Wave soldering jig
By designing welding holes and guide grooves in the wave soldering fixture, the problem of insufficient contact time between the solder and the pad was solved, thereby improving welding quality and efficiency and reducing welding defects.
Patent Information
- Application Number
- CN202620492716.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-14
- Publication Date
- 2026-05-12
- Estimated Expiration
- 2036-04-14
AI Technical Summary
Existing wave soldering fixtures are prone to insufficient contact time between the solder and the pad during the soldering process, resulting in blank solder joints or false solder joints, which affects the soldering yield.
Design a wave soldering fixture with a soldering hole and a guide groove that run through the thickness direction. During soldering, the solder is guided to the solder joint through the guide groove and excess solder is discharged, ensuring full contact between the solder and the solder joint and avoiding accumulation.
Improve welding quality and efficiency, reduce defects such as cold solder joints, bridging, and solder overflow, adapt to wave soldering operations for various PCBAs, and reduce welding defect rate.
Smart Images
Figure CN224233927U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic welding auxiliary equipment technology, and in particular to a wave soldering fixture. Background Technology
[0002] With the rapid development of electronic technology, printed circuit board assembly (PCBA), as a fundamental electronic assembly technology, has been widely used in the field of electronic manufacturing. In the production process of PCBA, wave soldering is the main process for soldering through-hole components. Its basic principle is to allow the printed circuit board with through-hole components to pass through the wave crest of molten solder, thereby achieving mechanical and electrical connections between the component pins and the pads.
[0003] In wave soldering, to ensure soldering quality and protect non-soldered areas on the PCBA, a wave soldering fixture (also known as a reflow fixture) is typically used to support and fix the PCBA. Existing wave soldering fixtures usually have soldering holes to expose the solder joints on the PCBA, allowing solder to pass through the soldering holes and contact the solder joints to complete the soldering process.
[0004] However, in actual production processes, existing wave soldering fixtures still have certain limitations. Due to deficiencies in fixture structural design, the wave soldering fixture can easily have an adverse effect on the flow characteristics of molten solder during wave soldering, leading to insufficient contact time between the solder and the pad, resulting in open solder joints or false solder joints, thus reducing the soldering yield and causing soldering defects. Utility Model Content
[0005] The main purpose of this invention is to propose a wave soldering fixture, which aims to optimize the structure of the wave soldering fixture and improve the yield of welded products.
[0006] To achieve the above objectives, the wave soldering fixture proposed in this utility model has a first side and a second side facing each other. The first side is used to connect a PCBA. The wave soldering fixture has a soldering hole that extends through the thickness direction to expose the solder joints on the PCBA. The wave soldering fixture has an inlet end and an outlet end along the wave soldering movement direction. The inlet end and the outlet end are positioned opposite each other. The second side of the wave soldering fixture has a first guide groove and a second guide groove respectively corresponding to the inlet end and the outlet end. The first guide groove and the second guide groove are connected to the soldering hole.
[0007] In one embodiment, the wave soldering fixture includes multiple soldering zones, each soldering zone being configured corresponding to a functional area on the PCBA. The first and second flow guide channels include multiple channels, each of the first and second flow guide channels being spaced apart along the width direction of the wave soldering fixture. Each soldering zone is connected to a first flow guide channel and / or a second flow guide channel.
[0008] In one embodiment, the sidewall of the welding hole is sloped.
[0009] In one embodiment, the angle between the sidewall of the welding hole and the moving direction of the wave welding fixture is 60°.
[0010] In one embodiment, the depth of the welding hole is h, where 3mm ≤ h ≤ 6mm.
[0011] In one embodiment, a receiving groove is further formed on the second side of the wave soldering fixture. The receiving groove is disposed on the side facing the wave soldering, the welding hole is located at the bottom of the receiving groove, and the depth of the receiving groove is less than the depth of the wave soldering fixture.
[0012] In one embodiment, the soldering hole includes a plug-in device hole and a power chip device hole, and the plug-in device hole is in communication with the power chip device hole.
[0013] In one embodiment, the wave soldering fixture also has a plurality of clearance slots, each clearance slot corresponding to the solder joint design on the PCBA board, and a baffle is formed between two adjacent clearance slots, with each baffle located in the gap between two adjacent solder joints to block the flow.
[0014] In one embodiment, the wave soldering fixture includes two mounting sections, which are spaced apart along the moving direction of the wave soldering. Each mounting section corresponds to a PCBA, and the first guide groove and the second guide groove are respectively connected to one of the mounting sections.
[0015] This invention provides a wave soldering fixture comprising soldering holes, a first guide groove, and a second guide groove. During wave soldering, the fixture moves the PCBA from the inlet to the outlet. The solder wave first contacts the first guide groove at the inlet and is guided through it to the soldering hole, where it contacts the solder joints on the PCBA to complete the soldering. Excess solder is discharged through the second guide groove, preventing solder accumulation in the soldering hole. The coordinated operation of these structures achieves precise PCBA fixation and effective exposure of the solder joints. The guiding effect of the first and second guide grooves ensures smooth solder contact with the solder joints, helping to extend the contact time between the solder and the solder joint, reducing soldering defects such as cold solder joints, bridging, and solder overflow, improving soldering quality and efficiency, adapting to wave soldering operations on various PCBAs, and reducing the soldering defect rate. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0017] Figure 1 A top view of the wave soldering fixture provided by this utility model.
[0018] Figure 2 for Figure 1 A schematic diagram of the structure of a medium wave welding fixture viewed from below.
[0019] Figure 3 for Figure 1 A cross-sectional view of section AA of the medium wave soldering fixture.
[0020] Explanation of reference numerals in the attached figures: 10, wave soldering fixture; 10a, welding hole; 10b, first guide channel; 10c, second guide channel; 10d, receiving channel.
[0021] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0023] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0025] With the rapid development of electronic technology, printed circuit board assembly (PCBA), as a fundamental electronic assembly technology, has been widely used in the field of electronic manufacturing. In the production process of PCBA, wave soldering is the main process for soldering through-hole components. Its basic principle is to allow the printed circuit board with through-hole components to pass through the wave crest of molten solder, thereby achieving mechanical and electrical connections between the component pins and the pads.
[0026] In wave soldering, to ensure soldering quality and protect non-soldered areas on the PCBA, a wave soldering fixture (also known as a reflow fixture) is typically used to support and fix the PCBA. Existing wave soldering fixtures usually have soldering holes to expose the solder joints on the PCBA, allowing solder to pass through the soldering holes and contact the solder joints to complete the soldering process.
[0027] However, in actual production processes, existing wave soldering fixtures still have certain limitations. Due to deficiencies in fixture structural design, the wave soldering fixture can easily have an adverse effect on the flow characteristics of molten solder during wave soldering, leading to insufficient contact time between the solder and the pad, resulting in open solder joints or false solder joints, thus reducing the soldering yield and causing soldering defects.
[0028] To solve the above problems, please refer to... Figures 1 to 3This utility model proposes a wave soldering fixture 10, which has a first side and a second side facing each other. The first side is used to connect a PCBA. The wave soldering fixture 10 has a soldering hole 10a that is provided through the thickness direction to expose the solder joints on the PCBA. The wave soldering fixture 10 has an inlet end and an outlet end along the wave soldering movement direction, which are arranged opposite to each other. The second side of the wave soldering fixture 10 has a first guide groove 10b and a second guide groove 10c respectively corresponding to the inlet end and the outlet end. The first guide groove 10b and the second guide groove 10c are connected to the soldering hole 10a.
[0029] This utility model proposes a wave soldering fixture 10, applied in the wave soldering process of PCBA (Printed Circuit Board Assembly), suitable for the soldering operations of various electronic devices. It is used to fix the PCBA, expose the solder joints on the PCBA, guide the solder to smoothly contact the solder joints to complete the soldering, and avoid problems such as solder overflow and cold solder joints, ensuring soldering quality and efficiency. The wave soldering fixture 10 includes soldering holes 10a, a first guide groove 10b, and a second guide groove 10c. The wave soldering fixture 10 is made of a high-temperature resistant and solder corrosion-resistant insulating material, typically fiberglass board or high-temperature resistant resin, which is robust and dimensionally stable, and will not deform or be damaged in the high-temperature environment of wave soldering, nor will it affect the electrical performance of the soldered circuit. The wave soldering fixture 10 has opposing first and second sides. The first side is used to connect the PCBA, and the PCBA is precisely fixed by a positioning pin or snap-fit structure, ensuring that the PCBA does not shake or shift during the soldering process, and ensuring precise alignment of the solder joints with the soldering holes 10a. The wave soldering fixture 10 has soldering holes 10a extending through the thickness direction. The position and size of the soldering holes 10a are adapted to the solder joints on the PCBA, exposing the solder joints on the PCBA so that the solder from the wave soldering can contact the solder joints through the soldering holes 10a to complete the soldering operation. The wave soldering fixture 10 has an inlet end and an outlet end along the wave soldering movement direction. The inlet end and the outlet end are positioned opposite each other, corresponding to the solder wave flow direction of the wave soldering equipment. A first guide groove 10b and a second guide groove 10c are formed on the second side of the wave soldering fixture 10 corresponding to the inlet end and the outlet end, respectively. Both the first guide groove 10b and the second guide groove 10c are elongated groove structures that communicate with the soldering holes 10a. During wave soldering, the wave soldering fixture 10 moves the PCBA from the inlet to the outlet. The solder wave first contacts the first guide groove 10b at the inlet and is guided through the first guide groove 10b to the soldering hole 10a, where it contacts the solder joint on the PCBA to complete the soldering. Excess solder is discharged through the second guide groove 10c, preventing solder from accumulating in the soldering hole 10a. The coordinated operation of these structures achieves precise PCBA fixation and effective exposure of the solder joints. The guiding effect of the first guide groove 10b and the second guide groove 10c ensures smooth contact between the solder and the solder joint, which helps to extend the contact time between the solder and the solder joint, reduce soldering defects such as cold solder joints, solder bridging, and solder overflow, improve soldering quality and efficiency, adapt to wave soldering operations of various PCBAs, and reduce the soldering defect rate.
[0030] Furthermore, in one embodiment, the wave soldering fixture 10 includes multiple soldering areas, each soldering area being configured corresponding to a functional area on the PCBA. The first guide channel 10b and the second guide channel 10c include multiple channels, each first guide channel 10b and each second guide channel 10c being distributed at intervals along the width direction of the wave soldering fixture 10. A soldering area is connected to a first guide channel 10b and / or a second guide channel 10c.
[0031] PCBAs are typically divided into different functional areas, each containing different types of components and solder joints. Corresponding soldering zones are specifically designed to meet the soldering needs of each functional area, ensuring precise solder supply to the solder joints in each area. Each soldering zone is independent and spaced apart to avoid interference between solders from different functional areas and reduce solder bridging defects. Multiple first and second flow channels 10b and 10c are included, evenly spaced along the width of the wave soldering fixture 10. The spacing is designed according to the size and distribution of the soldering zones, ensuring that each soldering zone corresponds to a suitable flow channel, achieving precise solder guidance. Each soldering zone is connected to a first guide channel 10b and / or a second guide channel 10c. This means that some soldering zones can be simultaneously connected to both the first and second guide channels 10b and 10c, ensuring proper solder flow and removal of excess solder. Other soldering zones can be connected only to the first guide channel 10b or only to the second guide channel 10c, depending on the solder joint distribution and soldering requirements, adapting to the soldering characteristics of different functional areas. The multiple soldering zones allow the wave soldering fixture 10 to adapt to the solder joint distribution in different functional areas of the PCBA, providing targeted solder flow and improving soldering accuracy. The corresponding connections of multiple first and second guide channels 10b and 10c with the soldering zones ensure sufficient solder supply and smooth solder removal in each zone, preventing solder defects caused by solder accumulation or insufficient supply. The coordinated operation of each welding zone, the first guide channel 10b, and the second guide channel 10c enables the wave soldering fixture 10 to adapt to the welding requirements of complex PCBAs, take into account the welding characteristics of different functional areas, further improve welding quality and efficiency, reduce welding defect rate, and expand the adaptability range of the wave soldering fixture 10.
[0032] In one embodiment, please refer to Figures 1 to 3 The sidewall of welding hole 10a is set with an inclined surface.
[0033] The inclined structure extends along the thickness direction of the welding hole 10a, from the first side to the second side of the wave soldering fixture 10. The inclined direction of the inclined surface faces the solder flow direction, i.e., it slopes from the inlet end to the outlet end, facilitating the smooth flow of solder into the welding hole 10a and guiding excess solder to flow out quickly. The sidewall of the welding hole 10a is designed with an inclined surface, which increases the contact area between the solder and the sidewall of the welding hole 10a, reduces solder residue on the sidewall, and prevents the solder from clogging the welding hole 10a after solidification, ensuring smooth subsequent soldering operations. The inclined structure guides the solder to flow smoothly along the sidewall, avoiding problems such as solder joint displacement and solder splatter caused by direct impact of solder on the solder joint. At the same time, it allows the solder to more evenly coat the solder joint, improving the strength of the solder and reducing defects such as cold solder joints and false solder joints. The inclined sidewall of the welding hole 10a is ground to make the surface smooth, further reducing the adhesion of solder on the sidewall, ensuring smooth solder flow, and facilitating post-soldering cleaning, reducing the impact of residual solder on subsequent soldering. The beveled sidewall of the solder hole 10a optimizes the solder flow path, ensuring that the solder can accurately and smoothly contact the solder joints on the PCBA. It also promotes the removal of excess solder, reduces soldering defects, improves soldering quality, facilitates post-soldering cleaning and maintenance, and extends the service life of the wave soldering fixture 10.
[0034] In one embodiment, the angle between the sidewall of the welding hole 10a and the moving direction of the wave welding fixture 10 is 60°.
[0035] This angle ensures smooth flow of solder into and out of the soldering hole 10a while guaranteeing sufficient contact between the solder joint and the solder, balancing flow guidance and soldering quality. The 60° angle provides a moderate inclination angle for the sidewall slope of the soldering hole 10a, preventing excessive solder flow that would hinder contact with the solder joint, or insufficient flow that would cause accumulation or blockage. When the wave soldering fixture 10 moves the PCBA along the direction of travel, the solder wave flows into the soldering hole 10a along the first guide channel 10b. The 60° sidewall slope guides the solder to flow smoothly, evenly coating the solder joint and ensuring a strong weld. Excess solder flows quickly along the slope into the second guide channel 10c, preventing accumulation. This ensures sufficient solder supply and smooth flow, improving soldering accuracy and strength, and reducing soldering defects.
[0036] In one embodiment, the depth of the welding hole 10a is h, where 3mm ≤ h ≤ 6mm.
[0037] This depth ensures that the solder fully contacts the solder joints on the PCBA for reliable soldering, while avoiding problems such as solder buildup due to excessive depth and insufficient solder contact due to insufficient depth. When the depth of the soldering hole 10a is less than 3mm, the solder does not reach the solder joint sufficiently, leading to defects such as cold solder joints and poor solder joints, affecting the soldering quality. When the depth of the soldering hole 10a is greater than 6mm, the flow resistance of the solder within the soldering hole 10a increases, making it prone to solder buildup, resulting in problems such as solder bridging and solder overflow. It also increases the processing difficulty of the soldering hole 10a and the overall thickness of the fixture, which is detrimental to the lightweight design of the fixture. In this embodiment, the wave soldering fixture 10 is 10mm thick, and the depth of the soldering hole 10a is controlled between 3mm and 6mm. This adapts to the solder joint height and component lead length of most PCBAs, ensuring precise solder contact with the solder joints while allowing for smooth solder flow and quick removal of excess solder, balancing soldering quality and processing convenience. The depth of the welding hole 10a is set within a reasonable range, which not only ensures the reliability of welding and reduces welding defects, but also optimizes the structural design of the fixture, reduces the processing difficulty and cost, and improves the versatility and practicality of the wave welding fixture 10.
[0038] In one embodiment, please refer to Figures 1 to 3 The second side of the wave soldering fixture 10 also has a receiving groove 10d, which is provided on the side facing the wave soldering. The welding hole 10a is located at the bottom of the receiving groove 10d, and the depth of the receiving groove 10d is less than the depth of the wave soldering fixture 10.
[0039] A receiving groove 10d is also formed on the second side of the wave soldering fixture 10. The receiving groove 10d is set on the side facing the wave soldering, that is, towards the direction of the solder wave. The receiving groove 10d has a concave structure, and its size is designed according to the distribution of the soldering holes 10a. It is used to receive solder and prevent solder from splashing directly onto the surface of the wave soldering fixture 10. At the same time, it buffers the solder and ensures that the solder flows smoothly into the soldering holes 10a. The soldering holes 10a are located at the bottom of the receiving groove 10d and are connected to the receiving groove 10d. The solder first flows into the receiving groove 10d and then contacts the solder joints on the PCBA through the soldering holes 10a. The receiving groove 10d can store a certain amount of solder to ensure sufficient solder supply and avoid soldering defects caused by insufficient solder supply. The depth of the receiving tank 10d is less than the depth of the wave soldering fixture 10, ensuring that the receiving tank 10d does not penetrate the wave soldering fixture 10, thus avoiding affecting the structural strength and insulation performance of the fixture. It also prevents solder from penetrating through the receiving tank 10d to the first side of the fixture, damaging components on the PCBA or affecting circuit performance. The inner wall of the receiving tank 10d is smooth, reducing solder residue within it and facilitating post-soldering cleaning. It also guides the solder smoothly into the soldering hole 10a. The design of the receiving tank 10d buffers and stores the solder, ensuring a stable and sufficient supply of solder to the soldering hole 10a, reducing solder splashing and soldering defects caused by insufficient supply. Simultaneously, it protects the wave soldering fixture 10 and the PCBA, preventing solder damage to components and further improving soldering quality and fixture lifespan.
[0040] In one embodiment, the solder hole 10a includes a plug-in device hole and a power chip device hole, and the plug-in device hole and the power chip device hole are in communication.
[0041] Specifically, in some PCBA structures, the distance between the protective edge of the power chip device and the solder joint edges of other adjacent DIP devices is too small. The fixture only exposes the area of the DIP device body. During the wave soldering process, the pads cannot receive flux, cannot be fully heated (preheated), and ultimately, during soldering in the reflow oven, insufficient soldering occurs, leading to cold solder joints or even no solder (empty solder joints). After removal from the oven, components may detach, be lost, or repair errors may occur. During testing, this can cause product failure and damage to the load (fan and compressor), among other quality risks. Therefore, in this embodiment, by creating a through-hole for the power chip device in the wave soldering fixture 10, some solder joints of the power SMD device are exposed and connected to the holes of nearby through-hole devices. This increases the contact area between the solder joints and the solder, facilitating solder flow and ensuring sufficient soldering of the device pins.
[0042] In one embodiment, the wave soldering fixture 10 also has a plurality of clearance slots, each clearance slot corresponding to the solder joint design on the PCBA board, and a baffle is formed between two adjacent clearance slots, with each baffle located in the gap between two adjacent solder joints to block the flow.
[0043] The wave soldering fixture 10 also features multiple clearance slots, each corresponding to the solder joint design on the PCBA. The position and size of these slots are adapted to the solder joints on the PCBA, preventing the fixture from obscuring the solder joints and ensuring they are fully exposed. Simultaneously, it avoids interference between the fixture and component leads, preventing damage to components or affecting soldering. The clearance slots have a concave structure, with the depth designed according to the height of the component leads, ensuring that the component leads can smoothly extend into the clearance slots without contacting the fixture. A baffle is formed between adjacent clearance slots, integrally molded with the wave soldering fixture 10 body. Each baffle is located in the gap between two adjacent components, blocking solder and preventing solder from flowing between adjacent components, thus avoiding solder bridging defects. The width of the baffle is adapted to the size of the gap between adjacent components, effectively blocking solder without interfering with the components, ensuring proper component installation and soldering. The design of the clearance slots ensures full exposure of solder joints on the PCBA and smooth clearance of components, avoiding interference from the fixtures during soldering; the design of the guards effectively blocks the flow of solder between adjacent components, reduces solder bridging defects, and improves soldering quality.
[0044] In one embodiment, please refer to Figure 1 and Figure 2 The wave soldering fixture 10 includes two mounting sections, which are spaced apart along the moving direction of the wave soldering. Each mounting section corresponds to a PCBA. The first guide groove 10b and the second guide groove 10c are respectively connected to a mounting section.
[0045] The wave soldering fixture 10 includes two mounting sections, which are spaced apart along the wave soldering movement direction. The spacing is designed according to the PCBA size and soldering requirements to ensure that the two mounting sections do not interfere with each other and can simultaneously complete the soldering operation of two PCBAs. Each mounting section corresponds to one PCBA, meaning that the first side of each mounting section is used to connect one PCBA. Both mounting sections have soldering holes 10a, a first guide groove 10b, and a second guide groove 10c, which are adapted to the corresponding PCBAs. The first guide groove 10b and the second guide groove 10c are connected to a mounting section, respectively. That is, the first guide groove 10b at the inlet end connects to the mounting section near the inlet end, and the second guide groove 10c at the outlet end connects to the mounting section near the outlet end. This ensures that the PCBA corresponding to each mounting section receives sufficient solder supply, while excess solder can be smoothly discharged. The two mounting sections allow the wave soldering fixture 10 to simultaneously fix two PCBAs and complete the wave soldering operation of two PCBAs simultaneously, significantly improving soldering efficiency and adapting to the needs of industrial mass production. The two mounting sections are spaced apart along the wave soldering direction to ensure that the solder wave energy sequentially solders the two PCBAs, avoiding interference between the solders on the two PCBAs. This also facilitates simultaneous loading and unloading of two PCBAs by the operator, further improving work efficiency. The coordinated operation of the two mounting sections with the first guide channel 10b and the second guide channel 10c enables synchronous soldering of dual PCBAs, improving soldering efficiency, reducing production costs, and ensuring the soldering quality of each PCBA. This balances production efficiency and soldering reliability, expanding the applicability of the wave soldering fixture 10.
[0046] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A wave soldering fixture, characterized in that, The wave soldering fixture has a first side and a second side facing each other. The first side is used to connect to the PCBA. The wave soldering fixture has a soldering hole that extends through the thickness direction to expose the solder joints on the PCBA. The wave soldering fixture has an inlet end and an outlet end along the wave soldering movement direction. The inlet end and the outlet end are positioned opposite each other. The second side of the wave soldering fixture has a first guide groove and a second guide groove corresponding to the inlet end and the outlet end, respectively. The first guide groove and the second guide groove are connected to the soldering hole.
2. The wave soldering fixture as described in claim 1, characterized in that, The wave soldering fixture includes multiple soldering zones, each of which corresponds to a functional area on the PCBA. The first and second flow channels include multiple channels, and each of the first and second flow channels is distributed at intervals along the width direction of the wave soldering fixture. Each soldering zone is connected to a first flow channel and / or a second flow channel.
3. The wave soldering fixture as described in claim 2, characterized in that, The sidewalls of the welding holes are sloped.
4. The wave soldering fixture as described in claim 3, characterized in that, The angle between the sidewall of the welding hole and the moving direction of the wave welding fixture is 60°.
5. The wave soldering fixture as described in any one of claims 1 to 4, characterized in that, The depth of the welding hole is h, where 3mm ≤ h ≤ 6mm.
6. The wave soldering fixture as described in claim 5, characterized in that, The second side of the wave soldering fixture is also formed with a receiving groove, which is provided on the side facing the wave soldering. The welding hole is located at the bottom of the receiving groove, and the depth of the receiving groove is less than the depth of the wave soldering fixture.
7. The wave soldering fixture as described in claim 5, characterized in that, The welding holes include insertion device holes and power chip device holes, and the insertion device holes are connected to the power chip device holes.
8. The wave soldering fixture as described in claim 5, characterized in that, The wave soldering fixture also has multiple clearance slots, each clearance slot corresponding to the solder joint design on the PCBA board. A baffle is formed between two adjacent clearance slots, and each baffle is located in the gap between two adjacent solder joints to block the flow.
9. The wave soldering fixture as described in claim 5, characterized in that, The wave soldering fixture includes two mounting sections, which are spaced apart along the moving direction of the wave soldering. Each mounting section corresponds to a PCBA, and the first guide groove and the second guide groove are respectively connected to one of the mounting sections.