High-pressure spray tank of wafer electroplating equipment

Abstract

The utility model discloses a high-pressure spray tank of wafer electroplating equipment, relates to the technical field of electroplating processing, and provides the following scheme for solving the problems proposed in the background technology: the high-pressure spray tank comprises a spray tank body, an end cover is lapped on the upper surface of the spray tank body, and a servo motor is fixedly connected on the upper surface of the end cover; and the inner top wall of the end cover is rotationally connected with a plurality of uniform assemblies, the right side of the spraying tank body is fixedly connected with a spraying assembly, and the left side of the spraying tank body is provided with a recycling assembly. According to the uniform spraying device, the uniform assembly and the spraying assembly are arranged in a matched mode, spraying operation can be completed on electroplated parts through a plurality of high-pressure sprayers when the uniform spraying device is used, the servo motor can be matched with a plurality of sets of transmission chain wheels and chains, a plurality of sets of circular shafts are driven to rotate at the same time, and the electroplated parts hung on the hanging rods can rotate at a constant speed; and it is ensured that no spraying dead angle exists on the surface of the electroplated part, and the spraying effect on the electroplated part is better.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to a high-pressure spray tank for wafer electroplating equipment. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It utilizes electrolysis to coat the surface of metal or other material parts with a metal film, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhancing aesthetics. In the semiconductor circuit manufacturing process, silicon wafers require electroplating during production. A thin metal film, such as copper or aluminum, is deposited on the wafer surface using electrochemical methods as a conductive layer. This determines the performance, power consumption, reliability, and manufacturing cost of semiconductor products. The electroplating process requires control of parameters such as current density, plating time, and temperature to ensure the quality and uniformity of the metal film; therefore, a spraying operation is necessary for electroplated parts during production.

[0003] Currently, when high-pressure spray tanks are used to spray electroplated parts, the parts are usually placed in a tray before being placed into the spray tank. Spray heads with fixed positions spray the parts in the tray. Because the parts are fixed in position and cannot be moved, the spray heads can only spray one side of the parts, which can easily lead to spray dead zones. This results in uneven spraying of the surface of the parts and reduces the spraying effect. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a high-pressure spray tank for wafer electroplating equipment.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-pressure spray tank for wafer electroplating equipment includes a spray tank body. An end cap is attached to the upper surface of the spray tank body. A servo motor is fixedly connected to the upper surface of the end cap. Several uniform components are rotatably connected to the inner top wall of the end cap. A spray component is fixedly connected to the right side of the spray tank body, and a recycling component is installed on the left side of the spray tank body. The uniform component includes a circular shaft. A bracket is fixedly connected to the bottom end of the circular shaft. A hanging rod is fixedly connected to the inner wall of the bracket. A transmission sprocket is fixedly connected to the surface of every two adjacent circular shafts, and a chain is driven between every two transmission sprockets.

[0007] Preferably, the output end of the servo motor extends to the lower surface of the end cap and is fixedly connected to the top end of any circular shaft.

[0008] Preferably, the spray assembly includes a liquid storage tank, an inlet pipe connected to the upper surface of the liquid storage tank, a delivery pump fixedly connected to the lower surface of the spray tank body, a suction pipe connected to the input end of the delivery pump, and a delivery pipe connected to the output end of the delivery pump.

[0009] Preferably, a diverter is fixedly connected to the inner bottom wall of the spray tank body, and a number of positioning tubes are fixedly connected to the top of the diverter. The surface of the positioning tubes is connected to a liquid outlet pipe, and a high-pressure nozzle is fixedly connected to the end of the liquid outlet pipe away from the positioning tube. The position of the high-pressure nozzle corresponds to the position of the bracket.

[0010] Preferably, the end of the liquid extraction pipe away from the delivery pump is connected to the interior of the liquid storage tank, and the end of the liquid delivery pipe away from the delivery pump extends into the interior of the spray tank body and is connected to the interior of the distributor.

[0011] Preferably, the recycling component includes a filter frame, with mounting plates fixedly connected to both the front and back of the filter frame. Positioning bolts are threaded onto the left side of both mounting plates. The left side of the spray tank body is connected to the interior of the filter frame via a return pipe. A vertical pipe is fixedly connected to the lower surface of the filter frame. A recycling box is fixedly connected to the lower surface of the spray tank body. The bottom end of the vertical pipe is connected to the interior of the recycling box.

[0012] Preferably, the upper surface of the filter frame has a strip-shaped hole, and a strip plate is inserted into the inner wall of the strip-shaped hole. Two positioning posts are fixedly connected to the lower surface of the strip plate. Two hexagonal bolts are threaded onto the opposite sides of the two positioning posts. Support plates are fixedly connected to the opposite sides of the two positioning posts by the two hexagonal bolts. Filter screens are fixedly connected to the opposite sides of the two support plates. The vertical tube is located to the left of the filter screen.

[0013] The beneficial effects of this utility model are as follows:

[0014] By combining the uniform spraying and rinsing components, multiple high-pressure nozzles can spray the electroplated parts during operation. A servo motor, in conjunction with multiple sets of transmission sprockets and chains, simultaneously drives multiple circular shafts to rotate, ensuring the electroplated parts hanging on the mounting rod rotate at a uniform speed. This prevents any spray dead zones on the surface of the electroplated parts, resulting in better spraying performance. The recycling component recovers the electroplating agents after spraying, and the filter screen filters out impurities, ensuring the recovered agents are free of excessive impurities, leading to high energy efficiency. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a high-pressure spray tank for wafer electroplating equipment proposed in this utility model;

[0016] Figure 2This is a three-dimensional structural diagram of a uniform component in a high-pressure spray tank for wafer electroplating equipment proposed in this utility model.

[0017] Figure 3 This is a three-dimensional structural diagram of a distributor for a high-pressure spray tank in a wafer electroplating equipment proposed in this utility model.

[0018] Figure 4 This is a three-dimensional disassembled structural diagram of the filter frame of the high-pressure spray tank of a wafer electroplating equipment proposed in this utility model.

[0019] In the diagram: 1. Spray tank body; 2. End cap; 3. Servo motor; 4. Circular shaft; 5. Hanger; 6. Hanging rod; 7. Transmission sprocket; 8. Chain; 9. Storage tank; 10. Inlet pipe; 11. Transfer pump; 12. Suction pipe; 13. Delivery pipe; 14. Diverter; 15. Positioning pipe; 16. Outlet pipe; 17. High-pressure nozzle; 18. Filter frame; 19. Mounting plate; 20. Positioning bolt; 21. Vertical pipe; 22. Recovery box; 23. Strip plate; 24. Positioning column; 25. Hex bolt; 26. Support plate; 27. Filter screen. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Example:

[0022] Reference Figure 1-4 A high-pressure spray tank for wafer electroplating equipment includes a spray tank body 1, an end cap 2 overlapping the upper surface of the spray tank body 1, a servo motor 3 fixedly connected to the upper surface of the end cap 2, a plurality of uniform components rotatably connected to the inner top wall of the end cap 2, a spray component fixedly connected to the right side of the spray tank body 1, and a recycling component installed on the left side of the spray tank body 1. The uniform component includes a circular shaft 4, a bracket 5 fixedly connected to the bottom end of the circular shaft 4, a hanging rod 6 fixedly connected to the inner wall of the bracket 5, a transmission sprocket 7 fixedly connected to the surface of every two adjacent circular shafts 4, and a chain 8 drivingly connected between every two transmission sprockets 7.

[0023] The output end of the servo motor 3 extends to the lower surface of the end cover 2 and is fixedly connected to the top of any circular shaft 4. After the servo motor 3 is started, it can drive any circular shaft 4 to rotate. At this time, through the cooperation of multiple sets of transmission sprockets 7 and chains 8, multiple circular shafts 4 can rotate synchronously, thereby driving the bottom bracket 5 and hanging rod 6 to rotate, which facilitates the electroplating parts to rotate at a uniform speed, ensuring that the electroplating agent can be sprayed evenly on the surface of the electroplating parts, with higher uniformity and no spray dead corners.

[0024] The spray assembly includes a storage tank 9, with an inlet pipe 10 connected to the upper surface of the storage tank 9. A delivery pump 11 is fixedly connected to the lower surface of the spray tank body 1. A suction pipe 12 is connected to the input end of the delivery pump 11, and a delivery pipe 13 is connected to the output end of the delivery pump 11. A distributor 14 is fixedly connected to the inner bottom wall of the spray tank body 1. Several positioning pipes 15 are fixedly connected to the top of the distributor 14. An outlet pipe 16 is connected to the surface of the positioning pipe 15. A high-pressure nozzle 17 is fixedly connected to the end of the outlet pipe 16 away from the positioning pipe 15, and the position of the high-pressure nozzle 17 is relative to the hanging... Corresponding to the position of the frame 5, the end of the liquid extraction pipe 12 away from the delivery pump 11 is connected to the inside of the liquid storage tank 9, and the end of the liquid delivery pipe 13 away from the delivery pump 11 extends into the inside of the spray tank body 1 and is connected to the inside of the distributor 14. The delivery pump 11 can deliver the electroplating agent in the liquid storage tank 9 to the distributor 14 through the liquid extraction pipe 12 and the liquid delivery pipe 13, and spray it out through the positioning pipe 15, the liquid outlet pipe 16 and the high-pressure nozzle 17. In conjunction with the uniform component, it can ensure that the electroplated parts are in full contact with the electroplating agent, thereby improving the spraying effect on the electroplated parts.

[0025] The recycling assembly includes a filter frame 18, with mounting plates 19 fixedly connected to both the front and back of the filter frame 18. Positioning bolts 20 are threaded onto the left sides of both mounting plates 19. The left side of the spray tank body 1 is connected to the interior of the filter frame 18 via a return pipe. A vertical pipe 21 is fixedly connected to the lower surface of the filter frame 18. A recycling box 22 is fixedly connected to the lower surface of the spray tank body 1. The bottom end of the vertical pipe 21 is connected to the interior of the recycling box 22. A strip-shaped hole is formed on the upper surface of the filter frame 18. A strip plate 23 is inserted into the inner wall of the strip-shaped hole. Two positioning posts 24 are fixedly connected to the lower surface of the strip plate 23. Two hexagonal bolts 25 are threaded onto the opposite sides of the two positioning posts 24. The opposite faces of the two positioning posts 24 are connected by the two hexagonal bolts 25. A support plate 26 is fixedly connected, and a filter screen 27 is fixedly connected to the opposite side of the two support plates 26. The vertical pipe 21 is located to the left of the filter screen 27. The electroplating agent after spraying can enter the filter frame 18 through the return pipe. Due to the blocking effect of the filter screen 27, impurities can be retained in the filter frame 18, while the agent enters the recycling box 22 through the vertical pipe 21 for easy reuse. It can also ensure that the recycled agent is free of impurities, resulting in better recycling effect. When the filter screen 27 is damaged, simply pull the strip plate 23 upwards, and the filter screen 27 can be moved out by the two positioning posts 24. At this time, the two support plates 26 can be removed by tightening the four hexagonal bolts 25, so as to quickly replace the filter screen 27, which is highly flexible.

[0026] Working principle: First, the electroplating parts are hung using the various hangers 5 and hanging rods 6. After hanging, the end cap 2 is secured to the top of the spray tank body 1. At this time, the electroplating parts are positioned in front of the high-pressure nozzles 17. The delivery pump 11 is turned on, and the delivery pump 11 delivers the electroplating agent to the distributor 14 through the suction pipe 12 and the delivery pipe 13. The agent is then sprayed onto the surface of the electroplating parts through the positioning pipe 15, the outlet pipe 16, and the various high-pressure nozzles 17. Simultaneously, the servo motor 3 drives the circular shaft 4 to rotate. The circular shaft 4 drives the hangers 5 and hanging rods 6 to rotate through multiple sets of transmission sprockets 7 and chains 8, thereby driving the electroplating parts to rotate under the pressure of the high-pressure nozzles 17. The forward rotation allows the electroplated parts to be sprayed with electroplating agent from the high-pressure nozzle 17 from all directions, greatly improving the spraying effect and eliminating any dead spots. After spraying, the agent enters the filter frame 18 through the return pipe. Due to the blocking effect of the filter screen 27, some impurities remain in the filter frame 18, while the agent flows back to the recovery box 22 through the vertical pipe 21, which can separate impurities from the agent. When the filter screen 27 is damaged, it can be pulled out through the strip plate 23, and the two support plates 26 can be quickly removed using the four hexagonal bolts 25, so as to quickly replace the filter screen 27, which is highly flexible.

[0027] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-pressure spray tank for wafer electroplating equipment, comprising a spray tank body (1), characterized in that, The upper surface of the spray tank body (1) is covered with an end cap (2), and a servo motor (3) is fixedly connected to the upper surface of the end cap (2). Several uniform components are rotatably connected to the inner top wall of the end cap (2). A spraying component is fixedly connected to the right side of the spray tank body (1), and a recycling component is installed on the left side of the spray tank body (1). The uniform component includes a circular shaft (4), a bracket (5) is fixedly connected to the bottom end of the circular shaft (4), and a hanging rod (6) is fixedly connected to the inner wall of the bracket (5). A transmission sprocket (7) is fixedly connected to the surface of every two adjacent circular shafts (4), and a chain (8) is connected between every two transmission sprockets (7).

2. The high-pressure spray tank for wafer electroplating equipment according to claim 1, characterized in that, The output end of the servo motor (3) extends to the lower surface of the end cap (2) and is fixedly connected to the top of any circular shaft (4).

3. The high-pressure spray tank for wafer electroplating equipment according to claim 1, characterized in that, The spray assembly includes a storage tank (9), the upper surface of which is connected to an inlet pipe (10), and a delivery pump (11) is fixedly connected to the lower surface of the spray tank body (1). The input end of the delivery pump (11) is connected to a suction pipe (12), and the output end of the delivery pump (11) is connected to a delivery pipe (13).

4. The high-pressure spray tank for wafer electroplating equipment according to claim 1, characterized in that, A diverter (14) is fixedly connected to the inner bottom wall of the spray tank body (1). Several positioning tubes (15) are fixedly connected to the top of the diverter (14). A liquid outlet pipe (16) is connected to the surface of the positioning tube (15). A high-pressure nozzle (17) is fixedly connected to the end of the liquid outlet pipe (16) away from the positioning tube (15). The position of the high-pressure nozzle (17) corresponds to the position of the bracket (5).

5. The high-pressure spray tank for wafer electroplating equipment according to claim 3, characterized in that, The end of the liquid extraction pipe (12) away from the delivery pump (11) is connected to the interior of the liquid storage tank (9), and the end of the liquid delivery pipe (13) away from the delivery pump (11) extends into the interior of the spray tank body (1) and is connected to the interior of the diverter (14).

6. The high-pressure spray tank for wafer electroplating equipment according to claim 1, characterized in that, The recycling assembly includes a filter frame (18), with mounting plates (19) fixedly connected to both the front and back of the filter frame (18). Positioning bolts (20) are threaded onto the left side of both mounting plates (19). The left side of the spray tank body (1) is connected to the interior of the filter frame (18) via a return pipe. A vertical pipe (21) is fixedly connected to the lower surface of the filter frame (18). A recycling box (22) is fixedly connected to the lower surface of the spray tank body (1). The bottom end of the vertical pipe (21) is connected to the interior of the recycling box (22).

7. The high-pressure spray tank for wafer electroplating equipment according to claim 6, characterized in that, The filter frame (18) has a strip-shaped hole on its upper surface. A strip plate (23) is inserted into the inner wall of the strip-shaped hole. Two positioning posts (24) are fixedly connected to the lower surface of the strip plate (23). Two hexagonal bolts (25) are threaded onto the opposite sides of the two positioning posts (24). Support plates (26) are fixedly connected to the opposite sides of the two positioning posts (24) through the two hexagonal bolts (25). Filter screens (27) are fixedly connected to the opposite sides of the two support plates (26). The vertical tube (21) is located to the left of the filter screen (27).

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