Tray for bearing wafer

Abstract

The utility model provides a tray for bearing wafers, and relates to the technical field of semiconductor manufacturing. Which comprises a tray for bearing a wafer, and is characterized by comprising a bearing seat which is provided with a bearing part for supporting the wafer; the protective cover is buckled on the bearing seat, and an accommodating space for accommodating the edge of the wafer is formed between the protective cover and the bearing part; and when plasma is adopted to clean the surface of the wafer, the protective cover is used for shielding the edge of the wafer. According to the tray for bearing the wafer, the protection film can be prevented from being damaged in the plasma cleaning process, so that back surface plating is avoided, the yield and reliability of the single-surface chemical plating wafer are remarkably improved, and the back surface plating defect caused by falling of the protection film is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more particularly to trays for carrying wafers. Background Technology

[0002] In semiconductor manufacturing, single-sided electroless plating is a common technique used to form a conductive or protective film on one side of a wafer, while the other side needs to remain unplated. To achieve this, a protective film is typically applied to the back of the wafer to prevent metal from being deposited on it during the electroless plating process. Before electroless plating, the wafer surface needs to undergo plasma cleaning to remove dirt and impurities, improve surface activity, and thus ensure the uniformity and adhesion of the electroless plating layer.

[0003] However, during plasma cleaning of the wafer surface, the protective film is exposed to the plasma environment. Since the protective film is usually made of organic materials, the high-energy particles of the plasma attack the protective film, causing its adhesion to the back of the wafer to decrease. In subsequent electroless plating processes, the protective film is prone to peeling off, resulting in a metal layer being deposited on the back of the wafer, affecting product yield and reliability. Utility Model Content

[0004] This application mainly provides a tray for carrying wafers to solve the problem of the protective film on the back of the wafer easily falling off.

[0005] The technical solution adopted by this application to solve the above-mentioned technical problems is as follows:

[0006] This application provides a tray for carrying wafers, comprising: a support base having a support portion for supporting the wafer; a protective cover fastened to the support base, wherein an accommodating space for accommodating the edge of the wafer is formed between the protective cover and the support portion; and the protective cover for shielding the edge of the wafer when plasma cleaning is used on the wafer surface.

[0007] Optionally, the support includes: a base; an outer ring baffle disposed on the base, the inner diameter of the outer ring baffle being larger than the diameter of the wafer; and an inner support ring, which is the support portion, disposed on the base, the inner support ring being concentrically arranged with the outer ring baffle, and the inner diameter of the inner support ring being smaller than the diameter of the wafer, and the outer diameter of the inner support ring being less than or equal to the inner diameter of the outer ring baffle.

[0008] Optionally, the outer ring baffle is provided with a plurality of tablet taking slots, the tablet taking slots passing through the inner sidewall and the outer sidewall of the outer ring baffle, and the bottom wall of the tablet taking slot is located between the top surface of the inner bearing ring and the base, and the height of the inner bearing ring is greater than 10mm.

[0009] Optionally, the height of the outer ring baffle is more than 5mm higher than the height of the inner bearing ring, and / or the thickness of the base is greater than 5mm.

[0010] Optionally, the inner diameter of the outer ring baffle is 2mm to 4mm larger than the diameter of the wafer.

[0011] Optionally, the inner diameter of the inner bearing ring is 4mm to 8mm smaller than the diameter of the wafer.

[0012] Optionally, the protective cover includes: an outer support ring for covering the outer ring baffle and fixing the inner protective ring; an inner protective ring concentrically arranged with the outer support ring, and the outer side wall of the inner protective ring is fixedly connected to the inner side wall of the outer support ring, wherein the inner diameter of the inner protective ring is smaller than the diameter of the wafer, and is used to shield the edge of the wafer.

[0013] Optionally, the protective cover also includes multiple locking protrusions, which are embedded in the outer support ring and correspond one-to-one with the take-up slots. The locking protrusions cooperate with the take-up slots to position the outer support ring, and the height of the locking protrusions is the same as the height of the outer ring baffle.

[0014] Optionally, the inner diameter of the inner protective ring is 4mm to 6mm smaller than the diameter of the wafer.

[0015] Optionally, the distance between the side of the inner protective ring facing the wafer and the surface of the wafer is 1mm to 2mm.

[0016] The beneficial effects of the tray for carrying wafers provided in this application are as follows: by placing the wafer on the carrier and fastening the protective cover on the carrier to shield the wafer edge, the bombardment of the wafer edge by plasma is reduced, thereby preventing the protective film from being attacked by high-energy particles, so that the adhesion of the protective film can be maintained, reducing the risk of the protective film falling off during subsequent electroplating. By protecting the protective film on the back of the wafer, the protective film is prevented from being damaged during plasma cleaning, thereby avoiding back-side plating. This significantly improves the yield and reliability of single-sided electroplated wafers and reduces back-side plating defects caused by the falling off of the protective film. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1This is a cross-sectional view of the tray used to carry the wafer and its mating with the wafer, according to an embodiment of this application.

[0019] Figure 2 This is a schematic diagram of the structure of the bearing seat in the embodiments of this application;

[0020] Figure 3 This is a schematic diagram of the protective cover in an embodiment of this application.

[0021] Icons: 10-Bearing seat; 11-Base; 12-Outer ring baffle; 12a-Wafer pick-up slot; 13-Inner bearing ring; 20-Protective cover; 21-Outer support ring; 22-Inner protective ring; 23-Card protrusion; 30-Wafer; 31-Protective film.

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in this application embodiment are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0025] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0026] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0027] During plasma cleaning of the wafer surface, the protective film is exposed to the plasma environment. Since the protective film is typically made of organic materials, the high-energy particles of the plasma attack it, reducing its adhesion to the back of the wafer. In subsequent electroless plating processes, the protective film is prone to detachment, resulting in a metal layer being deposited on the back of the wafer, affecting product yield and reliability. To address these issues, embodiments of this application refer to... Figures 1 to 3 The following technical solutions are provided to overcome the above problems.

[0028] This application provides a tray for carrying wafers, including: a support base 10 having a support portion for supporting wafers 30; a protective cover 20 fastened to the support base 10, wherein the protective cover 20 and the support portion form an accommodating space for accommodating the edge of the wafer 30; when plasma cleaning is used on the surface of the wafer 30, the protective cover 20 is used to cover the edge of the wafer 30.

[0029] Specifically, the support 10 is the main body of the tray, having a support section for supporting the wafer 30. The design of the support section ensures that the wafer 30 can be placed stably on it, while providing the necessary support for the wafer 30. The protective cover 20 is fastened to the support 10, forming an accommodating space between itself and the support section to accommodate the edge portion of the wafer 30. During the plasma cleaning process, the wafer 30 is placed on the support section of the support 10, and then the protective cover 20 is fastened to the support 10. The protective cover 20, through its design structure, shields the edge of the wafer 30, thereby isolating the edge of the wafer 30 from the plasma environment.

[0030] The wafer-carrying tray provided in the embodiments of this application, by placing the wafer 30 on the carrier 10 and fastening the protective cover 20 on the carrier to shield the edge of the wafer 30, reduces the bombardment of the edge of the wafer 30 by plasma, thereby preventing the protective film 31 from being attacked by high-energy particles, so that the adhesion of the protective film 31 can be maintained, reducing the risk of the protective film 31 falling off during subsequent electroplating. By protecting the protective film 31 on the back side of the wafer 30, preventing it from being damaged during plasma cleaning, back-side plating is avoided, significantly improving the yield and reliability of single-sided electroplated wafers 30, and reducing back-side plating defects caused by the falling off of the protective film 31.

[0031] Optionally, the support 10 includes: a base 11; an outer ring baffle 12 disposed on the base 11, the inner diameter of the outer ring baffle 12 being larger than the diameter of the wafer 30; and an inner support ring 13, which is the support portion, disposed on the base 11, the inner support ring 13 being concentrically disposed with the outer ring baffle 12, and the inner diameter of the inner support ring 13 being smaller than the diameter of the wafer 30, and the outer diameter of the inner support ring 13 being less than or equal to the inner diameter of the outer ring baffle 12.

[0032] Specifically, the base 11 serves as the foundation of the support 10, supporting the entire structure. An outer ring baffle 12 is mounted on the base 11, forming a ring structure with an inner diameter larger than the diameter of the wafer 30. This restricts the lateral movement of the wafer 30 and provides support for the protective cover 20, preventing the wafer 30 from introducing new impurities due to shaking or displacement during cleaning. The inner support ring 13, acting as the direct support for the wafer 30, is mounted on the base 11 and concentric with the outer ring baffle 12. The inner diameter of the inner support ring 13 is smaller than the diameter of the wafer 30, ensuring the wafer 30 can be stably placed on it, maintaining stability during plasma cleaning and improving cleaning efficiency. The outer diameter of the inner support ring 13 is less than or equal to the inner diameter of the outer ring baffle 12, ensuring the inner support ring 13 can be positioned within the outer ring baffle 12. In use, the wafer 30 is placed on the inner support ring 13, while the outer ring baffle 12 provides positioning and protection, and also provides installation space for the protective cover 20.

[0033] Optionally, the outer ring baffle 12 is provided with a plurality of tablet taking slots 12a, the tablet taking slots 12a passing through the inner sidewall and the outer sidewall of the outer ring baffle 12, and the bottom wall of the tablet taking slot 12a is located between the top surface of the inner bearing ring 13 and the base 11, and the height of the inner bearing ring 13 is greater than 10mm.

[0034] Specifically, the wafer pick-up slot 12a penetrates the inner and outer walls of the outer ring baffle 12, forming a channel extending from the inside of the outer ring baffle 12 to the outside. The bottom wall of the wafer pick-up slot 12a is located between the top surface of the inner support ring 13 and the base 11, ensuring that the depth of the wafer pick-up slot 12a is sufficient to facilitate the operation of personnel or robotic arms in picking up and placing wafers 30 from the side. The height of the inner support ring 13 is greater than 10mm, providing sufficient space for the design of the wafer pick-up slot 12a to facilitate the operation of personnel or robotic arms in picking up and placing wafers 30. When placing or removing wafers 30, the operation of personnel or robotic arms can contact wafers 30 from the side through the wafer pick-up slot 12a, avoiding direct contact with the surface of wafers 30 from above, thereby reducing damage to the surface of wafers 30. Wafers 30 are placed on or removed from the inner support ring 13 through the wafer pick-up slot 12a.

[0035] By adopting the above-described configuration, wafers 30 are picked up and placed from the wafer pick-up slot 12a, avoiding direct gripping of the wafers 30 from above, thus reducing scratches and mechanical damage to the surface of the wafers 30. This significantly improves the surface quality of the wafers 30, reduces defects caused by operation, and increases product yield. The design of the wafer pick-up slot 12a allows operators or robotic arms to conveniently pick up and place wafers 30 from the side, reducing operational difficulty.

[0036] Optionally, the height of the outer ring baffle 12 is more than 5mm higher than the height of the inner bearing ring 13, and / or the thickness of the base 11 is greater than 5mm.

[0037] Specifically, the outer ring baffle 12 is at least 5mm higher than the inner support ring 13, providing sufficient installation space for the protective cover 20. This height difference ensures that the protective cover 20 completely covers the edge of the wafer 30 when snapped shut. This height difference prevents direct contact between the protective cover 20 and the edge of the wafer 30, and ensures a tight fit with the outer ring baffle 12, preventing plasma from entering the accommodating space from the side. The base 11 is thicker than 5mm, providing sufficient structural strength for the entire tray and a stable support platform for the installation of the protective cover 20.

[0038] Understandably, the height margin of the outer ring baffle 12 ensures that the protective cover 20 can completely cover the edge of the wafer 30 without directly contacting it. This not only protects the wafer 30 but also reduces the possibility of plasma entering the accommodating space from the side. This further improves the protection effect on the edge of the wafer 30, reduces the bombardment of the wafer 30 edge by plasma, and thus better protects the protective film 31 on the back side.

[0039] Optionally, the inner diameter of the outer ring baffle 12 is 2mm to 4mm larger than the diameter of the wafer 30.

[0040] Specifically, wafer 30 may undergo slight deformation during the manufacturing process, such as bending or dimensional changes. By designing the inner diameter of the outer ring baffle 12 to be 2mm to 4mm larger than the diameter of wafer 30, even if wafer 30 undergoes slight deformation, it can be ensured that wafer 30 can be smoothly placed in the tray without getting stuck or unable to be placed due to size mismatch. This design provides sufficient tolerance for wafer 30 placement, ensuring that wafer 30 can still be placed normally on the tray even if slight deformation occurs during the manufacturing process. The 2mm to 4mm gap design strikes a balance between accommodating slight deformation of wafer 30 and reducing movement space. If the gap is too large, wafer 30 may wobble in the tray; if the gap is too small, it may not be able to accommodate slightly deformed wafer 30. This design ensures that wafer 30 can be smoothly placed in the tray while minimizing the movement space of wafer 30, thereby reducing the risk of damage.

[0041] Optionally, the inner diameter of the inner bearing ring 13 is 4mm to 8mm smaller than the diameter of the wafer 30.

[0042] Specifically, the inner diameter of the inner support ring 13 is 4mm to 8mm smaller than the diameter of the wafer 30. This dimensional difference ensures that the wafer 30 can be stably placed on the inner support ring 13. This ensures that the center of gravity of the wafer 30 falls within the support area of ​​the inner support ring 13 when placed in the tray. This design prevents the wafer 30 from wobbling or shifting due to insufficient support area. The wafer 30 remains stable in the tray, reducing the risk of damage caused by wobbling or shifting and improving the reliability of the plasma cleaning process.

[0043] Optionally, the protective cover 20 includes: an outer support ring 21 for covering the outer ring baffle 12 and fixing the inner protective ring 22; an inner protective ring 22 concentrically arranged with the outer support ring 21, and the outer side wall of the inner protective ring 22 is fixedly connected to the inner side wall of the outer support ring 21, the inner diameter of the inner protective ring 22 being smaller than the diameter of the wafer 30, for shielding the edge of the wafer 30.

[0044] Specifically, the outer support ring 21 covers the outer ring baffle 12, serving to support and fix the inner protective ring 22. Through its cooperation with the outer ring baffle 12, it provides structural stability for the entire protective cover 20. The inner protective ring 22 is concentrically arranged with the outer support ring 21, and its outer sidewall is fixedly connected to the inner sidewall of the outer support ring 21. The inner diameter of the inner protective ring 22 is smaller than the diameter of the wafer 30, ensuring that it can cover and shield the edge portion of the wafer 30. When the protective cover 20 is fastened onto the carrier 10, the outer support ring 21 cooperates with the outer ring baffle 12, and the inner protective ring 22 can shield the edge of the wafer 30, isolating the edge of the wafer 30 from the plasma environment.

[0045] Understandably, the inner protective ring 22 and the outer support ring 21 are concentrically positioned to ensure that the protective cover 20 can evenly cover the edge of the wafer 30 when it is fastened. The outer support ring 21 provides structural strength, while the inner protective ring 22 provides shielding. The inner diameter of the inner protective ring 22 is smaller than the diameter of the wafer 30, ensuring that it can completely cover the edge of the wafer 30. Through this dual-layer structure design, the protective cover 20 provides sufficient mechanical strength while effectively shielding the edge of the wafer 30, reducing plasma bombardment of the wafer 30's edge. This protects the protective film 31 on the back of the wafer 30, preventing plating problems on the back side due to the protective film 31 peeling off.

[0046] Optionally, the protective cover 20 further includes a plurality of latching protrusions 23, which are embedded in the outer support ring 21 and are correspondingly arranged with the take-up slot 12a. The latching protrusions 23 cooperate with the take-up slot 12a to position the outer support ring 21. The height of the latching protrusions 23 is the same as the height of the outer ring baffle 12.

[0047] Specifically, the locking protrusions 23 are embedded in the outer support ring 21, and their number matches that of the wafer pick-up slots 12a. The height of the locking protrusions 23 matches the height of the outer ring baffle 12, ensuring that the locking protrusions 23 can fit tightly with the wafer pick-up slots 12a. When installing the protective cover 20, the locking protrusions 23 are aligned with and embedded in the wafer pick-up slots 12a, achieving precise positioning of the outer support ring 21 through this fit. The fit between the locking protrusions 23 and the wafer pick-up slots 12a not only serves a positioning function but also prevents the protective cover 20 from shifting or loosening during plasma cleaning.

[0048] Optionally, the inner diameter of the inner protective ring 22 is 4mm to 6mm smaller than the diameter of the wafer 30.

[0049] Specifically, the inner diameter of the inner protective ring 22 is 4mm to 6mm smaller than the diameter of the wafer 30. This dimensional difference ensures that the inner protective ring 22 can completely cover the edge of the wafer 30, isolating the edge of the wafer 30 from the plasma environment. Through this design, the inner protective ring 22 can effectively shield the edge of the wafer 30, reducing the bombardment of the wafer 30 edge by the plasma, thereby protecting the protective film 31 on the back of the wafer 30.

[0050] Optionally, the distance between the side of the inner protective ring 22 facing the wafer 30 and the surface of the wafer 30 is 1mm to 2mm.

[0051] Specifically, the gap between the inner protective ring 22 facing the wafer 30 and the surface of the wafer 30 is 1mm to 2mm. This gap is small enough to effectively block the direct bombardment of the plasma on the edge of the wafer 30. Through this design, the protective cover 20 can minimize the bombardment of the wafer 30 edge by the plasma, thereby protecting the protective film 31 on the back of the wafer 30. The 1mm to 2mm gap ensures that the inner protective ring 22 does not directly contact the surface of the wafer 30, avoiding mechanical damage or contamination caused by contact. This design reduces scratches or other damage that may be introduced into the surface of the wafer 30 during plasma cleaning due to contact with the protective cover 20, improving the surface quality of the wafer 30.

[0052] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A tray for carrying wafers, characterized in that, include: A support base, having a support section, is used to support the wafer; A protective cover is fastened to the carrier, and an accommodating space for accommodating the edge of the wafer is formed between the protective cover and the carrier. When plasma cleaning is used to clean the wafer surface, the protective cover is used to shield the edges of the wafer.

2. The wafer-carrying tray according to claim 1, characterized in that, The support includes: Base; An outer ring baffle is disposed on the base, wherein the inner diameter of the outer ring baffle is larger than the diameter of the wafer; The inner bearing ring is the bearing part, which is disposed on the base. The inner bearing ring is concentrically disposed with the outer ring baffle, and the inner diameter of the inner bearing ring is smaller than the diameter of the wafer, and the outer diameter of the inner bearing ring is smaller than or equal to the inner diameter of the outer ring baffle.

3. The wafer-carrying tray according to claim 2, characterized in that, The outer ring baffle is provided with multiple tablet taking slots, which pass through the inner and outer sidewalls of the outer ring baffle. The bottom wall of the tablet taking slot is located between the top surface of the inner bearing ring and the base. The height of the inner bearing ring is greater than 10mm.

4. The wafer-carrying tray according to claim 2, characterized in that, The height of the outer ring baffle is more than 5mm higher than the height of the inner bearing ring, and / or the thickness of the base is greater than 5mm.

5. The wafer-carrying tray according to claim 2, characterized in that, The inner diameter of the outer ring baffle is 2mm to 4mm larger than the diameter of the wafer.

6. The wafer-carrying tray according to claim 2, characterized in that, The inner diameter of the inner bearing ring is 4mm to 8mm smaller than the diameter of the wafer.

7. The wafer-carrying tray according to claim 3, characterized in that, The protective cover includes: An outer support ring is used to cover the outer ring baffle. An inner protective ring is concentrically arranged with the outer support ring. The outer support ring fixes the inner protective ring, and the outer sidewall of the inner protective ring is fixedly connected to the inner sidewall of the outer support ring. The inner diameter of the inner protective ring is smaller than the diameter of the wafer, and it is used to shield the edge of the wafer.

8. The wafer-carrying tray according to claim 7, characterized in that, The protective cover also includes multiple locking protrusions, which are embedded in the outer support ring and correspond one-to-one with the take-up slots. The locking protrusions cooperate with the take-up slots to position the outer support ring, and the height of the locking protrusions is the same as the height of the outer ring baffle.

9. The wafer-carrying tray according to claim 7, characterized in that, The inner diameter of the inner protective ring is 4mm to 6mm smaller than the diameter of the wafer.

10. The wafer-carrying tray according to claim 7, characterized in that, The distance between the side of the inner protective ring facing the wafer and the surface of the wafer is 1mm to 2mm.

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