Base material gluing device for flexible circuit board processing

Abstract

The utility model relates to the technical field of gluing devices, and discloses a base material gluing device for flexible circuit board processing, which comprises a gluing table, the top of the gluing table is fixedly connected with four support columns and a support ring, the top of the gluing table is rotatably connected with a rotating shaft in the support ring, and the rotating shaft is fixedly connected with the bottom of the gluing table. A gluing disc is fixedly connected to the outer wall of the top end of the rotating shaft, and a rotating assembly for driving the gluing disc to rotate is arranged on the inner wall of the supporting ring. According to the circuit board gluing device, the movable frame, the movable block, the gluing head, the adjusting assembly and other structures are matched for use, so that a plurality of circuit boards can be glued, the position of the gluing head can be adjusted, gluing of the plurality of circuit boards can be completed at a time, a large amount of gluing work can be completed in a short time, the overall production cycle is shortened, and the production efficiency is improved. The production efficiency is remarkably improved, the gluing quality of each circuit board is ensured to be consistent through synchronous work of the multiple nozzles, and the quality problem caused by non-uniform gluing is avoided.

Description

Technical Field

[0001] This utility model relates to the field of adhesive coating equipment technology, and in particular to an adhesive coating equipment for substrates used in flexible circuit board processing. Background Technology

[0002] With the continuous development of electronic products, flexible printed circuit boards (FPCs) have been widely used in mobile phones, tablets, television displays, automotive electronics, and other fields due to their advantages such as thinness, flexibility, high density, and high performance. In the production process of FPCs, the coating process is a crucial step, typically used to apply protective films, insulating layers, or adhesives to the surface of the circuit board to improve its durability, protect the circuitry, and ensure electrical performance. Traditional coating equipment often uses a single nozzle or scraper head to coat each circuit board individually. While relatively simple to operate, this method is inefficient, and it's difficult to guarantee the uniformity and precision of the coating, especially in mass production, where both coating quality stability and production efficiency face challenges.

[0003] For example, Chinese utility model patent application number 202323187260.8 discloses a substrate coating device for flexible circuit board processing, relating to the technical field of coating devices. It includes a support plate, a movable component fixedly connected to the surface of the support plate, a coating mechanism driven to the surface of the movable component, and a clamping mechanism on the surface of the support plate. The movable component includes a movable frame, which is fixedly connected to the surface of the support plate. This utility model uses a motor to drive a screw to rotate, which in turn drives a connecting block to rotate, thereby achieving the effect of moving the coating mechanism back and forth for coating, making coating the circuit board more convenient. A motor drives a transmission roller to rotate, which in turn drives a belt to move, thereby moving a transmission block, a support frame, and a coating nozzle to move left and right for coating, thus achieving a flexible coating effect.

[0004] Existing adhesive coating equipment uses a single-board coating method, meaning it can only coat one circuit board at a time. This not only wastes time but also fails to fully utilize the efficiency of the coating equipment. This is especially true when the production line needs to process a large number of flexible circuit boards, which greatly affects the overall production efficiency. While some rotary dispensing machines can process in batches, they lack dynamic nozzle adjustment capabilities, and the coating accuracy is limited by the fixed station layout. Based on this, this innovative design proposes a substrate adhesive coating device for flexible circuit board processing to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a substrate coating device for flexible circuit board processing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a substrate coating device for flexible circuit board processing, comprising a coating table, four support columns and a support ring fixedly connected to the top of the coating table, a rotating shaft rotatably connected to the top of the coating table and inside the support ring, a coating disc fixedly connected to the outer wall of the top end of the rotating shaft, a rotating component for driving the coating disc to rotate provided on the inner wall of the support ring, several placement frames fixedly installed on the top of the coating disc, a fixing component provided on the top of the placement frames, a fixing plate fixedly connected to the top of the four support columns, a telescopic component provided on the top of the fixing plate, a U-shaped frame slidably connected to the outer wall of the four support columns, several movable frames fixedly connected to the bottom of the U-shaped frame, a cross plate fixedly connected to one opposite end of the several movable frames, an adjustment component provided on the top of the cross plate, a movable block slidably connected to the inner wall of the movable frame, a coating head fixedly installed on one side of the movable block, and a pumping component for supplying adhesive to the coating head provided on the top of the fixing plate.

[0007] The bottom of the coating tray is rotatably connected to the top of the support ring. The support ring has an embedded drive component, providing a rigid foundation for the transmission of rotational power and limiting the radial offset of the rotation axis. The top of the coating table integrates a controller system, and the front is also equipped with control buttons and an emergency stop button. The support column serves as a vertical load-bearing frame, supporting the lifting and lowering guide of the top fixed plate and the U-shaped frame, ensuring the stable vertical movement of the coating head. The moving frame ensures that the moving block slides smoothly, avoiding uneven line width caused by glue vibration.

[0008] As a further description of the above technical solution:

[0009] The rotating assembly includes a drive motor fixedly mounted on the inner wall of the support ring, and a worm gear is fixedly connected to the output end of the drive motor.

[0010] One end of the worm gear is rotatably connected to the inner wall of the support ring, and the worm gear meshing transmission enables precise positioning of the glue applicator angle.

[0011] As a further description of the above technical solution:

[0012] The outer wall of the worm is meshed with a worm wheel.

[0013] The worm gear is fixedly connected to the rotating shaft, and its self-locking characteristic prevents accidental displacement during the glue application process, making it particularly suitable for high torque requirements during high-speed rotation.

[0014] As a further description of the above technical solution:

[0015] The fixing component includes a threaded block fixedly installed on the top of the placement frame, with a fixing screw connected internally to the threaded block, and a clamping plate rotatably connected to one end of the fixing screw.

[0016] The bottom of the clamping plate is slidably connected to the top of the placement frame. The threaded block serves as the fixed end of the threaded pair, converting rotational motion into linear displacement. The fixed screw is manually rotated by the lever to drive the clamping plate to slide, applying uniform pressure to the substrate and avoiding local stress that could cause substrate deformation. The edges of the clamping plate are covered with silicone pads, which also have anti-slip and anti-scratch functions.

[0017] As a further description of the above technical solution:

[0018] The telescopic assembly includes a cylinder fixedly mounted on the top of the fixed plate, the telescopic end of the cylinder passing through the fixed plate and fixedly connected to a pusher frame.

[0019] The bottom of the push frame is fixedly connected to the top of the U-shaped frame. The cylinder drives the U-shaped frame to rise and fall along the support column, realizing the Z-axis coarse adjustment of the glue applicator head and quickly switching the working plane of substrates with different thicknesses.

[0020] As a further description of the above technical solution:

[0021] The adjustment assembly includes a servo motor fixedly mounted on the top of the cross plate. The output end of the servo motor is fixedly connected to a main bevel gear, and the outer wall of the main bevel gear is meshed with several secondary bevel gears.

[0022] The servo motor provides a high-precision power source, which synchronously drives multiple sets of auxiliary bevel gears through the main bevel gear.

[0023] As a further description of the above technical solution:

[0024] A threaded rod is fixedly connected to the side of the secondary bevel gear near the moving frame.

[0025] One end of the threaded rod is rotatably connected to the inner wall of the movable frame, and the outer wall of the threaded rod is threadedly connected to the movable block.

[0026] As a further description of the above technical solution:

[0027] The pumping assembly includes a glue storage tank and a screw pump fixedly installed on the top of the fixed plate. The suction end of the screw pump is fixedly connected to the screw pump through a pipe, and the discharge end of the screw pump is fixedly connected to a diversion hose.

[0028] The diversion ports of the diversion hoses are fixedly connected to the dispensing heads. The screw pump adopts the positive displacement pumping principle and is suitable for high viscosity adhesives. The flow rate is precisely adjusted through frequency conversion control. The diversion hoses adopt an equal-length flow channel design and a dynamic pressure compensation valve to ensure consistent adhesive output from multiple nozzles and avoid the risk of short circuits caused by excessive local adhesive thickness.

[0029] This utility model has the following beneficial effects:

[0030] 1. Compared with the prior art, the substrate coating device for flexible circuit board processing, through the coordinated use of structures such as a moving frame, a moving block, a coating head, and an adjustment component, can coat multiple circuit boards with adhesive and adjust the position of the coating head to complete the coating of multiple circuit boards at one time. It can complete a large amount of coating work in a short time, thereby shortening the overall production cycle and significantly improving production efficiency. Moreover, by working simultaneously with multiple nozzles, it ensures that the coating quality of each circuit board is consistent and avoids quality problems caused by uneven coating.

[0031] 2. Compared with existing technologies, this substrate coating device for flexible circuit board processing, through the coordinated use of structures such as a rotating shaft, support ring, coating disc, and rotating components, enables the coating disc to rotate via a worm gear transmission system. Combined with cylinder-driven Z-axis lifting and adjusting components, it achieves 360° omnidirectional coating path coverage, adapting to complex curved surfaces and irregularly shaped circuit boards. This makes the coating process more flexible and adaptable to different production needs. Attached Figure Description

[0032] Figure 1 This is a three-dimensional schematic diagram of the overall structure of a substrate coating device for flexible circuit board processing proposed in this utility model.

[0033] Figure 2 This is a three-dimensional schematic diagram of the rotating component structure of a substrate coating device for flexible circuit board processing proposed in this utility model.

[0034] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0035] Figure 4 This is a three-dimensional schematic diagram of the adjustment component structure of a substrate coating device for flexible circuit board processing proposed in this utility model.

[0036] Figure 5 This is a three-dimensional schematic diagram of the telescopic component structure of a substrate coating device for flexible circuit board processing proposed in this utility model.

[0037] Legend:

[0038] 1. Glue application table; 2. Support column; 3. Support ring; 4. Rotating shaft; 5. Glue application tray; 6. Placement frame; 7. Fixing plate; 8. U-shaped frame; 9. Moving frame; 10. Cross plate; 11. Moving block; 12. Glue application head; 13. Drive motor; 14. Worm gear; 15. Worm wheel; 16. Threaded block; 17. Fixing screw; 18. Clamping plate; 19. Cylinder; 20. Push frame; 21. Servo motor; 22. Main bevel gear; 23. Secondary bevel gear; 24. Threaded rod; 25. Glue storage tank; 26. Screw pump; 27. Diverter hose. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] Reference Figure 1-5 This utility model provides a substrate coating device for flexible circuit board processing: It includes a coating table 1, with four support columns 2 and a support ring 3 fixedly connected to the top of the coating table 1. A rotating shaft 4 is rotatably connected to the top of the coating table 1 and inside the support ring 3. A coating disc 5 is fixedly connected to the outer wall of the top of the rotating shaft 4. A rotating assembly for driving the coating disc 5 to rotate is provided on the inner wall of the support ring 3. Several placement frames 6 are fixedly installed on the top of the coating disc 5, and a fixing assembly is provided on the top of the placement frames 6. A fixing plate 7 is fixedly connected to the top of the four support columns 2. A telescopic assembly is provided on the top of the fixing plate 7. A U-shaped frame 8 is slidably connected to the outer wall of the four support columns 2. Several movable frames 9 are fixedly connected to the bottom of the U-shaped frame 8. A cross plate 10 is fixedly connected to one end of the several movable frames 9. An adjustment assembly is provided on the top of the cross plate 10. A movable block 11 is slidably connected to the inner wall of the movable frame 9. A coating head 12 is fixedly installed on one side of the movable block 11. A feeding device for the coating head is provided on the top of the fixing plate 7. The adhesive pumping assembly 12 has a bottom rotatably connected to the top of the support ring 5. The support ring 3 has an embedded drive assembly, providing a rigid foundation for the transmission of rotational power and limiting the radial offset of the rotation axis 4. The top of the adhesive application table 1 integrates a controller system, and the front is also equipped with control buttons and an emergency stop button. The support column 2 serves as a vertical load-bearing frame, supporting the lifting and lowering guide of the top fixed plate 7 and the U-shaped frame 8, ensuring the stable vertical movement of the adhesive application head 12. The moving frame 9 ensures the smooth sliding of the moving block 11, avoiding uneven line width caused by adhesive vibration. Through the coordinated use of the moving frame 9, the moving block 11, the adhesive application head 12, and the adjustment assembly, multiple circuit boards can be coated with adhesive, and the position of the adhesive application head 12 can be adjusted to complete the coating of multiple circuit boards at once. This allows for the completion of a large amount of coating work in a short time, thereby shortening the overall production cycle and significantly improving production efficiency. Furthermore, the synchronous operation of multiple nozzles ensures consistent coating quality for each circuit board, avoiding quality problems caused by uneven coating.

[0041] The rotating assembly includes a drive motor 13 fixedly mounted on the inner wall of the support ring 3. The output end of the drive motor 13 is fixedly connected to a worm gear 14. One end of the worm gear 14 is rotatably connected to the inner wall of the support ring 3. The worm gear 14 and worm wheel 15 mesh and drive to achieve precise angular positioning of the glue application disc 5. The outer wall of the worm gear 14 is meshed with a worm wheel 15. The inside of the worm wheel 15 is fixedly connected to the rotating shaft 4. The self-locking characteristic of the worm wheel 15 prevents accidental displacement during the glue application process, and is especially suitable for high torque requirements during high-speed rotation.

[0042] The fixing component includes a threaded block 16 fixedly installed on the top of the placement frame 6. The threaded block 16 is internally threaded with a fixing screw 17. One end of the fixing screw 17 is rotatably connected to a clamping plate 18. The bottom of the clamping plate 18 is slidably connected to the top of the placement frame 6. The threaded block 16 serves as the fixing end of the threaded pair, converting rotational motion into linear displacement. The fixing screw 17 is manually rotated by a lever to drive the clamping plate 18 to slide, applying uniform pressure to the substrate and avoiding deformation of the substrate due to local stress. The edges of the clamping plate 18 are covered with silicone pads, which have both anti-slip and anti-scratch functions.

[0043] The telescopic assembly includes a cylinder 19 fixedly installed on the top of the fixed plate 7. The telescopic end of the cylinder 19 passes through the fixed plate 7 and is fixedly connected to a pusher frame 20. The bottom of the pusher frame 20 is fixedly connected to the top of the loop frame 8. The cylinder 19 drives the loop frame 8 to rise and fall along the support column 2, thereby realizing the Z-axis coarse adjustment of the glue applicator 12 and quickly switching the working plane of substrates with different thicknesses.

[0044] The adjustment assembly includes a servo motor 21 fixedly mounted on the top of the cross plate 10. The output end of the servo motor 21 is fixedly connected to a main bevel gear 22. Several secondary bevel gears 23 are meshed with the outer wall of the main bevel gear 22. The servo motor 21 provides a high-precision power source and synchronously drives multiple sets of secondary bevel gears 23 through the main bevel gear 22. A threaded rod 24 is fixedly connected to the side of the secondary bevel gear 23 near the moving frame 9. One end of the threaded rod 24 is rotatably connected to the inner wall of the moving frame 9, and the outer wall of the threaded rod 24 is threadedly connected to the moving block 11.

[0045] The pumping assembly includes a glue storage tank 25 and a screw pump 26 fixedly installed on the top of the fixed plate 7. The suction end of the screw pump 26 is fixedly connected to the screw pump 26 via a pipe, and the discharge end of the screw pump 26 is fixedly connected to a diversion hose 27. The diversion ports of the diversion hose 27 are fixedly connected to the glue applicator head 12 respectively. The screw pump 26 adopts the principle of volumetric pumping and is suitable for high viscosity glue. The flow rate is precisely adjusted through frequency conversion control. The diversion hose 27 adopts an equal length flow channel design and a dynamic pressure compensation valve to ensure the consistency of glue output from multiple nozzles and avoid the risk of short circuit caused by excessive local glue thickness.

[0046] Working principle: First, place the circuit board to be coated with glue in the placement frame 6 on the glue application tray 5. Then, the operator rotates the lever on the fixing screw 17 to rotate the fixing screw 17. Under the action of the threaded block 16, the clamping plate 18 slides along the top of the placement frame 6, thereby fixing the circuit board to be coated and preventing it from shaking during the glue application process, which would affect the glue application effect. Then, the glue application table 1 can be powered by an external power source. At this time, the operator can control the device through the controller on the top of the glue application table 1. Then, the cylinder 19 is started, and its telescopic end drives the push frame 20 to move, which in turn pushes the U-shaped frame 8 along the support column 2, so that the glue application head 12 is aligned with the circuit board. At this time, the screw pump is started. 26, so that the suction end draws in the glue in the glue storage tank 25, and then sends it into the diversion hose 27 through the discharge end. At this time, the diversion hose 27 diverts the glue so that each glue application head 12 can get the glue, thereby applying glue to the circuit board. When it is necessary to change the vertical glue application position, the servo motor 21 can be started, so that its output end rotates to drive the main bevel gear 22 to rotate, which in turn drives several secondary bevel gears 23 to rotate, so that the secondary bevel gears 23 drive the threaded rod 24 to rotate, thereby allowing the moving block 11 that is threaded with the threaded rod 24 to slide along the inner wall of the moving frame 9, thereby simultaneously adjusting the position of several glue application heads 12, applying glue to multiple circuit boards at one time, and improving production efficiency;

[0047] Then, when it is necessary to apply glue to other vertical positions of the circuit board, the operator controls the controller to start the drive motor 13, which rotates the worm gear 14, thereby driving the meshing worm wheel 15 to rotate, which in turn drives the rotating shaft 4 to rotate, so that the glue application disc 5 can rotate, effectively changing the orientation of the circuit board, allowing the nozzle to apply glue more accurately. With multiple nozzles working synchronously, the consistency of glue application quality is ensured during the production process, so that a large number of circuit boards can be glued in a short time, thereby shortening the production cycle and improving the overall efficiency of the production line.

[0048] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A substrate coating apparatus for flexible circuit board processing, comprising a coating table (1), characterized in that: The top of the coating table (1) is fixedly connected to four support columns (2) and a support ring (3). A rotating shaft (4) is rotatably connected to the top of the coating table (1) and inside the support ring (3). A coating disc (5) is fixedly connected to the outer wall of the top of the rotating shaft (4). A rotating component for driving the coating disc (5) to rotate is provided on the inner wall of the support ring (3). Several placement frames (6) are fixedly installed on the top of the coating disc (5). A fixing component is provided on the top of the placement frames (6). A fixing plate (7) is fixedly connected to the top of the four support columns (2). (7) is provided with a telescopic component at the top. The outer walls of the four support columns (2) are slidably connected to a loop frame (8). The bottom of the loop frame (8) is fixedly connected to several movable frames (9). The opposite ends of the several movable frames (9) are fixedly connected to a cross plate (10). The top of the cross plate (10) is provided with an adjustment component. The inner wall of the movable frame (9) is slidably connected to a movable block (11). A glue applicator (12) is fixedly installed on one side of the movable block (11). The top of the fixed plate (7) is provided with a pumping component that can supply glue to the glue applicator (12).

2. The substrate coating apparatus for flexible circuit board processing according to claim 1, characterized in that: The rotating assembly includes a drive motor (13) fixedly installed on the inner wall of the support ring (3), and a worm gear (14) is fixedly connected to the output end of the drive motor (13).

3. The substrate coating apparatus for flexible circuit board processing according to claim 2, characterized in that: The outer wall of the worm (14) is meshed with a worm wheel (15).

4. The substrate coating apparatus for flexible circuit board processing according to claim 1, characterized in that: The fixing component includes a threaded block (16) fixedly installed on the top of the placement frame (6), and a fixing screw (17) is threadedly connected inside the threaded block (16). One end of the fixing screw (17) is rotatably connected to a clamping plate (18).

5. The substrate coating apparatus for flexible circuit board processing according to claim 1, characterized in that: The telescopic assembly includes a cylinder (19) fixedly installed on the top of the fixed plate (7), and the telescopic end of the cylinder (19) passes through the fixed plate (7) and is fixedly connected to a pusher frame (20).

6. The substrate coating apparatus for flexible circuit board processing according to claim 1, characterized in that: The adjustment assembly includes a servo motor (21) fixedly installed on the top of the cross plate (10). The output end of the servo motor (21) is fixedly connected to a main bevel gear (22), and the outer wall of the main bevel gear (22) is meshed with several secondary bevel gears (23).

7. The substrate coating apparatus for flexible circuit board processing according to claim 6, characterized in that: A threaded rod (24) is fixedly connected to the side of the secondary bevel gear (23) near the moving frame (9).

8. The substrate coating apparatus for flexible circuit board processing according to claim 1, characterized in that: The pumping assembly includes a glue storage tank (25) and a screw pump (26) fixedly installed on the top of the fixed plate (7). The suction end of the screw pump (26) is fixedly connected to the screw pump (26) through a pipe, and the discharge end of the screw pump (26) is fixedly connected to a diversion hose (27).

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