecting the first connecting portion 131B and the second connecting portion 131C. The first connecting portion 131B is bonded to the first surface 11A of the display panel 11, the second connecting portion 131C is disposed on the side of the display panel 11 away from the first surface 11A, and the bending portion 131D is disposed on one side of the display panel 11, thereby realizing the transition layout of the flexible circuit board 131 from one side of the display panel 11 to the back side.

[0062] It is understood that the first connecting portion 131B, the second connecting portion 131C, and the bending portion 131D of the flexible circuit board 131 are continuous structures, and the three are divided into regions only according to their different positions.

[0063] The driving chip 133 is bonded to the bending portion 131D, and the driving chip 133 is located on the side of the bending portion 131D close to the first connecting portion 131B, so that the driving chip 133 avoids the lowest point area formed after the flexible circuit board 131 is installed.

[0064] Specifically, in the direction perpendicular to the first surface 11A of the display panel 11, the distance between the side of the driving chip 133 closest to the display panel 11 and the first surface 11A is smaller than the distance between the center line W1 of the bent portion 131D and the first surface 11A. This allows the driving chip 133 to avoid the lowest point area formed after the flexible circuit board 131 is installed by moving the position of the driving chip 133 forward relative to the position of the first connecting portion 131B of the flexible circuit board 131.

[0065] It is understood that the bending portion 131D of the flexible circuit board 131 is used to bend the flexible circuit board 131 along the first surface 11A of the display panel 11 to the side of the display panel 11 away from the first surface 11A. During use or storage, moisture or condensation is easily accumulated at the lowest point of the bending portion 131D due to gravity or layout structure.

[0066] This embodiment sets the distance between the side of the driver chip 133 closest to the display panel 11 and the first surface 11A to be smaller than the distance between the center line W1 of the bent portion 131D and the first surface 11A. This moves the relative position of the driver chip 133 forward, away from the lowest point of the bent portion 131D. As a result, when water droplets or condensate adhering to the bent portion 131D flow to the lowest point of the bent portion 131D, they will not flow to the electrical connection between the driver chip 133 and the flexible circuit board 131. This avoids problems such as corrosion, short circuits, or abnormal performance of the driver chip 133 due to the accumulation of water droplets or condensate, thereby improving the environmental stability of the driver chip 133 and the service life of the display module 1.

[0067] Please continue to combine Figure 1 , Figure 2 and Figure 3 In one embodiment, the display module 1 further includes a protective layer 16, which is disposed on the side of the flexible circuit board 131 away from the display panel 11. The protective layer 16 can extend from above the first connecting portion 131B to the side of the second connecting portion 131C away from the first connecting portion 131B. The protective layer 16 can protect the flexible circuit board 131. The material of the protective layer 16 may include a photocurable resin.

[0068] Specifically, at least a portion of the second connecting part 131C does not contact the protective layer 16, and the second connecting part 131C not covered by the protective layer 16 is conveniently electrically connected to the printed circuit board 132; the protective layer 16 has a plurality of second openings 16A, which penetrate the protective layer 16, and one second opening 16A is correspondingly provided with and connected to one first opening 131A, thereby improving the efficiency of moisture discharge and preventing moisture from accumulating between the flexible circuit board 131 and the protective layer 16, thereby enhancing the moisture resistance and working stability of the circuit board assembly 13.

[0069] Furthermore, the display module 1 also includes an insulating film 17, which is disposed on the inner wall of the first opening 131A and the second opening 16A. The insulating film 17 does not fill the first opening 131A and the second opening 16A, thereby electrically isolating the inner wall of the first opening 131A and the second opening 16A and improving the insulation and reliability of the flexible circuit board 131.

[0070] Specifically, the insulating film 17 covers the inner wall surfaces of the first opening 131A and the second opening 16A, effectively insulating and protecting the inner walls of the first opening 131A and the second opening 16A, preventing electrical faults such as short circuits and leakage caused by the accumulation of moisture, water vapor or other conductive impurities on the inner walls of the first opening 131A and the second opening 16A; wherein, the insulating film 17 can be formed of a polymer material with good insulation and heat resistance, thereby improving the electrical isolation effect of the insulating film 17.

[0071] Please combine Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ;in, Figure 4 This is a schematic diagram of the structure of the display device provided in an embodiment of the present utility model; Figure 5 Provided for the embodiments of this utility model Figure 4 A schematic diagram of the cross section corresponding to BB'.

[0072] This embodiment also provides a display device, which includes a backlight module and the display module described in any of the above embodiments; wherein, the backlight module is located on one side of the backlight of the display panel, and the brightness display of the display panel is realized by the light source provided by the backlight module. The backlight module includes, but is not limited to, a direct-lit backlight module or an edge-lit backlight module. This embodiment takes an edge-lit backlight module as an example for illustration.

[0073] Furthermore, the display device may also include a mid-frame, which is integrated with the display module to provide support, fixation, and protection for the display module.

[0074] It is understood that the display module has been described in detail in the above embodiments, and will not be repeated here; in particular, since the display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be elaborated here.

[0075] In specific applications, the display device can be at least one of the following devices with display functions: smartphone, tablet computer, mobile phone, video phone, e-book reader, desktop computer, laptop computer, netbook, workstation, server, personal digital assistant, portable media player, MP3 player, mobile medical device, camera, game console, digital camera, car navigation system, electronic billboard, ATM, or wearable device.

[0076] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0077] The above provides a detailed description of a display module and display device provided by the embodiments of this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this utility model. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A display module, characterized in that, include: Display panel; A flexible circuit board, wherein a first end of the flexible circuit board is connected to a first surface of the display panel, and a second end of the flexible circuit board is bent to the side of the display panel away from the first surface; The flexible circuit board has multiple first openings, and the first openings penetrate the flexible circuit board.

2. The display module according to claim 1, characterized in that, The display module also includes: A driver chip is bonded to the flexible circuit board, and the driver chip is located between the flexible circuit board and the display panel; The first opening is located between the driver chip and the second end of the flexible circuit board.

3. The display module according to claim 2, characterized in that, The flexible circuit board includes a first connecting portion, a second connecting portion, and a bent portion connecting the first connecting portion and the second connecting portion; The driving chip is bonded to the bending portion, and the driving chip is located on the side of the bending portion closer to the first connecting portion.

4. The display module according to claim 3, characterized in that, In a direction perpendicular to the first surface of the display panel, the distance between the side of the driving chip closest to the display panel and the first surface is smaller than the distance between the center line of the bent portion and the first surface.

5. The display module according to claim 2, characterized in that, The flexible circuit board includes a wiring area and a non-wiring area. The first opening is located in the non-wiring area, and the distance between the first opening and the wiring area is greater than a preset distance.

6. The display module according to claim 2, characterized in that, The flexible circuit board includes at least one aperture group, and the aperture group includes a plurality of first apertures spaced apart along the length direction of the driving chip.

7. The display module according to claim 6, characterized in that, Along the length of the driver chip, the length of the aperture group is greater than or equal to the length of the driver chip.

8. The display module according to any one of claims 1 to 5, characterized in that, The display module further includes a protective layer, which is disposed on the side of the flexible circuit board away from the display panel and covers at least a portion of the flexible circuit board. The protective layer has multiple second openings that penetrate the protective layer, and each second opening corresponds to and is connected to a first opening.

9. The display module according to any one of claims 1 to 5, characterized in that, The display module also includes an insulating film, which is disposed on the inner wall of the first opening.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.