Imaging device applied to chip material strip
By combining multiple light sources and using the adsorption structure of the light-transmitting tray, the problem of poor imaging effect in traditional machine vision inspection has been solved, realizing multi-dimensional high-precision imaging of chip strips and improving the clarity and stability of the inspection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GRAND INNOSYS CORP
- Filing Date
- 2025-04-27
- Publication Date
- 2026-05-15
AI Technical Summary
Traditional machine vision inspection is difficult to adapt to the complex working conditions of chip strips, especially due to poor imaging results caused by strip warping, deformation and color difference.
It adopts a multi-light source combination design, including an inner coaxial light source, an outer coaxial light source, a ring light source and a backlight source, combined with the adsorption structure of the light-transmitting plate, to achieve multi-dimensional high-precision imaging.
It improves the imaging clarity and detection stability of chip strips, enabling accurate detection of chip strips of different thicknesses and materials under complex optical conditions.
Smart Images
Figure CN224247617U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of detection and imaging technology, and in particular to an imaging device for use in chip strips. Background Technology
[0002] With the rapid development of integrated circuit technology driving chips towards miniaturization, multifunctionality, and increased complexity, the market demand for chip inspection accuracy and stability has significantly increased. Traditional manual visual inspection has been fully upgraded to machine vision inspection. However, due to limitations caused by manufacturing processes such as material warping, deformation, and color differences, vision systems using a single light source struggle to reliably capture defect features. Therefore, overcoming the limitations of existing technologies in adapting to complex working conditions has become an urgent problem to be solved. Utility Model Content
[0003] In order to overcome at least one of the defects described in the prior art, the present invention provides an imaging device for chip strips to solve the problem that existing machine vision inspection is difficult to adapt to current complex working conditions.
[0004] The present invention provides a technical solution to solve the problem. The present invention discloses an imaging device for chip strips, which includes a camera lens, an outer coaxial light source, a ring light source, a light-transmitting support plate and a backlight source arranged in sequence from top to bottom in the vertical direction. The camera lens is provided with an inner coaxial light source.
[0005] The tray is equipped with an adsorption structure for adsorbing and fixing the chip strip and keeping it flat. The inner coaxial light source and the outer coaxial light source both provide light sources that are perpendicular to the chip strip from top to bottom. The ring light source provides a ring light source that is inclined to the chip strip from top to bottom. The backlight source provides a light source that penetrates the tray and is perpendicular to the chip strip from bottom to top.
[0006] As an optional implementation, in this embodiment of the present invention, the power supply lines of the inner coaxial light source, the outer coaxial light source, the ring light source and the backlight are independently connected, and the independent lighting mode or the combined lighting mode is achieved by the controller.
[0007] As an optional implementation, in this embodiment of the present invention, the inner coaxial light source, the outer coaxial light source, the ring light source, and the backlight source are located on the same axis.
[0008] As an optional implementation, in this embodiment of the present invention, the external coaxial light source includes a hollow first shell, a first semi-transparent semi-reflective mirror, and a first light-emitting component. The first semi-transparent semi-reflective mirror is inclinedly disposed inside the first shell, and the first light-emitting component is disposed on the inner side of the first shell. The first light-emitting component emits light toward the first semi-transparent semi-reflective mirror, and the light is refracted by the mirror to form a light path perpendicular to the chip strip.
[0009] As an optional implementation, in this embodiment of the present invention, the external coaxial light source further includes a glass window, which covers the end of the first housing facing the camera lens and is located below the camera lens.
[0010] As an optional implementation, in this embodiment of the present invention, the annular light source includes a hollow annular second outer shell and a second light-emitting component. The light emitted by the outer coaxial light source passes through the hollow part of the second outer shell and illuminates the chip strip. The second light-emitting component is arranged around the second outer shell to generate an annular light source inclined to the chip strip.
[0011] As an optional implementation, in this embodiment of the present invention, the second housing has an inclined surface on the side facing the tray, and the second light-emitting component is disposed on the inclined surface to emit light at an angle to the chip strip.
[0012] As an optional implementation, in this embodiment of the present invention, the inner coaxial light source includes a second semi-transparent semi-reflective mirror and a third light-emitting component. The second semi-transparent semi-reflective mirror is obliquely disposed on the camera lens, and the third light-emitting component is disposed on the inner side of the camera lens. The third light-emitting component emits light toward the second semi-transparent semi-reflective mirror, and the light is refracted by the mirror to form a light path perpendicular to the chip strip.
[0013] As an optional implementation, in this embodiment of the present invention, the adsorption structure includes vacuum adsorption holes arranged in an array on the surface of the tray. The vacuum adsorption holes are used to form a uniform adsorption force on the chip strip, so that the chip strip is laid flat on the surface of the tray.
[0014] As an optional implementation, in this embodiment of the invention, the adsorption structure further includes an internal air channel and a vacuum generating device, wherein the vacuum adsorption pore is connected to the vacuum generating device through the internal air channel.
[0015] Implementing the embodiments of this utility model will have the following beneficial effects:
[0016] This invention provides an imaging device for chip strips, comprising a camera lens, an outer coaxial light source, a ring light source, a light-transmitting support plate, and a backlight source arranged vertically from top to bottom. The camera lens has an inner coaxial light source. The support plate has an adsorption structure for adsorbing and fixing the chip strip and keeping it flat. Both the inner and outer coaxial light sources provide light sources perpendicular to the chip strip from top to bottom. The ring light source provides a ring light source inclined from top to bottom to the chip strip. The backlight source provides a light source that penetrates the support plate and is perpendicular to the chip strip from bottom to top. This design approach offers several advantages. First, the inner coaxial light source provides more vertical light with better perpendicularity, while the outer coaxial light source offers more uniform light. The outer coaxial light source's vertical illumination suppresses surface reflection, highlighting subtle defects and structural features. The ring light source's tilted illumination enhances the contrast of three-dimensional shapes and improves edge contour recognition. The backlight's transmissive illumination strengthens the detection of material uniformity and internal light transmittance, highlighting metal layers such as solder lines in the chip strip. In other words, the combined use of the inner coaxial light source, outer coaxial light source, ring light source, and backlight effectively improves imaging results, solving the problem of insufficient imaging performance due to a single light source. Second, the tray's adsorption structure can flatten the chip strip during inspection, preventing imaging changes caused by chip strip deformation. In summary, the combined illumination of the inner coaxial light source, outer coaxial light source, ring light source, and backlight, along with the adsorption and flattening effect of the translucent tray, achieves multi-dimensional, high-precision imaging of the chip strip. This results in clearer imaging of solder lines, solder joints, and other parts, significantly improving imaging clarity and inspection stability. It can adapt to the precise inspection needs of chip strips of different thicknesses and materials under complex optical conditions. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the imaging device applied to chip strips in an embodiment of the present invention;
[0019] Figure 2 This is a schematic diagram of the structure of the tray of the imaging device applied to chip strips in an embodiment of this utility model.
[0020] The meanings of the reference numerals in the attached figures are as follows:
[0021] 1-Camera lens; 11-Inner coaxial light source; 111-Second semi-transparent semi-reflective mirror; 112-Third light-emitting component; 2-Outer coaxial light source; 21-First outer shell; 22-First semi-transparent semi-reflective mirror; 23-First light-emitting component; 24-Glass window; 3-Ring light source; 31-Second outer shell; 311-Inclined surface; 32-Second light-emitting component; 4-Panel; 41-Vacuum adsorption hole; 5-Backlight; 6-Chip strip. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0024] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.
[0025] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.
[0026] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.
[0027] The technical solution of this utility model will be further described below with reference to the embodiments and accompanying drawings.
[0028] Please refer to the following: Figure 1 and Figure 2 This utility model discloses an imaging device for chip strips. The imaging device for chip strips includes a camera lens 1, an outer coaxial light source 2, a ring light source 3, a light-transmitting support plate 4, and a backlight 5 arranged vertically from top to bottom. The camera lens 1 is equipped with an inner coaxial light source 11. The support plate 4 has an adsorption structure for adsorbing and fixing the chip strip 6 and keeping it flat. Both the inner coaxial light source 11 and the outer coaxial light source 2 provide light sources perpendicular to the chip strip 6 from top to bottom (e.g., ...). Figure 1 As shown in Figure x), the ring light source 3 provides a ring light source 3 that is inclined from top to bottom towards the chip strip 6 (as shown in Figure x). Figure 1 As shown in Figure y), the backlight 5 provides a light source that penetrates the tray 4 and is perpendicular to the chip strip 6 from bottom to top (as shown in Figure y). Figure 1 (As shown in Figure z). This design approach offers several advantages. First, the inner coaxial light source 11 provides vertical light with better perpendicularity, while the outer coaxial light source 2 provides more uniform light. The vertical illumination of the outer coaxial light source 2 suppresses surface reflection, highlighting subtle defects and structural features. The ring light source 3 provides tilted supplementary lighting to enhance the contrast of the three-dimensional shape and improve edge contour recognition. The backlight source 5 provides transmitted illumination to strengthen the detection of material uniformity and internal light transmittance, highlighting the metal layers such as solder lines in the chip strip 6. In other words, by combining the inner coaxial light source 11, the outer coaxial light source 2, the ring light source 3, and the backlight source, the imaging effect can be effectively improved, solving the problem that the imaging effect caused by a single light source is insufficient to meet the detection requirements. Second, the adsorption structure of the tray 4 can adsorb and flatten the chip strip 6 during the detection process, avoiding imaging changes caused by deformation of the chip strip 6. In summary, through the combined illumination of the inner coaxial light source 11, the outer coaxial light source 2, the ring light source 3 and the backlight 5, and the adsorption and flattening effect of the light-transmitting plate 4, multi-dimensional high-precision imaging of the chip strip 6 is achieved, making the imaging of various parts such as the solder wire and solder joint clearer, significantly improving the imaging clarity and detection stability, and adapting to the precise detection needs of chip strips 6 of different thicknesses and materials under complex optical conditions.
[0029] The power supply lines for the inner coaxial light source 11, outer coaxial light source 2, ring light source 3, and backlight source 5 are independently connected, and controlled by a controller to achieve independent or combined lighting modes. With this design, in practical use, when the chip strips 6 require less stringent testing, lighting some light sources is sufficient to meet the testing needs, thus avoiding resource waste. When the chip strips 6 require more stringent testing, all light sources can be controlled to precisely match different testing requirements.
[0030] In addition, the external coaxial light source 2 can be set up movably. In some usage scenarios, the internal coaxial light source 11 and the external coaxial light source 2 need to be used together, or only the external coaxial light source 2 is needed. The external coaxial light source 2 and other light sources are set up in sequence along the vertical direction. However, in some usage scenarios, only the internal coaxial light source 11 needs to be used. The external coaxial light source can be moved out of its position to avoid its physical structure affecting the clarity of the camera lens 1 when it is not providing a light source.
[0031] The inner coaxial light source 11, the outer coaxial light source 2, the ring light source 3, and the backlight source 5 are located on the same axis. This design, which arranges the camera lens 1, the outer coaxial light source 2, the ring light source 3, and the backlight source 5 coaxially, eliminates specular reflection interference (coaxial light suppresses light spots), enhances surface defect detection (ring light provides uniform illumination from multiple angles, highlighting edges and scratches), improves the measurement accuracy of contours and textures (uniform backlight transmission), optimizes the optical path structure, reduces calibration difficulty, and adapts to the high-efficiency detection needs of complex materials such as metals and glass.
[0032] In some embodiments, in order for the inner coaxial light source 11 to provide a vertical light source to the chip strip 6, the inner coaxial light source 11 includes a second semi-transparent semi-reflective mirror 111 and a third light-emitting component 112. The second semi-transparent semi-reflective mirror 111 is inclinedly disposed on the camera lens 1, and the third light-emitting component 112 is disposed inside the camera lens 1. The third light-emitting component 112 emits light toward the second semi-transparent semi-reflective mirror 111, and forms a light path perpendicular to the chip strip through refraction.
[0033] In some embodiments, in order for the external coaxial light source 2 to provide a vertical light source to the chip strip 6 without interfering with the shooting of the camera lens 1, the external coaxial light source 2 includes a hollow first housing 21, a first semi-transparent semi-reflective mirror 22, and a first light-emitting component 23. The first semi-transparent semi-reflective mirror 22 is inclinedly disposed inside the first housing 21, and the first light-emitting component 23 is disposed on the inner side of the first housing 21. The first light-emitting component 23 emits light toward the first semi-transparent semi-reflective mirror 22, and the light is refracted by the mirror to form a light path perpendicular to the chip strip 6. The chip strip 6 is imaged onto the camera lens 1 through the glass window 24.
[0034] Furthermore, the external coaxial light source 2 also includes a glass window 24, which covers the end of the first housing 21 facing the camera lens 1 and is located below the camera lens 1. With this design, the sealed glass window 24 effectively isolates dust and oil from contaminating the internal first translucent semi-reflective mirror 22 and the first light-emitting component 23, maintaining the cleanliness of the optical path in an industrial environment.
[0035] In some embodiments, in order for the ring light source 3 to provide a ring light source 3 to the chip strip 6 without interfering with the shooting of the camera lens 1 or blocking the light emitted by the external coaxial light source 2, the ring light source 3 includes a hollow annular second shell 31 and a second light-emitting component 32. The light emitted by the external coaxial light source 2 passes through the hollow part of the second shell 31 and illuminates the chip strip 6. The second light-emitting component 32 is arranged around the second shell 31 to generate a ring light source 3 that is inclined to the chip strip 6.
[0036] Furthermore, in order for the second light-emitting component 32 to generate an annular light source 3 inclined to the chip strip 6, the second housing 31 is provided with an inclined surface 311 on the side facing the tray 4, and the second light-emitting component 32 is disposed on the inclined surface 311 to emit light inclined to the chip strip 6.
[0037] In some embodiments, in order to adsorb and fix the chip strip 6 and keep it flat, the adsorption structure includes vacuum adsorption holes 41 arranged in an array on the surface of the tray 4. The vacuum adsorption holes 41 are used to form a uniform adsorption force on the chip strip 6 so that the chip strip 6 is laid flat on the surface of the tray 4.
[0038] Furthermore, in order to adsorb the chip strip 6, the adsorption structure also includes an internal air channel and a vacuum generating device, with the vacuum adsorption hole 41 connected to the vacuum generating device through the internal air channel.
[0039] Preferably, the light intensity of the backlight 5, the refraction angle of the inner coaxial light source 11, the refraction angle of the outer coaxial light source 2, and the tilt angle of the ring light source 3 can all be adjusted independently. This design allows the imaging device to adapt to the imaging needs of chip strips 6 with different surface characteristics.
[0040] The present invention provides an imaging device for chip strips, comprising a camera lens 1, an outer coaxial light source 2, a ring light source 3, a light-transmitting support plate 4, and a backlight 5 arranged vertically from top to bottom. The camera lens 1 is provided with an inner coaxial light source 11. The support plate 4 is provided with an adsorption structure for adsorbing and fixing the chip strip 6 and keeping it flat. The inner coaxial light source 11 and the outer coaxial light source 2 both provide light sources perpendicular to the chip strip 6 from top to bottom. The ring light source 3 provides a ring light source 3 inclined to the chip strip 6 from top to bottom. The backlight 5 provides a light source that penetrates the support plate 4 and is perpendicular to the chip strip 6 from bottom to top. This design approach offers several advantages. First, the inner coaxial light source 11 provides vertical light with better perpendicularity, while the outer coaxial light source 2 provides light with better uniformity. The vertical illumination of the outer coaxial light source 2 suppresses surface reflection, highlighting subtle defects and structural features. The ring light source 3 provides tilted supplementary lighting to enhance the contrast of three-dimensional morphology and improve edge contour recognition. The backlight source 5 provides transmitted illumination to enhance the detection of material uniformity and internal light transmittance, highlighting metal layers such as bonding wires in the chip strip 6. In other words, by combining the inner coaxial light source 11, the outer coaxial light source 2, the ring light source 3, and the backlight source, the imaging effect can be effectively improved, solving the problem that the imaging effect caused by a single light source is insufficient to meet the detection requirements. Second, the adsorption structure of the tray 4 can adsorb the chip strip 6 flat during the detection process, avoiding imaging changes caused by deformation of the chip strip 6. In summary, through the combined illumination of the inner coaxial light source 11, the outer coaxial light source 2, the ring light source 3 and the backlight 5, and the adsorption and flattening effect of the light-transmitting plate 4, multi-dimensional high-precision imaging of the chip strip 6 is achieved, making the imaging of various parts such as the solder wire and solder joint clearer, significantly improving the imaging clarity and detection stability, and adapting to the precise detection needs of chip strips 6 of different thicknesses and materials under complex optical conditions.
[0041] The above provides a detailed description of an imaging device for chip strips disclosed in this utility model. This article uses specific examples to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the imaging device for chip strips and its core idea. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. An imaging device for use with chip strips, characterized in that, It includes a camera lens (1), an outer coaxial light source (2), a ring light source (3), a light-transmitting support plate (4), and a backlight source (5) arranged vertically from top to bottom. The camera lens (1) is provided with an inner coaxial light source (11). The tray (4) is provided with an adsorption structure for adsorbing and fixing the chip strip (6) and keeping it flat. The inner coaxial light source (11) and the outer coaxial light source (2) both provide light sources that are perpendicular to the chip strip (6) from top to bottom. The ring light source (3) provides a ring light source that is inclined to the chip strip (6) from top to bottom. The backlight source (5) provides a light source that penetrates the tray (4) and is perpendicular to the chip strip (6) from bottom to top.
2. The imaging device for chip strips according to claim 1, characterized in that: The power supply lines of the inner coaxial light source (11), the outer coaxial light source (2), the ring light source (3), and the backlight source (5) are independently connected, and the controller controls the independent lighting mode or the combined lighting mode.
3. The imaging device for chip strips according to claim 1, characterized in that: The inner coaxial light source (11), the outer coaxial light source (2), the ring light source (3), and the backlight source (5) are located on the same axis.
4. The imaging apparatus for use with chip strips according to any one of claims 1 to 3, characterized in that: The external coaxial light source (2) includes a hollow first shell (21), a first semi-transparent semi-reflective mirror (22) and a first light-emitting component (23). The first semi-transparent semi-reflective mirror (22) is inclinedly disposed inside the first shell (21). The first light-emitting component (23) is disposed on the inner side of the first shell (21). The first light-emitting component (23) emits light toward the first semi-transparent semi-reflective mirror (22) and forms a light path perpendicular to the chip strip (6) through refraction.
5. The imaging device for chip strips according to claim 4, characterized in that: The external coaxial light source (2) also includes a glass window (24), which covers the end of the first housing (21) facing the camera lens (1) and is located below the camera lens (1).
6. The imaging apparatus for use with chip strips according to any one of claims 1 to 3, characterized in that: The ring light source (3) includes a hollow ring-shaped second outer shell (31) and a second light-emitting component (32). The light emitted by the outer coaxial light source (2) passes through the hollow part of the second outer shell (31) and illuminates the chip strip (6). The second light-emitting component (32) is arranged around the second outer shell (31) to generate a ring light source (3) that is inclined to the chip strip (6).
7. The imaging device for chip strips according to claim 6, characterized in that: The second housing (31) has an inclined surface (311) on the side facing the tray (4), and the second light-emitting component (32) is disposed on the inclined surface (311) to emit light at an angle to the chip strip (6).
8. The imaging apparatus for use with chip strips according to any one of claims 1 to 3, characterized in that: The inner coaxial light source (11) includes a second semi-transparent semi-reflective mirror (111) and a third light-emitting component (112). The second semi-transparent semi-reflective mirror (111) is inclinedly disposed on the camera lens (1), and the third light-emitting component (112) is disposed on the inner side of the camera lens (1). The third light-emitting component (112) emits light toward the second semi-transparent semi-reflective mirror (111) and forms a light path perpendicular to the chip strip through refraction.
9. The imaging apparatus for use with chip strips according to any one of claims 1 to 3, characterized in that: The adsorption structure includes vacuum adsorption holes (41) arranged in an array on the surface of the tray (4). The vacuum adsorption holes (41) are used to form a uniform adsorption force on the chip strip (6) so that the chip strip (6) is laid flat on the surface of the tray (4).
10. The imaging device for chip strips according to claim 9, characterized in that: The adsorption structure also includes an internal air channel and a vacuum generating device, and the vacuum adsorption hole (41) is connected to the vacuum generating device through the internal air channel.