Heat dissipation structure, air cooling heat dissipation structure and liquid cooling heat dissipation structure for controller, controller and movable platform

Abstract

The utility model discloses a heat dissipation structure, an air cooling heat dissipation structure and a liquid cooling heat dissipation structure used for a controller, the controller and a movable platform, the heat dissipation structure used for the controller comprises a first housing of the controller, and the first housing is arranged at one side, departing from a circuit board of the controller, of a chipset of the controller; the first shell comprises a main shell and a heat dissipation module which are modularly arranged, and the heat dissipation module is installed on the main shell, located at the position, corresponding to the chipset arrangement area, of the main shell and used for conducting heat dissipation on the chipset. Therefore, after the specification or the position of the chip of the controller is changed, only the heat dissipation module corresponding to a new chip is replaced under the condition that the main shell is not replaced, the heat dissipation effect can be ensured not to be deteriorated, the development time is greatly shortened, and the development cost is greatly reduced.

Description

Technical Field

[0001] This utility model relates to heat dissipation devices, specifically to a heat dissipation structure for a controller, an air-cooled heat dissipation structure, a liquid-cooled heat dissipation structure, a controller, and a mobile platform. Background Technology

[0002] The chipset in the controller generates heat during operation. To prevent performance degradation due to overheating, avoid permanent hardware damage, and ensure the reliability and safety of the controller, it is generally necessary to cool the chipset, especially for high-performance chipsets.

[0003] However, controllers on the market are often configured with different chipsets to meet different needs. When the chipset configuration changes, the entire heat dissipation structure usually needs to be replaced to ensure effective heat dissipation. However, this solution of replacing the entire heat dissipation structure leads to excessively high production costs. Utility Model Content

[0004] To solve at least one of the above problems, according to one aspect of the present invention, a heat dissipation structure for a controller is provided.

[0005] The heat dissipation structure for the controller includes a first housing of the controller, which is disposed on the side of the controller's chipset away from the controller's circuit board. The first housing includes a modularly configured main housing and a heat dissipation module, which is mounted on the main housing and located at a position on the main housing corresponding to the chipset's placement area, and is used to dissipate heat from the chipset.

[0006] Therefore, when the specifications or location of the controller chip are changed, the heat dissipation effect can be maintained without changing the main housing. Only the heat dissipation module corresponding to the new chip (the chip with the changed location or specifications) needs to be replaced, which greatly reduces development time and development cost.

[0007] In some implementations, the heat dissipation module is mounted on the main housing by welding. This reduces the thermal resistance between the heat dissipation module and the main housing, ensuring the heat dissipation effect of both the heat dissipation module and the main housing.

[0008] In some implementations, a raised group is provided at the position of the heat dissipation module corresponding to the chipset. This raised group ensures the heat dissipation effect of the heat dissipation module on the chipset.

[0009] In some implementations, the heat dissipation module is mounted on the main housing using friction welding, brazing, adhesive welding, or laser welding. This ensures a good weld between the heat dissipation module and the main housing, while maintaining low thermal resistance between them.

[0010] In some embodiments, the main housing is die-cast, has serrated edges, or is formed by aluminum extrusion. Die-casting has high processing efficiency; adding serrated edges to the main housing or using aluminum extrusion can increase the density of the heat dissipation teeth on the main housing, thereby significantly improving the heat dissipation efficiency of the main housing by greatly increasing the heat dissipation area.

[0011] In some embodiments, the heat dissipation module is die-cast, has serrated edges, is formed by aluminum extrusion, or includes a heat dissipation tooth module and a heat equalization module. The heat equalization module is connected to the side of the heat dissipation tooth module facing the chipset, and the protrusion assembly is provided on the side of the heat equalization module facing the chipset. Die-casting has high processing efficiency; adding serrated edges to the heat dissipation module or using aluminum extrusion can increase the density of the heat dissipation teeth of the heat dissipation module, thereby significantly improving the heat dissipation efficiency of the heat dissipation module by greatly increasing the heat dissipation area; the heat dissipation module includes a heat dissipation tooth module and a heat equalization module, which can homogenize the heat of the chipset through the heat equalization module, reduce the heat flux density, and then introduce it into the heat dissipation tooth module, and finally dissipate it into the outside, thereby greatly improving the heat dissipation efficiency of the heat dissipation module.

[0012] In some implementations, the heat distribution module is made of a pure metal plate or heat distribution plate, such as pure copper. This ensures the heat distribution effect of the heat distribution module.

[0013] In some implementations, the heat dissipation fin module and the heat equalization module are connected by welding. This reduces the thermal resistance between the heat dissipation fin module and the heat equalization module, ensuring the heat dissipation efficiency of the resulting heat dissipation module.

[0014] In some embodiments, a first through-hole is provided on the main housing at a position corresponding to the chipset mounting area; the heat dissipation module is installed in the first through-hole. Therefore, heat transferred from the chipset to the heat dissipation module can be directly dissipated into the outside environment, improving heat dissipation efficiency.

[0015] According to another aspect of this utility model, a wind-cooled heat dissipation structure for a controller is provided, which includes a fan and the aforementioned heat dissipation structure for the controller; wherein the fan is disposed on the side of the heat dissipation module opposite to the chipset. Thus, the heat dissipation efficiency of the heat dissipation structure can be improved by using the fan.

[0016] According to another aspect of this utility model, a liquid-cooled heat dissipation structure for a controller is provided, which includes the aforementioned heat dissipation structure for a controller; wherein the main housing is a water-cooled housing, and the heat dissipation module is disposed on the side of the water-cooled housing facing the chipset. Thus, the heat dissipation efficiency of the heat dissipation structure can be improved by using a water-cooled housing.

[0017] According to another aspect of the present invention, a controller is provided, comprising a first housing, a chipset, a circuit board, and a bottom cover; wherein, the first housing is the aforementioned first housing; the chipset is electrically connected to a first side of the circuit board; the first housing is disposed on the side of the chipset opposite to the circuit board; the bottom cover is disposed on the side of the circuit board opposite to the chipset; the first housing and the bottom cover are connected to form an accommodating space for accommodating the circuit board and the chipset.

[0018] Therefore, when the specifications or position of the controller chip are changed, the heat dissipation module of the first housing corresponding to the new chip (the chip with the changed position or the chip with the changed specifications) can be replaced without replacing the main housing of the first housing, thus ensuring that the heat dissipation effect does not deteriorate, greatly reducing development time and development costs.

[0019] In some embodiments, the controller further includes a thermally conductive interface material, with its two sides contacting the chipset and the heat dissipation module, respectively. This allows heat from the chipset to be transferred through the thermally conductive interface material into the heat dissipation module and the main housing, and ultimately dissipated into the environment, thereby improving heat dissipation efficiency.

[0020] According to one aspect of this utility model, a movable platform is provided, which includes the aforementioned controller. Therefore, when the specifications or location of the controller's chip are changed, the heat dissipation effect can be maintained by replacing only the heat dissipation module of the first housing corresponding to the new chip, without replacing the main housing of the first housing. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the heat dissipation structure for a controller according to one embodiment of the present invention, and a disassembly structure for the controller.

[0022] Figure 2 for Figure 1 The diagram shows a heat dissipation structure for the controller, which is a schematic diagram of the circuit board in the controller in which the chipset is located.

[0023] Figure 3 for Figure 2 A schematic diagram of the first arrangement of chipsets on the circuit board shown;

[0024] Figure 4 This is a schematic diagram of the heat dissipation module according to the first embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the second arrangement of the chipset of this utility model;

[0026] Figure 6 This is a schematic diagram of the heat dissipation module structure according to the second embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of the heat dissipation module structure according to the third embodiment of this utility model;

[0028] Figure 8 This is a schematic diagram of the heat dissipation module structure according to the fourth embodiment of this utility model;

[0029] Figure 9 This is a schematic diagram of the air-cooled heat dissipation structure for a controller according to one embodiment of the present invention, and a disassembly structure for the controller.

[0030] Figure 10 This is a schematic diagram of the liquid cooling heat dissipation structure for a controller according to one embodiment of the present invention, and a disassembly structure for the controller.

[0031] Reference numerals: 20, First housing; 21 / 21', Main housing; 211, First through hole; 22 / 22a / 22b / 22c / 22d, Heat dissipation module; 221a / 221b / 221c / 221d, Protrusion group; 2211a / 2211b / 2211c / 2211d, First protrusion; 2212a / 2212b / 2212c / 2212d, Second protrusion; 222, Heat dissipation tooth module; 223, Heat equalization module; 224, Fin; 225, Shovel teeth; 30 / 30a / 30b, Chipset; 31 / 31a / 31b, Main chip; 32 / 32a / 32b, Key chip; 40, Circuit board; 50, Bottom cover; 60, Thermal interface material; 70, Fan; 80, Fan cover. Detailed Implementation

[0032] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0033] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0034] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or component and another (or other) element or component as shown in the figure. In addition to the orientation shown in the figure, spatial relative terms are intended to include different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted accordingly.

[0035] In this paper, the term "thermal interface materials" (TIM) refers to materials used to improve the heat dissipation performance of electronic devices. They are primarily used to fill the tiny gaps between electronic components and heat sinks caused by surface irregularities, reducing heat transfer contact thermal resistance and thus improving heat dissipation efficiency. Because air has extremely low thermal conductivity (approximately 0.024 W / (m·K)), direct contact leads to low heat sink efficiency. Thermal interface materials, by filling these gaps, excluding air, and establishing effective heat conduction channels, can significantly reduce contact thermal resistance. Common types include: thermal greases made primarily of silicone; thermally conductive silicone sheets with silicone as the base material and added metal oxides and other auxiliary materials; phase change materials composed of polyolefin resins, acrylic resins, aluminum, alumina, carbon nanotubes, etc.; thermally conductive adhesives with epoxy resin as the base and added thermally conductive fillers such as iron, silver, and nickel; thermally conductive gels with both solid and liquid properties; and indium sheets, etc.

[0036] In this article, the term "vapor chamber" (VC) refers to a highly efficient heat dissipation element whose working principle is based on the gas-liquid phase change of an internal liquid. It typically consists of a sealed cavity filled with a small amount of working liquid (such as deionized water or acetone), and the liquid circulates through capillary structures on the inner wall. When heat from a heat source (such as a CPU or GPU) is conducted to the vapor chamber, the liquid vaporizes in the evaporation zone. The vapor flows to the condensation zone under pressure difference, dissipates heat in the condensation zone, and then recondenses back into liquid, flowing back to the evaporation zone through the capillary structure, thus achieving rapid heat conduction and diffusion. A vapor chamber generally includes a shell, a working liquid, and a capillary structure. The shell can be made of copper, stainless steel, or aluminum alloy. The working liquid can be deionized water or acetone. The capillary structure can be sintered copper powder, copper mesh, or a composite structure.

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0038] Figures 1 to 4 The diagram schematically illustrates a heat dissipation structure for a controller according to one embodiment of the present invention.

[0039] As shown in Figure 1, the heat dissipation structure for the controller includes a first housing 20 of the controller, which is disposed on the side of the controller's chipset 30 away from the controller's circuit board 40. The first housing 20 includes a modularly configured main housing 21 and a heat dissipation module 22. The heat dissipation module 22 is mounted on the main housing 21 and located at a position on the main housing 21 corresponding to the area where the chipset 30 is disposed, and is used to dissipate heat from the chipset 30. As one embodiment of the chipset 30, the chipset 30 includes a main chip 31 and a key chip 32 disposed on the controller's circuit board 40.

[0040] Therefore, when the specifications or position of the controller chip are changed, the heat dissipation effect can be maintained without changing the main housing 21, by simply replacing the heat dissipation module 22 corresponding to the new chip (the chip with the changed position or the chip with the changed specifications), which greatly reduces development time and development cost.

[0041] In some embodiments, continue to refer to Figure 1 As shown, the main housing 21 has a first through hole 211 integrally formed or machined at the position corresponding to the chip group 30; the heat dissipation module 22 is installed in the first through hole 211. Therefore, the heat introduced into the heat dissipation module 22 by the chip group 30 can be directly dissipated to the outside through the heat dissipation module 22, improving heat dissipation efficiency.

[0042] In some preferred embodiments, the heat dissipation module 22 is mounted on the main housing 21 by welding to reduce the thermal resistance between the heat dissipation module 22 and the main housing 21, ensuring the heat dissipation effect between the heat dissipation module 22 and the main housing 21, and thus ensuring the overall heat dissipation effect of the first housing 20. For example, the heat dissipation module 22 is mounted on the main housing 21 by friction welding, brazing, adhesive welding, or laser welding to ensure both the welding effect between the heat dissipation module 22 and the main housing 21 and a low thermal resistance between them. Furthermore, it may also have dustproof, waterproof, and EMC shielding functions (EMC shielding is a key aspect of electromagnetic compatibility (EMC) design; its core purpose is to block the propagation of electromagnetic waves through physical barriers or materials, thereby suppressing electromagnetic interference (EMI) inside or outside the device and ensuring that electronic equipment can operate normally and without interference in complex electromagnetic environments).

[0043] In some embodiments, such as Figure 4 As shown, a protrusion 221a is provided at the position corresponding to the chipset 30a in the heat dissipation module 22a, so as to ensure the heat dissipation effect of the heat dissipation module 22a on the chipset 30a. For example, as shown in the figure... Figure 3 As shown, the chipset 30a includes a main chip 31a and key chips 32a mounted on the controller's circuit board 40; one main chip 31a is provided; four key chips 32a are provided and distributed at the four corners of the main chip 31a. Figure 3 and Figure 4 As shown, the protrusion group 221a includes a first protrusion 2211a and a second protrusion 2212a disposed on the heat dissipation module 22a. The first protrusion 2211a is disposed corresponding to the main chip 31a, and the second protrusion 2212a is disposed corresponding to the key chip 32a. Preferably, the number of second protrusions 2212a is disposed corresponding to the number of key chips 32a.

[0044] In some implementations, such as Figure 4 As shown, the heat dissipation module 22a has fins 224 on the side opposite to the protrusion group 221a. Multiple sets of fins 224 are arranged in a parallel array perpendicular to the protrusion group 221a. In other embodiments, the side of the heat dissipation module 22a opposite to the protrusion group 221a is provided with not fins but spade-like teeth. Multiple sets of spade-like teeth are arranged in a parallel array perpendicular to the protrusion group 221a.

[0045] In some embodiments, such as Figure 1 As shown, at least one of the main housing 21 and the heat dissipation module 22 is formed by die casting to ensure high processing efficiency. The fins 224 can also be formed by die casting.

[0046] In some embodiments, the main housing 21 is provided with spade teeth or the main housing 21 is formed by aluminum extrusion to increase the density of the heat dissipation teeth of the main housing 21, thereby significantly improving the heat dissipation efficiency of the main housing 21 by greatly increasing the heat dissipation area. The spade teeth on the heat dissipation module 22a can be formed by aluminum extrusion.

[0047] Figure 5 and Figure 6 The diagram schematically illustrates a heat dissipation structure for a controller according to a second embodiment of the present invention. The main difference between the heat dissipation structure for a controller in this embodiment and that in the first embodiment lies in the different positions of the key chip 32b and the second protrusion 2212b.

[0048] like Figure 5 and Figure 6 As shown, a protrusion group 221b is provided at the position corresponding to the chipset 30b in the heat dissipation module 22b, so as to ensure the heat dissipation effect of the heat dissipation module 22b on the chipset 30b. The chipset 30b includes a main chip 31b and key chips 32b. Four key chips 32b are provided, and they are distributed in pairs on the adjacent sides of the main chip 31b. The protrusion group 221b includes a first protrusion 2211b and a second protrusion 2212b. The second protrusion 2212b is correspondingly provided with the key chips 32b. Preferably, the number of second protrusions 2212b corresponds to the number of key chips 32b. Because this application divides the first housing 20 into a main housing 21 and a heat dissipation module 22, and the heat dissipation module 22 can be flexibly selected and replaced, when the setting position, quantity, size, etc. of the main chip 31b and / or key chip 32b change, only the position and / or height of the protrusion group 221b on the heat dissipation module 22 needs to be changed, or the heat dissipation module 22 corresponding to the position and / or height of the protrusion group 221b needs to be selected. There is no need to change the main housing 21, which greatly reduces development time and development cost while ensuring heat dissipation effect. For example, when the heat dissipation power and thermal resistance of the main chip 31b and the main chip 31a are similar, there is no need to replace the main housing 21. Only the position and height of the protrusion group on the heat dissipation module need to be modified. For example, the height of the protrusion group 221b of the heat dissipation module 22b needs to be modified.

[0049] Figure 7The diagram schematically illustrates heat dissipation structures for a controller according to three embodiments of the present invention. The main difference between the heat dissipation structure for a controller in this embodiment and the first embodiment lies in the fact that the heat dissipation module 22c is provided with spade teeth 225, or the heat dissipation module 22c is formed by aluminum extrusion. Multiple sets of spade teeth 225 are provided, arranged in a parallel array perpendicular to the protrusion group 221c. Providing spade teeth 225 on the heat dissipation module 22c or forming it by aluminum extrusion increases the density of the heat dissipation teeth, significantly improving the heat dissipation efficiency of the heat dissipation module 22c by greatly increasing the heat dissipation area. For example, when the main chip is significantly higher than the main chip 31a, there is no need to replace the main housing 21; simply replace the die-cast heat dissipation module 22 with a heat dissipation module 22c with spade teeth 225 or an aluminum extrusion-formed heat dissipation module 22c.

[0050] like Figure 7 As shown, a protrusion group 221c is provided at the position corresponding to the chipset 30 of the heat dissipation module 22c to ensure the heat dissipation effect of the heat dissipation module 22c on the chipset 30. The protrusion group 221c includes a first protrusion 2211c and a second protrusion 2212c. The first protrusion 2211c is corresponding to the main chip; the second protrusion 2212c is corresponding to the key chip.

[0051] The heat dissipation structure for the controller in this embodiment is particularly suitable for dissipating heat from controllers with high main chip power. Optionally, the heat dissipation structure for the controller in this embodiment is also suitable for situations with a large number of critical chips, such as... Figure 7 As shown, the heat dissipation module 22c has a number of second protrusions 2212c.

[0052] Figure 8 The diagram schematically illustrates heat dissipation structures for a controller according to four embodiments of the present invention. The main difference between the heat dissipation structure for a controller in this embodiment and the heat dissipation structure in the first embodiment is that the heat dissipation module 22d includes a heat dissipation tooth module 222 and a heat homogenizing module 223. The heat homogenizing module 223 is connected to the side of the heat dissipation tooth module 222 facing the chipset 30, and the protrusion group 221d is disposed on the side of the heat homogenizing module 223 facing the chipset 30. The heat dissipation module 22d, including the heat dissipation tooth module 222 and the heat homogenizing module 223, allows the heat from the chipset 30 to be homogenized by the heat homogenizing module 223, reducing the heat flux density before being introduced into the heat dissipation tooth module 222, and finally dissipated to the outside, thus greatly improving the heat dissipation efficiency of the heat dissipation module 22. For example, when the main chip has high heat output and the heat is concentrated, there is no need to replace the main housing 21; the heat dissipation module 22 can simply be disassembled into the interconnected heat dissipation tooth module 222 and the heat homogenizing module 223.

[0053] like Figure 8As shown, the heat dissipation module 223 is provided with a protrusion group 221d at the position corresponding to the chipset 30, so as to ensure the heat dissipation effect of the heat dissipation module 223 on the chipset 30. The protrusion group 221d includes a first protrusion 2211d and a second protrusion 2212d. The first protrusion 2211d is provided corresponding to the main chip; the second protrusion 2212d is provided corresponding to the key chip.

[0054] In some embodiments, the heat distribution module 223 and the heat dissipation tooth module 222 are connected by welding to reduce the thermal resistance between them and ensure the heat dissipation effect between them.

[0055] In some embodiments, the heat distribution module 223 is made of a pure metal plate or heat distribution plate, such as pure copper, to ensure the heat distribution effect of the heat distribution module 223.

[0056] The heat dissipation structure for the controller in this embodiment is particularly suitable for heat dissipation of controllers where the main chip 31 has a high heat output and the heat points are clearly concentrated. Moreover, since the components in the heat dissipation module 22d (such as the heat dissipation tooth module 222 and the heat equalization module 223 with protrusions 221d) can be pre-designed standard modules, they can be replaced or combined according to the type, position, size, and other conditions of the chips on the circuit board; the heat dissipation module 22d can also be molded or processed separately as needed, which helps to reduce costs.

[0057] In other embodiments, a heat pipe or a TEC (Thermoelectric Cooler) semiconductor cooling module can be provided as needed. The heat pipe or TEC semiconductor cooling module can be directly connected to the chipset 31, directly connected to the heat dissipation module 22, embedded in the circuit board 40, attached to the surface of the circuit board, or pass through the heat dissipation module as needed.

[0058] Figure 9 The diagram schematically illustrates a wind-cooled heat dissipation structure for a controller according to one embodiment of the present invention. For example... Figure 9 As shown, the air-cooled heat dissipation structure for the controller includes a fan 70 and the aforementioned heat dissipation structure for the controller; wherein, the fan 70 is disposed on the side of the heat dissipation module 22 away from the chipset 30, for example, the fan 70 is mounted on the heat dissipation module 22 or the main housing 21, so as to improve the heat dissipation efficiency of the heat dissipation structure through the fan 70.

[0059] In some embodiments, such as Figure 9 As shown, a fan 70 cover can also be provided on the side of the fan 70 away from the main housing 21 to ensure the stability of the fan 70 during installation and operation. For example, the fan 70 cover can be installed on the main housing 21.

[0060] Figure 10The diagram schematically illustrates a liquid-cooled heat dissipation structure for a controller according to one embodiment of the present invention. For example... Figure 10 As shown, the liquid cooling structure for the controller includes the aforementioned heat dissipation structure for the controller; wherein, the main housing 21' is a water-cooled housing, and the main housing 21' does not have a first through hole 211. The heat dissipation module 22 is disposed on the side of the water-cooled housing facing the chipset 30, so as to improve the heat dissipation efficiency of the heat dissipation structure through the water-cooled housing. Exemplarily, the heat dissipation module 22 can be fixedly mounted on the circuit board 40 by means of screws or the like.

[0061] Figure 1 , Figure 9 and Figure 10 A controller according to one embodiment of the present invention is schematically shown. For example... Figure 1 , Figure 9 and Figure 10 As shown, the controller includes a first housing 20, a chipset 30, a circuit board 40, and a bottom cover 50; wherein, the first housing 20 is the aforementioned first housing 20; the chipset 30 is electrically connected to a first side of the circuit board 40; the first housing 20 is disposed on the side of the chipset 30 opposite to the circuit board 40; the bottom cover 50 is disposed on the side of the circuit board 40 opposite to the chipset 30; the first housing 20 and the bottom cover 50 are connected to form an accommodating space for accommodating the circuit board 40 and the chipset 30.

[0062] Therefore, when the specifications or position of the controller chip are changed, the heat dissipation effect can be maintained without changing the main housing 21, 21' of the first housing 20, by simply replacing the heat dissipation module 22 of the first housing 20 corresponding to the new chip. Moreover, since the components in the heat dissipation module 22 (such as fins, spade teeth or heat dissipation tooth modules, and protrusion groups) can be pre-designed standard modules, they can be replaced or combined according to the type, position, size and other conditions of the chip on the circuit board. Alternatively, the heat dissipation module 22 can be molded or processed separately as needed, which greatly reduces development time and development cost.

[0063] In some embodiments, continue to refer to Figure 9 and Figure 10 As shown, the controller also includes a thermally conductive interface material 60, with its two sides in contact with the chipset 30 and the heat dissipation module 22, respectively. Thus, heat from the chipset 30 can be transferred through the thermally conductive interface material 60 into the heat dissipation module 22 and the main housing 21, 21', and ultimately dissipated into the environment, thereby improving heat dissipation efficiency.

[0064] The heat dissipation mechanism of this application is particularly suitable for automotive controllers. This is because automotive controllers often need to change the system-on-chip (SoC) or system-in-a-package (SIP) used, depending on the computing power configuration of different chips and the needs of vehicle customers, while their electrical interfaces and peripheral circuits can remain unchanged. This application, through a modular heat dissipation design, only requires replacing the heat dissipation module with one that uses an SoC or SIP, thereby reducing development time and costs.

[0065] When the main housing 21 is provided with the first through hole 211, and the heat dissipation module 22 is connected to the main housing 21 by welding, or when the main housing 21 is not provided with the first through hole 211, the electromagnetic compatibility (EMC) performance and dustproof and waterproof performance of the whole machine will not be affected.

[0066] According to one aspect of this utility model, a movable platform is provided, which includes the aforementioned controller. Therefore, when the specifications or location of the controller chip are changed, the heat dissipation effect can be maintained by replacing only the heat dissipation module 22 of the first housing 20 corresponding to the new chip, without replacing the main housing 21, 21' of the first housing 20.

[0067] In this invention, the connection or installation is a fixed connection unless otherwise specified. A fixed connection can be implemented as a detachable or non-detachable connection commonly used in the prior art. A detachable connection can be implemented using existing technologies, such as threaded connections or keyed connections. A non-detachable connection can also be implemented using existing technologies, such as welding or adhesive bonding.

[0068] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A heat dissipation structure for a controller, characterized by, The first shell (20) of the controller is arranged on the side of the chipset away from the circuit board (40) of the controller; The first shell (20) comprises a main shell and a heat dissipation module arranged modularly, the heat dissipation module is mounted on the main shell and arranged at the position corresponding to the chipset on the main shell, and used for dissipating heat of the chipset.

2. The heat dissipation structure for a controller according to claim 1, wherein The heat dissipation module is mounted on the main shell by welding; and / or, The position corresponding to the chipset on the heat dissipation module is provided with a group of protrusions.

3. The heat dissipation structure for a controller according to claim 2, wherein The main shell is die-cast, provided with a spade tooth or aluminum extrusion.

4. The heat dissipation structure for a controller according to claim 2, wherein The heat dissipation module is die-cast, provided with a spade tooth, aluminum extrusion or comprises a heat dissipation tooth module (222) and a heat uniformization module (223), the heat uniformization module (223) is connected to the side of the heat dissipation tooth module (222) facing the chipset, and the group of protrusions is arranged on the side of the heat uniformization module (223) facing the chipset.

5. The heat dissipation structure for a controller according to claim 4, wherein The heat uniformization module (223) is made of a pure metal plate or a heat uniformization plate; and / or, The heat dissipation tooth module (222) and the heat uniformization module (223) are connected by welding.

6. The heat dissipation structure for a controller according to any one of claims 1 to 5, characterized by, The position corresponding to the chipset on the main shell is provided with a first through hole (211); The heat dissipation module is mounted in the first through hole (211).

7. A wind cooling heat dissipation structure for a controller, characterized by, The heat dissipation structure for the controller according to any one of claims 1 to 6 and a fan (70); wherein, The fan (70) is arranged on the side of the heat dissipation module away from the chipset.

8. A liquid cooling heat dissipation structure for a controller, characterized by, The heat dissipation structure for the controller according to any one of claims 1 to 5; wherein, The main shell is a water-cooled shell, and the heat dissipation module is arranged on the side of the water-cooled shell facing the chipset.

9. A controller characterized by, The first shell (20), the chipset, the circuit board (40) and the bottom cover (50); wherein, The first shell (20) is the first shell (20) according to any one of claims 1 to 8; The chipset is electrically connected to the first side of the circuit board (40); The first shell (20) is arranged on the side of the chipset away from the circuit board (40); The bottom cover (50) is arranged on the side of the circuit board (40) away from the chipset; The first shell (20) is connected with the bottom cover (50) to form a containing space containing the circuit board (40) and the chipset.

10. A movable platform, characterized by The controller according to claim 9.

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