Cleaning mechanism on wafer chamfering equipment

Abstract

The utility model discloses a cleaning mechanism on a wafer chamfering device, which comprises a cleaning tank, a wafer adsorption rotating mechanism, a cleaning nozzle mechanism, a brush cleaning mechanism and a wafer lifting mechanism, the cleaning tank is arranged on the wafer chamfering device, the wafer adsorption rotating mechanism is arranged on the cleaning tank, and the brush cleaning mechanism is arranged on the wafer lifting mechanism. The wafer adsorption rotating mechanism comprises a vacuum adsorption assembly used for adsorbing a wafer and a driving module used for driving the wafer to rotate. According to the design scheme, multi-dimensional cleaning of the edge and the surface of the chamfered wafer can be achieved through the brush cleaning mechanism and the cleaning nozzle mechanisms arranged at multiple positions, meanwhile, the wafer lifting mechanism is additionally arranged, after the wafer is lifted, secondary cleaning can be carried out on the suction cup suction area, cleaning blind areas are avoided, and the cleaning efficiency is improved. And meanwhile, through the dual functions of spin-drying and air blowing, the problem that cleaning liquid is left after cleaning is completed on existing equipment is solved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically a cleaning mechanism in a wafer chamfering device. Background Technology

[0002] In semiconductor wafer fabrication, the chamfering process is used to remove sharp edges from the wafer, preventing edge chipping and optimizing compatibility with subsequent packaging processes. Contaminants such as silicon chips, grinding fluid residue, and metal ions generated during the chamfering process need to be removed by a cleaning unit.

[0003] Existing cleaning methods mainly rely on brushing for cleaning. However, there are blind spots in the edge cleaning process, resulting in incomplete cleaning of the wafers. Furthermore, cleaning fluid residue remains on the wafers after cleaning, affecting the quality of subsequent finished products. There is still room for improvement. Utility Model Content

[0004] The purpose of this invention is to provide a cleaning mechanism for a wafer chamfering device in order to solve the problems mentioned above.

[0005] The technical solution adopted by this utility model is as follows: a cleaning mechanism on a wafer chamfering device includes a cleaning tank, a wafer adsorption and rotation mechanism, a cleaning nozzle mechanism, a brush cleaning mechanism, and a wafer lifting mechanism. The cleaning tank is disposed on the wafer chamfering device. The wafer adsorption and rotation mechanism is disposed on the cleaning tank and includes a vacuum adsorption component for adsorbing the wafer and a drive module for driving the wafer to rotate. The cleaning nozzle mechanism is disposed on the cleaning tank and is configured to spray water for cleaning and air for drying towards the upper and lower walls of the wafer, respectively. The brush cleaning mechanism is disposed on the cleaning tank and includes a brush component that can fit against the upper and lower walls and outer edge of the wafer and a swing cylinder that can drive the brush component to swing back and forth. The wafer lifting mechanism is disposed on the cleaning tank and is used to remove the wafer from the wafer adsorption and rotation mechanism. When the wafer adsorption and rotation mechanism drives the wafer to rotate, the cleaning nozzle mechanism and the brush cleaning mechanism perform an all-round cleaning operation on the wafer.

[0006] In a preferred embodiment, the vacuum adsorption assembly includes a vacuum suction cup and a vacuum module connected to the vacuum suction cup. The adsorption end of the vacuum suction cup is arranged facing upward and located at the center of the cleaning tank. The vacuum module is also provided with a fixing plate for fixing on the cleaning tank. The output end of the drive module is connected to the vacuum module.

[0007] In a preferred embodiment, the cleaning nozzle mechanism includes a fixed base disposed on the cleaning tank, with an upper air blowing connector and an upper water spray connector respectively disposed on both sides of the upper end of the fixed base, and a lower air blowing connector and a lower water spray connector respectively disposed on both sides of the lower end of the fixed base.

[0008] In a preferred embodiment, the upper air-blowing connector and the lower air-blowing connector are connected to an external air supply module, and the upper water-spraying connector and the lower water-spraying connector are connected to an external water supply module. The upper air-blowing connector and the upper water-spraying connector are respectively detachably equipped with an air jet pipe and a water spray pipe facing the upper wall of the wafer; the lower air-blowing connector and the lower water-spraying connector are respectively detachably equipped with an air jet pipe and a water spray pipe facing the lower wall of the wafer.

[0009] In a preferred embodiment, the brush assembly includes a sequentially detachable upper brush, an edge brush, and a lower brush, wherein the upper brush, the edge brush, and the lower brush together form a U-shaped brushing space.

[0010] In a preferred embodiment, the top of the upper brush is connected to the output end of the swing cylinder via a connecting rod, and the length of the lower brush is less than the length of the upper brush.

[0011] In a preferred embodiment, the wafer lifting mechanism includes a lifting cylinder, a second swing cylinder, and a second vacuum chuck. The second swing cylinder is installed at the lifting end of the lifting cylinder, and the swing end of the second swing cylinder is connected to the second vacuum chuck via a connecting arm.

[0012] In a preferred embodiment, the brush cleaning mechanism, the cleaning nozzle mechanism, and the cleaning tank are all located within the operating trajectory of the wafer lifting mechanism.

[0013] In a preferred embodiment, there are multiple cleaning nozzles, which are spaced apart on the cleaning tank.

[0014] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0015] 1. In this utility model, the brush cleaning mechanism and the cleaning nozzle mechanism arranged in multiple places can achieve multi-dimensional cleaning of the edge and surface of the wafer after chamfering. At the same time, the wafer lifting mechanism is added. After the initial cleaning, the area after suction cup adsorption can be cleaned again by lifting the wafer, avoiding cleaning blind spots. At the same time, the problem of cleaning fluid residue after cleaning is solved by the dual action of spin drying and blowing.

[0016] 2. In this utility model, both the cleaning equipment and the transfer equipment are automatically controlled, which can realize fully automated wafer cleaning and handling operations, saving manpower while significantly increasing the cleaning volume of the cleaning organization per working day. Attached Figure Description

[0017] Figure 1 This is a top view of the overall planar structure of this utility model;

[0018] Figure 2 This is a simplified planar structural diagram of the wafer adsorption and rotation mechanism in this utility model;

[0019] Figure 3 This is a three-dimensional structural diagram of the cleaning nozzle mechanism in this utility model;

[0020] Figure 4 This is a simplified three-dimensional schematic diagram of the brush assembly in this utility model;

[0021] Figure 5 This is a three-dimensional structural diagram of the wafer lifting mechanism in this utility model.

[0022] Marked in the image:

[0023] 1-Wafer adsorption and rotation mechanism, 11-Drive module, 12-Vacuum module, 13-Fixing plate, 14-Vacuum chuck, 15-Wafer;

[0024] 2-Cleaning nozzle mechanism, 21-Fixed seat, 22-Lower air blower connector, 23-Lower water spray connector, 24-Upper air blower connector, 25-Upper water spray connector;

[0025] 3-Brush cleaning mechanism, 31-Swing cylinder, 32-Connecting rod, 33-Upper brush, 34-Edge brush, 35-Lower brush;

[0026] 4-Wafer lifting mechanism, 41-Second swing cylinder, 42-Lifting cylinder, 43-Second vacuum chuck;

[0027] 5-Cleaning tank. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0030] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0031] Reference Figure 1-5 A cleaning mechanism for a wafer chamfering device includes a cleaning tank 5, a wafer adsorption and rotation mechanism 1, a cleaning nozzle mechanism 2, a brush cleaning mechanism 3, and a wafer lifting mechanism 4. The cleaning tank 5 is mounted on the wafer chamfering device (not shown in the figure). The wafer adsorption and rotation mechanism 1 is mounted on the cleaning tank 5 and includes a vacuum adsorption component for adsorbing wafers 15 and a drive module 11 for driving the wafers 15 to rotate. Multiple cleaning nozzle mechanisms 2 are spaced apart on the cleaning tank 5 and are configured to spray water for cleaning and air for drying the upper and lower walls of the wafers 15, respectively. The brush cleaning mechanism 3 is mounted on the cleaning tank 5 and includes a brush assembly that can fit against the upper and lower walls and outer edges of the wafers 15, and a drive module 11 that can drive the brushes to rotate. The brush assembly reciprocates with a swing cylinder 31; the wafer lifting mechanism 4 is mounted on the cleaning tank 5. The wafer lifting mechanism 4 is used to remove the wafer 15 from the wafer adsorption and rotation mechanism 1. When the wafer adsorption and rotation mechanism 1 drives the wafer 15 to rotate, the cleaning nozzle mechanism 2 and the brush cleaning mechanism 3 perform all-round cleaning operations on the wafer 15. Through the brush cleaning mechanism 3 and the multiple cleaning nozzle mechanisms 2, multi-dimensional cleaning of the edges and surfaces of the wafer 15 after chamfering can be achieved. At the same time, the added wafer lifting mechanism 4 can perform secondary cleaning on the area adsorbed by the vacuum adsorption assembly after the initial cleaning by lifting the wafer 15, avoiding cleaning blind spots. At the same time, through the dual action of spin drying and blowing, the problem of cleaning fluid residue after cleaning on the current equipment can also be solved.

[0032] Specifically, in this embodiment, the drive module 11 adopts a motor plus synchronous belt drive structure, which can realize the rotation operation of the wafer 15 through the drive module 11, thereby satisfying the need for subsequent all-round cleaning operation of the wafer 15 by other cleaning mechanisms after the wafer is dewatered. Other similar structures such as DD motor direct drive and sprocket drive structures are also within the scope of protection.

[0033] In this embodiment, refer to Figure 2As shown, the vacuum adsorption assembly includes a vacuum suction cup 14 and a vacuum module 12 connected to the vacuum suction cup 14. The adsorption end of the vacuum suction cup 14 is positioned upwards and located at the center of the cleaning tank 5. The vacuum module 12 is also provided with a fixing plate 13 for fixing it to the cleaning tank 5. The output end of the drive module 11 is connected to the vacuum module 12. The vacuum module 12 mainly provides vacuum pressure for adsorbing the wafer. After the wafer 15 is placed on the vacuum suction cup 14, it can realize the adsorption and fixing operation of the wafer 15 to meet the subsequent cleaning operations such as rotation and water spin-off.

[0034] Among them, the vacuum module 12 is a technology that has been realized and is known to the public. It mainly includes a vacuum pump, solenoid valve, pipeline, etc. The specific way to achieve vacuum adsorption will not be described in detail here. The same applies to the subsequent vacuum modules.

[0035] In this embodiment, the cleaning nozzle mechanism 2 includes a fixed base 21 mounted on the cleaning tank 5. An upper air-blowing connector 24 and an upper water-spraying connector 25 are respectively provided on both sides of the upper end of the fixed base 21. A lower air-blowing connector 22 and a lower water-spraying connector 23 are respectively provided on both sides of the lower end of the fixed base 21. The upper air-blowing connector 24 and the lower air-blowing connector 22 are connected to an external air supply module, and the upper water-spraying connector 25 and the lower water-spraying connector 23 are connected to an external water supply module (not shown in the figure). The head 25 is detachably equipped with an air jet pipe and a water spray pipe facing the upper wall of the wafer 15; the lower air blowing connector 22 and the lower water spray connector 23 are detachably equipped with an air jet pipe and a water spray pipe facing the lower wall of the wafer 15. When the wafer is cleaned, the upper water spray connector 25 and the lower water spray connector 23 first start spraying water. During the rotation of the wafer 15, the upper and lower walls of the wafer 15 are cleaned. After the cleaning is completed, the upper air blowing connector 24 and the lower air blowing connector 22 start blowing air to dry the wafer surface.

[0036] The gas supply module may include an air pump, pipelines, etc., and the water supply module may include a water tank, water pump, pipelines, etc., which will not be described in detail here.

[0037] Specifically, the orientation and position of the multiple cleaning nozzle mechanisms 2 can be adjusted according to the size of the wafer 15, but it must be able to clean the wafer 15 from all directions to avoid cleaning blind spots. This will not be elaborated on here.

[0038] In other embodiments, the cleaning nozzle mechanism 2 can also be designed to be movable, that is, a structure such as an electric guide rail or an electric push rod can be designed at the bottom of the cleaning nozzle mechanism 2 to drive the cleaning nozzle mechanism 2 to move back and forth, which can be compatible with the cleaning of wafers 15 of different sizes and shapes, and at the same time has a better cleaning effect on cleaning blind areas.

[0039] In this embodiment, the brush assembly includes a detachable upper brush 33, an edge brush 34, and a lower brush 35. The length of the lower brush 35 is shorter than the length of the upper brush 33. The upper brush 33, the edge brush 34, and the lower brush 35 together form a U-shaped brushing space. The top of the upper brush 33 is connected to the output end of the swing cylinder 31 via a connecting rod 32. When cleaning the wafer 15, the swing cylinder 31 is activated, and the upper and lower brushes clean the residual dirt on the upper and lower surfaces of the wafer respectively. The edge brush 34 cleans the edge residue when the chamfer is removed, thus enabling a full-range brushing operation on the wafer.

[0040] In other embodiments, a pressure sensing device can be added to the brush assembly (e.g., on the brush holder, but not limited thereto), which can collect the pressure during brushing in real time, and then adjust the oscillation amplitude of the brush assembly according to the pressure, which can reduce the probability of the brush damaging the surface of wafer 15 during cleaning.

[0041] In this embodiment, the wafer lifting mechanism 4 includes a lifting cylinder 42, a second swing cylinder 41, and a second vacuum chuck 43. The second swing cylinder 41 is installed on the lifting end of the lifting cylinder 42, and the swing end of the second swing cylinder 41 is connected to the second vacuum chuck 43 through a connecting arm. The second vacuum chuck 43 is connected to an external vacuum module. After the initial cleaning is completed, the lifting cylinder 42 descends, causing the second vacuum chuck 43 to contact the wafer 15. At this time, the vacuum chuck 14 stops working (i.e., it is not in a negative pressure state), and the second vacuum chuck 43 works (in a negative pressure state) to adsorb the wafer 15. It can be lifted to the cleaning position by the second swing cylinder 41 for secondary cleaning. After cleaning, it is transferred to the subsequent position by the wafer lifting mechanism 4.

[0042] In other embodiments, a CCD camera (not shown) can also be integrated on the wafer lifting mechanism 4. The CCD camera can be located at the end of the connecting arm, which is not limited here. After cleaning is completed, the cleaning effect can be detected immediately. If the cleaning effect is poor, the cleaning time can be extended or a second cleaning can be performed to prevent it from affecting subsequent processes.

[0043] Furthermore, the brush cleaning mechanism 3, the cleaning nozzle mechanism 2, and the cleaning tank 5 are all located in the running trajectory of the wafer lifting mechanism 4. Since the wafer 15 is adsorbed on the vacuum suction cup 14, the contact area between the wafer 15 and the vacuum suction cup 14 cannot be cleaned properly. At this time, the wafer 15 can be adsorbed by the second vacuum suction cup 43 and transferred to the cleaning mechanism position to perform secondary cleaning on the cleaning blind area. At the same time, the wafer lifting assembly 4 can also be used as a wafer 15 transfer device after cleaning, placing the wafer 15 on subsequent transfer equipment (such as a transfer arm) and moving it away.

[0044] It should be noted that the various mechanisms mentioned above can be synchronously controlled via an external PLC terminal (not shown in the figure) to achieve fully automated wafer cleaning and handling operations.

[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cleaning mechanism in a wafer chamfering device, characterized in that, include: A cleaning tank, wherein the cleaning tank is disposed on a wafer chamfering device; A wafer adsorption and rotation mechanism is disposed on the cleaning tank. The wafer adsorption and rotation mechanism includes a vacuum adsorption component for adsorbing wafers and a drive module for driving the wafers to rotate. A cleaning nozzle mechanism is disposed on the cleaning tank and is configured to spray water for cleaning and air for drying towards the upper and lower walls of the wafer, respectively. A brush cleaning mechanism is provided on the cleaning tank. The brush cleaning mechanism includes a brush assembly that can fit against the upper and lower walls and outer edge of the wafer, and a swing cylinder that can drive the brush assembly to swing back and forth. A wafer lifting mechanism is disposed on the cleaning tank and is used to remove the wafer from the wafer adsorption and rotation mechanism. When the wafer adsorption and rotation mechanism drives the wafer to rotate, the cleaning nozzle mechanism and the brush cleaning mechanism perform an all-round cleaning operation on the wafer.

2. The cleaning mechanism on the wafer chamfering equipment as described in claim 1, characterized in that: The vacuum adsorption assembly includes a vacuum suction cup and a vacuum module connected to the vacuum suction cup. The adsorption end of the vacuum suction cup is positioned upwards and located at the center of the cleaning tank. The vacuum module is also provided with a fixing plate for fixing it to the cleaning tank. The output end of the drive module is connected to the vacuum module.

3. The cleaning mechanism on the wafer chamfering equipment as described in claim 1, characterized in that: The cleaning nozzle mechanism includes a fixed base mounted on the cleaning tank. An upper air-blowing connector and an upper water-spraying connector are respectively provided on both sides of the upper end of the fixed base, and a lower air-blowing connector and a lower water-spraying connector are respectively provided on both sides of the lower end of the fixed base.

4. The cleaning mechanism on the wafer chamfering equipment as described in claim 3, characterized in that: The upper air-blowing connector and the lower air-blowing connector are connected to an external air supply module, and the upper water-spraying connector and the lower water-spraying connector are connected to an external water supply module. The upper air-blowing connector and the upper water-spraying connector are respectively detachably equipped with an air jet pipe and a water spray pipe facing the upper wall of the wafer; the lower air-blowing connector and the lower water-spraying connector are respectively detachably equipped with an air jet pipe and a water spray pipe facing the lower wall of the wafer.

5. The cleaning mechanism on the wafer chamfering equipment as described in claim 1, characterized in that: The brush assembly includes a detachable upper brush, an edge brush, and a lower brush, which together form a U-shaped brushing space.

6. The cleaning mechanism on the wafer chamfering equipment as described in claim 5, characterized in that: The top of the upper brush is connected to the output end of the swing cylinder via a connecting rod, and the length of the lower brush is less than the length of the upper brush.

7. The cleaning mechanism on the wafer chamfering equipment as described in claim 1, characterized in that: The wafer lifting mechanism includes a lifting cylinder, a second swing cylinder, and a second vacuum chuck. The second swing cylinder is installed at the lifting end of the lifting cylinder, and the swing end of the second swing cylinder is connected to the second vacuum chuck via a connecting arm.

8. The cleaning mechanism in the wafer chamfering equipment as described in claim 7, characterized in that: The brush cleaning mechanism, the cleaning nozzle mechanism, and the cleaning tank are all located within the operating trajectory of the wafer lifting mechanism.

9. The cleaning mechanism in the wafer chamfering equipment as described in claim 1, characterized in that: The cleaning nozzle mechanism comprises multiple nozzles, which are spaced apart on the cleaning tank.

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