High-strength double-layer PCB (printed circuit board)

Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a high-strength double-layer PCB, which comprises a heat dissipation frame, frames are fixedly connected to the top surface and the bottom surface of the heat dissipation frame, and a circuit board main body is slidably connected to the inner wall of each frame. Compared with the prior art, the circuit board has the advantages that the circuit board main bodies are assembled in a bolt locking mode instead of a glue bonding mode, so that the single circuit board main body can be disassembled and overhauled, heat generated by the inner sides of the two circuit board main bodies can be transferred to the heat dissipation frame after the circuit board main bodies are assembled on the heat dissipation frame by a worker, and the heat dissipation efficiency is improved. Through the arrangement of the heat conducting plate, the contact area between the circuit board main bodies and the heat dissipation frame can be increased, the heat transfer efficiency can be improved, heat on the heat dissipation frame can be transferred to a plurality of heat exchange plates and is discharged from a plurality of heat dissipation cavities, the heat dissipation effect of the joint of the two circuit board main bodies is greatly improved, and the service life of the circuit board main bodies is prolonged. The performance of the circuit board is prevented from being reduced by heat accumulation.

Description

Technical Field

[0001] This utility model relates to the field of PCB circuit board technology, and in particular to a high-strength double-layer PCB circuit board. Background Technology

[0002] Double-Sided Printed Circuit Board (DSPCB) is an indispensable component in modern electronic devices. It involves printing conductive lines on two insulating substrates (usually composite materials such as fiberglass or epoxy resin) and connecting these lines vertically through metallized vias to form a complex circuit structure. The design of double-layer PCBs not only improves the flexibility of circuit layout but also significantly saves board space, enabling electronic devices to be more compact and efficient.

[0003] While double-layer PCBs offer numerous advantages, they also present several challenges. Because the two circuit boards are connected via metallized vias and are typically tightly fitted together, heat generated during operation is difficult to dissipate effectively. This heat accumulation problem is particularly pronounced in high-power, high-frequency applications. Prolonged heat buildup can not only degrade PCB performance but also potentially cause circuit malfunctions or even damage the entire board. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to provide a high-strength double-layer PCB circuit board to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides a high-strength double-layer PCB circuit board, including a heat sink frame. A frame is fixedly connected to both the top and bottom surfaces of the heat sink frame. A circuit board body is slidably connected to the inner wall of each frame. The sides of two circuit board bodies near the heat sink frame are abutted against the heat sink frame. Locking plates are fixedly installed on both the left and right sides of each heat sink frame by bolts. A splicing plate is fixedly connected to the inner side of each locking plate. The splicing plate is slidably connected to the frame. A clamping plate is fixedly connected to the side of each splicing plate near the circuit board body. Both clamping plates are clamped to the circuit board body. A plurality of linearly arrayed heat exchange plates are fixedly connected to the inner wall of the heat sink frame. A heat dissipation cavity is formed between two adjacent heat exchange plates and the heat sink frame.

[0007] Preferably, in any of the above solutions, splicing grooves are provided on both the left and right sides of the frame, and the splicing plate is slidably connected to the frame through the splicing grooves, wherein the thickness of the splicing plate is equal to the depth of the splicing groove.

[0008] Preferably, as described in any of the above schemes, slots are provided on both the left and right sides of the circuit board body, and the two card plates are engaged with the circuit board body through the two slots.

[0009] Preferably, in any of the above embodiments, a plurality of linearly arrayed heat-conducting plates are fixedly connected to the top and bottom surfaces of the heat sink frame, and a plurality of linearly arrayed embedding slots are provided on the side of the circuit board body near the heat sink frame, wherein the heat plate is slidably connected to the circuit board body through the embedding slots.

[0010] Preferably, in any of the above solutions, the heat dissipation frame, heat exchange plate, and heat conduction plate are all made of aluminum alloy, and the height of the frame is equal to the thickness of the circuit board body.

[0011] Preferably, in any of the above solutions, the top and bottom surfaces of the heat sink frame are provided with a number of symmetrically arranged positioning pins, and the side of the circuit board body near the heat sink frame is provided with a number of symmetrically arranged positioning holes, and the positioning pins are slidably connected to the circuit board body through the positioning holes.

[0012] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0013] 1. When assembling a double-layer circuit board, the operator can insert the two circuit board bodies into the two frames until the inner side of the circuit board body is in close contact with the heat sink frame. Then, the positioning pin will be inserted into the positioning hole to position the circuit board body, improving the installation stability of the circuit board body. Then, the locking plate is installed on the frame with bolts. At this time, the card plate will be inserted into the card slot to lock the circuit board body inside the frame. The assembly of the circuit board body is done by bolt locking instead of glue bonding, so as to facilitate the disassembly and maintenance of individual circuit board bodies.

[0014] 2. After assembling the circuit board body onto the heat sink frame, the heat generated inside the two circuit board bodies will be transferred to the heat sink frame. The heat conduction plate can increase the contact area between the circuit board body and the heat sink frame, thereby improving the efficiency of heat transfer. The heat on the heat sink frame will be transferred to several heat exchange plates and discharged from several heat dissipation cavities, which greatly improves the heat dissipation effect at the connection between the two circuit board bodies and prevents heat accumulation from reducing the performance of the circuit board. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of the assembly of this utility model;

[0016] Figure 2 This is a cross-sectional structural diagram of the assembly of this utility model;

[0017] Figure 3 This is an exploded structural diagram of the assembly of this utility model;

[0018] Figure 4 This is a first-view structural diagram of the heat dissipation frame of this utility model;

[0019] Figure 5 This is a second-view structural diagram of the heat dissipation frame of this utility model;

[0020] Figure 6 This is a schematic diagram of the main body of the circuit board of this utility model.

[0021] In the diagram: 1-heat dissipation frame, 2-frame, 3-circuit board body, 4-locking plate, 5-splicing plate, 6-card plate, 7-heat exchange plate, 8-heat dissipation cavity, 9-splicing groove, 10-card slot, 11-heat conduction plate, 12-embedded groove, 13-positioning pin, 14-positioning hole. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0023] like Figures 1 to 6 As shown, a high-strength double-layer PCB circuit board includes a heat dissipation frame 1. A frame 2 is fixedly connected to both the top and bottom surfaces of the heat dissipation frame 1. A circuit board body 3 is slidably connected to the inner wall of each frame 2. The sides of the two circuit board bodies 3 closest to the heat dissipation frame 1 are in contact with the heat dissipation frame 1. Locking plates 4 are fixedly installed on both the left and right sides of each heat dissipation frame 1 by bolts. A splicing plate 5 is fixedly connected to the inner side of each locking plate 4. The splicing plate 5 is slidably connected to the frame 2. A clamping plate 6 is fixedly connected to the side of each splicing plate 5 closest to the circuit board body 3. Both clamping plates 6 are clamped to the circuit board body 3. Several linear array heat exchange plates 7 are fixedly connected to the inner wall of the heat dissipation frame 1. A heat dissipation cavity 8 is formed between two adjacent heat exchange plates 7 and the heat dissipation frame 1.

[0024] As an optional technical solution of this utility model, splicing grooves 9 are provided on both the left and right sides of the frame 2, and the splicing plate 5 is slidably connected to the frame 2 through the splicing grooves 9. The thickness of the splicing plate 5 is equal to the depth of the splicing grooves 9.

[0025] As an optional technical solution of this utility model, slots 10 are provided on both the left and right sides of the circuit board body 3. Two locking plates 6 are engaged with the circuit board body 3 through the two slots 10. The locking plate 4 is installed on the frame 2 using bolts. At this time, the locking plate 6 will be inserted into the slot 10, which can lock the circuit board body 3 inside the frame 2. The assembly of the circuit board body 3 is replaced by the method of bolt locking, so as to facilitate the disassembly and maintenance of a single circuit board body 3.

[0026] As an optional technical solution of this utility model, the top and bottom surfaces of the heat dissipation frame 1 are fixedly connected with a number of linear array heat-conducting plates 11. The side of the circuit board body 3 near the heat dissipation frame 1 is provided with a number of linear array embedding slots 12. The heat plate 11 is slidably connected to the circuit board body 3 through the embedding slots 12. The setting of the heat-conducting plate 11 can increase the contact area between the circuit board body 3 and the heat dissipation frame 1, and can improve the efficiency of heat transfer.

[0027] As an optional technical solution of this utility model, the heat dissipation frame 1, the heat exchange plate 7 and the heat conduction plate 11 are all made of aluminum alloy. The height of the frame 2 is equal to the thickness of the circuit board body 3. The heat on the heat dissipation frame 1 will be transferred to several heat exchange plates 7 and discharged from several heat dissipation cavities 8, which greatly improves the heat dissipation effect at the connection between the two circuit board bodies 3 and prevents heat accumulation from reducing the performance of the circuit board.

[0028] As an optional technical solution of this utility model, the top and bottom surfaces of the heat sink frame 1 are provided with a number of symmetrically arranged positioning pins 13, and the side of the circuit board body 3 near the heat sink frame 1 is provided with a number of symmetrically arranged positioning holes 14. The positioning pins 13 are slidably connected to the circuit board body 3 through the positioning holes 14. After the inner side of the circuit board body 3 is in close contact with the heat sink frame 1, the positioning pins 13 will be inserted into the positioning holes 14, which can position the circuit board body 3 and improve the installation stability of the circuit board body 3.

[0029] A high-strength double-layer PCB circuit board, the working principle of which is as follows:

[0030] 1): Insert the two circuit board bodies 3 into the two frame 2 until the inner side of the circuit board body 3 is in close contact with the heat sink frame 1. Then the positioning pin 13 will be inserted into the positioning hole 14 to position the circuit board body 3.

[0031] 2): Use bolts to install the locking plate 4 on the frame 2. At this time, the card plate 6 will be inserted into the card slot 10, which can lock the circuit board body 3 inside the frame 2. The assembly of the circuit board body 3 is done by bolt locking instead of glue bonding.

[0032] 3): The heat generated inside the two circuit board bodies 3 will be transferred to the heat dissipation frame 1. The heat conduction plate 11 can increase the contact area between the circuit board body 3 and the heat dissipation frame 1, thereby improving the efficiency of heat transfer. The heat on the heat dissipation frame 1 will be transferred to several heat exchange plates 7 and discharged from several heat dissipation cavities 8.

[0033] In summary, when assembling this high-strength double-layer PCB circuit board, the operator can insert the two circuit board bodies 3 into the two frame 2 until the inner side of the circuit board body 3 is in close contact with the heat sink frame 1. Then, the positioning pin 13 will be inserted into the positioning hole 14 to position the circuit board body 3, improving the installation stability of the circuit board body 3. Subsequently, the locking plate 4 is installed on the frame 2 using bolts. At this time, the card plate 6 will be inserted into the card slot 10 to lock the circuit board body 3 inside the frame 2. The assembly of the circuit board body 3 by bolt locking instead of glue bonding is convenient for disassembly and maintenance of individual circuit board bodies 3. After the circuit board body 3 is assembled onto the heat sink frame 1, the heat generated on the inner side of the two circuit board bodies 3 will be transferred to the heat sink frame 1. The setting of the heat conduction plate 11 can increase the contact area between the circuit board body 3 and the heat sink frame 1, which can improve the heat transfer efficiency. The heat on the heat sink frame 1 will be transferred to several heat exchange plates 7 and discharged from several heat dissipation cavities 8, which greatly improves the heat dissipation effect at the connection of the two circuit board bodies 3 and prevents heat accumulation from reducing the performance of the circuit board.

Claims

1. A high-strength double-layer PCB circuit board, characterized in that: The device includes a heat dissipation frame (1), with a frame (2) fixedly connected to the top and bottom surfaces of the heat dissipation frame (1). A circuit board body (3) is slidably connected to the inner wall of each frame (2). The two circuit board bodies (3) are attached to the heat dissipation frame (1) on the side closest to the heat dissipation frame (1). Locking plates (4) are fixedly installed on the left and right sides of each heat dissipation frame (1) by bolts. A splicing plate (5) is fixedly connected to the inner side of each locking plate (4). The splicing plate (5) is slidably connected to the frame (2). A card plate (6) is fixedly connected to the side of each splicing plate (5) closest to the circuit board body (3). The two card plates (6) are locked to the circuit board body (3). A number of linear array heat exchange plates (7) are fixedly connected to the inner wall of the heat dissipation frame (1). A heat dissipation cavity (8) is formed between two adjacent heat exchange plates (7) and the heat dissipation frame (1).

2. The high-strength double-layer PCB circuit board according to claim 1, characterized in that: The left and right sides of the frame (2) are provided with splicing grooves (9), and the splicing plate (5) is slidably connected to the frame (2) through the splicing grooves (9). The thickness of the splicing plate (5) is equal to the depth of the splicing grooves (9).

3. A high-strength double-layer PCB circuit board according to claim 2, characterized in that: The circuit board body (3) has slots (10) on both the left and right sides, and the two card plates (6) are engaged with the circuit board body (3) through the two slots (10).

4. A high-strength double-layer PCB circuit board according to claim 3, characterized in that: The top and bottom surfaces of the heat dissipation frame (1) are fixedly connected with several linear array heat-conducting plates (11). The side of the circuit board body (3) near the heat dissipation frame (1) is provided with several linear array embedding slots (12). The heat plate (11) is slidably connected to the circuit board body (3) through the embedding slots (12).

5. A high-strength double-layer PCB circuit board according to claim 4, characterized in that: The heat dissipation frame (1), heat exchange plate (7) and heat conduction plate (11) are all made of aluminum alloy, and the height of the frame (2) is equal to the thickness of the circuit board body (3).

6. A high-strength double-layer PCB circuit board according to claim 5, characterized in that: The top and bottom surfaces of the heat sink frame (1) are provided with a number of symmetrically arranged positioning pins (13), and the circuit board body (3) is provided with a number of symmetrically arranged positioning holes (14) on the side near the heat sink frame (1). The positioning pins (13) are slidably connected to the circuit board body (3) through the positioning holes (14).

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