Vacuum adsorption device for semiconductor production

Abstract

The utility model discloses a vacuum adsorption device for semiconductor production, and belongs to the field of semiconductor production equipment. According to the technical scheme, the vacuum adsorption device for semiconductor production comprises a suction cup connecting assembly and a negative pressure equipment connecting assembly which are designed in a split mode, and the negative pressure equipment connecting assembly and the negative pressure equipment connecting assembly are internally provided with coaxially-arranged air guide channels. The negative pressure equipment connecting assemblies are connected to the interiors of the negative pressure equipment connecting assemblies in a sliding mode, and elastic pieces are fixedly connected between the negative pressure equipment connecting assemblies; according to the utility model, the buffering effect is provided through the elastic piece, and the flexibility is increased through sliding connection, so that the risk of mechanical damage to semiconductor materials is effectively reduced, meanwhile, the adsorption stability and the device adaptability are improved, and the requirements on lossless carrying and positioning of precision elements in semiconductor production can be better met.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor production equipment, and specifically relates to a vacuum adsorption device for semiconductor production. Background Technology

[0002] In semiconductor manufacturing, the core function of vacuum adsorption equipment is to achieve non-destructive handling and positioning of precision components such as wafers and chips through negative pressure adsorption. Due to the extremely brittle nature of semiconductor materials and their stringent requirements for surface integrity, any improper mechanical contact or pressure can damage the materials, leading to a decrease in product yield. Therefore, the design of vacuum adsorption equipment not only needs to ensure stable adsorption force but also requires good buffering and pressure regulation functions to avoid causing excessive mechanical stress to the semiconductor materials during adsorption.

[0003] In traditional integrated vacuum adsorption devices, the suction cup directly transmits mechanical pressure when it comes into contact with the semiconductor material during adsorption, lacking an effective buffering mechanism. This design can easily lead to excessive contact pressure between the adsorption end and the semiconductor material, especially when the adsorption end is pressed down, which may cause scratches or microcracks on the semiconductor surface, affecting product quality and performance. Furthermore, the rigid connection between the negative pressure equipment connecting component and the suction cup connecting component in traditional devices also limits the flexibility and adaptability of the device, making it unable to effectively handle semiconductor materials of different thicknesses or surface properties.

[0004] To address the aforementioned issues, some improved vacuum adsorption devices have incorporated elastic elements and a relative sliding arrangement between the negative pressure device connection assembly and the suction cup connection assembly. These designs are significant in improving device performance.

[0005] First, the introduction of the elastic element provides effective cushioning. When the adsorption end contacts and presses down on the semiconductor material, the elastic element provides a flexible buffering force, effectively absorbing and dispersing mechanical pressure, preventing excessive pressure from being directly transmitted to the semiconductor material surface. This design significantly reduces the risk of mechanical damage to the semiconductor material during adsorption, making it particularly suitable for wafers and chips with extremely high surface integrity requirements.

[0006] Secondly, the relative sliding arrangement between the negative pressure device connection assembly and the suction cup connection assembly increases the flexibility of the device. This sliding connection design not only improves the adaptability of the device but also allows for automatic adjustment of the position and pressure of the adsorption end according to the thickness and surface characteristics of the semiconductor material. For example, when adsorbing wafers of different thicknesses, the sliding connection design ensures that the adsorption end is always in contact with the material surface at an appropriate pressure, without causing damage due to excessive pressure.

[0007] Furthermore, through the synergistic effect of the elastic element and the sliding connection, the improved vacuum adsorption device can achieve uniform pressure distribution and dynamic adjustment during the adsorption process. When the adsorption end comes into contact with the semiconductor material, the compression of the elastic element and the relative movement of the sliding connection work together to ensure that the adsorption force is always within a safe range, avoiding excessive local pressure. This design not only protects the semiconductor material but also improves the stability and reliability of the adsorption process.

[0008] However, while these improved designs have addressed some of the problems of traditional vacuum adsorption devices, they still have limitations. For example, the selection and installation location of the elastic element have a significant impact on the device's performance; different semiconductor materials may require different elastic coefficients, which increases the complexity and difficulty of use. Furthermore, sliding connection designs may introduce new problems, such as decreased sealing performance and accelerated component wear, all of which require trade-offs and optimization in practical applications. Utility Model Content

[0009] This invention provides a vacuum adsorption device for semiconductor production to solve at least one of the aforementioned technical problems.

[0010] The technical solution adopted in this utility model is as follows:

[0011] A vacuum adsorption device for semiconductor production includes a separate suction cup connecting assembly and a negative pressure device connecting assembly. The suction cup connecting assembly and the negative pressure device connecting assembly have coaxially arranged air guiding channels inside. The negative pressure device connecting assembly is slidably connected inside the suction cup connecting assembly. An elastic element is fixedly connected between the suction cup connecting assembly and the negative pressure device connecting assembly.

[0012] Furthermore, this application also proposes that the suction cup connection assembly includes a split-design connector and an air guide tube, wherein the end of the air guide tube is provided with an internal thread, and the end of the connector is provided with an external thread that mates with the internal thread.

[0013] Furthermore, this application also proposes that the inner cavity of the air guide tube is provided with a sliding groove, the negative pressure connection assembly includes a connecting pipe, the connecting pipe has a sliding part that slides with the sliding groove, and the side wall of the sliding part is provided with a limiting boss that cooperates with the sliding groove.

[0014] Furthermore, this application also proposes that a sealing ring is provided between the connector and the air guide tube, and a tightening boss for fixing the sealing ring is provided at one end of the connector near the air guide tube.

[0015] Furthermore, this application also proposes that the upper end of the air guide tube is provided with a first protrusion, the side wall of the connecting tube is provided with a second protrusion, and the elastic element is located between the first protrusion and the second protrusion.

[0016] Furthermore, this application also proposes that the outer wall of the connecting pipe and the inner wall of the air guide pipe have an overlapping area, and the outer wall of the connecting pipe located in the overlapping area is provided with a plurality of first sealing rubber rings.

[0017] Furthermore, this application also proposes that the upper end of the connecting pipe is provided with a connecting port, and a second sealing rubber ring is provided inside the connecting port.

[0018] Furthermore, this application also proposes that the end of the connector away from the air duct is provided with a suction cup connector, and the outer wall of the suction cup connector is provided with several anti-detachment flanges.

[0019] Furthermore, this application also proposes that the elastic element is a compression spring.

[0020] Due to the adoption of the above technical solution, the beneficial effects achieved by this utility model are as follows:

[0021] 1. Buffering effect of the elastic element: In the technical solution of this invention, the elastic element is fixedly connected between the negative pressure device connecting assembly and the suction cup connecting assembly. When the adsorption end contacts the semiconductor material and is pressed down, the elastic element can provide a flexible buffering force, effectively absorbing and dispersing mechanical pressure, and preventing excessive pressure from being directly transmitted to the surface of the semiconductor material. This design significantly reduces the risk of mechanical damage to the semiconductor material during adsorption, and is particularly suitable for wafers and chips with extremely high requirements for surface integrity.

[0022] The relative sliding connection offers flexibility: the negative pressure device connecting assembly and the suction cup connecting assembly employ a sliding connection design, allowing them to move relative to each other within a certain range. This sliding connection not only improves the flexibility and adaptability of the device but also enables automatic adjustment of the position and pressure of the adsorption end based on the thickness and surface characteristics of the semiconductor material.

[0023] Uniform Pressure Distribution and Stability: Through the synergistic effect of the elastic element and the sliding connection, the vacuum adsorption device of this invention can achieve uniform pressure distribution and dynamic adjustment during the adsorption process. When the adsorption end contacts the semiconductor material, the compression of the elastic element and the relative movement of the sliding connection work together to ensure that the adsorption force is always within a safe range, avoiding excessive local pressure. This design not only protects the semiconductor material but also improves the stability and reliability of the adsorption process.

[0024] 2. The suction cup connection assembly is designed so that the connector and the air duct are connected together by threads. This separate design not only facilitates the disassembly and replacement of the assembly but also increases the flexibility of the device. The internal thread at the end of the air duct mates with the external thread at the end of the connector, ensuring the stability and sealing of the connection and preventing air leakage. Through this design, the suction cup connection assembly can achieve a reliable airtight connection, thereby ensuring the normal operation of the negative pressure adsorption function.

[0025] 3. The air duct is equipped with a sliding groove, and the sliding part of the connecting pipe slides in conjunction with the sliding groove, allowing the connecting pipe to slide relative to the air duct. The limiting boss further ensures that the connecting pipe will not disengage from the sliding groove during sliding, thereby guaranteeing the stability and reliability of the device.

[0026] 4. The sealing ring ensures airtightness between the air guide tube and the connector, preventing air leakage during adsorption and thus improving the working efficiency and reliability of the vacuum adsorption device. The tightening boss is used to fix the sealing ring, ensuring that the sealing ring is not easily displaced or detached during operation, further guaranteeing the sealing effect.

[0027] 5. A buffer system is formed by setting a first protrusion on the gas guide tube and a second protrusion on the side wall of the connecting tube, and placing an elastic element between them. When the adsorption end comes into contact with the semiconductor material, the elastic element can provide a flexible buffering force, effectively absorbing and dispersing mechanical pressure, and preventing excessive pressure from being directly transmitted to the surface of the semiconductor material. This design significantly reduces the risk of mechanical damage to the semiconductor material during adsorption, and is particularly suitable for wafers and chips with extremely high requirements for surface integrity.

[0028] 6. By overlapping the outer wall of the connecting tube with the inner wall of the air guide tube, the connection stability between the two tubes during adsorption is ensured. Specifically, the outer wall of the connecting tube and the inner wall of the air guide tube are in close contact within the overlap area, providing a reliable sealing interface. Several first-stage sealing rubber rings are provided on the outer wall of the connecting tube within the overlap area. These sealing rubber rings further enhance the sealing effect, prevent air leakage, and ensure that the negative pressure equipment can provide stable adsorption force. Furthermore, the sealing rubber rings also reduce friction between the connecting tube and the air guide tube, improving the durability and service life of the device.

[0029] 7. The anti-detachment flange effectively prevents the suction cup from accidentally falling off during use, improving the stability and reliability of the adsorption device. This design allows the suction cup to be more securely attached to the connector, ensuring that it will not loosen or fall off during adsorption. Attached Figure Description

[0030] Figure 1 This is a structural schematic diagram of a specific embodiment of the present utility model;

[0031] Figure 2 This is a front view of a specific embodiment of the present utility model;

[0032] Figure 3 This is a perspective view of a specific embodiment of the present utility model.

[0033] The accompanying drawings, which are provided to further illustrate the present invention and constitute a part of the present invention, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0034] In the attached diagram:

[0035] 1. Connector; 11. Anti-detachment flange; 12. Tightening boss; 13. Sealing ring; 2. Air guide pipe; 21. Sliding groove; 22. First boss; 3. Connecting pipe; 31. Second boss; 32. Connecting port; 33. First sealing rubber ring; 4. Elastic element. Detailed Implementation

[0036] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.

[0037] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0038] Furthermore, it should be understood in the description of this utility model that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "implementation," "example," "aspect," or "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] Those skilled in the art will understand that in semiconductor manufacturing, the core function of a vacuum adsorption device is to achieve non-destructive handling and positioning of precision components such as wafers and chips through negative pressure adsorption. Due to the extremely high brittleness of semiconductor materials and their stringent requirements for surface integrity, any improper mechanical contact or pressure can damage the materials, leading to a decrease in product yield. Therefore, the design of a vacuum adsorption device not only needs to ensure stable adsorption force but also requires good buffering and pressure regulation functions to avoid causing excessive mechanical stress to the semiconductor materials during adsorption.

[0042] In traditional integrated vacuum adsorption devices, the suction cup directly transmits mechanical pressure when it comes into contact with the semiconductor material during adsorption, lacking an effective buffering mechanism. This design can easily lead to excessive contact pressure between the adsorption end and the semiconductor material, especially when the adsorption end is pressed down, which may cause scratches or microcracks on the semiconductor surface, affecting product quality and performance. Furthermore, the rigid connection between the negative pressure equipment connecting component and the suction cup connecting component in traditional devices also limits the flexibility and adaptability of the device, making it unable to effectively handle semiconductor materials of different thicknesses or surface properties.

[0043] Reference Figures 1-3 To address the aforementioned problems, the vacuum adsorption device of this invention particularly emphasizes two key features in its technical solution: the elastic element 4 and the relative sliding arrangement between the negative pressure device connecting assembly and the suction cup connecting assembly. Their importance is reflected in the following aspects:

[0044] The buffering effect of the elastic element 4: In the technical solution of this invention, the elastic element 4 is fixedly connected between the negative pressure device connection assembly and the suction cup connection assembly. When the adsorption end contacts the semiconductor material and is pressed down, the elastic element 4 can provide a flexible buffering force, effectively absorbing and dispersing mechanical pressure, and preventing excessive pressure from being directly transmitted to the surface of the semiconductor material. This design significantly reduces the risk of mechanical damage to the semiconductor material during the adsorption process, and is particularly suitable for wafers and chips with extremely high requirements for surface integrity.

[0045] The relative sliding connection offers flexibility: The negative pressure device connecting assembly and the suction cup connecting assembly employ a sliding connection design, allowing them to move relative to each other within a certain range. This sliding connection not only improves the flexibility and adaptability of the device but also enables automatic adjustment of the position and pressure of the adsorption end based on the thickness and surface characteristics of the semiconductor material. For example, when adsorbing wafers of different thicknesses, the sliding connection design ensures that the adsorption end always maintains appropriate pressure in contact with the material surface, preventing damage due to excessive pressure.

[0046] Uniform Pressure Distribution and Stability: Through the synergistic effect of the elastic element 4 and the sliding connection, the vacuum adsorption device of this invention can achieve uniform pressure distribution and dynamic adjustment during the adsorption process. When the adsorption end contacts the semiconductor material, the compression of the elastic element 4 and the relative movement of the sliding connection work together to ensure that the adsorption force is always within a safe range, avoiding excessive local pressure. This design not only protects the semiconductor material but also improves the stability and reliability of the adsorption process.

[0047] In summary, the relative sliding arrangement between the elastic element 4 and the negative pressure device connecting assembly and the suction cup connecting assembly is the core innovation of this invention. Together, they constitute a highly efficient pressure regulation and buffering system, which can effectively protect semiconductor materials during adsorption, avoid mechanical damage, and improve the adaptability and stability of the device. This design is particularly suitable for semiconductor production environments with extremely high requirements for cleanliness and surface integrity, and has significant practical application value.

[0048] The vacuum adsorption device of this invention employs a split-design suction cup connecting assembly and a negative pressure device connecting assembly. The negative pressure device connecting assembly has a coaxially arranged air guiding channel inside. The negative pressure device connecting assembly is slidably connected within the negative pressure device connecting assembly, and an elastic element 4 is fixedly connected between the two negative pressure device connecting assemblies. This design effectively buffers mechanical pressure during the adsorption process, preventing damage to the semiconductor material.

[0049] In practical implementation, the suction cup connection assembly includes a connector 1 and an air guide tube 2. The end of the air guide tube 2 has an internal thread, and the end of the connector 1 has an external thread that mates with the internal thread. The inner cavity of the air guide tube 2 has a sliding groove 21. The negative pressure connection assembly includes a connecting tube 3, which has a sliding part that slidably mates with the sliding groove 21. The side wall of the sliding part has a limiting boss that mates with the sliding groove 21. A sealing ring 13 is provided between the connector 1 and the air guide tube 2. The end of the connector 1 near the air guide tube 2 has a tightening boss 12 for fixing the sealing ring 13. These designs ensure the sealing performance and connection stability of the device.

[0050] Furthermore, the upper end of the air guide tube 2 is provided with a first protrusion 22, and the side wall of the connecting tube 3 is provided with a second protrusion 31. The elastic element 4 is located between the first protrusion 22 and the second protrusion 31. The outer wall of the connecting tube 3 and the inner wall of the air guide tube 2 have an overlapping area, and the outer wall of the connecting tube 3 located in the overlapping area is provided with several first sealing rubber rings 33. The upper end of the connecting tube 3 is provided with a connection port 32, and a second sealing rubber ring is provided inside the connection port 32. The end of the connector 1 away from the air guide tube 2 is provided with a suction cup connector, and the outer wall of the suction cup connector is provided with several anti-detachment flanges 11. Through the above design, the vacuum adsorption device of the present invention can achieve buffering and pressure regulation during the adsorption process, effectively protect semiconductor materials, avoid mechanical damage, and improve the adaptability and stability of the device.

[0051] Reference Figures 1-3 This application also proposes that the suction cup connection assembly includes a split-design connector 1 and an air guide tube 2, with an internal thread at the end of the air guide tube 2 and an external thread at the end of the connector 1 that mates with the internal thread.

[0052] The suction cup connection assembly is designed so that connector 1 and air guide tube 2 are connected together by threads. This split design not only facilitates the disassembly and replacement of the assembly but also increases the flexibility of the device. The internal thread at the end of air guide tube 2 mates with the external thread at the end of connector 1, ensuring the stability and sealing of the connection and preventing air leakage. Through this design, the suction cup connection assembly can achieve a reliable airtight connection, thereby ensuring the normal operation of the negative pressure adsorption function.

[0053] Specifically, the threaded connection between connector 1 and air guide tube 2 can be achieved through standard thread machining processes. The external thread of connector 1 and the internal thread of air guide tube 2 need to be precision machined to ensure the accuracy of the thread fit and the sealing effect. As a preferred embodiment, connector 1 and air guide tube 2 can be made of corrosion-resistant and wear-resistant metal materials to improve the service life and reliability of the components. In addition, to further enhance the sealing effect, sealant or sealing rings can be added to the threaded connection.

[0054] Through the above design, the suction cup connection assembly of this application not only solves the problem of difficult disassembly and replacement in traditional integrated designs, but also improves the airtightness and stability of the device, avoiding the impact of air leakage on the negative pressure adsorption function. Compared with the prior art, the design of this application is more flexible and adaptable, and can better meet the requirements of vacuum adsorption devices in semiconductor manufacturing processes.

[0055] As a preferred embodiment of this application, refer to Figures 1-3 The inner cavity of the air duct 2 is provided with a sliding groove 21. The negative pressure connection assembly includes a connecting pipe 3. The connecting pipe 3 has a sliding part that slides with the sliding groove 21. The side wall of the sliding part is provided with a limiting boss that cooperates with the sliding groove 21.

[0056] In semiconductor manufacturing, the core function of vacuum adsorption equipment is to achieve non-destructive handling and positioning of precision components such as wafers and chips through negative pressure adsorption. Due to the extremely brittle nature of semiconductor materials and their stringent requirements for surface integrity, any improper mechanical contact or pressure can damage the materials, leading to a decrease in product yield. Therefore, the design of vacuum adsorption equipment not only needs to ensure stable adsorption force but also requires good buffering and pressure regulation functions to avoid causing excessive mechanical stress to the semiconductor materials during adsorption.

[0057] The air duct 2 in this application has a sliding groove 21 inside its cavity. The negative pressure connection assembly includes a connecting pipe 3, which has a sliding part that slides with the sliding groove 21. The side wall of the sliding part has a limiting boss that mates with the sliding groove 21. The sliding groove 21 inside the air duct 2 and the sliding part of the connecting pipe 3 sliding with the sliding groove 21 allow the connecting pipe 3 to slide relative to the sliding groove 21. The limiting boss further ensures that the connecting pipe 3 will not disengage from the sliding groove 21 during sliding, thereby ensuring the stability and reliability of the device.

[0058] Specifically, the design of the sliding groove 21 and the sliding part allows the connecting tube 3 to slide freely within the air guide tube 2, adapting to semiconductor materials of different thicknesses. This design improves the flexibility and adaptability of the device, enabling it to automatically adjust the position and pressure of the adsorption end according to the thickness and surface characteristics of the semiconductor material, ensuring that the adsorption force is always within a safe range and avoiding excessive local pressure.

[0059] By sliding the sliding groove 21 inside the gas guide pipe 2 and the sliding part of the connecting pipe 3, the vacuum adsorption device of this application can achieve uniform pressure distribution and dynamic adjustment during the adsorption process. This design not only protects the semiconductor material but also improves the stability and reliability of the adsorption process, making it particularly suitable for semiconductor production environments with extremely high requirements for cleanliness and surface integrity. Therefore, it effectively solves the problem of mechanical damage to semiconductor materials during the adsorption process in traditional vacuum adsorption devices, improving product quality and performance.

[0060] Furthermore, this application also proposes that a sealing ring 13 is provided between the connector 1 and the air guide tube 2, and a tightening boss 12 for fixing the sealing ring 13 is provided at the end of the connector 1 near the air guide tube 2.

[0061] The technical solution of this application solves the sealing problem at the connection point by setting a sealing ring 13 between the connector 1 and the air guide pipe 2, and providing a tightening boss 12 at the end of the connector 1 near the air guide pipe 2. The sealing ring 13 ensures the airtightness between the air guide pipe 2 and the connector 1, preventing air leakage during the adsorption process, thereby improving the working efficiency and reliability of the vacuum adsorption device. The tightening boss 12 is used to fix the sealing ring 13, ensuring that the sealing ring 13 is not easily displaced or detached during operation, further guaranteeing the sealing effect.

[0062] The sealing ring 13 can be made of high-temperature and corrosion-resistant materials, such as silicone or fluororubber, to adapt to the various complex environments that may be encountered during semiconductor manufacturing. The clamping boss 12 can be designed as an annular protrusion to ensure that the sealing ring 13 fits tightly between the air guide tube 2 and the connector 1. This design can effectively avoid problems such as insufficient adsorption force or unstable negative pressure caused by poor sealing.

[0063] This application solves the problem of air leakage at the connection point in traditional vacuum adsorption devices by setting a sealing ring 13 between the connector 1 and the air guide pipe 2, and providing a tightening boss 12 at the end of the connector 1 near the air guide pipe 2. Compared with the prior art, this design improves the sealing performance and operational stability of the vacuum adsorption device, ensuring the reliability and safety of the adsorption process, and is particularly suitable for semiconductor production environments with high airtightness requirements.

[0064] As another preferred embodiment of this application, refer to Figures 1-3 The upper end of the air duct 2 is provided with a first protrusion 22, the side wall of the connecting pipe 3 is provided with a second protrusion 31, and the elastic element 4 is located between the first protrusion 22 and the second protrusion 31.

[0065] The technical solution of this application forms a buffer system by setting a first protrusion 22 on the gas guide tube 2 and a second protrusion 31 on the side wall of the connecting tube 3, and placing an elastic element 4 between them. When the adsorption end comes into contact with the semiconductor material, the elastic element 4 can provide a flexible buffering force, effectively absorbing and dispersing mechanical pressure, and preventing excessive pressure from being directly transmitted to the surface of the semiconductor material. This design significantly reduces the risk of mechanical damage to the semiconductor material during adsorption, and is particularly suitable for wafers and chips with extremely high requirements for surface integrity.

[0066] Specifically, the design of the first protrusion 22 and the second protrusion 31 enables the elastic element 4 to provide a stable buffering effect between the negative pressure device connecting assembly and the suction cup connecting assembly. The elastic element 4 can be in the form of a compression spring, absorbing mechanical pressure through its elastic deformation, ensuring uniform pressure distribution during adsorption and avoiding excessive local pressure. Therefore, when adsorbing semiconductor materials of different thicknesses, the position and pressure of the adsorption end can be automatically adjusted to ensure that the adsorption force is always within a safe range, improving the adaptability and stability of the device.

[0067] In one preferred embodiment, the elastic element 4 can be selected from compression springs of different specifications to adapt to different usage environments and needs. For example, for thinner semiconductor materials, a softer compression spring can be selected to provide a gentler cushioning force; while for thicker semiconductor materials, a stiffer compression spring can be selected to provide sufficient support force.

[0068] In summary, this application establishes a highly efficient buffer system by setting a first protrusion 22 on the gas guide pipe 2 and a second protrusion 31 on the side wall of the connecting pipe 3, and placing an elastic element 4 between them. This design effectively protects semiconductor materials during adsorption, preventing mechanical damage, while improving the adaptability and stability of the device. Compared with traditional integrated vacuum adsorption devices, the technical solution of this application has significant advantages in buffering and pressure regulation, and is particularly suitable for semiconductor production environments with extremely high requirements for cleanliness and surface integrity.

[0069] As a preferred example of this application, see reference to Figure 1 The outer wall of the connecting pipe 3 and the inner wall of the air guide pipe 2 have an overlapping area, and the outer wall of the connecting pipe 3 located in the overlapping area is provided with a number of first sealing rubber rings 33.

[0070] By overlapping the outer wall of the connecting pipe 3 with the inner wall of the air guide pipe 2, the connection stability between the connecting pipe 3 and the air guide pipe 2 during adsorption is ensured. Specifically, the outer wall of the connecting pipe 3 and the inner wall of the air guide pipe 2 are in close contact within the overlap area, thus providing a reliable sealing interface. Several first sealing rubber rings 33 are provided on the outer wall of the connecting pipe 3 within the overlap area. These sealing rubber rings further enhance the sealing effect, prevent air leakage, and ensure that the negative pressure device can provide stable adsorption force. Furthermore, the sealing rubber rings also reduce friction between the connecting pipe 3 and the air guide pipe 2, improving the durability and service life of the device.

[0071] The sealing rubber ring can be made of various materials, such as silicone and fluororubber. These materials have good elasticity and chemical corrosion resistance, and can maintain a stable sealing effect in various working environments. As a preferred embodiment, the sealing rubber ring can be evenly distributed on the outer wall of the connecting pipe 3 to ensure consistent sealing performance throughout the entire overlap area.

[0072] Therefore, by setting several first sealing rubber rings 33 on the outer wall of the connecting pipe 3, the vacuum adsorption device of this application can provide a more stable and reliable sealing effect during the adsorption process, avoid negative pressure leakage, and improve the stability and reliability of the adsorption process. Compared with the prior art, this design not only improves the sealing performance of the device, but also enhances its durability, making it suitable for various semiconductor production environments.

[0073] Furthermore, this application also proposes that the upper end of the connecting pipe 3 is provided with a connecting port 32, and a second sealing rubber ring is provided inside the connecting port 32.

[0074] The purpose of this technical solution is to provide a connection port 32 at the upper end of the connecting pipe 3, and to install a second sealing rubber ring inside the connection port 32, thereby achieving a better sealing effect. This design effectively prevents air or other impurities from entering the interior of the connecting pipe 3, ensuring the stability of the negative pressure environment and the reliability of vacuum adsorption.

[0075] Specifically, the connection port 32 at the upper end of the connecting pipe 3 is equipped with a second sealing rubber ring, which provides additional sealing protection during the connection process and prevents air leakage. This design not only improves the sealing performance of the entire vacuum adsorption device, but also enhances the durability and stability of the device.

[0076] As a preferred embodiment, the second sealing rubber ring can be made of a highly wear-resistant and highly elastic material to ensure good sealing performance during long-term use. Furthermore, the design of the connection port 32 can be optimized according to specific application requirements; for example, it can be configured as a threaded connection or a snap-fit ​​connection for ease of installation and maintenance.

[0077] Through the above design, the vacuum adsorption device of this application can provide a better sealing effect when the connecting pipe 3 is connected to other components, avoiding air leakage and improving the stability of the negative pressure system and the reliability of the adsorption process. Compared with traditional designs, this technical solution has higher sealing performance and adaptability, and can effectively solve the problem of poor sealing in the prior art.

[0078] As a preferred example of connector 1, refer to Figures 1-3 The end of the connector 1 away from the air duct 2 is provided with a suction cup connector, and the outer wall of the suction cup connector is provided with several anti-detachment flanges 11.

[0079] The end of connector 1 furthest from the air duct 2 is designed with a suction cup connector, and several anti-detachment flanges 11 are provided on the outer wall of the suction cup connector. These anti-detachment flanges 11 can effectively prevent the suction cup from accidentally falling off during use, improving the stability and reliability of the adsorption device. Through this design, the suction cup can be more firmly connected to connector 1, thus ensuring that it will not loosen or fall off during adsorption.

[0080] As a preferred embodiment, the anti-detachment flange 11 can adopt various shapes and structures, such as annular flanges, strip flanges, or other suitable structural forms. Specifically, the number and spacing of the anti-detachment flanges 11 can be adjusted according to actual usage requirements to ensure that the suction cup connector can be firmly fixed to the connector 1. In addition, the material of the anti-detachment flange 11 can be selected to have a certain degree of elasticity and wear resistance to adapt to different working environments and usage requirements.

[0081] Through this design, the vacuum adsorption device of this application can better protect semiconductor materials and avoid mechanical damage during the adsorption process. At the same time, the anti-detachment flange 11 improves the stability and reliability of the device, making the adsorption process safer and more efficient. Compared with traditional integrated designs, this application provides a more flexible and adaptable solution, effectively solving the problem of suction cup detachment that may occur during the use of traditional devices.

[0082] As a preferred example of the elastic element 4, refer to Figures 1-3 Elastic element 4 is a compression spring.

[0083] The elastic element 4 in this application is used as a compression spring, which can provide flexible buffering force, effectively absorb and disperse mechanical pressure, and prevent excessive pressure from being directly transmitted to the surface of the semiconductor material. This design significantly reduces the risk of mechanical damage to the semiconductor material during adsorption, and is particularly suitable for wafers and chips with extremely high requirements for surface integrity.

[0084] The spring form of the elastic element 4 can be achieved through different materials and specifications to meet different pressure requirements and adsorption environments. For example, the spring can be made of high-strength steel or other elastic materials and adjusted and optimized according to specific adsorption force requirements. In this way, the elastic element 4 can maintain stable buffering performance under different working conditions, ensuring that the semiconductor material is not damaged during adsorption.

[0085] The elastic element 4 in this application is designed as a compression spring, which solves the problem of the lack of an effective buffering mechanism in traditional vacuum adsorption devices during the adsorption process. Through the buffering effect of the compression spring, uniform pressure distribution and dynamic adjustment can be achieved during adsorption, avoiding excessive local pressure, protecting the semiconductor material, and improving the stability and reliability of the adsorption process. Furthermore, the use of the compression spring also enhances the adaptability and flexibility of the device, enabling automatic adjustment of the position and pressure of the adsorption end according to the thickness and surface characteristics of the semiconductor material, ensuring that the adsorption force is always within a safe range.

[0086] For any parts not mentioned in this utility model, existing technologies can be used or referenced.

[0087] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0088] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A vacuum adsorption device for semiconductor production, characterized in that, It includes a suction cup connecting assembly and a negative pressure device connecting assembly with separate designs. The suction cup connecting assembly and the negative pressure device connecting assembly have coaxially arranged air guiding channels inside. The negative pressure device connecting assembly is slidably connected inside the suction cup connecting assembly. An elastic element (4) is fixedly connected between the suction cup connecting assembly and the negative pressure device connecting assembly.

2. The vacuum adsorption device for semiconductor production according to claim 1, characterized in that, The suction cup connection assembly includes a split-design connector (1) and an air guide tube (2). The end of the air guide tube (2) is provided with an internal thread, and the end of the connector (1) is provided with an external thread that mates with the internal thread.

3. The vacuum adsorption device for semiconductor production according to claim 2, characterized in that, The inner cavity of the air guide pipe (2) is provided with a sliding groove (21), and the negative pressure device connection assembly includes a connecting pipe (3). The connecting pipe (3) has a sliding part that slides and engages with the sliding groove (21). The side wall of the sliding part is provided with a limiting boss that engages with the sliding groove (21).

4. A vacuum adsorption device for semiconductor production according to claim 3, characterized in that, A sealing ring (13) is provided between the connector (1) and the air duct (2), and a tightening boss (12) for fixing the sealing ring (13) is provided at one end of the connector (1) near the air duct (2).

5. A vacuum adsorption device for semiconductor production according to claim 3, characterized in that, The upper end of the air duct (2) is provided with a first boss (22), the side wall of the connecting pipe (3) is provided with a second boss (31), and the elastic element (4) is located between the first boss (22) and the second boss (31).

6. A vacuum adsorption device for semiconductor production according to claim 3, characterized in that, The outer wall of the connecting pipe (3) and the inner wall of the air guide pipe (2) have an overlapping area, and the outer wall of the connecting pipe (3) located in the overlapping area is provided with a number of first sealing rubber rings (33).

7. A vacuum adsorption device for semiconductor production according to claim 6, characterized in that, The upper end of the connecting pipe (3) is provided with a connecting port (32), and a second sealing rubber ring is provided inside the connecting port (32).

8. A vacuum adsorption device for semiconductor production according to claim 3, characterized in that, The connector (1) is provided with a suction cup connector at the end away from the air duct (2), and the outer wall of the suction cup connector is provided with several anti-detachment flanges (11).

9. A vacuum adsorption apparatus for semiconductor production according to any one of claims 1-8, characterized in that, The elastic element (4) is a compression spring.

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