Vacuum adsorption clamp for steel mesh printing

Abstract

The utility model discloses a vacuum adsorption fixture for steel mesh printing, which comprises a base and an adsorption plate, a negative pressure cavity is arranged in the base, an air flow channel communicated with the negative pressure cavity is arranged on the side wall of the base, the adsorption plate is arranged on the upper portion of the base, an adsorption table top is arranged in the middle of the adsorption plate, and a vacuum pump is arranged on the adsorption table top. A plurality of adsorption holes communicated with the negative pressure cavity are formed in the adsorption table board; strong negative pressure (suction force) is generated through a plurality of adsorption holes in the surface of the base plate, and the base plate is firmly adsorbed on an adsorption table top, so that a flat printing reference surface is provided, which is crucial for obtaining uniform printing thickness and preventing blurred printing (virtual printing), broken lines or uneven thickness caused by suspension of a local area. The flatness directly affects the consistency of the height and width of the grid line and the electrical performance of the battery piece.

Description

Technical Field

[0001] This utility model belongs to the field of stencil printing technology, and specifically relates to a vacuum adsorption fixture for stencil printing. Background Technology

[0002] Stencil printing is a widely used printing process in many fields such as electronics manufacturing, circuit board production, and precision parts machining. Its basic principle is to cover the substrate to be printed with a stencil, and then use a squeegee to evenly spread solder paste, ink, and other printing materials through the openings in the stencil, precisely transferring the printing material to the corresponding positions on the substrate, thus completing the printing of patterns or lines. In electronic product manufacturing, stencil printing plays a crucial role in the soldering quality of electronic components on circuit boards. Precise printing ensures good electrical connections and mechanical stability between electronic components and circuit boards, directly affecting the performance and reliability of electronic products.

[0003] Traditional stencil printing fixtures mostly employ mechanical clamping methods, such as using screws or clips to fix the stencil to the printing platform. This fixing method has significant drawbacks. Firstly, the uneven distribution of mechanical clamping force can easily lead to localized deformation of the stencil. During the printing process, this deformation can alter the size and shape of the openings, affecting the transfer accuracy of the printing material and resulting in problems such as blurry printed patterns and inconsistent line thickness. Secondly, mechanical clamping operations are cumbersome, requiring considerable time for installation and disassembly, thus reducing production efficiency. In large-scale production, frequent fixture installation and disassembly operations accumulate significant time costs, impacting the overall production schedule. Therefore, this application provides a vacuum adsorption fixture for stencil printing. Utility Model Content

[0004] This invention provides a vacuum adsorption fixture for stencil printing, aiming to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A vacuum adsorption fixture for stencil printing includes: a base and an adsorption plate. The base has a negative pressure chamber inside and an air flow channel communicating with the negative pressure chamber on its side wall. The adsorption plate is disposed on the upper part of the base, and an adsorption platform is disposed in the middle of the adsorption plate. The adsorption platform has a plurality of adsorption holes communicating with the negative pressure chamber.

[0007] Furthermore, a sealing groove is provided on the upper surface of the base, the sealing groove is arranged around the negative pressure cavity, and a sealing strip is provided in the sealing groove.

[0008] Furthermore, the sealing strip includes: a bottom insert that is adapted to the bottom of the sealing groove, an extension strip being provided on the upper part of the bottom insert, and side sealing strips and top sealing strips being provided on the lower and upper parts of both sides of the extension strip, respectively.

[0009] Furthermore, the four corners of the adsorption plate are fixedly connected to the base by fixing bolts.

[0010] Furthermore, the negative pressure chamber is equipped with a baffle plate, a dust collection assembly, and a vibration assembly;

[0011] The baffle plate is located below the adsorption hole, the dust collection assembly is located on the side of the negative pressure chamber adjacent to the air flow channel, the vibration assembly is fixedly connected to the side wall of the negative pressure chamber and abuts against the lower surface of the adsorption plate.

[0012] Furthermore, the dust collection assembly includes: a dust collection plate fixedly connected to the side wall of the negative pressure chamber and an inclined guide plate. The dust collection plate includes a vertical baffle, and a triangular plate is provided on the side of the vertical baffle away from the air flow channel. A dust collection groove is provided between the triangular plate and the vertical baffle.

[0013] Furthermore, the vibration assembly includes a support base fixedly connected to the side wall of the negative pressure chamber, a vibration motor fixedly connected to the support base, a support column slidably connected to the upper part of the vibration motor, a spring provided between the support column and the vibration motor, and a buffer pad at the top of the support column.

[0014] Compared with the prior art, the present invention has the following technical effects:

[0015] 1. The vacuum adsorption fixture for stencil printing described in this utility model generates a strong negative pressure (suction) through several adsorption holes on its surface, firmly adsorbing the substrate onto the adsorption platform, thereby providing a flat printing reference surface. This is crucial for obtaining uniform printing thickness and preventing blurry printing (false printing), broken lines, or uneven thickness caused by local areas being suspended. Flatness directly affects the consistency of grid line height and width, as well as the electrical performance of the battery cell. Furthermore, while adsorbing the substrate, the vacuum suction can also remove some tiny dust or particles that may be present on the bottom surface of the substrate and the adsorption platform, reducing the risk of local printing defects (such as bumps or pinholes) caused by particles raising the substrate, and improving the printing yield. Attached Figure Description

[0016] Figure 1 This is an overall isometric view of a vacuum adsorption fixture for stencil printing as described in this utility model;

[0017] Figure 2 This is an isometric view of the base of a vacuum adsorption fixture for stencil printing as described in this utility model;

[0018] Figure 3 This is an overall sectional view of a vacuum adsorption fixture for stencil printing as described in this utility model;

[0019] Figure 4 This is a schematic diagram of a sealing strip for a vacuum adsorption fixture used in stencil printing according to the present invention;

[0020] Figure 5 This is a cross-sectional view of another embodiment of the vacuum adsorption fixture for stencil printing described in this utility model;

[0021] Figure 6 This is a schematic diagram of the dust collection component of a vacuum adsorption fixture for stencil printing as described in this utility model;

[0022] Figure 7 This is a schematic diagram of the vibration component of a vacuum adsorption fixture for stencil printing as described in this utility model.

[0023] In the picture:

[0024] 1. Base; 101. Airflow channel; 102. Negative pressure chamber; 103. Sealing groove;

[0025] 2. Adsorption plate;

[0026] 3. Adsorption platform; 301; Adsorption holes;

[0027] 4. Fixing bolts;

[0028] 5. Sealing strip; 501. Bottom insert strip; 502. Extension strip; 503. Side seal strip; 504. Top seal strip;

[0029] 6. Blindfold;

[0030] 7. Dust collection assembly; 701. Dust collection plate; 702. Guide plate; 703. Vertical baffle; 704. Triangular plate; 705. Dust collection trough;

[0031] 8. Vibration assembly; 801. Support base; 802. Vibration motor; 803. Support column; 804. Spring; 805. Buffer pad. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to specific embodiments of this application and the accompanying drawings.

[0033] like Figure 1-3As shown, a vacuum adsorption fixture for stencil printing includes: a base 1 and an adsorption plate 2. The base 1 has a negative pressure chamber 102 inside and an air flow channel 101 communicating with the negative pressure chamber 102 on its side wall. The adsorption plate 2 is disposed on the upper part of the base 1, and an adsorption platform 3 is disposed in the middle of the adsorption plate 2. The adsorption platform 3 has a plurality of adsorption holes 301 communicating with the negative pressure chamber 102.

[0034] In practical use, the airflow channel 101 works in conjunction with an external negative pressure generating device to create negative pressure in the adsorption holes 301. This negative pressure (suction) generated through the adsorption holes 301 on the adsorption platform 3 firmly adsorbs the substrate onto the adsorption platform 301, thus providing a flat printing reference surface. This is crucial for obtaining uniform printing thickness and preventing blurry printing (false printing), broken lines, or uneven thickness caused by local areas being suspended. Flatness directly affects the consistency of grid line height and width, as well as the electrical performance of the solar cell. Furthermore, while adsorbing the substrate, the vacuum suction can also remove any small dust or particles that may be present on the bottom surface of the substrate and the adsorption platform 3, reducing the risk of local printing defects (such as bumps or pinholes) caused by particles raising the substrate, and improving printing yield. Moreover, the base 1 and the adsorption plate 2 are separate components, making it compatible with different product models. The modular design of the fixture allows for quick replacement of the adsorption plate 2, thus ensuring compatibility with different printing methods.

[0035] like Figure 2-3 As shown, a sealing groove 103 is provided on the upper surface of the base 1. The sealing groove 103 is arranged around the negative pressure chamber 102, and a sealing strip 5 is provided in the sealing groove 103.

[0036] During the vacuum adsorption process, a stable negative pressure environment needs to be formed in the negative pressure chamber 102 to generate sufficient adsorption force to firmly adsorb the substrate onto the adsorption platform 3. The sealing groove 103 and the sealing strip 5 can effectively prevent outside air from entering the negative pressure chamber 102 from the junction of the base 1 and the adsorption plate 2. Without a good seal, outside air will continuously rush into the negative pressure chamber 102, causing the negative pressure to fail to reach the expected value, thereby weakening the adsorption force. By filling the sealing groove 103 with the sealing strip 5, a sealing barrier can be formed to ensure the stability of the negative pressure in the negative pressure chamber 102.

[0037] like Figure 4 As shown, the sealing strip 5 includes: a bottom insert 501 adapted to the bottom of the sealing groove 103, an extension strip 502 provided on the upper part of the bottom insert 501, and side sealing strips 503 and upper sealing strips 504 respectively provided on the lower and upper parts of both sides of the extension strip 502.

[0038] The bottom insert 501 is adapted to fit the bottom of the sealing groove 103, allowing it to fit tightly against the bottom of the sealing groove and preventing air from entering the negative pressure chamber 102 through gaps at the bottom of the sealing groove. The extension strip 502 extends upward from the bottom insert 501, providing support and connection for the side seals 503 and the upper seal 504. The side seals 503 are located on the lower sides of the extension strip 502, sealing the sides of the sealing groove 103 and preventing air leakage from the sides. The upper seal 504 is located above the extension strip 502. When the adsorption plate 2 is installed on the base 1, the upper seal 504 can make close contact with the lower surface of the adsorption plate 2, further preventing outside air from entering the negative pressure chamber 102. This all-around sealing design greatly improves the sealing performance of the negative pressure chamber 102, ensuring a stable and strong negative pressure environment can be formed during vacuum adsorption, thus enhancing the adsorption force on the steel mesh.

[0039] like Figure 1-2 As shown, the four corners of the adsorption plate 2 are fixedly connected to the base 1 by fixing bolts 4.

[0040] In another specific implementation, such as Figure 5-7 As shown, the negative pressure chamber 102 is equipped with a baffle plate 6, a dust collection assembly 7, and a vibration assembly 8;

[0041] The baffle plate 6 is located below the adsorption hole 301, the dust collection assembly 7 is located on the side of the negative pressure chamber 102 adjacent to the air flow channel 101, and the vibration assembly 8 is fixedly connected to the side wall of the negative pressure chamber 102 and abuts against the lower surface of the adsorption plate 2.

[0042] When the fixture is used for a long time, a lot of dust and debris accumulate inside the negative pressure chamber 102. The baffle plate 6 can reduce the upward drift of dust when the negative pressure stops. For some heavier impurities, they can be collected by the dust collection component 7. The vibration of the vibration component 8 can also cause the adsorption plate 2 to vibrate slightly. For some printing materials such as solder paste with a certain degree of stickiness, the vibration can reduce their accumulation around the adsorption hole 301, ensure the unobstructedness of the adsorption hole 301, make the adsorption force more stable and uniform, and ensure the flatness of the substrate after adsorption and fixation.

[0043] like Figure 6 As shown, the dust collection assembly 7 includes: a dust collection plate 701 fixedly connected to the side wall of the negative pressure chamber 102 and an inclined guide plate 702. The dust collection plate 701 includes a vertical baffle 703. A triangular plate 704 is provided on the side of the vertical baffle 703 away from the air flow channel 101. A dust collection groove 705 is provided between the triangular plate 704 and the vertical baffle 703.

[0044] By setting up the dust collection plate 701, large particles of impurities can be prevented from clogging the airflow channel 101, thereby ensuring the stability of the negative pressure. It also makes it convenient for operators to clean impurities inside the negative pressure chamber 102.

[0045] When the production workshop is equipped with a large-diameter impurity adsorption pipe, the dust collection component 7 can be omitted, and operators can directly clean the dust and impurities inside the negative pressure chamber 102 through the impurity adsorption pipe.

[0046] like Figure 7 As shown, the vibration assembly 8 includes a support base 801 fixedly connected to the side wall of the negative pressure chamber 102. A vibration motor 802 is fixedly connected to the support base 801. A support column 803 is slidably connected to the upper part of the vibration motor 802. A spring 804 is provided between the support column 803 and the vibration motor 802. The top of the support column 803 is a buffer pad 805.

[0047] For highly adhesive dust or impurities, activating the vibration assembly 8 and negative pressure adsorption before placing the substrate ensures a cleaner adsorption surface, guaranteeing the flatness of the substrate. The support column 803 and spring 804 ensure proper contact between the vibration assembly 8 and the adsorption plate 2 without affecting the flatness of the adsorption plate 2 and the base 1. Furthermore, the spring 804 mitigates vibrations generated by the vibration motor 802, protecting the adsorption plate 2. The top of the support column 803 is a buffer pad 805, which directly contacts the lower surface of the adsorption plate 2. The buffer pad 805 prevents direct rigid contact between the support column 803 and the adsorption plate 2, preventing scratches or wear during vibration.

[0048] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present utility model, and these all fall within the protection scope of the present utility model.

Claims

1. A vacuum adsorption fixture for stencil printing, characterized in that, include: The base (1) and the adsorption plate (2) are provided. The base (1) has a negative pressure chamber (102) inside and an air flow channel (101) communicating with the negative pressure chamber (102) on the side wall. The adsorption plate (2) is located on the upper part of the base (1) and an adsorption platform (3) is provided in the middle of the adsorption plate (2). The adsorption platform (3) has a plurality of adsorption holes (301) communicating with the negative pressure chamber (102).

2. The vacuum adsorption fixture for stencil printing according to claim 1, characterized in that, A sealing groove (103) is provided on the upper surface of the base (1), the sealing groove (103) is arranged around the negative pressure chamber (102), and a sealing strip (5) is provided in the sealing groove (103).

3. A vacuum adsorption fixture for stencil printing according to claim 2, characterized in that, The sealing strip (5) includes a bottom insert (501) adapted to the bottom of the sealing groove (103), an extension strip (502) is provided on the upper part of the bottom insert (501), and side sealing strips (503) and upper sealing strips (504) are provided on the lower and upper parts of the two sides of the extension strip (502), respectively.

4. A vacuum adsorption fixture for stencil printing according to claim 1, characterized in that, The four corners of the adsorption plate (2) are fixedly connected to the base (1) by fixing bolts (4).

5. A vacuum adsorption fixture for stencil printing according to claim 1, characterized in that, The negative pressure chamber (102) is equipped with a baffle plate (6), a dust collection assembly (7), and a vibration assembly (8); The shielding plate (6) is located below the adsorption hole (301), the dust collection assembly (7) is located on the side of the negative pressure chamber (102) adjacent to the air flow channel (101), the vibration assembly (8) is fixedly connected to the side wall of the negative pressure chamber (102) and abuts against the lower surface of the adsorption plate (2).

6. A vacuum adsorption fixture for stencil printing according to claim 5, characterized in that, The dust collection assembly (7) includes a dust collection plate (701) fixedly connected to the side wall of the negative pressure chamber (102) and an inclined guide plate (702). The dust collection plate (701) includes a vertical baffle (703). A triangular plate (704) is provided on the side of the vertical baffle (703) away from the air flow channel (101). A dust collection groove (705) is provided between the triangular plate (704) and the vertical baffle (703).

7. A vacuum adsorption fixture for stencil printing according to claim 5, characterized in that, The vibration assembly (8) includes a support base (801) fixedly connected to the side wall of the negative pressure chamber (102), a vibration motor (802) fixedly connected to the support base (801), a support column (803) slidably connected to the upper part of the vibration motor (802), a spring (804) provided between the support column (803) and the vibration motor (802), and a buffer pad (805) at the top of the support column (803).

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