Substrate processing equipment

Abstract

The utility model provides substrate processing equipment, relates to the technical field of semiconductor manufacturing equipment, and aims to find the position deviation of a supporting assembly in time and improve the operation efficiency of the substrate processing equipment. The substrate processing equipment comprises a processing chamber, a supporting assembly, a detection device and a control device, the detection device comprises a transmitting assembly, a reflecting part and a receiving assembly. The emitting assembly is arranged in the processing chamber and used for emitting light beams; the reflecting piece is arranged on the supporting assembly and is used for receiving and reflecting the light beam from the transmitting assembly; the receiving assembly is arranged in the processing chamber and used for receiving the light beams from the reflecting part; the control device is connected with the receiving assembly and used for processing position information of the light beams in the receiving assembly and obtaining position changes of the supporting assembly relative to the processing chamber according to the position information, the substrate processing equipment moves along with the supporting assembly through the reflecting part, and the receiving assembly converts the received reflected light beams into position information and sends the position information to the processing chamber. The position information change of the light beam in the receiving assembly is obtained, and the position change of the supporting assembly is monitored.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, and more particularly to a substrate processing device. Background Technology

[0002] Substrate processing equipment, such as chemical vapor deposition (CVD) equipment, is a key piece of equipment in the semiconductor and electronics manufacturing industries. During CVD, the equipment primarily uses support components to hold the substrate, which is then heated to promote the decomposition and deposition reaction of the gaseous precursors.

[0003] The support assembly of a chemical vapor deposition (CVD) system is a screw-driven, vertically movable component that is prone to horizontal tilting and changes in height during repeated movements. These positional changes can lead to a decrease in the uniformity of the deposited film thickness.

[0004] Typically, changes in the level or height of the support components are only discovered during troubleshooting after the substrate has undergone chemical vapor deposition. Adjusting the support components often requires operators to open the equipment's cavities for measurement, which not only increases operational complexity but can also lead to equipment downtime, thus impacting production efficiency. Utility Model Content

[0005] This application provides a substrate processing device for monitoring positional changes of a support component, so as to promptly detect positional deviations of the support component and improve the operating efficiency of the substrate processing device.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In some embodiments, a substrate processing apparatus is provided. The substrate processing apparatus includes a processing chamber, a support assembly, a detection device, and a control device. The processing chamber encloses a cavity. One end of the support assembly passes through the processing chamber and extends into the cavity; the support assembly is movable relative to the processing chamber. The detection device includes a emitting assembly, a reflector, and a receiving assembly. The emitting assembly is disposed in the processing chamber and is used to emit a light beam. The reflector is disposed in the support assembly and is used to receive and reflect the light beam from the emitting assembly. The receiving assembly is disposed in the processing chamber and is used to receive the light beam from the reflector. The control device is connected to the receiving assembly and is used to process the position information of the light beam on the receiving assembly and to obtain the position change of the support assembly relative to the processing chamber based on the position information.

[0008] In the substrate processing apparatus provided in the above embodiments, a processing chamber surrounds a cavity, providing a reaction space for substrate processing. One end of a support component extends through the processing chamber into the cavity, serving to support the substrate. The support component can move relative to the processing chamber, thereby causing the substrate to move relative to the processing chamber. A transmitting component is fixedly mounted in the processing chamber and is used to emit a light beam to a reflector. The reflector is mounted on the support component and is used to reflect the light beam emitted by the transmitting component to a receiving component. During the movement of the support component relative to the processing chamber, the reflector, being mounted on the support component, moves along with the support component relative to the processing chamber. The receiving component receives the light beam reflected by the reflector and converts it into position information. As the reflector moves with the support component relative to the processing chamber, the position information of the light beam in the receiving component also changes, allowing the control device to acquire the positional change of the support component relative to the processing chamber, thus enabling monitoring of the support component's positional change. This allows for timely detection of positional deviations of the support component, eliminating the cumbersome process of opening the equipment cavity for measurement and improving the operational efficiency of the substrate processing apparatus.

[0009] When substrate processing equipment includes chemical vapor deposition equipment, i.e., when detection and control devices are applied to chemical vapor deposition equipment, timely detection of positional deviations in the support components can improve the thickness uniformity of the deposited film, thereby improving the quality of the film.

[0010] In some embodiments, the transmitting component, the reflector, and the receiving component are all located outside the cavity.

[0011] In some embodiments, the support assembly includes a carrier and a support rod. The carrier is located within the cavity, and the support rod extends through the bottom wall of the processing chamber, with one end of the support rod connected to the carrier. A transmitting assembly and a receiving assembly are located on the bottom wall, and a reflector is located on the support rod, on the side of the bottom wall facing away from the cavity.

[0012] In some embodiments, the plane containing the reflector is perpendicular to the extension direction of the support rod.

[0013] In some embodiments, at least a portion of the orthographic projection of the reflector onto the processing chamber is located between the transmitting assembly and the receiving assembly.

[0014] In some embodiments, the angle between the light emission direction of the emitting component and the plane in which the emitting component is located is an acute angle.

[0015] In some embodiments, there are multiple detection devices, including a first detection device and a second detection device. The transmitting component in the first detection device points in the direction of the receiving component, intersecting the transmitting component in the second detection device pointing in the direction of the receiving component.

[0016] In some embodiments, the receiving components of different detection devices are located in the same plane.

[0017] In some embodiments, different detection devices share the same reflector.

[0018] In some embodiments, the emitting component includes a laser.

[0019] In some embodiments, the receiving component includes a complementary metal-oxide-semiconductor sensor.

[0020] In some embodiments, the substrate processing apparatus includes a chemical vapor deposition apparatus. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below.

[0022] Figure 1 A structural diagram of a substrate processing apparatus provided in an embodiment of this application;

[0023] Figure 2 A structural diagram of another substrate processing device provided in an embodiment of this application;

[0024] Figure 3 A top view of a substrate processing apparatus provided in an embodiment of this application;

[0025] Figure 4 This is a schematic diagram showing the position of a reflected light beam received by a receiving component, as provided in an embodiment of this application.

[0026] Figure 5 A schematic diagram illustrating the principle of a detection device for detecting changes in the height of a support component, provided in an embodiment of this application;

[0027] Figure 6 A schematic diagram illustrating the principle of a detection device for detecting changes in the tilt angle of a support assembly, provided in an embodiment of this application;

[0028] Figure 7 This is a schematic diagram of a control method for a substrate processing device provided in an embodiment of this application. Detailed Implementation

[0029] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0030] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0031] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "exemplary," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0032] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0033] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0034] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0035] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0036] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0037] It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

[0038] Figure 1 This is a structural diagram of a substrate processing apparatus provided in an embodiment of this application. The substrate processing apparatus 1 refers to equipment used for various process treatments on semiconductor substrates (such as silicon wafers), covering multiple key manufacturing steps from wafer fabrication to chip forming. For example, the substrate processing apparatus 1 can be used to deposit thin films on the substrate surface; that is, the substrate processing apparatus 1 may include thin film deposition equipment, such as chemical vapor deposition equipment, physical vapor deposition equipment, or atomic layer deposition equipment. Furthermore, the substrate processing apparatus 1 can also be used to planarize or mirror-polish the wafer surface; that is, the substrate processing apparatus 1 may include a grinding machine or a polishing machine. The substrate processing apparatus 1 can also be used to coat or develop photoresist on the substrate; that is, the substrate processing apparatus 1 may include photoresist coating equipment or developing equipment.

[0039] like Figure 1 As shown, the substrate processing apparatus 1 includes a processing chamber 10 and a support assembly 20. The processing chamber 10 surrounds a cavity 100. One end of the support assembly 20 passes through the processing chamber 10 and extends into the cavity 100, and the support assembly 20 can move relative to the processing chamber 10.

[0040] In the substrate processing apparatus 1 provided in this embodiment, the processing chamber 10 surrounds a cavity 100, providing a reaction space for substrate processing. One end of the support assembly 20 extends through the processing chamber 10 into the cavity 100 and is used to support the substrate. The support assembly 20 can move relative to the processing chamber 10, thereby causing the substrate to move relative to the processing chamber 10.

[0041] For example, the support assembly 20 can move vertically relative to the processing chamber 10, or rotate relative to the processing chamber 10, causing the substrate supported on the support assembly 20 to tilt. However, such a change in substrate position, deviating from the target position, can easily lead to a decrease in the yield of the finished product. The target position refers to the position where the support assembly should be located during substrate processing, where substrate processing will produce a finished product that meets the required specifications. For example, when the substrate processing equipment 1 is a chemical vapor deposition equipment, and the support assembly 20 changes position, deviating from the target position, it can easily cause a decrease in the uniformity of the deposited film thickness, thereby affecting the quality of the film.

[0042] Normally, changes in the position of the support assembly 20 supporting the substrate are only discovered during troubleshooting after the substrate has been processed. When adjusting the state of the support assembly 20, operators often need to open the cavity 100 of the substrate processing equipment 1 for measurement, which not only increases the complexity of the operation but may also cause equipment downtime, thereby affecting production efficiency.

[0043] In view of this, the substrate processing apparatus 1 provided in this application embodiment further includes a detection device 30 and a control device 40. The detection device 30 includes an emitting component 300, a reflector 301, and a receiving component 302. The emitting component 300 is disposed in the processing chamber 10 and is used to emit a light beam. The reflector 301 is disposed in the support component 20 and is used to receive and reflect the light beam from the emitting component 300. The receiving component 302 is disposed in the processing chamber 10 and is used to receive the light beam from the reflector 301. The control device 40 is connected to the receiving component 302 and is used to process the position information of the light beam in the receiving component 302 and to obtain the position change of the support component 20 relative to the processing chamber 10 based on the position information.

[0044] In this embodiment, the detection device 30 includes a transmitting component 300, a reflector 301, and a receiving component 302. The transmitting component 300 is fixedly mounted in the processing chamber 10 and transmits a light beam to the reflector 301. The reflector 301 is mounted on the support component 20 and reflects the light beam emitted by the transmitting component 300 to the receiving component 302. During the movement of the support component 20 relative to the processing chamber 10, the reflector 301, being fixed to the support component 20, moves with the support component 20 relative to the processing chamber 10. The receiving component 302 receives the light beam reflected from the reflector 301 and converts it into position information. As the reflector 301 moves with the support component 20 relative to the processing chamber 10, the position information of the light beam in the receiving component 302 changes, allowing the control device 40 to communicate with the receiving component 302, process the position information of the light beam in the receiving component 302, and thus acquire the position change of the support component 20 relative to the processing chamber 10, thereby monitoring the position change of the support component 20.

[0045] In summary, the detection device 30 and the control device 40 work together to detect the position information of the support component 20, thereby monitoring the positional changes of the support component 20 relative to the processing chamber 10. This allows for timely detection of positional deviations in the support component 20, avoiding the cumbersome process of opening the equipment cavity 100 for measurement and improving the operational efficiency of the substrate processing equipment 1. Furthermore, upon detecting a positional deviation in the support component 20, operators can promptly correct its position, improving the yield rate of finished products produced by the substrate processing equipment 1.

[0046] When the substrate processing equipment 1 includes a chemical vapor deposition equipment, namely the detection device 30 and the control device 40 are applied to the chemical vapor deposition equipment, the thickness uniformity of the deposited film can be improved by timely detection of the positional deviation of the support component 20, thereby improving the quality of the film.

[0047] In some embodiments, combined with Figure 1 As shown, the transmitting component 300, the reflector 301, and the receiving component 302 are all located outside the cavity 100. The cavity 100 is a space for processing the substrate. In this embodiment, by placing the transmitting component 300, the reflector 301, and the receiving component 302 outside the cavity 100, interference from the complex environment inside the cavity 100 (such as gas flow and temperature fluctuations) during substrate processing is avoided, ensuring the detection accuracy and stability of the detection device 30.

[0048] In some embodiments, combined with Figure 1 As shown, the support assembly 20 includes a carrier 200 and a support rod 201. The carrier 200 is located inside the cavity 100, and the support rod 201 is disposed through the bottom wall of the processing chamber 10, with one end of the support rod 201 connected to the carrier 200. The transmitting assembly 300 and the receiving assembly 302 are disposed on the bottom wall, and the reflector 301 is disposed on the support rod 201, with the reflector 301 located on the side of the bottom wall away from the cavity 100.

[0049] In this embodiment, the carrier 200 is located inside the cavity 100 and is used to support the substrate, ensuring the substrate remains stable during processing. The support rod 201 penetrates the bottom wall of the processing chamber 10, with one end connected to the carrier 200 and the other end extending outside the cavity 100. The transmitting assembly 300 and the receiving assembly 302 are located on the outer side of the bottom wall of the processing chamber 10 to avoid direct corrosion of the detection device 30 by high temperatures and chemical gases during the substrate reaction process, extending the service life of the detection device 30. Simultaneously, they avoid interference from environmental factors such as gas flow and temperature fluctuations on the light beam, ensuring the detection accuracy and stability of the detection device 30. The reflector 301 is fixed to the outside of the support rod 201 (i.e., the portion of the support rod 201 located outside the cavity 100) to ensure that the reflector 301 can move stably with the movement of the support rod 201, while avoiding damage to the reflector 301 from high temperatures and chemical gases inside the cavity 100, improving the long-term stability of the detection device 30.

[0050] Of course, in some embodiments, the transmitting component 300, the reflector 301, and the receiving component 302 may also be disposed inside the cavity 100. This application does not limit this aspect.

[0051] Figure 2 This is a structural diagram of another substrate processing device provided in an embodiment of this application. For example, when the transmitting component 300, the reflector 301, and the receiving component 302 are disposed inside the cavity 100, the transmitting component 300 and the receiving component 302 are disposed on the bottom wall, the reflector 301 is disposed on the support member 200, and the reflector 301 is located on the side of the support member 200 facing the bottom wall.

[0052] In some embodiments, combined with Figure 1 As shown, the plane containing the reflector 301 is perpendicular to the extending direction of the support rod 201. For example, the reflector 301 can be a mirror. Here, the plane containing the reflector 301 can be understood as the reflecting surface of the mirror. In this embodiment, by defining the plane containing the reflector 301 as perpendicular to the extending direction of the support rod 201, the path of the light beam is ensured to be stable during reflection, reducing beam deflection caused by angular deviation of the reflector 301, and improving the detection reliability of the detection device 30.

[0053] Figure 3 This is a top view of a substrate processing apparatus provided in an embodiment of this application. The dashed lines indicate the projected positions of each component in the detection device 30 within the substrate processing apparatus in this top view. In some embodiments, combined with... Figure 1 and Figure 3 As shown, at least a portion of the orthographic projection of the reflector 301 onto the processing chamber 10 is located between the transmitting assembly 300 and the receiving assembly 302.

[0054] In this embodiment, by defining at least a portion of the orthographic projection of the reflector 301 onto the processing chamber 10 between the transmitting component 300 and the receiving component 302, it is ensured that the reflector 301 can stably reflect the light beam emitted by the transmitting component 300 to the receiving component 302, while reducing the deflection path of the light beam, reducing optical path loss and error, and further improving the reliability of the detection device 30.

[0055] It should be noted that the shape of the reflector 301 in the illustrations of this application is only schematic. Based on the actual product equipment, the shape of the reflector 301 may be different. Therefore, in the above embodiments, the plane on which the reflector 301 is located can be understood as the reflecting surface of the reflector 301, that is, the plane on which the reflector 301 is used to reflect the light beam. The orthographic projection of the reflector 301 in the processing chamber 10 can be understood as the orthographic projection of the reflecting surface of the reflector 301 in the processing chamber 10.

[0056] In some embodiments, combined with Figure 1 As shown, the angle between the light emission direction of the emitting component 300 and the plane on which the emitting component 300 is located is an acute angle. For example, the angle between the light emission direction of the emitting component 300 and the plane on which the emitting component 300 is located can be 45°. It should be noted that in this embodiment, the specific value of the acute angle is not limited, as long as it is greater than 0° and less than 90°.

[0057] The transmitting component 300 and the receiving component 302 are spaced apart on the bottom wall of the processing chamber 10, meaning that the planes on which the transmitting component 300 and the receiving component 302 are located are parallel to each other. In this embodiment, by defining an acute angle between the light emission direction of the transmitting component 300 and the plane on which the transmitting component 300 is located, it is ensured that the light beam is emitted at an angle. The light beam emitted by the transmitting component 300 can be stably reflected to the receiving component 302 by the reflector 301, ensuring that the light beam has a smooth path during emission, reflection, and reception, and further ensuring the reliability of the detection device 30.

[0058] Figure 4 This is a schematic diagram illustrating the position of a reflected light beam received by a receiving component according to an embodiment of this application. The black squares represent light spots formed on the receiving component 302 when the reflected light beam illuminates it. The dashed lines with single arrows indicate the direction of movement of the light spot. Each white square represents a pixel. In specific applications, the number of pixels the light spot moves corresponds to the distance the reflected light beam moves on the receiving component 302. The correspondence between the number of pixels and the moving distance depends on the pixel size of a single pixel in the actual product device. For example, the pixel size is 3μm (micrometers), meaning that for every pixel the light spot moves, the reflected light beam moves 3μm on the receiving component 302. Figure 4As shown, the light spot moves from position P0 to P1, a total of 5 pixels, corresponding to a 15μm movement distance of the reflected beam on the receiving component 302. x1 This represents the distance between the light spot positions P0 and P1. At this point, d x1 It is 15μm.

[0059] In one embodiment, the transmitting component 300, the reflector 301, and the receiving component 302 are all located outside the cavity 100. Figure 1 and Figure 3 As shown, the transmitting component 300 and the receiving component 302 are spaced apart on the bottom wall of the processing chamber 10. A reflector 301 is located at the end of the support rod 201 outside the cavity 100, and the plane of the reflector 301 is perpendicular to the extending direction of the support rod 201. The orthographic projection of the reflector 301 onto the processing chamber 10 lies between the transmitting component 300 and the receiving component 302. The angle between the light emission direction of the transmitting component 300 and the plane of the transmitting component 300 forms an acute angle. During the operation of the detection device 30, the transmitting component 300 continuously emits a light beam, which is reflected by the reflector 301 to the receiving component 302.

[0060] Combination Figure 1 and Figure 4 As shown, the receiving component 302 receives the light beam reflected by the reflector 301 and displays the position of receiving the reflected light beam in the form of a light spot, i.e., the position where the reflected light beam illuminates the receiving component 302. When the support component 20 moves, i.e., its position changes, the reflector 301 changes position accordingly. This change in the position of the reflector 301 causes a change in the incident angle of the light beam on the reflector 301 and / or a change in the distance between the reflector 301 and the receiving component 302, thereby causing a change in the position where the receiving component 302 receives the reflected light beam, i.e., a change in the position of the light spot in the receiving component 302. For example, as... Figure 4 As shown, as the position of the reflector 301 changes, the light spot moves to the left from position P0 to P1.

[0061] In summary, given the initial position of the support component 20 and the known angle between the light emission direction of the emitting component 300 and the plane where the emitting component 300 is located, by analyzing the changes in the position information of the light beam in the receiving component 302, i.e. the changes in the position information of the light spot in the receiving component 302, the position change of the support component 20 relative to the processing chamber 10, including changes in height or tilt angle, can be obtained.

[0062] Figure 5 This is a schematic diagram illustrating the principle of a detection device for detecting changes in the height of a support component, as provided in an embodiment of this application.

[0063] To facilitate comparison of the relative positions of the reflectors before and after movement, 301a represents the reflector before movement, and 301b represents the reflector after movement. The dashed line with an arrow indicates the optical path corresponding to the beam reflected by the reflector 301a before movement, and the solid line with an arrow indicates the optical path corresponding to the beam reflected by the reflector 301b after movement. P0 represents the position on the receiving component 302 where the beam reflected by the reflector 301a before movement is projected. P1 represents the position on the receiving component 302 where the beam reflected by the reflector 301b after movement is projected.

[0064] Specifically, in combination Figure 1 , Figure 4 and Figure 5 As shown, when the support assembly 20 is in the initial position, the light beam emitted by the emitting assembly 300 passes through the reflector 301 (see Figure 1). Figure 5 After reflection by the reflector 301a), the position of the light spot projected by the receiving component 302 is P0.

[0065] When the support component 20 rises d relative to its initial position y At that time, the support assembly 20 drives the reflector 301 to rise along the extension direction of the support rod 201. y ,like Figure 5 The beam rises from position 301a to position 301b. At this time, the beam emitted by the emitting component 300 passes through the reflector 301 (see...). Figure 5 After reflection by the reflector 301b), the position of the light spot projected by the receiving component 302 is P1. By comparing the positions of the light spots P1 and P0, the positional change of the supporting component 20 relative to its initial position can be obtained.

[0066] When the reflected beam moves along the direction from the receiving component 302 toward the transmitting component 300 at the position of the light spot projected by the receiving component 302 (e.g.) Figure 4 When the reflected beam moves to the left (as indicated by the dotted line with the arrow), the support component 20 rises relative to its initial position. Conversely, when the reflected beam moves along the direction from the emitting component 300 towards the receiving component 302 at the position of the light spot projected by the receiving component 302, the support component 20 falls relative to its initial position. For example, Figure 4 When the light spot moves to the left, the support component 20 rises relative to its initial position; when the light spot moves to the right, the support component 20 falls relative to its initial position.

[0067] Furthermore, d x1 This represents the distance between the light spot positions P0 and P1. By calculating trigonometric functions, we can obtain... Right now This enables the detection of height changes of the support component 20 relative to the processing chamber 10. For example, Figure 4The light spot moves from position P0 to P1, corresponding to the reflected beam moving a distance d on the receiving component 302. x1 The value is 15μm. Let θ be the angle between the light emission direction of the emitting component 300 and the plane in which the emitting component 300 is located. When θ is 45°, the distance that the support component 20 rises relative to the processing chamber 10 is 7.5μm.

[0068] Figure 6 This is a schematic diagram illustrating the principle of a detection device for detecting changes in the tilt angle of a support component, as provided in an embodiment of this application.

[0069] To facilitate comparison of the relative positions of the reflectors before and after rotation, 301a represents the reflector before rotation, and 301b represents the reflector after rotation. The dashed line with an arrow indicates the optical path corresponding to the light beam reflected by the reflector 301a before rotation, and the solid line with an arrow indicates the optical path corresponding to the light beam reflected by the reflector 301b after rotation. P0 represents the position on the receiving component 302 where the light beam reflected by the reflector 301a before rotation is projected. P2 represents the position on the receiving component 302 where the light beam reflected by the reflector 301b after rotation is projected.

[0070] Specifically, in combination Figure 1 and Figure 6 As shown, when the support assembly 20 is in its initial position, the reflector 301 (see...) Figure 6 The distance h between the plane of the reflector 301a and the plane of the receiver 302 is known. The light beam emitted by the transmitter 300, after being reflected by the reflector 301a, is projected onto the receiver 302 at position P0. When the support assembly 20 rotates by an angle α relative to its initial position, it causes the reflector 301 to rotate by an angle α (see...). Figure 6 (The beam rotates from position 301a to position 301b). At this time, the beam emitted by the emitting assembly 300 passes through the reflector 301 (see...). Figure 6 After reflection by the reflector 301b), the position of the light spot projected by the receiving component 302 is P2. By comparing the positions of the light spots P2 and P0, the positional change of the support component 20 relative to the processing chamber 10 can be obtained.

[0071] When the reflected beam moves along the direction from the receiving component 302 toward the transmitting component 300 at the position of the light spot projected by the receiving component 302, such as Figure 4 As shown, when the light spot moves to the left, the support component 20 rotates toward the side where the emitting component 300 is located. At this time, as... Figure 6As shown, the support component 20 rotates counterclockwise relative to its initial position. Conversely, when the reflected beam moves along the direction from the transmitting component 300 toward the receiving component 302 at the position of the light spot projected by the receiving component 302, that is, when the light spot moves to the right, the support component 20 rotates toward the side where the receiving component 302 is located. The support component 20 rotates clockwise relative to its initial position.

[0072] Furthermore, as the support component 20 rotates relative to its initial position, the position information of the reflected beam on the receiving component 302 changes to d. x2 d x2 This represents the distance between the light spot positions P0 and P2. By calculating trigonometric functions, we can obtain... It can be seen that the position information of the reflected beam on the receiving component 302 changes by d. x2 It is determined by the tilt angle α, which realizes the conversion of the tilt state of the support component 20 into the movement of the light spot on the receiving component 302, thereby enabling the detection of the tilt angle change of the support component 20 relative to the initial position.

[0073] In some embodiments, the emitting component 300 includes a laser. The laser is used to emit laser light, which enables micrometer-level displacement measurement. In this embodiment, a laser is used to emit a laser beam to ensure the measurement accuracy of the detection device 30 by utilizing the high precision, strong directionality, and concentration of the laser.

[0074] In some embodiments, the emitting component 300 may further include an LED (Light Emitting Diode) collimated light source, such as an ultraviolet LED.

[0075] In some embodiments, the receiving component 302 includes a complementary metal-oxide-semiconductor (CMOS) sensor. A CMOS sensor is an image sensor that converts optical signals into electrical signals. In this embodiment, a CMOS sensor is used for beam capture to leverage its fast readout speed, high dynamic range, and low noise characteristics, enabling rapid conversion of optical signals into high-quality images.

[0076] In some embodiments, the pixel size of the image generated by the complementary metal-oxide-semiconductor sensor is 3 μm (micrometers), such as Figure 1 , Figure 4 and Figure 5 As shown, in the image generated by the complementary metal-oxide-semiconductor sensor, the distance the light spot moves by one pixel corresponds to a movement of 3 μm. Therefore, the height d that the support component 20 rises or falls relative to its initial position is... yThe relationship between the number of pixels p that the light spot moves in the image is: Then d y =3p. Based on the correspondence between pixel size and moving distance, the height change detection of the micrometer-level support component 20 was achieved.

[0077] In some embodiments, combined with Figure 1 , Figure 4 and Figure 6 As shown, the pixel size of the image generated by the complementary metal-oxide-semiconductor sensor is 3μm, and the distance h between the plane of the reflector 301 and the plane of the receiver 302 is 200mm. When the support assembly 20 rotates by an angle α = 0.01° relative to its initial position, the position information of the reflected beam on the receiver 302 changes as d. x2 The aperture is approximately 13.9 μm, equivalent to about 5 pixels. Therefore, for every pixel the light spot moves in the image, the corresponding tilt angle change is less than 0.01°. The detection device 30 provided in this application can achieve a tilt angle resolution better than 0.01°, realizing high-precision tilt angle change detection.

[0078] In some embodiments, the receiving component 302 may further include a position sensitive detector (PSD) or a CCD (charge-coupled device) image sensor.

[0079] In some embodiments, combined with Figures 1 to 3 As shown, there are multiple detection devices 30, including a first detection device 30a and a second detection device 30b. The transmitting component 300 in the first detection device 30a points in the direction of the receiving component 302, which intersects with the direction of the transmitting component 300 in the second detection device 30b pointing in the direction of the receiving component 302.

[0080] For ease of introduction, in the following embodiments, the transmitting component 300 in the first detection device 30a is named the first transmitting component 300a, and the receiving component 302 in the first detection device 30a is named the first receiving component 302a; the transmitting component 300 in the second detection device 30b is named the second transmitting component 300b, and the receiving component 302 in the second detection device 30b is named the second receiving component 302b.

[0081] In this embodiment, multiple detection devices 30 are used. Increasing the number of detection devices 30 improves the accuracy of the substrate processing device 1 in detecting changes in the position of the support component 20. The multiple detection devices 30 include a first detection device 30a and a second detection device 30b. The first transmitting component 300a in the first detection device 30a points in the direction of the first receiving component 302a, and intersects with the direction of the second transmitting component 300b in the second detection device 30b, which points in the direction of the second receiving component 302b. This intersecting arrangement further distinguishes whether the change in the position of the support component 20 is caused by a change in height or a change in tilt angle. For example, if the reflected beam moves the same distance and in the same direction (either from the transmitting component 300 to the receiving component 302 or from the receiving component 302 to the transmitting component 300) during a change in the position information of the receiving component 302, it indicates that the height of the support component 20 has changed; otherwise, it indicates that the tilt angle of the support component 20 has changed.

[0082] Specifically, when the height of the support component 20 changes, the position information of the reflected beam in the first receiving component 302a changes to d. x1 The position information of the reflected beam in the second receiving component 302b changes to d. x1 ", then d x1 ′=d x1 ", and the direction of position change of the reflected beam in the first detection device 30a is from the first transmitting component 300a to the first receiving component 302a, and the direction of position change of the reflected beam in the second detection device 30b is from the second transmitting component 300b to the second receiving component 302b, or, the direction of position change of the reflected beam in the first detection device 30a is from the first receiving component 302a to the first transmitting component 300a, and the direction of position change of the reflected beam in the second detection device 30b is from the second receiving component 302b to the second transmitting component 300b. Figure 4 As shown, the light spots either all move to the left or all move to the right. Figure 4 The dotted lines with arrows in the middle point in the same direction.

[0083] Furthermore, this can be achieved by calculating d. x1 ′ and d x1 The average value of " Other The height change d of the support component 20 relative to its initial position is calculated. y By averaging the detection values ​​from multiple detection devices 30, the height change of the support component 20 is obtained, thus avoiding the decrease in detection accuracy caused by the error of a single detection result and improving the overall detection accuracy and reliability of the substrate processing equipment 1.

[0084] Specifically, when the tilt angle of the support component 20 changes, the position information of the reflected beam in the first receiving component 302a changes to d. x2 The position information of the reflected beam in the second receiving component 302b changes to d. x2 ", then d x2 ′≠d x2 Alternatively, when the directions of position change of the reflected beam in the first receiving component 302a and the second receiving component 302b are different, the first transmitting component 300a points to the first receiving component 302a, and the second transmitting component 300b points to the second receiving component 302b; or, they are not simultaneously the first receiving component 302a pointing to the first transmitting component 300a, and the second receiving component 302b pointing to the second transmitting component 300b. Figure 4 As shown, the light spot does not move to the left at the same time or to the right at the same time. Figure 4 The dotted lines with arrows point in different directions.

[0085] Furthermore, based on the number of pixels whose light spots move in the first receiving component 302a and the second receiving component 302b, i.e., the distance change of the reflected light beams in the first receiving component 302a and the second receiving component 302b, the tilt angle change of the support component 20 relative to its initial position in the first direction and the second direction can be calculated respectively, thereby realizing the detection of the tilt angle change of the support component 20 in different directions. Here, the first direction refers to the direction from the first transmitting component 300a to the first receiving component 302a, and the second direction refers to the direction from the second transmitting component 300b to the second receiving component 302b. For example, the number of pixels whose light spots move in the receiving component of the i-th detection device is p. i Let i take values ​​of 1, 2, 3...n, where n is the number of detection devices. Then, in the i-th direction, the tilt angle of the support component relative to its initial position changes... The i-th direction refers to the direction in which the transmitting component points to the receiving component in the i-th detection device.

[0086] In some embodiments, combined with Figures 1 to 3 As shown, the receiving components 302 of different detection devices 30 are located in the same plane. In this embodiment, the receiving components 302 of different detection devices 30 are located in the same plane. This coplanar arrangement allows multiple receiving components 302 to be in the same coordinate system, thereby simplifying the geometric relationship of the beam transmission path and improving the efficiency of the detection device 30 in detecting changes in position. At the same time, it reduces the loss or deviation of different optical paths caused by spatial height differences, and improves the detection reliability of the detection device 30.

[0087] In some embodiments, combined with Figures 1 to 3As shown, the emitting components 300 of different detection devices 30 are located in the same plane. In this embodiment, the emitting components 300 of different detection devices 30 are located in the same plane. This coplanar arrangement allows multiple emitting components 300 to be in the same coordinate system, thereby simplifying the geometric relationship of the beam transmission path and improving the efficiency of the detection device 30 in detecting changes in position. At the same time, it reduces the loss or deviation of different optical paths caused by spatial height differences, improving the detection reliability of the detection device 30.

[0088] In some embodiments, combined with Figures 1 to 3 As shown, different detection devices 30 share the same reflector 301. Changes in the position of the reflector 301 indicate changes in the position of the support assembly 20. In this embodiment, by having different detection devices 30 share the same reflector 301, the structural layout is simplified and structural costs are reduced. Simultaneously, by sharing the reflector 301, it is ensured that different detection devices 30 detect the same point representing changes in the position of the support assembly 20, thus accurately representing changes in the position of the support assembly 20 and avoiding deviations in detection results caused by errors in the height or angle of multiple reflectors 301, which would reduce detection accuracy.

[0089] In some embodiments, combined with Figure 1 and Figure 2 As shown, the substrate processing equipment 1 also includes a display device 50. The display device 50 is connected to the control device 40 and is used to display the positional change information of the support component 20 relative to the processing chamber 10 acquired by the control device 40. In this embodiment, by adding the display device 50, the positional change of the support component 20 relative to the processing chamber 10 is visualized, allowing operators to observe the degree of positional change of the support component 20 relative to the processing chamber 10 in a timely manner, thereby enabling timely correction of the position of the support component 20 and ensuring the yield rate of the finished products produced by the substrate processing equipment 1. Furthermore, the display device 50 can also, through communication with the control device 40, display the adjustment results of the support component 20 in real time during the operator's adjustment process, assisting the operator in quickly adjusting the position of the support component 20 to a suitable position, further improving the operational convenience and efficiency of the substrate processing equipment 1.

[0090] In some embodiments, combined with Figure 1 and Figure 2 As shown, the substrate processing apparatus 1 also includes a drive device 60. The output end of the drive device 60 is connected to the support assembly 20 and is used to drive the support assembly 20 to move relative to the processing chamber 10. In this embodiment, the output end of the drive device 60 refers to the power output end of the drive device 60. The drive device 60 is used to provide power to drive the support assembly 20 to move relative to the processing chamber 10, so as to ensure the stability of the movement of the support assembly 20 relative to the processing chamber 10.

[0091] In some embodiments, the drive device 60 is connected to the control device 40, enabling the control device 40 to control the drive device 60 to move the support component 20 after receiving a change in the position of the support component 20 relative to the processing chamber 10, through a communication connection with the drive device 60, so that the support component 20 returns to its initial position or moves to a suitable position. The communication connection between the drive device 60 and the control device 40 enables the control device 40 to effectively control the drive device 60, avoiding the need for manual adjustment of the support component 20 by the operator, further improving the ease of operation and efficiency of the substrate processing equipment 1.

[0092] In some embodiments, combined with Figure 1 and Figure 2 As shown, the driving device 60 includes a stepper motor 600 and a screw rod 601. One end of the screw rod 601 is connected to the stepper motor 600, and the other end is connected to the support assembly 20. In this embodiment, the stepper motor 600 provides power to drive the screw rod 601. The screw rod 601 converts the rotational motion of the stepper motor 600 into linear motion of the support assembly 20, thereby causing the support assembly 20 to move relative to the processing chamber 10. The combination of the stepper motor 600 and the screw rod 601 effectively drives the support assembly 20. In this embodiment, the control device 40 can be connected to the stepper motor 600 to effectively control the driving device 60.

[0093] In some embodiments, combined with Figure 1 and Figure 2 As shown, the substrate processing equipment 1 also includes a guiding device 70. The guiding device 70 is connected to both the driving device 60 and the support assembly 20, and is used to guide the support assembly 20 to move along the extension direction of the support rod 201. In this embodiment, by setting the guiding device 70 to guide the support assembly 20 to move along the extension direction of the support rod 201, large-scale tilting deviations of the support assembly 20 during movement are avoided, thus improving the operational reliability of the substrate processing equipment 1. In this embodiment, the guiding device 70 is connected to the end of the helical rod 601 away from the stepper motor 600 and the end of the support rod 201 away from the carrier member 200, respectively, to achieve effective connection between the guiding device 70, the driving device 60, and the support assembly 20.

[0094] In some embodiments, combined with Figure 1 and Figure 2As shown, the guiding device 70 includes a slide rail 700 and a slider 701. The slide rail 700 is connected to the processing chamber 10 and extends along the extension direction of the support rod 201. The slider 701 is slidably disposed on the slide rail 700 and is connected to the support assembly 20 and the driving device 60. In this embodiment, the slider 701 is connected to the driving device 60 and the support assembly 20 so that it moves along the slide rail 700 relative to the processing chamber 10 under the drive of the driving device 60, thereby driving the support assembly 20 to move relative to the processing chamber 10, thus guiding the support assembly 20 to move along the extension direction of the support rod 201.

[0095] Figure 7 This is a schematic diagram illustrating a control method for a substrate processing apparatus provided in an embodiment of this application. Figure 7 As shown, in conjunction with the substrate processing equipment 1 described in the above embodiments, the control method of the substrate processing equipment includes:

[0096] S711, obtain the initial position of the light spot in the receiving component.

[0097] In this step, the initial position of the light spot refers to the position of the light beam emitted by the transmitting component after reflection by the reflector, projected onto the receiving component when the supporting component is located at the target position. The target position refers to the theoretical position where the supporting component should be located during substrate processing to meet the required substrate processing needs. Obtaining the initial position of the light spot in the receiving component includes: adjusting the supporting component to the target position; controlling the transmitting component to emit the light beam; and obtaining the position of the light spot projected onto the receiving component after reflection by the reflector as the initial position.

[0098] S712, obtain the position change information of the light spot in the receiving component relative to the initial position.

[0099] In this step, the position change information of the light spot relative to the initial position includes the distance the light spot has moved relative to the initial position and the direction of movement of the light spot relative to the initial position. When the support component changes position relative to the target position, the reflector will change along with the support component. At this time, the position of the light spot received by the receiving component will be displaced relative to the initial position.

[0100] S713 determines the positional deviation of the support component based on the positional change information.

[0101] In this step, the positional deviation of the support component includes either height deviation or tilt angle deviation. Determining the positional deviation of the support component based on the positional change information includes: when the light spot's movement distance relative to its initial position is the same and the movement direction is either from the transmitting component to the receiving component or from the receiving component to the transmitting component, determining the height deviation of the support component based on the movement distance of the light spot relative to its initial position; when the light spot's movement distance relative to its initial position is different, or when the movement direction is different (either from the transmitting component to the receiving component or from the receiving component to the transmitting component), determining the tilt angle deviation of the support component based on the movement distance of the light spot relative to its initial position. The determination of the height deviation or tilt angle deviation of the support component based on the movement distance of the light spot relative to its initial position can be referenced to the height change value d in the above embodiment. y The calculation process or tilt angle change α i The calculation process will not be elaborated here.

[0102] In the control method for the substrate processing equipment provided in this application embodiment, the executing entity can be a control device within the substrate processing equipment. By executing the aforementioned program instructions through the control device, the positional deviation of the support components is automatically determined, thereby improving the automation level and user experience of the substrate processing equipment.

[0103] After determining the positional deviation of the support component, the control method of the substrate processing equipment further includes sending the positional deviation to a display device for display. In this step, by sending the positional deviation to the display device for display, the operator can intuitively obtain the positional deviation of the support component, thereby enabling timely correction of the support component's position.

[0104] After determining the positional deviation of the support component, the control method of the substrate processing equipment further includes: comparing the positional deviation with a corresponding deviation threshold; executing step S712 when the positional deviation is less than the corresponding deviation threshold; and sending a warning message when the positional deviation is greater than or equal to the corresponding deviation threshold. In this embodiment, the deviation threshold is a tolerable, allowable height deviation threshold or tilt angle deviation threshold preset by the operator according to the substrate processing requirements. For example, the height deviation threshold is ±0.05 mm, and the tilt angle deviation threshold is ±0.02°. By setting the deviation threshold, the substrate processing equipment can automatically monitor the positional deviation of the support component, avoiding the process of manually monitoring the positional deviation data and further improving the user experience of the substrate processing equipment.

[0105] When the positional deviation is greater than or equal to the corresponding deviation threshold, the control method of the substrate processing equipment further includes: adjusting the position of the support component to return the light spot in the receiving component to its initial position. In this embodiment, when the positional deviation is greater than or equal to the corresponding deviation threshold, the position of the support component is adjusted by controlling the driving device to return the light spot in the receiving component to its initial position, thus automatically correcting the positional deviation of the support component. This further improves the automation level, operating efficiency, and user experience of the substrate processing equipment.

[0106] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A substrate processing apparatus (1), characterized in that, The substrate processing equipment (1) includes a processing chamber (10) and a support assembly (20). The processing chamber (10) surrounds a cavity (100). One end of the support assembly (20) passes through the processing chamber (10) and extends into the cavity (100). The support assembly (20) is movable relative to the processing chamber (10). The substrate processing equipment (1) also includes a detection device (30) and a control device (40). The detection device (30) includes: A emitting assembly (300) is disposed in the processing chamber (10), the emitting assembly (300) being used to emit a light beam; A reflector (301), disposed on the support assembly (20), is used to receive and reflect the light beam from the emitting assembly (300); A receiving component (302), disposed in the processing chamber (10), is used to receive the light beam from the reflector (301); The control device (40) is connected to the receiving component (302) and is used to process the position information of the beam in the receiving component (302) and obtain the position change of the support component (20) relative to the processing chamber (10) based on the position information.

2. The substrate processing apparatus (1) according to claim 1, characterized in that, The transmitting component (300), the reflector (301), and the receiving component (302) are all located outside the cavity (100).

3. The substrate processing apparatus (1) according to claim 1 or 2, characterized in that, The support assembly (20) includes a carrier (200) and a support rod (201). The carrier (200) is located inside the cavity (100). The support rod (201) is disposed through the bottom wall of the processing chamber (10), and one end of the support rod (201) is connected to the carrier (200). The transmitting component (300) and the receiving component (302) are disposed on the bottom wall, the reflector (301) is disposed on the support rod (201), and the reflector (301) is located on the side of the bottom wall away from the cavity (100).

4. The substrate processing apparatus (1) according to claim 3, characterized in that, The plane containing the reflector (301) is perpendicular to the extension direction of the support rod (201).

5. The substrate processing apparatus (1) according to claim 1 or 2, characterized in that, The reflector (301) is located at least a portion of its orthographic projection onto the processing chamber (10) between the transmitting assembly (300) and the receiving assembly (302).

6. The substrate processing apparatus (1) according to claim 1 or 2, characterized in that, The angle between the light emission direction of the emitting component (300) and the plane in which the emitting component (300) is located is an acute angle.

7. The substrate processing apparatus (1) according to claim 1 or 2, characterized in that, The number of detection devices (30) is multiple, and the multiple detection devices (30) include a first detection device (30a) and a second detection device (30b). The transmitting component (300) in the first detection device (30a) points in the direction of the receiving component (302), which intersects with the direction of the transmitting component (300) in the second detection device (30b) pointing in the direction of the receiving component (302).

8. The substrate processing apparatus (1) according to claim 7, characterized in that, The receiving components (302) of the different detection devices (30) are located in the same plane; and / or, The emission components (300) of different detection devices (30) are located in the same plane.

9. The substrate processing apparatus (1) according to claim 7, characterized in that, Different detection devices (30) share the same reflector (301).

10. The substrate processing apparatus (1) according to claim 1 or 2, characterized in that, The emitting component (300) includes a laser; and / or, The receiving component (302) includes a complementary metal-oxide-semiconductor sensor.

11. The substrate processing apparatus (1) according to claim 1 or 2, characterized in that, The substrate processing equipment (1) includes a chemical vapor deposition equipment.

Images