High-frequency multilayer circuit board with good heat dissipation

Abstract

The utility model discloses a high-frequency multilayer circuit board with good heat dissipation, which comprises a circuit board body, the circuit board body is horizontally arranged, the bottom of the circuit board body is provided with a heat conduction and heat dissipation assembly in a combined manner, and the bottom of the heat conduction and heat dissipation assembly is provided with an air cooling heat dissipation assembly in a combined manner. The beneficial effects are that the bottom of the circuit board body is provided with the heat conduction and heat dissipation assembly in a combined manner, and the bottom of the heat conduction and heat dissipation assembly is provided with the air cooling and heat dissipation assembly in a combined manner, so that the heat dissipation area can be increased in a manner that the heat dissipation fins of the heat conduction and heat dissipation assembly contact the bottom surface of the circuit board body; and meanwhile, forced air-cooling heat dissipation can be performed on the circuit board body above by means of a mode that a heat dissipation fan body of the air-cooling heat dissipation assembly works to blow air, so that dual combination of natural heat dissipation and air-cooling heat dissipation on the circuit board body is realized, efficient and stable heat dissipation of the circuit board body is facilitated, and a stable working state of the circuit board body is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of circuit board auxiliary components, specifically to a high-frequency multilayer circuit board with good heat dissipation. Background Technology

[0002] Circuit boards are classified into single-sided circuit boards, double-sided circuit boards, and multilayer circuit boards. The most fundamental difference is the number of circuit layers. Multilayer circuit boards refer to circuit boards with three or more layers. The manufacturing process of multilayer circuit boards involves adding an inner layer lamination process to the single-sided and double-sided boards. Multilayer circuit boards are usually selected when designing high-frequency circuit boards. High-frequency circuit boards refer to special circuit boards with high electromagnetic frequencies. They are mainly used in high-frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meters) fields. They are usually made of high-performance materials such as PTFE (polytetrafluoroethylene) and FEP, and play a key role in high-frequency signal processing in communications, radar, and satellites.

[0003] In the existing technology, high-frequency circuit boards are usually mounted in equipment by raising them. Although the bottom suspension can accelerate heat dissipation to a certain extent, the components of the high-frequency circuit board will work continuously for a long time and generate a lot of heat. Therefore, the high-frequency circuit board will still heat up in time due to insufficient heat dissipation, which will lead to unstable operation of the high-frequency circuit board. Utility Model Content

[0004] The purpose of this invention is to provide a high-frequency multilayer circuit board with good heat dissipation in order to solve the above problems, as detailed below.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] This utility model provides a high-frequency multilayer circuit board with good heat dissipation, including a circuit board body, which is arranged flat. A heat-conducting and heat-dissipating component is assembled at the bottom of the circuit board body, and a wind-cooling component is assembled at the bottom of the heat-conducting and heat-dissipating component, so as to combine natural heat dissipation and wind-cooling heat dissipation of the circuit board body by means of the heat-conducting and heat-dissipating component and the wind-cooling component.

[0007] Preferably, the circuit board body is a high-frequency multilayer circuit board.

[0008] Preferably, the heat dissipation assembly includes a mounting base and heat dissipation fins. An upper support sleeve is vertically fixed to the top corner of the mounting base. A fixing hole is vertically opened at the corner of the circuit board body, and the fixing hole and the upper support sleeve are vertically coaxially aligned. Each set of coaxially aligned fixing holes and the upper support sleeve are fixedly connected by screws installed coaxially from top to bottom. Multiple vertically arranged heat dissipation fins are fixed to the top surface of the mounting base, and the top of each heat dissipation fin contacts the bottom surface of the circuit board body.

[0009] Preferably, all the fixing holes are internally threaded through holes, all the upper support sleeves are internally threaded sleeves, and all the screws are plastic screws with an upper end larger than the diameter of the fixing hole, and the upper end of each screw is pressed against the top edge of the circuit board body.

[0010] Preferably, the heat dissipation fins are all vertically arranged along the longitudinal direction, and the vertical dimension of the heat dissipation fins is greater than the vertical dimension of the upper support sleeve.

[0011] Preferably, the heat dissipation fins are all rectangular PEEK heat dissipation fins.

[0012] Preferably, each of the bottom corners of the mounting base is vertically fixed with a lower support sleeve, and the lower support sleeve is an open-bottomed internal thread sleeve.

[0013] Preferably, the air-cooled heat dissipation component includes a ventilation opening and a cooling fan body. The ventilation opening is vertically opened in the middle of the mounting base plate. The cooling fan body, which is vertically arranged in the air blowing direction, is mounted flat on the bottom plate of the mounting base plate, and the cooling fan body is vertically coaxial with the ventilation opening.

[0014] Preferably, the cooling fan body has vertical mounting holes at its corners, and the mounting plate has multiple mating holes vertically around the ventilation opening. The mounting holes and the mating holes are all internally threaded through holes and are vertically coaxially aligned.

[0015] Preferably, the cooling fan body is a miniature cooling fan with the airflow direction from bottom to top, and the bottom of the cooling fan body extends outward with a power connection wire, and the outer end of the power connection wire is equipped with a power connector.

[0016] The aforementioned high-frequency multilayer circuit board with good heat dissipation, in its specific application, features a heat-conducting and heat-dissipating component assembled at the bottom of the circuit board body, and a wind-cooling component assembled at the bottom of the heat-conducting and heat-dissipating component. The heat dissipation fins of the heat-conducting and heat-dissipating component contact the bottom surface of the circuit board body, increasing the heat dissipation area. Simultaneously, the air-cooling component's fan blows air, forcibly cooling the circuit board body above. This achieves a combination of natural and wind-cooling heat dissipation, contributing to efficient and stable heat dissipation and ensuring stable operation of the circuit board body. Furthermore, by attaching screws to the upper support sleeve through the fixing holes, the heat-conducting and heat-dissipating component and the wind-cooling component can be assembled together at the bottom of the circuit board body, with the top of the heat dissipation fins abutting the bottom surface of the circuit board body. The circuit board body can then be easily accessed by simply removing the screws. The thermally conductive heat dissipation component and the air-cooled heat dissipation component are detached from the bottom of the circuit board body. The assembly and disassembly of the thermally conductive heat dissipation component and the air-cooled heat dissipation component at the bottom of the circuit board body are simple and easy to implement. This facilitates the efficient heat dissipation of the thermally conductive heat dissipation component and the air-cooled heat dissipation component at the bottom of the circuit board body, and also facilitates the subsequent disassembly of the thermally conductive heat dissipation component and the air-cooled heat dissipation component for maintenance. Furthermore, since the air-cooled heat dissipation component can be assembled at the bottom of the thermally conductive heat dissipation component by adding screws through the mounting holes and the mating holes, and the air-cooled heat dissipation component can be detached from the bottom of the thermally conductive heat dissipation component simply by removing the screws, the assembly and disassembly of the air-cooled heat dissipation component at the bottom of the thermally conductive heat dissipation component is simple and easy to implement. This facilitates the combined use of natural heat dissipation and air-cooled heat dissipation when the air-cooled heat dissipation component is assembled at the bottom of the thermally conductive heat dissipation component, and also facilitates the subsequent disassembly of the air-cooled heat dissipation component from the bottom of the thermally conductive heat dissipation component for maintenance.

[0017] The beneficial effects are as follows: 1. The present invention has a heat conduction and heat dissipation component assembled at the bottom of the circuit board body, and a wind-cooling heat dissipation component assembled at the bottom of the heat conduction and heat dissipation component. The heat dissipation fins of the heat conduction and heat dissipation component can increase the heat dissipation area by contacting the bottom surface of the circuit board body. At the same time, the cooling fan of the wind-cooling heat dissipation component can force the circuit board body above to be cooled by air. This realizes the dual combination of natural heat dissipation and wind-cooling heat dissipation of the circuit board body, which helps to efficiently and stably dissipate heat from the circuit board body and ensures the stable working state of the circuit board body.

[0018] 2. By adding screws to the support sleeve through the fixing holes, the heat dissipation component and the air cooling component can be combined together at the bottom of the circuit board body, with the top of the heat dissipation fins abutting against the bottom surface of the circuit board body. At the same time, the heat dissipation component and the air cooling component can be removed from the bottom of the circuit board body simply by removing the screws. The combination and disassembly of the heat dissipation component and the air cooling component at the bottom of the circuit board body is simple and easy to implement. It is convenient to combine the heat dissipation component and the air cooling component at the bottom of the circuit board body for efficient heat dissipation, and it is also convenient to remove the heat dissipation component and the air cooling component for subsequent inspection and maintenance.

[0019] 3. By installing screws through the mounting holes and mating holes, the air-cooled heat dissipation component can be assembled at the bottom of the heat-conducting heat dissipation component. At the same time, the air-cooled heat dissipation component can be removed from the bottom of the heat-conducting heat dissipation component simply by removing the screws. The assembly and disassembly of the air-cooled heat dissipation component at the bottom of the heat-conducting heat dissipation component is simple and easy to achieve. It is convenient to combine the air-cooled heat dissipation component with natural heat dissipation and air-cooling heat dissipation at the bottom of the heat-conducting heat dissipation component for use. At the same time, it is convenient to remove the air-cooled heat dissipation component from the bottom of the heat-conducting heat dissipation component for inspection and maintenance. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is an overall isometric schematic diagram of the combined state of this utility model. Figure 1 ;

[0022] Figure 2 This is an overall isometric schematic diagram of the combined state of this utility model. Figure 2 ;

[0023] Figure 3 This is an isometric view of the entire structure in its split configuration. Figure 1 ;

[0024] Figure 4 This is an isometric view of the entire structure in its split configuration. Figure 2 ;

[0025] Figure 5 This is a utility model Figure 1 Front view diagram;

[0026] Figure 6 This is a utility model Figure 1 A top-down view;

[0027] Figure 7 This is a utility model Figure 1 A diagram showing the view from below.

[0028] The annotations in the attached figures are explained as follows:

[0029] 1. Circuit board body; 101. Fixing hole; 2. Heat dissipation assembly; 201. Screw; 202. Upper support sleeve; 203. Mounting base plate; 204. Lower support sleeve; 205. Heat dissipation fins; 3. Air-cooled heat dissipation assembly; 301. Mating hole; 302. Mounting hole; 303. Cooling fan body; 304. Power connector; 305. Power connection; 306. Ventilation opening. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0031] See Figures 1-7As shown, this utility model provides a high-frequency multilayer circuit board with good heat dissipation, including a circuit board body 1, which is placed flat. A heat-conducting and heat-dissipating component 2 is assembled at the bottom of the circuit board body 1, and a wind-cooling heat-dissipating component 3 is assembled at the bottom of the heat-conducting and heat-dissipating component 2. This allows for a combination of natural heat dissipation and wind-cooling heat dissipation for the circuit board body 1. Specifically, the heat-conducting and heat-dissipating component 2 includes a mounting base 203 and heat dissipation fins 205. An upper support sleeve 202 is vertically fixed to the top corner of the mounting base 203. A fixing hole 101 is vertically opened at the corner of the circuit board body 1, and the fixing hole 101 and the upper support sleeve 202 are vertically coaxially aligned. Each set of coaxially aligned fixing holes 101 and upper support sleeves 202 are fixed together by screws 201 installed coaxially from top to bottom. The heat dissipation assembly 3 has multiple vertically arranged heat dissipation fins 205 fixed on its surface, and the top of each heat dissipation fin 205 contacts the bottom surface of the circuit board body 1. The air-cooled heat dissipation assembly 3 includes a ventilation opening 306 and a cooling fan body 303. The ventilation opening 306 is vertically opened in the middle of the mounting base 203. The cooling fan body 303 with the air blowing direction is mounted flat on the bottom plate of the mounting base 203. The cooling fan body 303 and the ventilation opening 306 are vertically coaxial. The purpose of this arrangement is to increase the heat dissipation area by using the heat dissipation fins 205 of the heat dissipation assembly 2 to contact the bottom surface of the circuit board body 1. At the same time, the cooling fan body 303 of the air-cooled heat dissipation assembly 3 can force air cooling of the circuit board body 1 above by blowing air. This achieves a combination of natural heat dissipation and air cooling of the circuit board body 1, which helps to efficiently and stably dissipate heat from the circuit board body 1.

[0032] See Figures 1-7 As shown, all fixing holes 101 are internally threaded through holes, all upper support sleeves 202 are internally threaded sleeves, and all screws 201 are plastic screws with an upper end larger than the diameter of the fixing hole 101. The upper end of each screw is pressed against the top corner of the circuit board body 1. The purpose of this arrangement is that by adding screws 201 to the upper support sleeves 202 through the fixing holes 101, the heat dissipation component 2 and the air cooling component 3 can be combined together at the bottom of the circuit board body 1, and the top of the heat dissipation fins 205 can be pressed against the bottom surface of the circuit board body 1. At the same time, the heat dissipation component 2 and the air cooling component 3 can be removed from the bottom of the circuit board body 1 simply by removing the screws 201. The combination and disassembly of the heat dissipation component 2 and the air cooling component 3 at the bottom of the circuit board body 1 is simple and easy to implement.

[0033] See Figures 1-7As shown, the cooling fan body 303 has vertically opened mounting holes 302 at its corners, and the mounting base plate 203 has multiple vertically opened mating holes 301 around the ventilation opening 306. The mounting holes 302 and mating holes 301 are all internally threaded through holes and are vertically coaxially aligned. The reason for this arrangement is that by adding screws through the mounting holes 302 and mating holes 301, the air-cooled heat dissipation component 3 can be assembled at the bottom of the heat-conducting heat dissipation component 2. At the same time, the air-cooled heat dissipation component 3 can be detached from the bottom of the heat-conducting heat dissipation component 2 simply by removing the screws. The assembly and disassembly of the air-cooled heat dissipation component 3 at the bottom of the heat-conducting heat dissipation component 2 is simple and easy to implement.

[0034] See Figures 1-7 As shown, the following more detailed optimizations have been made to this solution. Specifically, the circuit board body 1 is a high-frequency multilayer circuit board, so that the circuit board body 1 itself has a wide range of application scenarios that meet the needs of use. Optionally, the heat dissipation fins 205 are all vertically arranged, and the vertical dimension of the heat dissipation fins 205 is larger than the vertical dimension of the upper support sleeve 202. This arrangement facilitates the contact of the circuit board body 1 with the top of the heat dissipation fins 205 before the circuit board body 1 is pressed against the corner by tightening the screws 201. Furthermore, the heat dissipation fins 205 are all rectangular PEEK heat sinks, so that the heat dissipation fins 205 have good thermal conductivity and insulation performance.

[0035] See Figures 1-7 As shown, lower support sleeves 204 are vertically fixed at the bottom corners of the mounting base 203. These lower support sleeves 204 are open-bottomed internally threaded sleeves. This design facilitates the installation of the mounting base 203 and the circuit board body 1 inside the device by driving screws into the lower support sleeves 204 through the device housing. Optionally, the cooling fan body 303 is a miniature cooling fan with an upward airflow direction. A power connection 305 extends outward from the bottom of the cooling fan body 303, and the outer end of the power connection 305 is equipped with a power connector 304. This allows power to be supplied to the cooling fan body 303 via the power connection 305 by connecting the power connector 304 to a power socket.

[0036] With the above structure, in practical application, a heat-conducting and heat-dissipating component 2 is assembled at the bottom of the circuit board body 1, and a wind-cooling component 3 is assembled at the bottom of the heat-conducting and heat-dissipating component 2. The heat dissipation fins 205 of the heat-conducting and heat-dissipating component 2 contact the bottom surface of the circuit board body 1, increasing the heat dissipation area. Simultaneously, the cooling fan 303 of the wind-cooling component 3 blows air to force-cool the circuit board body 1 above, achieving a combination of natural and wind-cooling heat dissipation for the circuit board body 1. This contributes to efficient and stable heat dissipation of the circuit board body 1, ensuring its stable operation. Furthermore, by adding screws 201 to the upper support sleeve 202 through the fixing hole 101, the heat-conducting and heat-dissipating component 2 and the wind-cooling component 3 can be assembled together at the bottom of the circuit board body 1, with the top of the heat dissipation fins 205 abutting against the bottom surface of the circuit board body 1. Heat dissipation can be achieved simply by removing the screws 201. Component 2 and the air-cooled heat dissipation component 3 are detached from the bottom of the circuit board body 1. The combination and disassembly of the heat-conducting heat dissipation component 2 and the air-cooled heat dissipation component 3 at the bottom of the circuit board body 1 are simple and easy to implement. This facilitates the efficient heat dissipation of the heat-conducting heat dissipation component 2 and the air-cooled heat dissipation component 3 at the bottom of the circuit board body 1, and also facilitates the subsequent disassembly of the heat-conducting heat dissipation component 2 and the air-cooled heat dissipation component 3 for inspection and maintenance. Furthermore, by adding screws through the mounting holes 302 and mating holes 301, the air-cooled heat dissipation component 3 can be combined with the bottom of the heat-conducting heat dissipation component 2. At the same time, the air-cooled heat dissipation component 3 can be detached from the bottom of the heat-conducting heat dissipation component 2 simply by removing the screws. The combination and disassembly of the air-cooled heat dissipation component 3 at the bottom of the heat-conducting heat dissipation component 2 are simple and easy to implement. This facilitates the combined use of natural heat dissipation and air-cooled heat dissipation when the air-cooled heat dissipation component 3 is combined with the bottom of the heat-conducting heat dissipation component 2, and also facilitates the subsequent disassembly of the air-cooled heat dissipation component 3 from the bottom of the heat-conducting heat dissipation component 2 for inspection and maintenance.

[0037] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A high-frequency multilayer circuit board with good heat dissipation, comprising a circuit board body (1), characterized in that: The circuit board body (1) is placed flat, and a heat dissipation component (2) is assembled at the bottom of the circuit board body (1). A wind-cooling component (3) is assembled at the bottom of the heat dissipation component (2) to combine natural heat dissipation and wind-cooling heat dissipation for the circuit board body (1).

2. The high-frequency multilayer circuit board with good heat dissipation according to claim 1, characterized in that: The circuit board body (1) is a high-frequency multilayer circuit board.

3. The high-frequency multilayer circuit board with good heat dissipation according to claim 1, characterized in that: The heat dissipation assembly (2) includes a mounting base (203) and heat dissipation fins (205). An upper support sleeve (202) is vertically fixed to the top corner of the mounting base (203). A fixing hole (101) is vertically opened at the corner of the circuit board body (1). The fixing hole (101) and the upper support sleeve (202) are vertically coaxially aligned. At the same time, each set of coaxially aligned fixing holes (101) and the upper support sleeve (202) are fixedly connected by screws (201) installed coaxially from top to bottom. A number of vertically arranged heat dissipation fins (205) are fixed to the top surface of the mounting base (203), and the top of each heat dissipation fin (205) contacts the bottom surface of the circuit board body (1).

4. A high-frequency multilayer circuit board with good heat dissipation according to claim 3, characterized in that: All the fixing holes (101) are internal threaded through holes, all the upper support sleeves (202) are internal threaded sleeves, all the screws (201) are plastic screws with an upper end larger than the hole diameter of the fixing holes (101), and the upper end of the screws (201) are pressed against the top edge of the circuit board body (1).

5. A high-frequency multilayer circuit board with good heat dissipation according to claim 4, characterized in that: The heat dissipation fins (205) are all vertically arranged along the longitudinal direction, and the vertical dimension of the heat dissipation fins (205) is greater than the vertical dimension of the upper support sleeve (202).

6. A high-frequency multilayer circuit board with good heat dissipation according to claim 5, characterized in that: The heat dissipation fins (205) are all rectangular PEEK heat dissipation fins.

7. A high-frequency multilayer circuit board with good heat dissipation according to any one of claims 3-6, characterized in that: The bottom corners of the mounting base plate (203) are each vertically fixed with a lower support sleeve (204), and the lower support sleeve (204) is an open-bottomed internal thread sleeve.

8. A high-frequency multilayer circuit board with good heat dissipation according to claim 7, characterized in that: The air-cooled heat dissipation component (3) includes a ventilation opening (306) and a cooling fan body (303). The ventilation opening (306) is vertically opened in the middle of the mounting base (203). The cooling fan body (303) with the air blowing direction is mounted flat on the bottom plate of the mounting base (203), and the cooling fan body (303) and the ventilation opening (306) are vertically coaxial.

9. A high-frequency multilayer circuit board with good heat dissipation according to claim 8, characterized in that: The cooling fan body (303) has vertically opened mounting holes (302) at its corners. The mounting base plate (203) has multiple vertically opened mating holes (301) around the ventilation opening (306). The mounting holes (302) and the mating holes (301) are all internally threaded through holes and are vertically coaxially aligned.

10. A high-frequency multilayer circuit board with good heat dissipation according to claim 8 or 9, characterized in that: The cooling fan body (303) is a miniature cooling fan with the air blowing direction from bottom to top. The bottom of the cooling fan body (303) extends outward with a power connection wire (305), and the outer end of the power connection wire (305) is equipped with a power connector (304).

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