Friction welding liquid cooling plate and power box

Abstract

The utility model relates to the technical field of liquid cooling plates, in particular to a friction welding liquid cooling plate and a power box, the friction welding liquid cooling plate comprises a substrate and a cover plate, the substrate is provided with a first through hole, the cover plate is provided with a boss, the boss penetrates through the first through hole, and the part, extending into the first through hole, of the boss is connected with the substrate. According to the friction welding liquid cooling plate, the boss is matched with the first through hole, a new friction welding seam can be formed between the base plate and the cover plate, holes do not need to be formed in the cover plate, and a continuous planar area with a large area can be conveniently formed on the cover plate and used for installing components or arranging accessory structures; moreover, as the new friction welding seam is located at the position where the boss extends into the first through hole, the influence of all structures on the surface of the cover plate is small, the arrangement position is relatively flexible, and the new friction welding seam can be conveniently arranged close to the flow channel, so that the compression strength of the flow channel is improved, and the deformation risk and the leakage risk are reduced.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling plate technology, and in particular to a friction welding liquid cooling plate and a power supply box. Background Technology

[0002] Traditional liquid cooling plates often use friction stir welding, brazing, and other methods to weld the edge of the cover plate to the surface of the substrate. In some cases, perforations are made in the cover plate to increase the weld seam and allow the weld seam to be close to the curved flow channel. However, the above welding methods have the following problems: conventional liquid cooling plate processing uses the friction welding path to follow the flow channel. However, for high-density power consumption devices, the arrangement of devices will seriously affect the friction welding tool path. In order not to affect the setting of devices or auxiliary structures, the friction welding path can only be avoided to a position far away from the flow channel, which can easily lead to insufficient pressure resistance of the flow channel, deformation risk, or leakage risk. Utility Model Content

[0003] The purpose of this invention is to overcome the problem in the prior art that conventional liquid cooling plate processing involves walking along the flow channel to complete the friction welding path, while the arrangement of components will seriously affect the friction welding tool path, causing the friction welding path to be avoided to a position far away from the flow channel. This invention provides a friction welding liquid cooling plate and a power supply box.

[0004] In a first aspect, the present invention provides a friction welding liquid cooling plate, comprising a substrate and a cover plate, wherein the substrate is provided with a first through hole, and the cover plate is provided with a boss, the boss passing through the first through hole, and the portion of the boss extending into the first through hole being connected to the substrate.

[0005] The friction welding liquid cooling plate of this utility model can form a new friction welding seam between the substrate and the cover plate by the cooperation of the boss and the first through hole. The formation of the new friction welding seam does not require opening holes in the cover plate, which makes it convenient to form a large continuous surface area on the cover plate for mounting components or setting auxiliary structures. Moreover, since the new friction welding seam is located at the position where the boss extends into the first through hole, it is less affected by the various structures on the surface of the cover plate, and its setting position is relatively flexible. It is convenient to set it close to the flow channel to increase the pressure resistance of the flow channel and reduce the risk of deformation and leakage.

[0006] Preferably, the portion of the boss extending into the first through hole can be connected to the substrate by friction welding to form an integral structure.

[0007] Preferably, a flow channel is formed between the substrate and the cover plate.

[0008] Preferably, the substrate includes a first plate surface and a second plate surface opposite to each other, the boss is disposed on the lower surface of the cover plate, the cover plate covers the substrate with the lower surface facing the first plate surface, the edge of the cover plate is connected to the first plate surface by friction welding, and the edge of the boss is connected to the second plate surface by friction welding.

[0009] The friction-welded liquid cooling plate of this utility model optimizes the flow channel design and welding process. By using double-sided friction welding technology to form welds on both sides of the substrate, the welds can be made close to the flow channel while ensuring that the cover plate has a large plate surface. This helps to reduce the deformation of the internal flow channel, improve the pressure resistance of the flow channel, and thus improve the structural strength of the liquid cooling plate.

[0010] Preferably, the second plate surface has a recessed portion, the bottom surface of the recessed portion is lower than the peripheral surface, and the boss is located inside the recessed portion; the top surface of the boss is flush with the bottom surface of the recessed portion.

[0011] Preferably, the flow channel is used for the circulation of liquid cooling medium.

[0012] Preferably, the first plate surface is provided with a flow channel groove, and the cover plate covers the flow channel groove to form the flow channel.

[0013] Preferably, the flow channel groove is provided with a first partition extending along the flow channel, and the lower surface of the cover plate is provided with a second partition extending along the flow channel, and the first partition and the second partition are arranged laterally spaced along the flow channel.

[0014] Preferably, the first plate surface is provided with a recessed overlapping platform, and the cover plate overlaps on the overlapping platform; the upper surface of the cover plate is flush with the first plate surface.

[0015] Preferably, the gap between the side of the cover plate and the substrate is h, where h ≤ 0.1 mm.

[0016] Preferably, the cover plate is provided with at least one second through hole, and the edge of the cover plate near the second through hole is connected to the substrate by friction welding; at least two continuous annular friction welds are formed between the upper surface of the cover plate and the first plate surface.

[0017] Preferably, the upper surface of the cover plate is provided with a first enclosure plate, which is used to enclose and form a first mounting groove; the second plate surface is provided with a second enclosure plate, which is used to enclose and form a second mounting groove; the flow channel flows through the bottom of the first mounting groove and the second mounting groove.

[0018] Preferably, the substrate is further provided with a first channel opening and a second channel opening that connect to the flow channel. The first channel opening and the second channel opening form a loop through the flow channel, and the first channel opening and the second channel opening are located on the same side of the liquid cooling plate.

[0019] Preferably, the substrate is made of either an aluminum alloy or a copper alloy.

[0020] Preferably, the cover plate is made of either an aluminum alloy or a copper alloy.

[0021] Preferably, the flow channel is serpentine.

[0022] Preferably, at the welding position, the cover plate and the base plate are respectively provided with bevels, and the inclination angle of the bevels is α, where 30°≤α≤60°.

[0023] In a second aspect, the present invention provides a power supply box, including a box body and a friction welding liquid cooling plate as described above, wherein the friction welding liquid cooling plate is located inside the box body and a power supply module is connected to the friction welding liquid cooling plate.

[0024] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0025] The friction welding liquid cooling plate of this utility model can form a new friction welding seam between the substrate and the cover plate by the cooperation of the boss and the first through hole. The formation of the new friction welding seam does not require opening holes in the cover plate, which makes it convenient to form a large continuous surface area on the cover plate for mounting components or setting auxiliary structures. Moreover, since the new friction welding seam is located at the position where the boss extends into the first through hole, it is less affected by the various structures on the surface of the cover plate, and its setting position is relatively flexible. It is convenient to set it close to the flow channel to increase the pressure resistance of the flow channel and reduce the risk of deformation and leakage. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the liquid cooling plate described in this utility model;

[0027] Figure 2 This is a cross-sectional view of the liquid cooling plate described in this utility model (section I-I).

[0028] Figure 3 This is a cross-sectional view (section I-I) of the liquid cooling plate described in this utility model.

[0029] Figure 4 for Figure 3 Enlarged view of section A in the middle;

[0030] Figure 5 for Figure 3 Enlarged view of section B in the middle;

[0031] Figure 6This is a schematic diagram of the structure of the upper surface of the cover plate of this utility model;

[0032] Figure 7 This is a schematic diagram of the structure of the first plate surface of the substrate described in this utility model;

[0033] Figure 8 for Figure 7 Enlarged view of section C;

[0034] Figure 9 This is a schematic diagram of the structure of the second plate surface of the substrate described in this utility model;

[0035] Figure 10 This is a schematic diagram of the structure of the lower surface of the cover plate of this utility model;

[0036] Figure 11 This is a schematic diagram of the first weld of this utility model;

[0037] Figure 12 This is a schematic diagram of the second weld of this utility model;

[0038] Figure 13 This is a schematic diagram of the structure of the power supply box described in this utility model. Figure 1 ;

[0039] Figure 14 This is a schematic diagram of the structure of the power supply box described in this utility model. Figure 2 ;

[0040] Figure 15 This is a cross-sectional view of the power supply box described in this utility model.

[0041] Marked in the image:

[0042] 1-Substrate;

[0043] 11-First through hole; 12-First plate surface; 13-Second plate surface; 14-Recessed part; 15-Overlapping platform; 16-Second surrounding plate; 17-Second mounting groove;

[0044] 2-Cover plate;

[0045] 21-Second through hole; 22-Boss; 23-Lower surface; 24-Upper surface; 25-First enclosure plate; 26-First mounting groove;

[0046] 3-Flow channel;

[0047] 31-Flow channel groove; 32-First baffle; 33-Second baffle; 34-First channel opening; 35-Second channel opening;

[0048] 4-First weld;

[0049] 5-Second weld;

[0050] 6-Protrusion. Detailed Implementation

[0051] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0052] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.

[0053] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0054] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing descriptions of identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.

[0055] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.

[0056] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0057] Example 1

[0058] This embodiment provides a liquid cooling plate, including a substrate 1 and a cover plate 2. The two opposite sides of the substrate 1 are defined as a first plate surface 12 and a second plate surface 13, and the two opposite sides of the cover plate 2 are defined as a lower surface 23 and an upper surface 24. The cover plate 2 covers the substrate 1 with the lower surface 23 facing the first plate surface 12 of the substrate 1.

[0059] In a preferred embodiment, a flow channel 3 is formed between the substrate 1 and the cover plate 2. Further, the flow channel 3 is used for the flow of liquid cooling medium.

[0060] In existing technologies, the surface of the substrate 1 is generally larger than that of the cover plate 2. Friction stir welding, brazing, and other methods are often used to weld the edge of the cover plate 2 to the surface of the substrate 1. To ensure the weld seam is close to the flow channel 3, technicians create several perforated holes on the cover plate 2 and weld the cover plate 2 to the substrate 1 near the edge of the perforated holes. The advantages of this structure are: 1. The perforated holes do not compromise the integrity of the cover plate 2; the cover plate 2 and the substrate 1 only need to be positioned once. 2. The perforated holes provide more welding positions. Extending the edge of the perforated holes along the flow channel 3 allows the weld seam to be closer to the flow channel 3, which is beneficial for improving the structural strength and pressure resistance of the liquid cooling plate. However, the perforated holes will damage the integrity of the cover plate 2 and occupy the space of the cover plate 2, making it difficult to form a large continuous planar area for centralized installation of components or setting up auxiliary structures. Welds are usually not allowed in this continuous planar area. In order to achieve heat dissipation, the flow channel 3 needs to flow through this continuous planar area, which causes the weld to be avoided to a position far away from the flow channel 3, resulting in insufficient pressure resistance, easy deformation of the flow channel 3 and the risk of leakage.

[0061] To solve the above problems, this embodiment provides a first through hole 11 on the substrate 1, which connects the first plate surface 12 and the second plate surface 13. A boss 22 is provided on the lower surface 23 of the cover plate 2, which passes through the first through hole 11. The portion of the boss 22 extending into the first through hole 11 is connected to the substrate 1 by friction welding.

[0062] The liquid cooling plate described in this embodiment can form a new weld that is not located on the first plate surface 12 by cooperating with the boss 22 and the first through hole 11. The formation of the new weld does not require opening holes in the cover plate 2 and the setting position is more flexible. It can reduce the number of holes on the cover plate 2 while bringing the weld closer to the flow channel 3, thereby taking into account both the need for the weld to be close to the flow channel 3 and the need to form a large continuous surface area on the cover plate 2 for setting auxiliary structures and devices.

[0063] Example 2

[0064] like Figures 1 to 12 As shown, this embodiment provides a friction-welded liquid cooling plate, including a substrate 1 and a cover plate 2. A flow channel 3 is formed between the substrate 1 and the cover plate 2. The substrate 1 includes a first plate surface 12 and a second plate surface 13 facing each other. The cover plate 2 covers the substrate 1 with its lower surface 23 facing the first plate surface 12. The edge of the cover plate 2 is connected to the first plate surface 12 of the substrate 1 by friction welding. The substrate 1 is provided with a first through hole 11. The lower surface 23 of the cover plate 2 is provided with a boss 22. The boss 22 passes through the first through hole 11. The edge of the boss 22 is connected to the second plate surface 13 of the substrate 1 by friction welding.

[0065] Define the friction weld between the edge of cover plate 2 and the first plate surface 12 as the first weld 4, such as Figure 11 As shown, the friction weld between the edge of the boss 22 and the second plate surface 13 is defined as the second weld 5, as follows. Figure 12 As shown.

[0066] In this embodiment, the edge of the cover plate 2 refers to the edge position of the upper surface 24 of the cover plate 2, which can be further divided into the inner edge and the outer edge. The inner edge is the edge position near the hollow hole on the cover plate 2, and the outer edge is the edge position near the side of the cover plate 2; the edge of the boss 22 is the edge position of the top surface of the boss 22 near the side of the boss 22.

[0067] This embodiment optimizes the design and welding process of the flow channel 3. By using double-sided friction welding technology to form welds on both sides of the substrate 1, the welds can be made close to the flow channel 3 while ensuring that the cover plate 2 has a large continuous planar area to accommodate auxiliary structures and devices. This helps to reduce the deformation of the internal flow channel 3, improve the pressure resistance of the flow channel 3, and thus improve the structural strength of the liquid cooling plate.

[0068] The substrate 1 and cover plate 2 are rigid plate-shaped components. Strip grooves can be provided on the substrate 1 and / or cover plate 2. The cover plate 2 and the substrate 1 are connected together with their surfaces facing each other, thereby forming a sealed flow channel 3. The flow channel 3 can be used to supply the flow of liquid cooling medium. A first channel port 34 and a second channel port 35 can be provided on the liquid cooling plate. Both the first channel port 34 and the second channel port 35 are connected to the flow channel 3, so that the liquid cooling medium can enter the flow channel 3 from the first channel port 34 and flow out from the second channel port 35 after passing through the flow channel 3. The liquid cooling medium can be water or a special liquid, such as deionized water, ethylene glycol aqueous solution, fluorinated liquid, etc. In this case, the first channel port 34 and the second channel port 35 are also called the liquid inlet and the liquid outlet. However, it is not excluded that the liquid cooling medium can be gas under some operating conditions. In this case, the first channel port 34 and the second channel port 35 are also called the gas inlet and the gas outlet.

[0069] Preferably, the first channel port 34 and the second channel port 35 are located on the same side of the liquid cooling plate, which facilitates the connection of pipelines.

[0070] Preferably, the substrate 1 and the cover plate 2 are metal components; further, the substrate 1 is made of aluminum alloy or copper alloy; the cover plate 2 is made of aluminum alloy or copper alloy.

[0071] Preferably, the flow channel 3 is serpentine to increase the coverage area of ​​the flow channel 3 and improve the overall heat dissipation effect.

[0072] The first through hole 11 is a hole formed on the substrate 1, and the boss 22 is a protruding structure protruding from the lower surface 23 of the cover plate 2. The shape and size of the boss 22 are adapted to the first through hole 11 so that the boss 22 can pass through the first through hole 11. The boss 22 and the cover plate 2 can be integrally formed. For example, the boss 22 can be formed on the cover plate 2 by milling or etching process.

[0073] Preferably, the distance between the side of the boss 22 and the side of the first through hole 11 is less than or equal to 0.1 mm, so as to reduce the possible misalignment between the substrate 1 and the cover plate 2. This can be achieved by reasonably setting the size of the boss 22 and the first through hole 11.

[0074] Friction welding refers to the process of using heat generated by mechanical friction to bring the contact surfaces to a plastic state, and then joining materials under pressure. It is an existing technology. Compared to fusion welding, friction welding does not require melting metal and has advantages such as high efficiency, energy saving, and low deformation. In this embodiment, friction stir welding is preferably used, and the welding pressure of the friction welding head is preferably 10MPa-30MPa, more preferably 20MPa; the rotation speed is preferably 800RPM-1500RPM, more preferably 1000RPM.

[0075] Preferably, at the welding position, bevels are provided on the upper surface 24 of the cover plate 2 and the first plate surface 12, respectively, and bevels are also provided on the top surface of the boss 22 and the second plate surface 13, respectively. The bevels increase the welding area and enhance shear resistance, thereby reducing the probability of misalignment between the cover plate 2 and the base plate 1. The bevel angle α can be selected from a range of 30°-60°, such as... Figure 4 As shown.

[0076] In some embodiments, the second surface 13 of the substrate 1 is provided with a recess 14, the bottom surface of the recess 14 is lower than the peripheral surface, and the boss 22 is located in the recess 14; the top surface of the boss 22 is flush with the bottom surface of the recess 14, and the area of ​​the recess 14 is larger than the area of ​​the boss 22, which facilitates the welding of the friction welding head; by providing the recess 14, the protrusion height of the boss 22 can be reduced, thereby saving material, especially for the milled or etched boss 22, the thickness of the required raw material can be greatly reduced; the recess 14 can also hide the second weld 5 under the second surface 13.

[0077] In some embodiments, a flow channel groove 31 is provided on the first plate surface 12 of the substrate 1, and the cover plate 2 covers the flow channel groove 31 to form a flow channel 3.

[0078] Preferably, a first baffle 32 extending along the flow channel 3 is provided in the flow channel groove 31, and a second baffle 33 extending along the flow channel 3 is provided on the lower surface 23 of the cover plate 2. Both the first baffle 32 and the second baffle 33 are located in the flow channel 3, and the first baffle 32 and the second baffle 33 are arranged laterally along the flow channel 3. The first baffle 32 and the second baffle 33 can play the role of diverting the flow and reducing the flow channel pressure, while also strengthening the pressure resistance of the liquid cooling plate.

[0079] Furthermore, the first partition 32 is located in the middle of the flow channel groove 31, and two rows of second partitions 33 are distributed on both sides of the first partition 32; the first partition 32 and the second partition 33 can both be composed of a number of partition units that extend along the flow channel 3 and are spaced apart; the first partition 32 and the second partition 33 can also be formed by milling or etching processes.

[0080] In some embodiments, a recessed overlapping platform 15 is provided on the first plate surface 12, the overlapping platform 15 is higher than the bottom surface of the flow channel groove 31, and the cover plate 2 overlaps on the overlapping platform 15; the upper surface 24 of the cover plate 2 is flush with the first plate surface 12 of the substrate 1 to facilitate the friction welding head to pass through.

[0081] Preferably, the gap between the side of the cover plate 2 and the substrate 1 is h, where h ≤ 0.1 mm, to reduce the possible misalignment between the substrate 1 and the cover plate 2. Figure 4 As shown.

[0082] In some embodiments, the cover plate 2 is provided with at least one second through hole 21, which is the hollow hole provided on the cover plate 2 as described above. The cover plate 2 is connected to the substrate 1 by friction welding near the edge of the second through hole 21, that is, the inner edge.

[0083] Furthermore, at least two continuous annular friction welds are formed between the upper surface 24 of the cover plate 2 and the first plate surface 12, such as... Figure 11 As shown, one of them is formed by the outer edge of the cover plate 2, and the rest are formed by the edge of the cover plate 2 near the second through hole 21; the continuous annular friction weld seam is beneficial to improving the sealing performance of the flow channel 3, and the connection strength between the cover plate 2 and the substrate 1 can be improved by multiple continuous annular friction weld seams.

[0084] In some embodiments, the upper surface 24 of the cover plate 2 is provided with a first enclosure 25, which is used to enclose and form a first mounting groove 26.

[0085] In some embodiments, the second plate surface 13 of the substrate 1 is provided with a second surrounding plate 16, which is used to enclose and form a second mounting groove 17.

[0086] Preferably, the flow channel 3 flows through the bottom of the first mounting groove 26 and the second mounting groove 17; both the first mounting groove 26 and the second mounting groove 17 can be used to centrally mount various devices.

[0087] Preferably, the upper surface 24 of the cover plate 2 and the second plate surface 13 of the substrate 1 are provided with protrusions 6. The protrusions 6 are auxiliary components on the liquid cooling plate. The protrusions 6 can be formed by milling. The protrusions 6 can increase the strength and rigidity of the cover plate 2 or the substrate 1. Threaded holes can also be provided on them for screw connection. The boss 22 can be located on the back of a portion of the protrusions 6.

[0088] Example 3

[0089] like Figures 13 to 15 As shown, this embodiment provides a power supply box, including a box body as described in embodiment 1 or 2, consisting of a friction welding liquid cooling plate.

[0090] Preferably, the friction welding liquid cooling plate is located inside the cavity of the housing, and a power module is connected to the friction welding liquid cooling plate. The power module is a power supply that can be directly mounted on the printed circuit board. Further, the power module is located in the first mounting slot 26 and / or the second mounting slot 17.

[0091] Example 4

[0092] This embodiment provides a liquid cooling plate manufacturing process for forming the friction welding liquid cooling plate as described in Embodiment 1 or 2, including the following steps:

[0093] S1. Pre-treatment: Form a first through hole 11 on the substrate 1 and form a boss 22 on the cover plate 2;

[0094] S2. Clamping and positioning: Clamp and fix the base plate 1 and the cover plate 2;

[0095] S3. First-side welding: Weld along the edge of cover plate 2 using a friction welding head;

[0096] S4. Second side welding: Use a friction welding head to weld along the edge of the boss 22.

[0097] Preferably, the process further includes step S5. Post-processing: polishing the weld area.

[0098] Preferably, step S1 further includes the following steps: forming a flow channel groove 31, a first partition 32 and an overlapping platform 15 on the substrate 1, and forming a second partition 33 on the cover plate 2. The forming process can be milling or etching.

[0099] Furthermore, the bottom surface of the flow channel groove 31 is lower than the surface of the overlapping platform 15, and the surface of the overlapping platform 15 is lower than the first plate surface 12; the top surface of the first partition 32 is higher than the bottom surface of the flow channel groove 31 and lower than the surface of the overlapping platform 15.

[0100] Example 5

[0101] This embodiment provides a liquid cooling plate manufacturing process for forming the friction welding liquid cooling plate as described above, including the following steps:

[0102] ①Pre-treatment: Forming the first through hole 11 and the boss 22;

[0103] ② Clamping and positioning: Align and press the substrate 1 and cover plate 2 with the clamps to ensure that the gap between the side of the cover plate 2 and the substrate 1 is ≤0.1mm;

[0104] ③ First side welding: Use a friction welding head to apply rotation from both sides of flow channel 3, with a welding pressure of 10-30MPa and a rotation speed of 800-1500RPM;

[0105] ④ Second side welding: After the first side welding, the steps and auxiliary features are milled, and then the weak area of ​​flow channel 3 is welded. The welding pressure is 10-30MPa and the rotation speed is 800-1500RPM.

[0106] ⑤ Post-processing: Polish the weld area to improve surface roughness.

[0107] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A friction welding liquid cooling plate, characterized in that, The device includes a substrate (1) and a cover plate (2). The substrate (1) has a first through hole (11) and the cover plate (2) has a boss (22). The boss (22) passes through the first through hole (11) and the part of the boss (22) extending into the first through hole (11) is connected to the substrate (1).

2. The friction welding liquid cooling plate according to claim 1, characterized in that, The portion of the boss (22) extending into the first through hole (11) can be connected to the substrate (1) by friction welding to form an integral structure; A flow channel (3) is formed between the substrate (1) and the cover plate (2); the substrate (1) includes a first plate surface (12) and a second plate surface (13) facing each other, the boss (22) is disposed on the lower surface (23) of the cover plate (2), the cover plate (2) covers the substrate (1) with the lower surface (23) facing the first plate surface (12), the edge of the cover plate (2) is connected to the first plate surface (12) by friction welding, and the edge of the boss (22) is connected to the second plate surface (13) by friction welding.

3. The friction welding liquid cooling plate according to claim 2, characterized in that, The second plate surface (13) is provided with a recess (14), the bottom surface of the recess (14) is lower than the peripheral surface, and the boss (22) is located in the recess (14); the top surface of the boss (22) is flush with the bottom surface of the recess (14); And / or, the flow channel (3) is used for the flow of liquid cooling medium.

4. The friction welding liquid cooling plate according to claim 2, characterized in that, The first plate surface (12) is provided with a flow channel groove (31), and the cover plate (2) covers the flow channel groove (31) to form the flow channel (3); The flow channel groove (31) is provided with a first partition (32) extending along the flow channel (3), and the lower surface (23) of the cover plate (2) is provided with a second partition (33) extending along the flow channel (3). The first partition (32) and the second partition (33) are arranged at a lateral interval along the flow channel (3).

5. The friction welding liquid cooling plate according to claim 2, characterized in that, The first plate (12) is provided with a recessed overlapping platform (15), and the cover plate (2) overlaps on the overlapping platform (15); the upper surface (24) of the cover plate (2) is flush with the first plate (12).

6. The friction welding liquid cooling plate according to claim 5, characterized in that, The gap between the side of the cover plate (2) and the substrate (1) is h, where h ≤ 0.1 mm.

7. The friction welding liquid cooling plate according to claim 2, characterized in that, The cover plate (2) is provided with at least one second through hole (21), and the edge of the cover plate (2) near the second through hole (21) is connected to the substrate (1) by friction welding; at least two continuous annular friction welds are formed between the upper surface (24) of the cover plate (2) and the first plate surface (12).

8. The friction welding liquid cooling plate according to any one of claims 2-7, characterized in that, The upper surface (24) of the cover plate (2) is provided with a first enclosure plate (25), which is used to enclose and form a first mounting groove (26); the second plate surface (13) is provided with a second enclosure plate (16), which is used to enclose and form a second mounting groove (17); the flow channel (3) flows through the bottom of the first mounting groove (26) and the second mounting groove (17).

9. The friction welding liquid cooling plate according to any one of claims 2-7, characterized in that: The substrate (1) is also provided with a first channel port (34) and a second channel port (35) that connect to the flow channel (3). The first channel port (34) and the second channel port (35) form a loop through the flow channel (3). The first channel port (34) and the second channel port (35) are located on the same side of the liquid cooling plate. And / or, the substrate (1) is made of either an aluminum alloy or a copper alloy; And / or, the cover plate (2) is made of either an aluminum alloy or a copper alloy; And / or, the flow channel (3) is serpentine; And / or, at the welding position, the cover plate (2) and the base plate (1) are respectively provided with bevels, the bevel angle being a, 30°≤a≤60°.

10. A power supply box, characterized in that, It includes a housing and a friction welding liquid cooling plate as described in any one of claims 1-9, wherein the friction welding liquid cooling plate is located inside the housing and a power module is connected to the friction welding liquid cooling plate.

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