Fixed-point glue dispensing device for chip manufacturing

By designing the positioning and dispensing components, the problem of unstable chip dispensing caused by inertial errors during the movement of the dispensing machine was solved, achieving a high-precision chip dispensing effect.

CN224237341UActive Publication Date: 2026-05-15MINGHUA XIYU (SHENZHEN) TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
MINGHUA XIYU (SHENZHEN) TECHNOLOGY CO LTD
Filing Date
2025-06-03
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

In the existing technology, the dispensing quality of the chip is unstable due to displacement inertia error when the dispensing machine moves on the guide rail during the chip dispensing process, making it difficult to meet high precision requirements.

Method used

Employing a fixed-point positioning component and a dispensing component, the chip is precisely positioned by the rotor driving the universal disc to rotate and using positioning pins to embed into the slots. The dispensing machine only needs to move vertically to dispense the glue, avoiding errors caused by long-distance movement.

Benefits of technology

It achieves precise positioning of chip dispensing, avoids inertial errors, improves the stability and accuracy of dispensing, and meets the needs of high-precision chip manufacturing.

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Abstract

The utility model discloses a fixed-point glue dispensing device for chip manufacturing, which comprises a base plate and further comprises a fixed-point positioning assembly, the fixed-point positioning assembly comprises a rotor mounted in the middle of the base plate, a universal disc is arranged at the output end of the rotor, and a clamping groove is formed in an extension arm of the universal disc; a sliding groove is formed in one side of the base plate, a sliding block is arranged in the sliding groove in a sliding mode, a positioning pin is arranged on the surface of the sliding block, and an electric telescopic rod is arranged on one side of the sliding block and fixed to one side of the sliding groove. And the fixed-point positioning assembly is provided with a fixed-point clamping assembly on the periphery of a universal disc for rotating the chip. And when the chip rotates to a specific dispensing part, the positioning pin in the clamping assembly is embedded into the clamping groove, so that a fixed-point stopping effect is realized. And the dispensing machine can realize dispensing only by moving in the vertical direction and descending to a specific height. The fixed-point stopping mode avoids the error problem caused by inertia in the long-distance moving process of the dispenser.
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Description

Technical Field

[0001] This utility model relates to the field of chip dispensing technology, and in particular to a fixed-point dispensing device for chip manufacturing. Background Technology

[0002] Chip dispensing is a common process technology used in semiconductor packaging and electronic manufacturing. By precisely controlling the application position and amount of adhesive, adhesive is applied to specific areas of chips, substrates, or electronic components for fixing, sealing, insulation, or thermal conduction to improve product reliability and performance. Common applications include chip packaging, LED packaging, and PCB protection. Its core equipment includes dispensing machines, needles, and control systems, requiring high precision, high stability, and a high degree of automation to meet the needs of micron-level processing.

[0003] Chinese patent CN217911262U discloses a precision dispensing device for chip manufacturing. This patent includes a worktable and a dispensing device located on the surface of the worktable. It also includes a moving assembly for moving the dispensing device. The moving assembly includes a U-shaped base plate, a motor, a lead screw, a screw block, and an L-shaped fixing plate. The motor is fixedly mounted on one side of the U-shaped base plate. By controlling the forward and reverse rotation of the motor, the lead screw rotates on the surface of the U-shaped base plate, causing the L-shaped fixing plate fixedly mounted on one side of the screw block to move the dispensing device until it reaches the designated position for precise positioning. A guide block fixedly mounted on the U-shaped base plate on the surface of the screw sleeve allows the moving assembly to move downwards, positioning the dispensing nozzle at the chip's dispensing location for precise positioning. The dispensing head has a built-in dispensing pump, which starts dispensing when aligned with the dispensing position.

[0004] In existing technologies, during the dispensing process, the dispensing gun is controlled to move along the XOY plane and perform dispensing at a specific location. However, the dispensing machine experiences displacement inertia errors as it moves along the guide rail, and given the high precision requirements of chip manufacturing, this can lead to inconsistent dispensing quality, necessitating improvements. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a pinpoint dispensing device for chip manufacturing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A chip manufacturing dot-dispensing apparatus includes a chassis and further includes:

[0008] The positioning component includes a rotor installed in the middle of the chassis, a universal disc at the output end of the rotor, a first slot at the extension arm of the universal disc, a sliding groove on one side of the chassis, a slider sliding inside the sliding groove, a positioning pin on the surface of the slider, and an electric telescopic rod on one side of the slider, which is fixed to one side of the sliding groove.

[0009] A further technical solution is that the universal disk has an "X"-shaped multi-flange structure, and the positioning pin has a cylindrical structure.

[0010] A further technical solution involves a tray fixedly mounted on the surface of the omnidirectional disk, with a second slot in the middle of the tray, and a chip installed inside the second slot.

[0011] Further technical solutions also include:

[0012] The dispensing assembly includes a vertical pole fixed to one side of the chassis, a suspension at the top of the vertical pole, and a telescopic cylinder on one side of the suspension.

[0013] A further technical solution involves installing an automatic glue dispensing gun at the output end of the telescopic cylinder.

[0014] A further technical solution involves installing a PLC controller on one side of the suspension. In this device, the rotor, electric telescopic rod, telescopic cylinder, and automatic glue dispensing gun are connected to one side of the PLC controller.

[0015] A further technical solution involves positioning the dispensing area of ​​the automatic dispensing gun directly above the chip dispensing area.

[0016] Compared with the prior art, the present invention provides a pinpoint dispensing device for chip manufacturing, which has the following advantages:

[0017] This invention utilizes a fixed-point positioning component, which includes a positioning locking mechanism around the rotating chip's omnidirectional disk. When the chip rotates to a specific dispensing area, a positioning pin in the locking mechanism engages with a slot to achieve a fixed-point stop. The dispensing machine itself only needs to move vertically and descend to a specific height to complete the dispensing. This fixed-point stopping method avoids errors caused by inertia during long-distance movement of the dispensing machine. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a chip manufacturing fixed-point dispensing device proposed in this utility model;

[0019] Figure 2 This is a schematic diagram of the longitudinal section of a chip manufacturing fixed-point dispensing device proposed in this utility model;

[0020] Figure 3 This is a structural diagram showing the disassembly of the universal disk of a chip manufacturing fixed-point dispensing device proposed in this utility model.

[0021] Figure 4 This is a side view of a chip manufacturing dot-dispensing device proposed in this utility model.

[0022] In the diagram: 1. Chassis; 2. Positioning assembly; 3. Dispensing assembly; 4. Rotor; 5. Universal disc; 6. First slot; 7. Tray; 8. Second slot; 9. Chip; 10. Slide rail; 11. Slider; 12. Positioning pin; 13. Electric telescopic rod; 14. Upright pole; 15. Suspension; 16. PLC controller; 17. Telescopic cylinder; 18. Automatic dispensing gun. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model. In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of the present utility model.

[0024] Example 1: Refer to Figure 1 - Figure 4 A chip manufacturing dot-dispensing apparatus includes a chassis 1, and further includes:

[0025] The positioning component 2 includes a rotor 4 installed in the middle of the chassis 1. The rotor 4 indirectly controls the rotation of the chip 9 inside the slot 8 via a universal disk 5. The output end of the rotor 4 is provided with the universal disk 5, and the extended arm of the universal disk 5 is provided with a slot 6; the slot 6 is the embedding structure for subsequent positioning components. A slide groove 10 is provided on one side of the chassis 1. An electric telescopic rod 13 controls the slider 11 to slide inside the slide groove 10. The positioning pin 12 on the top of the slider 11 is embedded inside the slot 6 during movement to achieve positioning. The slider 11 is slidably arranged inside the slide groove 10. The surface of the slider 11 is provided with a positioning pin 12. An electric telescopic rod 13 is provided on one side of the slider 11 and is fixed to one side of the slide groove 10.

[0026] The chip manufacturing fixed-point dispensing device has an "X"-shaped multi-flange structure for the universal disk 5 and a cylindrical structure for the positioning pin 12.

[0027] The aforementioned chip manufacturing dispensing device includes a tray 7 fixedly mounted on the surface of the universal disk 5. A slot 8 inside the tray 7 serves as the receiving point for the chip 9. The slot 8 is located in the middle of the tray 7, and the chip 9 is installed inside the slot 8.

[0028] The chip manufacturing dot-dispensing apparatus further includes:

[0029] The dispensing assembly 3 includes a vertical rod 14 fixed to one side of the chassis 1, and a suspension 15 is provided on the top of the vertical rod 14. The vertical rod 14 and the suspension 15 are the suspension components of the telescopic cylinder 17. The telescopic cylinder 17 is provided on one side of the suspension 15.

[0030] The chip manufacturing fixed-point dispensing device is provided with an automatic dispensing gun 18 at the output end of the telescopic cylinder 17, which is used to achieve automatic dispensing effect at the dispensing point.

[0031] In the chip manufacturing fixed-point dispensing device, a PLC central controller 16 is installed on one side of the suspension 15. The PLC central controller 16 is used to centrally control all electrical components of this device. In this device, the rotor 4, electric telescopic rod 13, telescopic cylinder 17, and automatic dispensing gun 18 are connected to one side of the PLC central controller 16.

[0032] The chip manufacturing fixed-point dispensing device has an automatic dispensing gun 18 with its dispensing part positioned directly above the dispensing part of the chip 9, sinking down to a specific position to achieve the dispensing effect.

[0033] Working Principle: In the actual design process, this utility model addresses the following shortcomings in existing technologies: "In existing technologies, during the dispensing process, the dispensing gun is controlled to move on the XOY plane and then dispensing is performed at a specific dispensing location. However, there is a certain displacement inertia error during the movement of the dispensing machine on the guide rail, and chip manufacturing requires high precision, which will lead to unstable dispensing quality. Therefore, improvements are needed." Therefore, a fixed-point positioning component 2 and a dispensing component 3 are specifically proposed.

[0034] Positioning component 2:

[0035] The component consists of two parts: a rotating part and a locking part. The rotating part involves a rotor 4 driving a top-mounted omnidirectional disc 5 to rotate, mounting the chip 9 inside the slot 8 of the tray 7. The locking part includes a groove 10 on one side of the chassis 1, allowing a slider 11 to slide within it. The control component is an electric telescopic rod 13 mounted on one side of the groove 10. The electric telescopic rod 13 controls a positioning pin 12 on one side of the slider 11 within the groove 10, which in turn abuts against the slot 6, stopping the chip 9 inside the turntable. This stopping point is precisely where adhesive needs to be applied.

[0036] Dispensing component 3:

[0037] This component mounts the dispensing device directly above the chip dispensing area via a pole 14 and a suspension 15. An automatic dispensing gun 18 extends to the chip dispensing area via a telescopic cylinder 17, thus achieving the dispensing effect. Furthermore, to achieve global automatic control, a PLC controller 16 is installed on one side of the suspension 15, enabling overall synchronous control.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be covered within the scope of protection of this utility model.

Claims

1. A chip manufacturing applicator for spot dispensing, comprising a chassis (1), characterized in that, Also includes: The positioning component (2) includes a rotor (4) installed in the middle of the chassis (1), a universal disk (5) is provided at the output end of the rotor (4), and a first slot (6) is provided at the extension arm of the universal disk (5); a sliding groove (10) is provided on one side of the chassis (1), a slider (11) is slidably provided inside the sliding groove (10), a positioning pin (12) is provided on the surface of the slider (11), and an electric telescopic rod (13) is provided on one side of the slider (11), and the electric telescopic rod (13) is fixed to one side of the sliding groove (10).

2. The chip manufacturing dispensing apparatus according to claim 1, characterized in that, The omnidirectional disk (5) has an "X"-shaped multi-flange structure, and the positioning pin (12) has a cylindrical structure.

3. The chip manufacturing dispensing apparatus according to claim 1, characterized in that, The surface of the universal disk (5) is fixedly mounted with a tray (7), and a second slot (8) is provided in the middle part of the tray (7). A chip (9) is installed inside the second slot (8).

4. The chip manufacturing dispensing apparatus according to claim 3, characterized in that, Also includes: The dispensing assembly (3) includes a pole (14) fixed to one side of the chassis (1), a suspension (15) is provided on the top of the pole (14), and a telescopic cylinder (17) is provided on one side of the suspension (15).

5. The chip manufacturing dispensing apparatus according to claim 4, characterized in that, An automatic glue dispensing gun (18) is provided at the output end of the telescopic cylinder (17).

6. The chip manufacturing dispensing apparatus according to claim 4, characterized in that, A PLC controller (16) is provided on one side of the suspension (15). The rotor (4), electric telescopic rod (13), telescopic cylinder (17) and automatic glue gun (18) in this device are connected to one side of the PLC controller (16).

7. The chip manufacturing dispensing apparatus according to claim 5, characterized in that, The dispensing part of the automatic dispensing gun (18) is located directly above the dispensing part of the chip (9).