Gluing device for condensation prevention and heat dissipation in wood processing

Abstract

The utility model discloses a gluing device for condensation prevention and heat dissipation in wood processing. The gluing device comprises a glue attaching mechanism, a stirring mechanism and a transfer heat dissipation mechanism. The gluing mechanism adopts a driven shaft and a driving shaft which are vertically parallel and tangent to form a plate gluing channel; the stirring mechanism is positioned at the upper part and is responsible for mixing and heating rubber materials; a transfer heat dissipation mechanism composed of a U-shaped auxiliary groove and a main groove is innovatively arranged, a main spiral shaft is arranged in the main groove, auxiliary spiral shafts are symmetrically arranged on the two sides of the auxiliary groove, and a turbulent flow heat dissipation path is formed through synchronous rotation of the three shafts. A sizing material is guided into the main groove from the auxiliary groove after being stirred, flows along an extension path of the main groove and the auxiliary groove under the driving of the spiral shaft to dissipate heat, and is uniformly conveyed to the driven shaft through the bottom guide pipe to be coated. The structure reinforces heat exchange through turbulent flow, realizes gradient cooling of the sizing material, effectively solves the problem of advanced solidification of the surface layer of the sizing material, promotes uniform distribution of the sizing material and prevents solidification by utilizing the turbulent flow effect of the spiral shaft, and ensures that a stable coating layer is formed on the surface of a plate.

Description

Technical Field

[0001] This application relates to the field of wood processing technology, and more specifically, to a gluing device for preventing condensation and heat dissipation in wood processing. Background Technology

[0002] In the processing of sheet materials, adhesive application is typically required to ensure bonding strength and durability. This step is crucial, directly impacting the quality and lifespan of the final product. After the raw materials are heated and mixed, the high temperature prevents direct adhesive application, as this could cause the adhesive to solidify rapidly, affecting the bonding effect. While currently available adhesive application equipment meets basic requirements to some extent, the problem of surface solidification during cooling remains unresolved. This not only impacts production efficiency but also increases the probability of rework. Therefore, there is an urgent need to develop a new type of adhesive application device that can dissipate heat from the adhesive, prevent solidification, and maintain uniform adhesive application. Summary of the Invention

[0003] This application provides a gluing device for preventing condensation and heat dissipation in wood processing. The device is used to apply glue to boards and includes a glue-applying mechanism, a stirring mechanism, and a transfer and heat dissipation mechanism. The glue-applying mechanism includes a driven shaft and a driving shaft that are parallel and tangent to each other, and mounting seats at both ends of the shafts. The gap between the two shafts forms a glue-applying channel for the boards. The stirring mechanism is located above the glue-applying mechanism and is used to mix and heat the raw materials to form a coating. The transfer and heat dissipation mechanism includes a main tank and a secondary tank that are connected. The secondary tank is U-shaped and extends along the top sidewall of the main tank. A main spiral shaft is located on the central axis of the main tank, and secondary spiral shafts are symmetrically located on both sides of the secondary tank. A guide pipe extending directly above the driven shaft is provided at the bottom of the main tank. The secondary tank receives the glue applied by the stirring mechanism, flows through the main tank, and then through the guide pipe to the driven shaft. The main and secondary spiral shafts rotate synchronously to form a turbulent heat dissipation path for the glue. The glue dissipated by the secondary tank and the main tank forms a uniform coating layer along the guide pipe towards the driven shaft.

[0004] In some embodiments, the drive shaft and the driven shaft are arranged in pairs and their axes are coplanar. The surface of the driven shaft is covered with a rubber composite material with an elastic modulus ≤5MPa. The drive shaft and the driven shaft form equidistant glue channels, and the channel gap is adjustable in the range of 0.5-3mm.

[0005] In some embodiments, the diameter D of the drive shaft and the diameter d of the driven shaft satisfy D = 1.5d to 2d, and the guide tubes are distributed in a four-corner-center geometric array. The guide tubes at the four corners extend to the drive shaft, and the guide tube at the center extends to the center position where the two driven shafts are tangent.

[0006] In some embodiments, the guide tube outlet is provided with a fan-shaped diffusion surface with a spanwise angle greater than or equal to 30 degrees and less than or equal to 45 degrees, and the diffused adhesive flow forms a continuous coverage band covering 35%-50% of the circumference on the axial surface of the driven shaft.

[0007] In some embodiments, the flow rate of the central guide tube is in a 6:1 ratio to the flow rate of the guide tubes at each corner.

[0008] In some embodiments, the secondary tank includes a flow-inducing section and two symmetrical flow-guiding sections. The flow-inducing section extends along the width of the short side at one end of the main tank, and the flow-guiding sections extend along the length of the two symmetrical long sides of the main tank. The adhesive flowing down from the stirring mechanism is located at the center of the flow-guiding sections, and the secondary spiral shaft is mounted on the central axis of the flow-guiding sections.

[0009] In some embodiments, the guide section is provided with ramps sloping from the center to both sides to accelerate the flow of adhesive from the center to the guide section.

[0010] In some embodiments, the mounting base is provided with an axial linear adjustment mechanism and a radial pressure compensation mechanism. The linear adjustment mechanism realizes the synchronous adjustment of the distance between the two drive shafts, and the pressure compensation mechanism realizes the follow-up compensation of the distance between the driven shaft and the drive shaft.

[0011] In some embodiments, the stirring mechanism is mounted above the adhesive application mechanism via a support platform. The stirring mechanism also includes a stirring container with a heating function, a stirring paddle coaxially mounted inside the stirring container, and a stirring motor located outside the stirring container. The stirring motor drives the stirring paddle to rotate via a belt.

[0012] The gluing device of this application constructs a turbulent heat dissipation path for the adhesive material through synchronously rotating main and auxiliary spiral shafts. Combined with the synergistic heat dissipation structure of the U-shaped auxiliary channel and the main channel, it effectively extends the flow path of the adhesive material and improves the heat dissipation efficiency, enabling the high-temperature adhesive material to achieve gradient cooling during the flow process and avoiding surface solidification. At the same time, the guide pipe at the bottom of the main channel precisely guides the adhesive material to be evenly distributed along the driven shaft axis. With the stable gluing channel formed by the dual shafts of the gluing mechanism, it not only ensures the uniformity of the adhesive layer thickness, but also maintains the activity of the adhesive through dynamic heat dissipation, significantly improving the bonding strength and yield of the gluing on the board. This solves the technical problems of uneven adhesive solidification and high rework rate in traditional equipment.

[0013] Additional aspects and advantages of embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of embodiments of this application. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0015] Figure 1 This is a schematic diagram of the front of the adhesive applicator according to an embodiment of this application;

[0016] Figure 2 yes Figure 1 A schematic diagram of a half-section structure along the mid-section line AA;

[0017] Figure 3 This is a top view of the heat dissipation mechanism.

[0018] Explanation of main component symbols: Glue application device 100, glue application mechanism 10, driven shaft 11, drive shaft 12, mounting base 13, adjusting mechanism 131, compensation mechanism 132, stirring mechanism 20, stirring container 21, discharge pipe 211, stirring paddle 22, stirring motor 23, transfer and heat dissipation mechanism 30, main channel 31, main spiral shaft 311, notch 312, guide pipe 313, diffuser surface 314, secondary channel 32, secondary spiral shaft 321, diversion section 322, guide section 323, ramp 324, support platform 40. Detailed Implementation

[0019] The embodiments of this application will be further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions throughout.

[0020] Furthermore, the embodiments of this application described below in conjunction with the accompanying drawings are exemplary and are only used to explain the embodiments of this application, and should not be construed as limiting this application.

[0021] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0022] Please see Figure 1 and Figure 2This application discloses a gluing device 100 for preventing condensation and dissipating heat in wood processing. The device is used to apply glue to wood panels. The gluing device 100 includes a glue-applying mechanism 10, a stirring mechanism 20, and a transfer and heat dissipation mechanism 30. The glue-applying mechanism 10 includes a driven shaft 11 and a driving shaft 12 that are parallel and tangential, and mounting seats 13 located at both ends of the shafts. The gap between the two shafts forms a glue-applying channel for the wood panel. The stirring mechanism 20 is located above the glue-applying mechanism 10 and is used to mix and heat the raw materials to form a glue solution. The transfer and heat dissipation mechanism 30 includes a main tank 31 and a secondary tank 32 that are connected. The secondary tank 32 is U-shaped and extends along the top sidewall of the main tank 31. A main spiral shaft 311 is located along the central axis of the main tank 31, and secondary spiral shafts 321 are symmetrically arranged on both sides of the secondary tank 32. A guide pipe 313 extending to the axial direction directly above the driven shaft 11 is provided at the bottom of the main tank 31. The secondary tank 32 receives the adhesive liquid from the stirring mechanism 20. After flowing through the main tank 31, it flows to the driven shaft 11 through the guide pipe 313. The main and secondary spiral shafts 321 rotate synchronously to form a turbulent heat dissipation path for the adhesive liquid. The adhesive liquid that has been cooled by the secondary tank 32 and the main tank 31 forms a uniform coating layer along the axial direction of the guide pipe 313 toward the driven shaft 11.

[0023] The gluing device 100 of this application constructs a turbulent heat dissipation path for the adhesive liquid through synchronously rotating main and auxiliary spiral shafts 321. Combined with the synergistic heat dissipation structure of the U-shaped auxiliary groove 32 and the main groove 31, it effectively extends the flow path of the adhesive liquid and improves the heat dissipation efficiency, enabling the high-temperature adhesive liquid to achieve gradient cooling during the flow process and avoiding surface solidification. At the same time, the guide pipe 313 at the bottom of the main groove 31 precisely guides the adhesive liquid to be evenly distributed along the driven shaft 11. With the stable gluing channel formed by the dual shafts of the gluing mechanism 10, it not only ensures the uniformity of the adhesive layer thickness, but also maintains the activity of the adhesive liquid through dynamic heat dissipation, significantly improving the bonding strength and yield of the adhesive applied to the board. This solves the technical problems of uneven adhesive solidification and high rework rate in traditional equipment.

[0024] Specifically, please refer to Figure 1 and Figure 2 The adhesive application mechanism 10 is used to apply adhesive to the board material. The adhesive application mechanism 10 includes a driven shaft 11, a driving shaft 12, and a mounting base 13. The two ends of the driven shaft 11 and the driving shaft 12 are rotatably mounted on the mounting base 13. Both the driven shaft 11 and the driving shaft 12 are connected to an external power mechanism (not shown) to drive their rotation. In one embodiment, the driven shaft 11 can be arranged tangentially above and the driving shaft 12 below, with the gap between them forming an adhesive channel, which can also achieve adhesive application to the board material. In the embodiments of this application, to prevent the board material from bending, the driving shaft 12 and the driven shaft 11 are arranged in pairs with their axes coplanar; that is, the two driven shafts 11 are tangentially located on the same horizontal plane above each other, and the two driving shafts 12 are tangentially located on the same horizontal plane below each other.

[0025] The driven shaft 11 is coated with a rubber composite material with an elastic modulus ≤5MPa. The driving shaft 12 and the driven shaft 11 form equidistant glue channels, and the channel gap is adjustable from 0.5 to 3mm. The combination of the elastic coating layer and the rigid shaft reduces the deformation of the sheet metal under pressure by 40%, and the 0.01mm gap adjustment accuracy allows it to be used for processing sheet metal with a thickness of 0.5-3mm.

[0026] Furthermore, the mounting base 13 is equipped with an axial linear adjustment mechanism 131 and a radial pressure compensation mechanism 132. The linear adjustment mechanism 131 realizes the synchronous adjustment of the distance between the two drive shafts 12, and the pressure compensation mechanism 132 realizes the follow-up compensation of the distance between the driven shaft 11 and the drive shaft 12. The adjustment mechanism 131 is located on two opposite sides of the mounting base 13 and can adjust the horizontal distance between the drive shaft 12 and the driven shaft 11, while the compensation mechanism 132 is located on the top of the mounting base 13 and can adjust the vertical distance of the driven shaft 11, i.e., pressure adjustment.

[0027] Please continue reading. Figure 1 and Figure 2 The adhesive is mainly composed of various materials mixed together. The stirring mechanism 20 is used to stir, heat, and mix the materials to form the adhesive. The stirring mechanism 20 is mounted above the adhesive application mechanism 10 via a support platform 40. The stirring mechanism 20 also includes a stirring container 21 with a heating function, a stirring paddle 22 coaxially mounted inside the stirring container 21, and a stirring motor 23 located outside the stirring container 21. The stirring motor 23 drives the stirring paddle 22 to rotate via a belt. The stirring container 21 adopts a double-layer stainless steel structure (with a heating device in the interlayer), which passes through the support platform 40 and is fixed. A discharge pipe 211 with an electromagnetic flow valve is provided below the stirring container 21 for the adhesive to flow out. The flow rate of the adhesive in the discharge pipe 211 is controlled by adjusting the electromagnetic flow valve.

[0028] Please combine Figure 2 and Figure 3 The intermediate heat dissipation mechanism 30 is used to receive the adhesive flowing from the discharge pipe 211 of the mixing mechanism 20 and dissipate heat. The heat dissipation mechanism includes a main tank 31 and a secondary tank 32, both of which have U-shaped cross-sections. The main tank 31 has a cuboid structure, with its two short sides fixed to the mounting base 13. The secondary tank 32 is integrally formed with the top sidewall of the main tank 31 through a casting process. The inner sidewall of the secondary tank 32 coincides with the outer sidewall of the main tank 31, and notches 312 are provided at both ends of the secondary tank 32, which connect the main tank 31 and the secondary tank 32. The two ends of the main spiral shaft 311 are rotatably fixed to the end plates of the short sides of the main tank 31 through bearing seats, and a drive motor is externally connected to one end.

[0029] The secondary tank 32 includes a diversion section 322 and two symmetrical guide sections 323. The diversion section 322 extends along the short side width of one end of the main tank 31, and the two guide sections 323 extend along the length of the two symmetrical side walls of the main tank 31, respectively. The adhesive liquid flowing out of the stirring mechanism 20 is located at the center of the guide section 323 (the discharge pipe 211 at the bottom of the stirring container 21 is directly opposite the center of the diversion section 322). The secondary spiral shaft 321 is installed on the central shaft of the guide section 323. The two ends of each secondary spiral shaft 321 are rotatably fixed to the end plate of the guide section 323 through bearing seats, and each secondary spiral shaft 321 is equipped with a corresponding drive motor.

[0030] In the embodiments of this application, the main / secondary spiral shafts 321 are coated with a Teflon coating. The rotational speed ratio of the main / secondary spiral shafts 321 is 1:1.6. Maintaining this speed allows the temperature to be reduced from 110 degrees Celsius to below 90 degrees Celsius while preventing solidification. The U-shaped structure of the secondary groove 32 extends the flow path of the adhesive. The rotation of the secondary spiral shaft 321 generates a centrifugal force field, forcing the adhesive to move along the groove wall, increasing heat dissipation, and preventing the adhesive from solidifying during flow.

[0031] Further, please refer to Figure 3 The guide section 323 is equipped with ramps 324 sloping from the center to both sides to accelerate the flow of adhesive from the center to the guide section 323. The cross-section of the guide section 323 has an inverted "V" shape. The surface of the ramps 324 is coated with polytetrafluoroethylene to reduce the coefficient of friction. The angle of inclination is [30°, 45°]. The ramp structure 324 allows the adhesive to be split from the center to both sides within 5 seconds. Combined with the low-friction coating to reduce flow resistance, the adhesive is evenly distributed, effectively eliminating the phenomenon of insufficient adhesive at the edges.

[0032] Furthermore, in the embodiments of this application, the adhesive of the stirring mechanism 20 drips from top to bottom onto the rotating shaft under the action of gravity. In order to ensure that all four rotating shafts are covered with adhesive, the diameter of the lower drive shaft 12 is larger than that of the driven shaft 11, so that the adhesive can be applied to the rotating shaft.

[0033] Specifically, the diameter D of the drive shaft 12 and the diameter d of the driven shaft 11 satisfy D=1.5d~2d. The guide tubes 313 are distributed in a four-corner-center geometric array. The guide tubes 313 at the four corners extend to the drive shaft 12, and the guide tube 313 at the center extends to the center position where the two driven shafts 11 are tangent.

[0034] In the embodiments of this application, the diameter of the drive shaft 12 is designed to be 1.8 times that of the driven shaft 11, and the guide tube 313 array adopts a 5-point distribution: the outlets of the four corner tubes are aligned with the contact area of ​​the roller surface of the drive shaft 12, and the central tube is set directly above the meshing point of the two driven shafts 11. The flow rate of the adhesive in the guide tube 313 is controlled at 0.5-1.2m / s.

[0035] Furthermore, the outlet of the guide tube 313 is provided with a fan-shaped diffusion surface 314 with a spanwise angle of [30°, 45°]. The diffused adhesive flow forms a continuous coverage band covering 35%-50% of the circumference on the axial surface of the driven shaft 11. Along the axial direction of the shaft, the guide tube 313, after diffusion through the diffusion surface 314, can cover the entire axial length of the shaft. Under the rotation of the driving shaft 12 and the driven shaft 11, the adhesive can be evenly covered on the shaft surface. Furthermore, since there is only one guide tube 313 in the center, the solenoid valve controls the flow rate of the central guide tube 313 to be 6 times the flow rate of each of the four corner guide tubes 313, i.e., a 1:6 ratio, so as to keep the thickness of the shaft surface consistent.

[0036] The collaborative workflow of the heat dissipation mechanism is as follows:

[0037] 1. Adhesive input: The 120℃ adhesive output from the stirring mechanism 20 enters the center of the guide section 323 of the auxiliary tank 32 through the discharge pipe 211 at the bottom of the stirring container 21.

[0038] 2. Sub-tank 32 treatment: The guide section 323 quickly distributes the adhesive to both sides, and the sub-spiral shaft 321 rotates at a speed of 48 rpm. The adhesive moves closely against the tank wall due to centrifugal force, fully exchanging heat with the aluminum alloy tank body, and flows into the main tank 31 through the notch 312.

[0039] 3. Heat dissipation in main tank 31: After the adhesive enters the main tank 31 through the guide section 322, the main spiral shaft 311 drives the adhesive to move through the guide tube 313 at a speed of 30 rpm. This prevents solidification while continuing to dissipate heat.

[0040] 4. Guiding and Distribution: After cooling, the adhesive is diverted through five guide pipes 313, and then spirally spread onto the drive shaft 12 and driven shaft 11 by the diffusion surface 314. The adhesive is finally coated onto the surface of the board at 75℃ with a thickness of 0.2mm ± 0.01mm. The coating layer is free of bubbles and breaks, and the uniformity of the adhesive layer thickness meets the coating requirements.

[0041] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the stated features. In the description of this application, "multiple" means at least two, such as two or three, unless otherwise explicitly specified.

[0043] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A gluing device for preventing condensation and heat dissipation in wood processing, used for applying glue to boards, characterized in that, include: The adhesive application mechanism includes a driven shaft and a driving shaft that are parallel and tangent to each other, and mounting seats located at both ends of the shaft. The gap between the two shafts forms an adhesive passage for the board. A mixing mechanism is located above the adhesive application mechanism and is used to mix and heat raw materials to form an adhesive coating. A transfer heat dissipation mechanism includes a main groove and a secondary groove that are connected. The secondary groove is U-shaped and extends along the top side wall of the main groove. A main spiral shaft is provided on the central axis of the main groove. Secondary spiral shafts are symmetrically provided on both sides of the secondary groove. A guide pipe extending to the driven axis directly above is provided at the bottom of the main groove. The secondary tank receives the adhesive from the stirring mechanism. After flowing through the main tank, it flows through the guide pipe to the driven shaft. The main and secondary spiral shafts rotate synchronously to form a turbulent heat dissipation path for the adhesive. The adhesive that has been cooled by the secondary tank and the main tank forms a uniform coating layer along the axial direction of the guide pipe toward the driven shaft.

2. The gluing apparatus according to claim 1, characterized in that, The drive shaft and the driven shaft are arranged in pairs and their axes are coplanar. The surface of the driven shaft is covered with a rubber composite material with an elastic modulus ≤5MPa. The drive shaft and the driven shaft form an equidistant glue passage, and the gap between the passages is adjustable from 0.5 to 3mm.

3. The gluing apparatus according to claim 2, characterized in that, The diameter D of the driving shaft and the diameter d of the driven shaft satisfy D=1.5d~2d. The guide tubes are distributed in a four-corner-center geometric array. The guide tubes at the four corners extend to the driving shaft, and the guide tube at the center extends to the center position where the two driven shafts are tangent.

4. The gluing apparatus according to claim 3, characterized in that, The guide tube outlet is provided with a fan-shaped diffusion surface with a span angle greater than or equal to 30 degrees and less than or equal to 45 degrees. The diffused adhesive flow forms a continuous coverage band covering 35%-50% of the circumference on the axial surface of the driven shaft.

5. The gluing apparatus according to claim 4, characterized in that, The flow rate of the central guide tube is 6:1 to the flow rate of the guide tubes at each corner.

6. The gluing apparatus according to claim 1, characterized in that, The secondary tank includes a flow-inducing section and two symmetrical flow-guiding sections. The flow-inducing section extends along the width of the short side at one end of the main tank, and the flow-guiding sections extend along the length of the two symmetrical long sides of the main tank. The adhesive flowing down from the stirring mechanism is located at the center of the flow-guiding section, and the secondary spiral shaft is mounted on the central axis of the flow-guiding section.

7. The gluing apparatus according to claim 6, characterized in that, The guide section is provided with slopes that slop from the center to both sides to accelerate the flow of the adhesive from the center to the guide section.

8. The gluing apparatus according to claim 1, characterized in that, The mounting base is equipped with an axial linear adjustment mechanism and a radial pressure compensation mechanism. The linear adjustment mechanism realizes the synchronous adjustment of the distance between the two drive shafts, and the pressure compensation mechanism realizes the follow-up compensation of the distance between the driven shaft and the drive shaft.

9. The gluing apparatus according to claim 1, characterized in that, The stirring mechanism is mounted on top of the adhesive application mechanism via a support platform. The stirring mechanism also includes a stirring container with a heating function, a stirring paddle coaxially mounted inside the stirring container, and a stirring motor located outside the stirring container. The stirring motor drives the stirring paddle to rotate via a belt.

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