Semiconductor cleaning nozzle

Abstract

The utility model relates to the technical field of semiconductor cleaning equipment, and discloses a semiconductor cleaning nozzle, which comprises a main body bracket, a T-shaped movable bracket is movably mounted in the main body bracket, a cleaning nozzle is mounted on the movable bracket, and a rotary adjusting support is mounted at the joint of the movable bracket and the cleaning nozzle. The other side of the rotary adjusting support is fixedly connected with a cleaning nozzle, the back face of the cleaning nozzle is connected with a flexible water inlet pipe, the movable support is located in the main body support, and movable openings are formed in the two sides of the main body support. According to the semiconductor cleaning nozzle, by arranging the rotary adjusting support and the cleaning nozzle body, cleaning can be adjusted, the rotary adjusting support can adjust and control the cleaning nozzle body to adjust the angle, and therefore the cleaning comprehensiveness of semiconductor products is improved, the circular design of the bottom of the water spraying nozzle can improve the fine adjustment angle, and fine adjustment treatment during cleaning can be facilitated; and the supercharging equipment can increase the water outlet angle of the atomization nozzle, and the cleaning strength is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning equipment technology, specifically a semiconductor cleaning nozzle. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion, among other fields. For example, diodes are devices made using semiconductors. From both a technological and economic development perspective, the importance of semiconductors is immense. Most electronic products, such as computers, mobile phones, and digital recorders, rely heavily on semiconductors as their core components. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential in their applications.

[0003] During the manufacturing process of semiconductor products, effective cleaning is required. However, existing cleaning equipment is a fixed cleaning method, which lacks flexibility and cannot effectively remove stains or solder joints from the surface of semiconductor products. Therefore, this invention provides a semiconductor cleaning nozzle that can effectively clean products. Its flexibly adjustable nozzle can effectively reduce cleaning dead zones and greatly improve cleaning efficiency. Utility Model Content

[0004] To address the shortcomings of existing semiconductor cleaning nozzles, this invention provides a semiconductor cleaning nozzle with flexible adjustment capabilities, thus solving the problems mentioned in the background section.

[0005] This utility model provides the following technical solution: a semiconductor cleaning nozzle, including a main support, a movable support movably installed inside the main support, the movable support being T-shaped, a cleaning nozzle mounted on the movable support, the number of cleaning nozzles being four, and the four cleaning nozzles being arranged side by side in a straight line, a rotating adjustment support being installed at the connection between the movable support and the cleaning nozzle, the other side of the rotating adjustment support being fixedly connected to the cleaning nozzle, a flexible water inlet pipe being connected to the back of the cleaning nozzle, the other end of the flexible water inlet pipe being connected to a water pump unit, and the water pump unit being connected to a pure water tank and a medicine tank, the movable support being located inside the main support, movable openings being opened on both sides of the main support, both sides of the movable support extending to the outside of the main support through the movable openings, the cleaning nozzle including a pressurizing device at the bottom, a water spray head being movably installed at the front end of the pressurizing device, and an atomizing nozzle being opened at the front end of the water spray head.

[0006] Preferably, the front end of the booster device has an adjustment cavity, the bottom of the spray head is located inside the adjustment cavity, and the bottom of the spray head is spherical.

[0007] Preferably, the movable support is composed of a connecting support and a vertical moving rod, with the top end of the vertical moving rod connected to the middle of the connecting support.

[0008] Preferably, a drive motor is installed on the inner side of the connecting bracket, and the output shaft of the drive motor extends to the outer side of the connecting bracket and is connected to the rotation adjustment support.

[0009] Preferably, the outer surface of the vertical moving rod is provided with a rack, and the inside of the main support is equipped with a transmission belt adapted to the rack, and the transmission belt is meshed with the rack.

[0010] Preferably, the main support is equipped with a drive device that drives the transmission belt, and the movable support moves up and down via the transmission belt.

[0011] Compared with existing semiconductor cleaning nozzles, this invention has the following advantages:

[0012] 1. This semiconductor cleaning nozzle achieves adjustable cleaning by setting a rotating adjustment support and a cleaning nozzle. The rotating adjustment support can adjust the angle of the cleaning nozzle, thereby improving the comprehensiveness of cleaning semiconductor products. The circular design at the bottom of the nozzle can improve the fine-tuning angle and facilitate fine-tuning during cleaning. The pressurization device can increase the water outlet angle of the atomizing nozzle and increase the cleaning power.

[0013] 2. This semiconductor cleaning nozzle, by setting a movable support, can move up and down on the main support, which facilitates the cleaning nozzle to perform up and down cleaning, improves the comprehensiveness of cleaning, and can effectively clean the product. Its flexible adjustable nozzle can effectively reduce cleaning dead areas and greatly improve cleaning efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the main structure of the present utility model;

[0015] Figure 2 This is a schematic diagram of the cleaning nozzle structure of this utility model;

[0016] Figure 3 This is a partial structural cross-sectional view of the present invention;

[0017] Figure 4 This is a schematic diagram of the support structure of this utility model.

[0018] In the diagram: 1. Main support; 2. Movable support; 3. Rotary adjustment support; 4. Cleaning nozzle; 5. Flexible water inlet pipe; 6. Movable opening; 7. Pressurization equipment; 8. Spray head; 9. Atomizing nozzle; 10. Adjustment chamber; 11. Connecting support; 12. Vertical moving rod; 13. Output shaft; 14. Rack. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4A semiconductor cleaning nozzle includes a main support 1, with a movable support 2 movably mounted inside the main support 1. The movable support 2 is T-shaped and is composed of a connecting support 11 and a vertical moving rod 12. The top end of the vertical moving rod 12 is connected to the middle of the connecting support 11. A drive motor is mounted inside the connecting support 11, and the output shaft 13 of the drive motor extends to the outside of the connecting support 11 and is connected to a rotation adjustment support 3. A rack 14 is provided on the outer surface of the vertical moving rod 12. A transmission belt adapted to the rack 14 is installed inside the main support 1, and the transmission belt is meshed with the rack 14. A drive transmission belt is installed inside the main support 1 for transmission. The driving device is a movable support 2 that moves up and down via a transmission belt. By setting up the movable support 2 and allowing it to move up and down on the main support, the cleaning nozzles 4 can perform vertical cleaning, improving the comprehensiveness of the cleaning and effectively cleaning the product. Its flexibly adjustable nozzles can effectively reduce cleaning dead zones and greatly improve cleaning efficiency. The movable support 2 is equipped with four cleaning nozzles 4, arranged side-by-side in a straight line. A rotating adjustment support 3 is installed at the connection between the movable support 2 and the cleaning nozzles 4. The other side of the rotating adjustment support 3 is fixedly connected to the cleaning nozzles 4. By setting up the rotating adjustment support... 3 and cleaning nozzle 4 enable adjustable cleaning. Rotating the adjusting support 3 allows for vertical angle adjustment of the cleaning nozzle 4, thereby improving the comprehensiveness of cleaning semiconductor products. The circular design at the bottom of the spray head 8 allows for fine-tuning of the angle, facilitating adjustments during cleaning. The pressurizing device 7 increases the water outlet angle of the atomizing nozzle 9, enhancing cleaning power. A flexible water inlet pipe 5 is connected to the back of the cleaning nozzle 4, with the other end connected to a water pump unit. The water pump unit is connected to a pure water tank and a chemical solution tank, allowing the cleaning nozzle 4 to intelligently spray pure water or chemical solution during use. The movable support 2 is located inside the main support 1. The main support 1 has movable openings 6 on both sides. The movable support 2 extends to the outside of the main support 1 through the movable openings 6 on both sides. The cleaning nozzle 4 includes a pressurizing device 7 at the bottom. A water spray head 8 is movably installed at the front end of the pressurizing device 7. An atomizing nozzle 9 is opened at the front end of the water spray head 8. The pressurizing device 7 and the atomizing nozzle 9 enable the cleaning nozzle to achieve high-pressure water spray and high-pressure atomization. An adjustment chamber 10 is opened inside the front end of the pressurizing device 7. The bottom of the water spray head 8 is located inside the adjustment chamber 10, and the bottom of the water spray head 8 is spherical. This structural design can improve the flexibility of the water spray head 8 and realize multi-angle adjustment, including horizontal and vertical angle adjustment.

[0021] Working principle: When the cleaning nozzle is in use, the moving bracket 2 can move on the main body 1 through CNC settings. The internal transmission belt moves through the drive device, thereby controlling the vertical moving rod 12 to move up and down under the action of the rack 14. This controls the up and down movement of the moving bracket 2, and indirectly controls the movement of the cleaning nozzle 4. The cleaning nozzle 4 can increase the swing angle by rotating the adjustable support 3. The internal spray head 8 is designed to control the left and right fine adjustment swing of the cleaning nozzle 4, thereby improving the comprehensiveness of the cleaning equipment.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor cleaning nozzle, comprising a main support (1), characterized in that: The main support (1) is internally fitted with a movable support (2), which is T-shaped. A cleaning nozzle (4) is mounted on the movable support (2). There are four cleaning nozzles (4), arranged side-by-side in a straight line. A rotating adjustment support (3) is installed at the connection between the movable support (2) and the cleaning nozzle (4). The other side of the rotating adjustment support (3) is fixedly connected to the cleaning nozzle (4). A flexible water inlet pipe (5) is connected to the back of the cleaning nozzle (4). The other end of the flexible water inlet pipe (5) is connected to a water pump unit, and the water pump unit is connected to a pure water tank and a medicine tank. The movable support (2) is located inside the main support (1). Movable openings (6) are provided on both sides of the main support (1). Both sides of the movable support (2) extend to the outside of the main support (1) through the movable openings (6). The cleaning nozzle (4) includes a pressurizing device (7) at the bottom. A spray head (8) is movably installed at the front end of the pressurizing device (7). An atomizing nozzle (9) is provided at the front end of the spray head (8).

2. The semiconductor cleaning nozzle according to claim 1, characterized in that: The booster device (7) has an adjustment chamber (10) inside its front end. The bottom of the spray head (8) is located inside the adjustment chamber (10), and the bottom of the spray head (8) is spherical.

3. A semiconductor cleaning nozzle according to claim 1, characterized in that: The movable support (2) is composed of a connecting support (11) and a vertical moving rod (12), with the top end of the vertical moving rod (12) connected to the middle part of the connecting support (11).

4. A semiconductor cleaning nozzle according to claim 3, characterized in that: A drive motor is installed on the inner side of the connecting bracket (11), and the output shaft (13) of the drive motor extends to the outer side of the connecting bracket (11) and is connected to the rotation adjustment support (3).

5. A semiconductor cleaning nozzle according to claim 3, characterized in that: The outer surface of the vertical moving rod (12) is provided with a rack (14), and the main support (1) is equipped with a transmission belt that is compatible with the rack (14), and the transmission belt is meshed with the rack (14).

6. A semiconductor cleaning nozzle according to claim 1, characterized in that: The main support (1) is equipped with a drive device that drives the transmission belt, and the movable support (2) moves up and down via the transmission belt.

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