Analog signal acquisition device based on three-dimensional packaging
By using a three-dimensional encapsulated analog signal acquisition device, the signal circuit board, power circuit board, and analog circuit board are stacked and filled with resin, which solves the problems of large space occupation and high failure rate of traditional analog signal acquisition devices, and achieves miniaturization and improved stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI ORBITA AEROSPACE SCI TECH CO LTD
- Filing Date
- 2025-05-12
- Publication Date
- 2026-05-12
AI Technical Summary
Traditional analog signal acquisition devices have complex circuit connections, occupy a large space, have a high failure rate, and are costly to maintain, making them difficult to apply in complex and variable equipment with demanding design conditions.
The system employs a three-dimensional packaging structure, stacking signal circuit boards, power circuit boards, and analog circuit boards in sequence and electrically connecting them through laser-etched lines. It is then filled with resin and cured into a whole, utilizing the three-dimensional space to improve space utilization. Signal processing is performed through an analog-to-digital converter and a microcontroller module.
It achieves miniaturization and integration of the circuit system, improves shock resistance and oxidation resistance, reduces failure rate and maintenance costs, and adapts to harsh environments.
Smart Images
Figure CN224233957U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of analog signal acquisition devices, and in particular to an analog signal acquisition device based on three-dimensional packaging. Background Technology
[0002] With the advancement of technology, circuit functions are becoming increasingly sophisticated, leading to highly dense components and excessively large system-level circuits. These circuits occupy too much printed circuit board (PCB) space, which is detrimental to complex, variable, and demanding equipment environments. Traditional analog signal acquisition devices have complex and diverse circuit connections, which not only occupy a large amount of space but also result in high failure rates and maintenance costs. Utility Model Content
[0003] To address the problems existing in the prior art, this utility model proposes an analog signal acquisition device based on three-dimensional packaging, aiming to use a strategy of exchanging three-dimensional space for planar space to make the system-level circuit tend to be miniaturized.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an analog signal acquisition device based on three-dimensional packaging, including a housing, wherein a three-dimensional packaging structure is provided inside the housing, and a signal circuit board, a power circuit board and an analog circuit board are stacked sequentially from bottom to top in the three-dimensional packaging structure, and resin is filled between the signal circuit board, the power circuit board and the analog circuit board, and laser etching lines are provided on the side end face of the three-dimensional packaging structure, and the signal circuit board, the power circuit board and the analog circuit board are electrically connected through the laser etching lines, and a connection port is also provided at one end of the three-dimensional packaging structure.
[0005] Based on the above, the signal circuit board, power supply circuit board, and analog circuit board are stacked sequentially from bottom to top, with electronic components at different heights avoiding each other, to maximize the use of three-dimensional space, improve space utilization, and enable the integration and modularization of a large circuit system and the miniaturization of the overall device. Furthermore, the signal circuit board, power supply circuit board, and analog circuit board are cured into a single unit using resin, improving shock resistance and oxidation resistance, ensuring the integrity and stability of the system-level circuit functions, allowing this invention to better cope with harsh environments, and eliminating the soldering problems that often occur with BGA or PGA soldering modules, thus improving product quality.
[0006] The power supply circuit board converts external input power into the required internal power and provides power to the signal circuit board and the analog circuit board. The analog circuit board converts external input analog signals into digital signals and transmits the digital signals to the signal circuit board. The signal circuit board performs calculations and processes the received digital signals and outputs the processed data.
[0007] Furthermore, windows are symmetrically arranged at the front and rear ends of the outer casing, the connection port is directly opposite the window, and a disassembly port is provided on the lower end face of the outer casing, which is fitted with a lower cover.
[0008] Based on the above, the three-dimensional packaging structure is installed into the housing through the disassembly port and sealed using the lower cover.
[0009] Furthermore, the analog circuit board is equipped with an analog-to-digital converter, which converts the acquired analog signal into a digital signal and transmits the converted digital signal to the signal circuit board.
[0010] Furthermore, a microcontroller module is provided on the signal circuit board, which is used to perform calculations and processing on the received digital signals.
[0011] Furthermore, mounting blocks with mounting holes are symmetrically arranged at both the front and rear ends of the lower part of the outer casing.
[0012] Based on the above, the housing can be installed into an external device using the mounting block.
[0013] To more clearly illustrate the above-mentioned features of this utility model and the objectives it aims to achieve, the present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description
[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0015] Figure 2 : This is a schematic diagram of the three-dimensional packaging structure of this utility model;
[0016] Figure 3 : A three-dimensional view of the structure of the three-dimensional encapsulation structure of this utility model with the resin poured on it;
[0017] Figure 4 : This is a bottom view of the present invention without the lower cover;
[0018] Figure 5 : refers to the signal circuit board, power supply circuit board, and analog circuit board described in this utility model.
[0019] Explanation of reference numerals: 1. Housing; 2. 3D encapsulation structure; 3. Signal circuit board; 4. Power circuit board; 5. Analog circuit board; 6. Resin; 7. Connection port; 8. Window; 9. Mounting port; 11. Analog-to-digital converter; 12. Microcontroller module; 13. Mounting hole; 14. Mounting block. Detailed Implementation
[0020] like Figures 1 to 5 As shown, an analog signal acquisition device based on three-dimensional packaging includes a housing 1. Inside the housing 1, a three-dimensional packaging structure 2 is disposed. From bottom to top, a signal circuit board 3, a power circuit board 4, and an analog circuit board 5 are stacked sequentially in the three-dimensional packaging structure 2. Resin 6 fills the spaces between the signal circuit board 3, the power circuit board 4, and the analog circuit board 5. Laser-etched lines are provided on the side surfaces of the three-dimensional packaging structure 2. The signal circuit board 3, the power circuit board 4, and the analog circuit board 5 are electrically connected through these laser-etched lines. A connection port 7 is also provided at one end of the three-dimensional packaging structure 2. By stacking the signal circuit board 3, the power circuit board 4, and the analog circuit board 5 sequentially from bottom to top, the electronic components at different heights avoid each other, maximizing the utilization of three-dimensional space, improving space utilization, and enabling the integration and modularization of a large circuit system and the overall miniaturization of the device. Furthermore, by using the resin 6 to solidify the signal circuit board 3, the power circuit board 4, and the analog circuit board 5 into a whole, the shock resistance and oxidation resistance are improved, ensuring the integrity and stability of the system-level circuit functions. This allows the present invention to better cope with some harsh environments, while eliminating the problem of poor soldering that may occur in previous BGA or PGA soldering modules, thus improving product quality.
[0021] Preferably, windows 8 are symmetrically arranged at both the front and rear ends of the outer casing 1, the connection port 7 is directly opposite the window 8, and a disassembly port 9 is provided on the lower end face of the outer casing 1, the disassembly port 9 being fitted with a lower cover. The three-dimensional encapsulation structure 2 is installed into the outer casing 1 through the disassembly port 9 and encapsulated by the lower cover.
[0022] Preferably, the analog circuit board 5 is provided with an analog-to-digital converter 11, which converts the acquired analog signal into a digital signal and transmits the converted digital signal to the signal circuit board 3.
[0023] Preferably, the signal circuit board 3 is provided with a microcontroller module 12, which is used to perform calculations and processing on the received digital signals.
[0024] Preferably, mounting blocks 14 with mounting holes 13 are symmetrically arranged at both the front and rear ends of the lower part of the housing 1. The housing 1 can be installed into an external device through the mounting blocks 14.
[0025] The specific implementation of this embodiment is as follows: The power supply circuit board 4 converts the external input power into the internal required power and provides power to the signal circuit board 3 and the analog circuit board 5. The analog circuit board 5 converts the externally input analog signal into a digital signal and transmits the digital signal to the signal circuit board 3. The signal circuit board 3 performs calculations and processing on the received digital signal and outputs the processed data.
[0026] The above description is only the optimal solution embodiment of this utility model and is not intended to limit this utility model. Various modifications or substitutions made by those skilled in the art to this utility model without departing from the essence and protection scope of this utility model should also be within the protection scope of this utility model.
Claims
1. An analog signal acquisition device based on three-dimensional packaging, characterized in that: The device includes a housing (1), inside which a three-dimensional encapsulation structure (2) is provided. The three-dimensional encapsulation structure (2) is stacked from bottom to top with a signal circuit board (3), a power circuit board (4), and an analog circuit board (5). Resin (6) is filled between the signal circuit board (3), the power circuit board (4), and the analog circuit board (5). Laser etching lines are provided on the side end face of the three-dimensional encapsulation structure (2). The signal circuit board (3), the power circuit board (4), and the analog circuit board (5) are electrically connected through the laser etching lines. A connection port (7) is also provided at one end of the three-dimensional encapsulation structure (2).
2. The analog signal acquisition device based on three-dimensional packaging according to claim 1, characterized in that: The outer shell (1) has windows (8) symmetrically arranged at its front and rear ends. The connection port (7) is directly opposite the window (8). The lower end face of the outer shell (1) is provided with a disassembly port (9), and the disassembly port (9) is fitted with a lower cover.
3. The analog signal acquisition device based on three-dimensional packaging according to claim 1, characterized in that: The analog circuit board (5) is equipped with an analog-to-digital converter (11). The analog circuit board (5) converts the collected analog signal into a digital signal through the analog-to-digital converter (11) and transmits the converted digital signal to the signal circuit board (3).
4. The analog signal acquisition device based on three-dimensional packaging according to claim 1, characterized in that: The signal circuit board (3) is provided with a microcontroller module (12), which is used to perform calculations and processing on the received digital signals.
5. The analog signal acquisition device based on three-dimensional packaging according to claim 1, characterized in that: Mounting blocks (14) with mounting holes (13) are symmetrically arranged at the front and rear ends of the lower part of the outer shell (1).