High-buffering heat-conducting silica gel sheet

Abstract

The utility model relates to the technical field of heat-conducting silica gel sheets, in particular to a high-buffering heat-conducting silica gel sheet which comprises a silica gel assembly, the silica gel assembly comprises a first silica gel layer, a second silica gel layer is arranged on one side of the first silica gel layer, and a filling silica gel layer is integrally formed between the first silica gel layer and the second silica gel layer. The buffer assembly is arranged between the first silica gel layer and the second silica gel layer, the buffer assembly comprises a first grid buffer frame which is arranged at the gap of the filling silica gel layer, and a second grid buffer frame is arranged at the gap of the filling silica gel layer. According to the utility model, the buffer assembly is arranged in the silica gel sheet, the filling silica gel layer is divided into a plurality of disconnected parts, and when the silica gel sheet is pressed, the plurality of filling silica gel layers can expand and deform towards the outer side on the horizontal plane through the space between the first grid buffer frame and the second grid buffer frame, so that the deformation range of the silica gel sheet is enlarged; therefore, the buffering and damping effects of the silica gel sheet are improved.

Description

Technical Field

[0001] This utility model relates to the field of thermally conductive silicone pad technology, specifically a high-buffered thermally conductive silicone pad. Background Technology

[0002] Thermally conductive silicone pads are a type of thermally conductive medium material synthesized through a special process using silicone as the base material and adding various auxiliary materials such as metal oxides. In the industry, they are also known as thermally conductive silicone pads, thermally conductive silicone sheets, soft thermally conductive pads, thermally conductive silicone gaskets, etc. They are specially designed and manufactured to transfer heat through gaps, filling gaps and completing the heat transfer between heat-generating and heat-dissipating parts.

[0003] Existing thermally conductive silicone pads are made of silicone and auxiliary materials. When subjected to pressure, they deform through their own elasticity to absorb impact energy and reduce the transmission of vibration to other parts or structures. However, the silicone pads are relatively thin, and their vertical deformation range is small. Furthermore, the middle part of the silicone pad is constricted by the outer silicone pad, making it difficult for the middle part of the silicone pad to expand and deform outward in the horizontal direction. As a result, the thin silicone pads have poor cushioning and shock absorption effects. Utility Model Content

[0004] The purpose of this invention is to provide a high-buffered thermally conductive silicone pad to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A high-buffered thermally conductive silicone sheet, comprising:

[0007] A silicone component, comprising a first silicone layer, a second silicone layer disposed on one side of the first silicone layer, and a filling silicone layer integrally formed between the first silicone layer and the second silicone layer;

[0008] The buffer assembly is located between the first silicone layer and the second silicone layer.

[0009] Furthermore, a lower adhesive layer is provided on the other side surface of the first silicone layer, and a release paper is provided on one side surface of the lower adhesive layer.

[0010] Furthermore, an upper adhesive layer is provided on one side of the second silicone layer, and a second release paper is provided on one side of the upper adhesive layer.

[0011] Preferably, the second release paper has scale lines on one side surface.

[0012] Furthermore, the buffer component includes:

[0013] The No. 1 grid buffer frame is installed in the gaps of the silicone filling layer;

[0014] The No. 2 grid buffer frame is located in the gaps of the silicone layer and is symmetrical to the No. 1 grid buffer frame.

[0015] Preferably, the first grid buffer frame and the second grid buffer frame are fixedly connected, and a grid reinforcement frame is fixedly installed on one side of the inner surface of the first grid buffer frame.

[0016] Preferably, a grid positioning frame is fixedly installed on one side of the inner surface of the second grid buffer frame, and a positioning groove is opened on one side of the grid reinforcement frame, and the grid positioning frame is movably inserted into the positioning groove.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] 1. A grid-shaped space is formed by the No. 1 grid buffer frame and the No. 2 grid buffer frame. When the silicone sheet is compressed, multiple non-connected parts of the silicone layer can expand and deform outward in the horizontal plane through the space inside the No. 1 grid buffer frame and the No. 2 grid buffer frame, thereby increasing the vertical deformation range of the silicone sheet and improving the cushioning and shock absorption effect of the silicone sheet. The grid reinforcement frame supports the No. 1 grid buffer frame and the No. 2 grid buffer frame.

[0019] 2. By using the movable insertion of the grid positioning frame and the positioning groove, it is easier for the No. 1 grid buffer frame to be docked and fixed with the No. 2 grid buffer frame, which restricts the docking position of the two and improves the accuracy of docking and fixing.

[0020] 3. The scale lines are formed by the perpendicular intersection of equidistant straight lines, providing a reference when cutting silicone sheets, making it easier to cut silicone sheets to specific sizes. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the overall disassembled structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the disassembled structure of the buffer component in this utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the No. 1 grid buffer frame in this utility model;

[0025] Figure 5 This is a cross-sectional structural diagram of the connection between the silicone component and the buffer component in this utility model.

[0026] In the diagram: 1. Silicone component; 101. Silicone layer 1; 102. Silicone layer 2; 103. Filler silicone layer; 104. Lower adhesive layer; 105. Release paper 1; 106. Upper adhesive layer; 107. Release paper 2; 108. Scale line; 2. Buffer component; 201. Grid buffer frame 1; 202. Grid buffer frame 2; 203. Grid reinforcement frame; 204. Grid positioning frame; 205. Positioning groove. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-5 In this embodiment of the present invention, a high-buffering thermally conductive silicone sheet includes a silicone assembly 1. The silicone assembly 1 includes a first silicone layer 101, a second silicone layer 102 disposed on one side of the first silicone layer 101, and a filling silicone layer 103 integrally formed between the first silicone layer 101 and the second silicone layer 102. The first silicone layer 101, the second silicone layer 102 and the filling silicone layer 103 form a thermally conductive silicone sheet, which is cast onto the outside of the buffer assembly 2. The buffer assembly 2 is disposed between the first silicone layer 101 and the second silicone layer 102.

[0029] Specifically, the buffer component 2 divides the silicone layer 103 into multiple independent square units, allowing them to expand and deform independently outward. When pressure is applied above or below the silicone sheet, it increases the vertical deformation distance of the silicone sheet and improves the buffering effect of the silicone sheet.

[0030] Example 1

[0031] like Figure 1 and Figure 2 As shown, in this embodiment, a lower adhesive layer 104 is provided on the other side surface of the first silicone layer 101, and a first release paper 105 is provided on one side surface of the lower adhesive layer 104; an upper adhesive layer 106 is provided on one side surface of the second silicone layer 102, and a second release paper 107 is provided on one side surface of the upper adhesive layer 106; a scale line 108 is provided on one side surface of the second release paper 107.

[0032] In this embodiment, the lower adhesive layer 104 and the upper adhesive layer 106 enable the silicone sheet to be bonded between the heating component and the heat dissipation component, filling the gap between them. The lower adhesive layer 104 and the upper adhesive layer 106 are protected by release paper 105 and release paper 107, making the silicone sheet easy to store and use. The scale line 108 is formed by the perpendicular intersection of equidistant straight lines, providing a reference when cutting the silicone sheet, making it easier to cut the silicone sheet into specific sizes.

[0033] like Figure 3 and Figure 4 As shown, in this embodiment, the buffer assembly 2 includes: a first grid buffer frame 201 disposed in the gap of the silicone layer 103, and a second grid buffer frame 202 disposed in the gap of the silicone layer 103 and symmetrical to the first grid buffer frame 201; the first grid buffer frame 201 and the second grid buffer frame 202 are fixedly connected, and a grid reinforcement frame 203 is fixedly installed on one side of the inner surface of the first grid buffer frame 201. The grid reinforcement frame 203 limits the deformation range of the first grid buffer frame 201 and the second grid buffer frame 202, and avoids damage and breakage of the first grid buffer frame 201 and the second grid buffer frame 202 due to excessive pressure on the silicone sheet.

[0034] In specific implementation, the No. 1 grid buffer frame 201 and the No. 2 grid buffer frame 202 are symmetrically spliced ​​and fixed, so that the No. 1 grid buffer frame 201 and the No. 2 grid buffer frame 202 form a grid-like space. When the silicone sheet is compressed, through the space between the No. 1 grid buffer frame 201 and the No. 2 grid buffer frame 202, multiple unconnected parts of the silicone layer 103 can expand and deform outward in the horizontal plane, increasing the vertical deformation range of the silicone sheet, thereby improving the deformation range of the silicone sheet and increasing the buffering and shock absorption effect of the silicone sheet. The grid reinforcement frame 203 supports the No. 1 grid buffer frame 201 and the No. 2 grid buffer frame 202.

[0035] Example 2

[0036] Based on Embodiment 1, in order to compensate for the problem that it is not easy to connect the No. 1 grid buffer frame 201 and the No. 2 grid buffer frame 202.

[0037] like Figure 5 As shown, in this embodiment, a grid positioning frame 204 is fixedly installed on one side of the inner surface of the second grid buffer frame 202, and a positioning groove 205 is opened on one side of the grid reinforcement frame 203. The grid positioning frame 204 and the positioning groove 205 are movably inserted into each other.

[0038] In practice, the movable insertion of the grid positioning frame 204 and the positioning groove 205 makes it easier for the first grid buffer frame 201 to be docked and fixed with the second grid buffer frame 202, restricting the docking position of the two and improving the accuracy of docking and fixing.

[0039] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0040] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high-buffering thermally conductive silicone sheet, characterized in that, include: Silicone assembly (1), the silicone assembly (1) includes a first silicone layer (101), a second silicone layer (102) is provided on one side of the first silicone layer (101), and a filling silicone layer (103) is integrally formed between the first silicone layer (101) and the second silicone layer (102). The buffer component (2) is disposed between the first silicone layer (101) and the second silicone layer (102).

2. The high-buffering thermally conductive silicone sheet according to claim 1, characterized in that, A lower adhesive layer (104) is provided on the other side surface of the first silicone layer (101), and a first release paper (105) is provided on one side surface of the lower adhesive layer (104).

3. The high-buffering thermally conductive silicone sheet according to claim 1, characterized in that, An upper adhesive layer (106) is provided on one side of the second silicone layer (102), and a second release paper (107) is provided on one side of the upper adhesive layer (106).

4. The high-buffering thermally conductive silicone sheet according to claim 3, characterized in that, The second release paper (107) has a scale line (108) on one side surface.

5. The high-buffering thermally conductive silicone sheet according to claim 1, characterized in that, The buffer component (2) includes: The first grid buffer frame (201) is set in the gap of the silicone layer (103); The second grid buffer frame (202) is located in the gap of the silicone layer (103) and is symmetrical to the first grid buffer frame (201).

6. The high-buffering thermally conductive silicone sheet according to claim 5, characterized in that, The first grid buffer frame (201) and the second grid buffer frame (202) are fixedly connected, and a grid reinforcement frame (203) is fixedly installed on one side of the inner surface of the first grid buffer frame (201).

7. The high-buffering thermally conductive silicone sheet according to claim 6, characterized in that, A grid positioning frame (204) is fixedly installed on one side of the inner surface of the second grid buffer frame (202), and a positioning groove (205) is opened on one side of the grid reinforcement frame (203). The grid positioning frame (204) is movably inserted into the positioning groove (205).

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