Heat dissipation device based on notebook computer base

Abstract

The utility model relates to the technical field of notebook computer heat dissipation, in particular to a heat dissipation device based on a notebook computer base, which comprises a supporting frame, a rotating device is arranged on the bottom wall of the supporting frame, symmetrical damping telescopic rods are arranged at the lower end of the rotating device, and the heat dissipation device is arranged in the supporting frame. A cooling box is arranged on the upper side wall of the supporting frame, magnets are arranged on the cooling box and the supporting frame, the two magnets are connected in a magnetic attraction mode, the rotating device comprises a supporting rod and a rotating rod, a cooling cavity is formed in the cooling box, a water inlet pipe with a protective cover is arranged on one side wall of the cooling cavity, and a water outlet pipe with a protective cover is arranged on the other side wall of the cooling cavity. The heat dissipation device comprises a heat dissipation fan, a fan shell and a temperature sensor, the local temperature change of the bottom of the notebook computer is sensed in real time, the precise temperature control mode avoids noise and energy consumption waste caused by global high-speed air supply of a traditional heat dissipation base, and the heat dissipation device is particularly suitable for the directional cooling requirement of high heating elements such as a CPU and a GPU.

Description

Technical Field

[0001] This utility model relates to the field of laptop cooling technology, specifically a cooling device based on a laptop stand. Background Technology

[0002] As we all know, current laptops are developing in the dual direction of becoming thinner and lighter and higher in performance. The integration density and power consumption of their internal electronic components (such as CPU, GPU, and high-speed solid-state drives) continue to rise, resulting in a significant increase in local heat load during device operation.

[0003] Traditional passive cooling solutions (such as metal heat sinks and fans) are limited by heat dissipation area and heat conduction efficiency, making them difficult to cope with high dynamic load scenarios.

[0004] Specifically, existing cooling pads typically drive all fans at a constant speed, making it impossible to identify localized high-temperature areas on the bottom of the laptop (such as the area around the CPU). This results in airflow not accurately covering the heat-generating components, causing fans in non-hotspot areas to operate ineffectively. Consequently, it becomes difficult to respond promptly to instantaneous temperature rises in different parts, which can easily lead to hardware overheating and triggering frequency throttling protection, affecting performance stability. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] In view of the shortcomings of the existing technology, this utility model provides a heat dissipation device based on a laptop stand.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation device based on a laptop stand, comprising a support frame, a rotating device provided on the bottom wall of the support frame, symmetrical damping telescopic rods provided at the lower end of the rotating device, a heat dissipation device provided inside the support frame, a cooling box provided on the upper side wall of the support frame, and magnets provided on both the cooling box and the support frame, with the two magnets magnetically connected.

[0009] To achieve stable support at multiple angles, the present invention is improved as follows: the rotating device includes a support rod and a rotating rod, the support rod is symmetrically arranged on the bottom wall of the support frame, the rotating rod passes through the lower end of the support rod and is damped and rotatably connected to it, and both ends of the rotating rod pass through the upper end of the damping telescopic rod and are fixedly connected to it.

[0010] To simplify the coolant replenishment process, the present invention includes the following improvements: a cooling chamber is provided inside the cooling box, and a water inlet pipe with a protective cover is provided on one side wall of the cooling chamber.

[0011] To achieve regional intelligent temperature control, the present invention includes the following improvements: the heat dissipation device includes a cooling fan, a fan housing, and a temperature sensor. The fan housing is arranged in multiple groups evenly inside the support frame. The cooling fan is inside the fan housing. The temperature sensor is located on the front side wall of the fan housing. The cooling fan is connected to the temperature sensor via a signal connection.

[0012] To prevent the laptop from sliding to the side, the present invention is improved by providing symmetrical baffles at one end of the support frame.

[0013] To buffer and absorb equipment vibration, the present invention is improved as follows: each of the damping telescopic rods is provided with a placement plate at its lower end, and each placement plate is provided with a silicone anti-slip pad on its bottom wall. The anti-slip pad is 3-5mm thick and has cross anti-slip texture on its surface.

[0014] To make the monitoring more comprehensive, the present invention is improved as follows: the temperature sensor is a dual-mode probe, which includes a contact thermistor and a non-contact infrared sensor.

[0015] To ensure structural rigidity, the present invention is improved by adopting a magnesium-aluminum alloy frame with a honeycomb-shaped hollow weight-reducing structure at the bottom.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, this utility model provides a heat dissipation device based on a laptop stand, which has the following advantages:

[0018] This laptop stand-based cooling device features a rotating mechanism and a damping telescopic rod, allowing users to freely adjust the laptop's tilt angle according to their usage scenario, meeting the comfort needs of different sitting postures. The symmetrically distributed damping telescopic rods further enhance the stand's anti-shake capability, keeping the device stable even when typing or using touch operation, thus balancing ergonomics and safety.

[0019] The cooling box and support frame are connected by magnetic attraction for quick assembly and disassembly. Users can flexibly replace the coolant according to their heat dissipation needs. The magnetic structure ensures a stable connection while avoiding the cumbersome operation caused by traditional clips or screws. It extends the service life of the active cooling system, reduces liquid evaporation loss, and has low maintenance costs.

[0020] The cooling device uses a combination of multiple independent fans and temperature sensors. Each fan corresponds to a temperature monitoring point, which can sense the local temperature changes on the bottom of the laptop in real time. This precise temperature control mode avoids the noise and energy waste caused by the high-speed airflow of traditional cooling pads, and at the same time prevents the cooling efficiency from decreasing due to the collision of hot and cold airflows. It is especially suitable for the targeted cooling needs of high-heat components such as CPU and GPU. Attached Figure Description

[0021] Figure 1 This is a first-view schematic diagram of the structure of this utility model;

[0022] Figure 2 This is a second-view schematic diagram of the structure of this utility model;

[0023] Figure 3 This is a third-view schematic diagram of the structure of this utility model;

[0024] Figure 4 This is a partial schematic diagram of the structure of this utility model from a fourth perspective.

[0025] In the diagram: 1. Cooling box; 2. Support frame; 3. Baffle; 4. Damping telescopic rod; 5. Placement plate; 6. Water inlet pipe; 7. Fan housing; 8. Temperature sensor; 9. Cooling fan; 10. Rotating rod; 11. Support rod; 12. Magnet. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] Please see Figure 1-4A heat dissipation device based on a laptop stand includes a support frame 2. A rotating device is provided on the bottom wall of the support frame 2. Symmetrical damping telescopic rods 4 are provided at the lower end of the rotating device. A heat dissipation device is disposed inside the support frame 2. A cooling box 1 is provided on the upper side wall of the support frame 2. Magnets 12 are provided on both the cooling box 1 and the support frame 2, and the two magnets 12 are magnetically connected. The rotating device includes a support rod 11 and a rotating rod 10. The support rod 11 is symmetrically arranged on the bottom wall of the support frame 2, and the rotating rod 10 passes through the lower end of the support rod 11 and is connected to... Its damping rotation connection, the two ends of the rotating rod 10 pass through the upper end of the damping telescopic rod 4 and are fixedly connected to it, the cooling box 1 is provided with a cooling cavity, and a water inlet pipe 6 with a protective cover is provided on one side wall of the cooling cavity, the heat dissipation device includes a cooling fan 9, a fan housing 7 and a temperature sensor 8, the fan housing 7 is evenly arranged in multiple groups inside the support frame 2, the cooling fan 9 is inside the fan housing 7, the temperature sensor 8 is on the front side wall of the fan housing 7, the cooling fan 9 is signal connected to the temperature sensor 8, and a symmetrical baffle 3 is provided at one end of the support frame 2.

[0030] During use, the user first opens the protective cover on the side wall of the cooling box 1, and injects cold water or common coolant (such as ethylene glycol aqueous solution) into the cooling chamber through the water inlet pipe 6, ensuring that the liquid level does not exceed the upper limit of the capacity. After closing the protective cover, the cooling box 1 is precisely aligned with the upper side wall of the support frame 2 by magnet 12, forming a physical contact surface. The laptop is placed flat on the surface of the cooling box 1, and the coolant absorbs the heat emitted from the bottom of the laptop through heat conduction, reducing the temperature of the contact area. The magnetic connection design allows the cooling box 1 to be quickly disassembled or replaced. At the same time, the tight fit of the magnetic adsorption reduces contact thermal resistance and improves heat conduction efficiency. The symmetrical baffle 3 at one end of the support frame 2 provides lateral restraint for the device, forming a physical barrier to prevent slippage and offset the risk of device displacement caused by typing, touch operation, or desktop tilt. The user can rotate the support frame to... The support rod 11 adjusts the tilt angle of the support frame 2: hold the edge of the support frame 2 and apply torque. The damped rotation connection between the rotating rod 10 and the support rod 11 allows for smooth rotation and automatically locks the angle after releasing the grip. At the same time, manually stretching or compressing the damped telescopic rod 4 changes the overall height of the base to adapt to different usage scenarios. At this time, multiple temperature sensors 8 (located on the front side wall of the fan housing 7) monitor the temperature of different areas on the bottom of the laptop in real time. When the temperature of a certain area exceeds a preset threshold (such as the area corresponding to the CPU), the sensor transmits a signal to the corresponding cooling fan 9, triggering the cooling fan 9 to start and accelerate its operation. In other areas where the temperature has not reached the threshold, the cooling fan 9 remains at a low speed or in standby mode. The sensor and the cooling fan 9 are connected wirelessly (such as via Bluetooth) to form an independent control loop, realizing a one-to-one response between the "hot zone" and the fan.

[0031] In actual use, it is necessary to be able to buffer and absorb equipment vibration and prevent the base from sliding and shifting on a smooth surface. In order to meet the above requirements, in this embodiment, the lower end of the damping telescopic rod 4 is provided with a placement plate 5, and the bottom wall of the placement plate 5 is provided with a silicone anti-slip pad. The anti-slip pad is 3-5mm thick and has cross anti-slip texture on its surface.

[0032] In practical use, it is necessary to sense both the temperature gradient on the bottom surface of the device and the ability to detect the heating of internal components through gaps, providing more comprehensive monitoring. To meet these requirements, in this embodiment, the temperature sensor 8 is a dual-mode probe, comprising a contact thermistor and a non-contact infrared sensor.

[0033] Employing a dual-mode probe design, the contact thermistor is directly attached to the bottom of the laptop, sensing surface temperature through resistance changes, while the non-contact infrared sensor indirectly measures the temperature of internal core components (such as the CPU and GPU) by detecting infrared radiation from the heat dissipation holes or gaps on the bottom of the device. After the data from both are integrated by the control module, the speed of the cooling fan in the corresponding area is dynamically adjusted according to the temperature difference, achieving precise temperature control from the surface to the inside, and avoiding local overheating.

[0034] In actual use, it is necessary to ensure structural rigidity while simultaneously reducing weight and optimizing bottom air convection. To meet the above requirements, in this embodiment, the support frame 2 adopts a magnesium-aluminum alloy frame with a honeycomb hollow weight reduction structure at the bottom.

[0035] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device based on a laptop stand, comprising a support frame (2), characterized in that: The bottom wall of the support frame (2) is provided with a rotating device, and the lower end of the rotating device is provided with a symmetrical damping telescopic rod (4). The support frame (2) is provided with a heat dissipation device, and the upper side wall of the support frame (2) is provided with a cooling box (1). Both the cooling box (1) and the support frame (2) are provided with magnets (12), and the two magnets (12) are magnetically connected.

2. The heat dissipation device based on a laptop stand according to claim 1, characterized in that: The rotating device includes a support rod (11) and a rotating rod (10). The support rod (11) is symmetrically arranged on the bottom wall of the support frame (2). The rotating rod (10) passes through the lower end of the support rod (11) and is connected to it in a damped rotational manner. Both ends of the rotating rod (10) pass through the upper end of the damped telescopic rod (4) and are fixedly connected to it.

3. The heat dissipation device based on a laptop stand according to claim 1, characterized in that: The cooling box (1) is provided with a cooling chamber, and a water inlet pipe (6) with a protective cover is provided on one side wall of the cooling chamber.

4. A heat dissipation device based on a laptop stand according to claim 1, characterized in that: The heat dissipation device includes a heat dissipation fan (9), a fan housing (7) and a temperature sensor (8). The fan housing (7) is arranged in multiple groups evenly inside the support frame (2). The heat dissipation fan (9) is inside the fan housing (7). The temperature sensor (8) is on the front side wall of the fan housing (7). The heat dissipation fan (9) is connected to the temperature sensor (8) via signal connection.

5. A heat dissipation device based on a laptop dock according to claim 1, characterized in that: The support frame (2) has symmetrical baffles (3) at one end.

6. A heat dissipation device based on a laptop stand according to claim 2, characterized in that: Each of the damping telescopic rods (4) is provided with a placement plate (5) at its lower end. The bottom wall of each placement plate (5) is provided with a silicone anti-slip pad. The anti-slip pad is 3-5mm thick and has cross anti-slip texture on its surface.

7. A heat dissipation device based on a laptop dock according to claim 4, characterized in that: The temperature sensor (8) is a dual-mode probe, comprising a contact thermistor and a non-contact infrared sensor.

8. A heat dissipation device based on a laptop dock according to claim 1, characterized in that: The support frame (2) is made of magnesium-aluminum alloy and has a honeycomb hollow weight reduction structure at the bottom.

Images